CN104087992A - Electroplating processing method for copper-wire surface - Google Patents
Electroplating processing method for copper-wire surface Download PDFInfo
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- CN104087992A CN104087992A CN201410272880.8A CN201410272880A CN104087992A CN 104087992 A CN104087992 A CN 104087992A CN 201410272880 A CN201410272880 A CN 201410272880A CN 104087992 A CN104087992 A CN 104087992A
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Abstract
A disclosed electroplating processing method for a copper-wire surface comprises the following steps: (1) removing oil; (2) cleaning with flowing water; (3) drying; (4) performing electroplating processing; (5) washing with water at the temperature of 35-40 DEG C; and (6) performing spin drying and packaging. The method is low in pretreatment requirement and strong in dispersing capability, the current efficiency reaches 95% or more, no precipitate generates during electroplating, after electroplating is finished, the bonding force between the electroplating layer and the copper-wire surface is good, the electroplating effect is good, and the service life of a copper wire with the surface processed by employing the method is relatively long.
Description
Technical field
The present invention relates to copper cash processing technique field, be specifically related to a kind of electroplating processes method of copper line surface.
Background technology
Silver-coated copper wire is plating silver layer and making with one heart on copper core, and it combines the feature of two kinds of metals, has good conductivity, and become clear and the surface of gloss, and silver layer has very high erosion resistance, be also widely used at present on high-end electronic devices and components, use as outlet line.
Although silver layer has stronger corrosion resistance, long-term exposure is in air, and silver-coated copper wire surface is easy to work with airborne sulfide, halogenide etc., cause surface variable color comprehensively, not only break and changed outward appearance, make contact resistance increase simultaneously, brazing property degenerates.Find through experiment, the essence of silvered film variable color is surface ion, if coating purity is inadequate, contains the impurity such as micro-zinc, iron, copper, forms corrosion microbattery on surface, has accelerated silver-colored ionization process; If silvered film surface irregularity porous, more easily condenses moisture and causes silvered film variable color with entering corrosive medium.
In Chinese Patent Application No.: disclose a kind of tin-plating round copper wire in 201110202378.6.It comprises copper cash and be wrapped in the silvered film outside copper cash, and described copper cash and silvered film are provided with at least two-layer tin coating.Silver-colored long-term exposure in this technical scheme is in air, and silver-coated copper wire surface is easy to work with airborne sulfide, halogenide etc., causes surface variable color comprehensively, the not only broken outward appearance of having changed, make contact resistance increase, brazing property degenerates simultaneously, and this technical scheme haves much room for improvement.
In Chinese Patent Application No.: disclose a kind of copper line surface tin plating method in 201210142913, it comprises the following steps successively: (1) pre-treatment, the bare copper wire through anneal is introduced to the rinse bath with acid solution and carry out surface cleaning; (2) zinc-plated, how pretreated bare copper wire is immersed to rice liquid and carry out zinc-platedly, described how rice liquid is made up of following weight ratio component: 30-35% phosphoric acid tin, 20-30% phosphoric acid, 5-10% citric acid, 5-10% mixed interface promoting agent, 30-40% pure water; (3) neutralization, introduces the copper cash through zinc-plated the neutralizing well with alkali lye; (4) dry, the copper cash through neutralization is introduced to baking box and dry.This technical scheme is comparatively responsive to impurity, pre-treatment is had relatively high expectations, and current efficiency only has 60% left and right, and this technical scheme haves much room for improvement.
Summary of the invention
For the problems referred to above, the invention provides a kind of electroplating processes method of copper line surface, the technical program requires low to pre-treatment, and current efficiency reaches more than 95%, and after plating, coating and basal body binding force are good.
In order to address the above problem, technical scheme provided by the invention is:
An electroplating processes method for copper line surface, comprises the following steps:
(1) oil removing, sodium hydroxide: 30-34g/L, sodium carbonate: 14-18g/L, SODIUMNITRATE: 26-28g/L, temperature: 70-75 DEG C, duration: 10-13 minutes;
(2) flowing water cleans;
(3) dry;
(4) electroplating processes, electrolytic solution is: sodium stannate: 96-104g/L, sodium hydroxide: 40-46g/L, sodium-acetate: 6-8g/L, Sodium peroxoborate: 4.2-5.4g/L, temperature: 75-82 DEG C, current density: 4-4.6A/dm
2;
(5) washing, temperature: 35-40 DEG C;
(6) dry, pack.
Preferably, in step (4), electrolytic solution also comprises hydrogen peroxide: 10-16mL/L.
Preferably, the manner of formulation of electrolytic solution is: while carrying out step (4) first by dissolution of sodium hydroxide in 1/3rd to 1/2nd volume of electrolytic solution, then add sodium stannate, sodium-acetate, finally add residue water.
Preferably, carry out again step (4) after first switching on 80-100 minutes.
Sodium hydroxide ensures electrolyte conductivity, prevent pink salt hydrolysis, be conducive to anode normally dissolves, and suppresses CO2 impact in air.
Sodium-acetate has the electroconductibility of utilizing raising electrolytic solution.
The temperature of electrolytic solution is controlled at 75-82 DEG C, and when temperature is too low, current efficiency is low, when excess Temperature, easily produces Bivalent Tin, produces precipitation.
In the time occurring that anode dissolution is undesired, in electrolytic solution, there will be divalent tin ion, cause forming gloomy even spongiform coating; Hydrogen peroxide can make the divalent tin ion in electrolytic solution be oxidized to tetravalent tin.
Compared with prior art, beneficial effect of the present invention is:
The present invention requires low to pre-treatment, dispersive ability is strong, and current efficiency reaches more than 95%, does not produce precipitation in electroplating process, and after plating, coating and copper cash basal body binding force are good, and electroplating effect is good, longer service life.
Embodiment
The present invention will be further described below:
Embodiment 1:
An electroplating processes method for copper line surface, comprises the following steps:
(1) oil removing, sodium hydroxide: 34g/L, sodium carbonate: 14g/L, SODIUMNITRATE: 28g/L, temperature: 70 DEG C, duration: 13 minutes;
(2) flowing water cleans;
(3) dry;
(4) electroplating processes, electrolytic solution is: sodium stannate: 96g/L, sodium hydroxide: 46g/L, sodium-acetate: 6g/L, Sodium peroxoborate: 5.4g/L, hydrogen peroxide: 10mL/L, temperature: 82 DEG C, current density: 4A/dm
2, the manner of formulation of electrolytic solution is: first by dissolution of sodium hydroxide in 1/3rd volume of electrolytic solution, then add sodium stannate, sodium-acetate, Sodium peroxoborate, hydrogen peroxide, finally add residue water, after first switching on 100 minutes, carry out again electroplating processes;
(5) washing, temperature: 35 DEG C;
(6) dry, pack.
Sodium hydroxide ensures electrolyte conductivity, prevent pink salt hydrolysis, be conducive to anode normally dissolves, and suppresses CO2 impact in air.
Sodium-acetate has the electroconductibility of utilizing raising electrolytic solution.
The temperature of electrolytic solution is controlled at 75-82 DEG C, and when temperature is too low, current efficiency is low, when excess Temperature, easily produces Bivalent Tin, produces precipitation.
In the time occurring that anode dissolution is undesired, in electrolytic solution, there will be divalent tin ion, cause forming gloomy even spongiform coating; Hydrogen peroxide can make the divalent tin ion in electrolytic solution be oxidized to tetravalent tin.
Embodiment 2:
An electroplating processes method for copper line surface, comprises the following steps:
(1) oil removing, sodium hydroxide: 30g/L, sodium carbonate: 18g/L, SODIUMNITRATE: 26g/L, temperature: 75 DEG C, duration: 10 minutes;
(2) flowing water cleans;
(3) dry;
(4) electroplating processes, electrolytic solution is: sodium stannate: 104g/L, sodium hydroxide: 40g/L, sodium-acetate: 8g/L, Sodium peroxoborate: 4.2-g/L, hydrogen peroxide: 16mL/L, temperature: 75 DEG C, current density: 4.6A/dm
2, the manner of formulation of electrolytic solution is: first by dissolution of sodium hydroxide in 1/2nd volume of electrolytic solution, then add sodium stannate, sodium-acetate, Sodium peroxoborate, hydrogen peroxide, finally add residue water, after first switching on 80 minutes, carry out again electroplating processes;
(5) washing, temperature: 40 DEG C;
(6) dry, pack.
Embodiment 3:
An electroplating processes method for copper line surface, comprises the following steps:
(1) oil removing, sodium hydroxide: 30g/L, sodium carbonate: 14g/L, SODIUMNITRATE: 28g/L, temperature: 75 DEG C, duration: 10 minutes;
(2) flowing water cleans;
(3) dry;
(4) electroplating processes, electrolytic solution is: sodium stannate: 104g/L, sodium hydroxide: 46g/L, sodium-acetate: 6g/L, Sodium peroxoborate: 4.2g/L, hydrogen peroxide: 10mL/L, temperature: 75 DEG C, current density: 4.6A/dm
2, the manner of formulation of electrolytic solution is: first by dissolution of sodium hydroxide in 1/3rd volume of electrolytic solution, then add sodium stannate, sodium-acetate, Sodium peroxoborate, hydrogen peroxide, finally add residue water, after first switching on 100 minutes, carry out again electroplating processes;
(5) washing, temperature: 40 DEG C;
(6) dry, pack.
Embodiment 4:
An electroplating processes method for copper line surface, comprises the following steps:
(1) oil removing, sodium hydroxide: 32g/L, sodium carbonate: 16g/L, SODIUMNITRATE: 27g/L, temperature: 74 DEG C, duration: 12 minutes;
(2) flowing water cleans;
(3) dry;
(4) electroplating processes, electrolytic solution is: sodium stannate: 98g/L, sodium hydroxide: 44g/L, sodium-acetate: 6.8g/L, Sodium peroxoborate: 4.8g/L, hydrogen peroxide: 14mL/L, temperature: 78 DEG C, current density: 4.2A/dm
2, the manner of formulation of electrolytic solution is: first by dissolution of sodium hydroxide in 1/3rd volume of electrolytic solution, then add sodium stannate, sodium-acetate, Sodium peroxoborate, hydrogen peroxide, finally add residue water, after first switching on 90 minutes, carry out again electroplating processes;
(5) washing, temperature: 36 DEG C;
(6) dry, pack.
Embodiment 5:
An electroplating processes method for copper line surface, comprises the following steps:
(1) oil removing, sodium hydroxide: 33g/L, sodium carbonate: 15g/L, SODIUMNITRATE: 26.5g/L, temperature: 72 DEG C, duration: 11 minutes;
(2) flowing water cleans;
(3) dry;
(4) electroplating processes, electrolytic solution is: sodium stannate: 102g/L, sodium hydroxide: 42g/L, sodium-acetate: 7.2g/L, Sodium peroxoborate: 4.6g/L, hydrogen peroxide: 12mL/L, temperature: 80 DEG C, current density: 4.5A/dm
2, the manner of formulation of electrolytic solution is: first by dissolution of sodium hydroxide in 1/2nd volume of electrolytic solution, then add sodium stannate, sodium-acetate, Sodium peroxoborate, hydrogen peroxide, finally add residue water, after first switching on 96 minutes, carry out again electroplating processes;
(5) washing, temperature: 38 DEG C;
(6) dry, pack.
More than show and described ultimate principle of the present invention, principal character and advantage of the present invention.The technician of the industry should understand; the present invention is not restricted to the described embodiments; that in above-described embodiment and specification sheets, describes just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.The claimed scope of the present invention is defined by appending claims and equivalent thereof.
Claims (4)
1. an electroplating processes method for copper line surface, is characterized in that, comprises the following steps:
(1) oil removing, sodium hydroxide: 30-34g/L, sodium carbonate: 14-18g/L, SODIUMNITRATE: 26-28g/L, temperature: 70-75 DEG C, duration: 10-13 minutes;
(2) flowing water cleans;
(3) dry;
(4) electroplating processes, electrolytic solution is: sodium stannate: 96-104g/L, sodium hydroxide: 40-46g/L, sodium-acetate: 6-8g/L, Sodium peroxoborate: 4.2-5.4g/L, temperature: 75-82 DEG C, current density: 4-4.6A/dm
2;
(5) washing, temperature: 35-40 DEG C;
(6) dry, pack.
2. the electroplating processes method of copper line surface according to claim 1, is characterized in that: in step (4), electrolytic solution also comprises hydrogen peroxide: 10-16mL/L.
3. the electroplating processes method of copper line surface according to claim 1, it is characterized in that: while carrying out step (4), the manner of formulation of electrolytic solution is: first by dissolution of sodium hydroxide in 1/3rd to 1/2nd volume of electrolytic solution, add again sodium stannate, sodium-acetate, Sodium peroxoborate, finally add residue water.
4. the electroplating processes method of copper line surface according to claim 3, is characterized in that: after first switching on 80-100 minutes, carry out electroplating processes again.
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| CN201410272880.8A CN104087992A (en) | 2014-06-17 | 2014-06-17 | Electroplating processing method for copper-wire surface |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106191546A (en) * | 2016-08-11 | 2016-12-07 | 安徽波浪岛游乐设备有限公司 | A kind of durable type LED-baseplate composite heat dissipation material and production method thereof |
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| RO72895A2 (en) * | 1978-10-04 | 1981-08-17 | Institutul De Cercetari Pentru Industria Electrotehnica,Ro | PROCESS FOR COATING COPPER WIRES FOR ELECTRONIC COMPONENTS |
| KR20030026470A (en) * | 2001-09-25 | 2003-04-03 | 전정식 | preprocessing method for plating non conducting material with gold |
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| CN101245480A (en) * | 2008-03-19 | 2008-08-20 | 厦门大学 | Method for producing nickel coating on metal surface |
| US20110024156A1 (en) * | 2009-07-29 | 2011-02-03 | Hitachi Cable, Ltd. | Enameled insulated wire and manufanturing method thereof |
| CN101969124A (en) * | 2010-10-30 | 2011-02-09 | 湘潭大学 | Tin-copper alloy cathode material used for lithium ion battery and preparation method thereof |
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2014
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RO72895A2 (en) * | 1978-10-04 | 1981-08-17 | Institutul De Cercetari Pentru Industria Electrotehnica,Ro | PROCESS FOR COATING COPPER WIRES FOR ELECTRONIC COMPONENTS |
| KR20030026470A (en) * | 2001-09-25 | 2003-04-03 | 전정식 | preprocessing method for plating non conducting material with gold |
| CN1905248A (en) * | 2006-06-27 | 2007-01-31 | 福建师范大学 | Stannum-copper alloy composite oxide membrane negative electrode material and use in battery |
| CN101245480A (en) * | 2008-03-19 | 2008-08-20 | 厦门大学 | Method for producing nickel coating on metal surface |
| US20110024156A1 (en) * | 2009-07-29 | 2011-02-03 | Hitachi Cable, Ltd. | Enameled insulated wire and manufanturing method thereof |
| CN101969124A (en) * | 2010-10-30 | 2011-02-09 | 湘潭大学 | Tin-copper alloy cathode material used for lithium ion battery and preparation method thereof |
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| 张允诚等: "《电镀手册》", 31 July 1997, 国防工业出版社, article ""电镀手册"", pages: 411-413 * |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106191546A (en) * | 2016-08-11 | 2016-12-07 | 安徽波浪岛游乐设备有限公司 | A kind of durable type LED-baseplate composite heat dissipation material and production method thereof |
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