CN104053349A - System And Method For Manufacturing Led Lighting Substrate - Google Patents
System And Method For Manufacturing Led Lighting Substrate Download PDFInfo
- Publication number
- CN104053349A CN104053349A CN201310525099.2A CN201310525099A CN104053349A CN 104053349 A CN104053349 A CN 104053349A CN 201310525099 A CN201310525099 A CN 201310525099A CN 104053349 A CN104053349 A CN 104053349A
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- Prior art keywords
- lens
- installation
- led
- substrate
- led element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention relates to a system and a method for manufacturing an LED lighting substrate. Lighting quality can be ensured and production efficiency of the LED lighting substrate can be enhanced. During an inspection procedure where positions of representative marks (MA, MB) formed in a carrier (5) and installation positions where all LED elements (12) are installed on a substrate (4), position data (17a) are determined and fed back to a lens installing procedure of a later procedure. The position data is that data representing the relative position of the installing positions to the representative marks (MA, MB) according to each LED element. During the lens installing procedure, each of the LED elements (12) is installed aligned to a lens (26) on the basis of an identification result of the positions of the representative marks (MA, MB) and the transmitted position data (17a), so there is no need to detect installing reference positions alone in the lens installing procedure, and lighting quality of the LED lighting substrate can be ensured while the production efficiency is enhanced.
Description
Technical field
Manufacturing system and the manufacture method of the LED illuminating board that the present invention relates to multiple LED elements are installed on substrate and form.
Background technology
In the manufacture process of the LED illuminating board using at the light supply apparatus of the use backlight as lighting device or LCD TV etc., multiple LED elements of installing are installed separately to the lens of light diffusion use on substrate.These lens, so that the uniform-illumination of LED illuminating board is improved to lighting quality as object, in order to ensure high lighting quality, need to be aimed at LED element in the optical axis of the lens mode consistent with the luminescence center of LED element with lens exactly.As the method for meeting the requirement in such lighting quality, known when to LED element mounted lens, the result of the position based on independent detection LED element is carried out the method (for example,, with reference to patent documentation 1) of mounted lens.In the prior art representing in this patent documentation example, after LED element being installed to substrate by solder joints, the shape of identifying LED element by optical mode is obtained center or is obtained the Luminance Distribution Shang center of illumination light, detects the reference for installation position of wanting mounted lens.
[prior art document]
[patent documentation]
[patent documentation 1] TOHKEMY 2012-238410 communique
Summary of the invention
The problem that invention will solve
But, in the prior art including above-mentioned prior art example, in the production efficiency in the lens installation procedure of LED element mounted lens, there is following difficult point.; due to multiple LED elements being installed in LED illuminating board; therefore in lens installation procedure, detect separately in the prior art of reference for installation position, lens are installed required operation pitch time and are postponed, thereby cause the decline of the productivity ratio of manufacturing process's entirety of LED illuminating board.
Therefore, the object of the invention is to manufacturing system and the manufacture method of the LED illuminating board of boosting productivity when a kind of lighting quality that can guarantee LED illuminating board is provided.
For the means of dealing with problems
The LED illuminating board that the manufacturing system manufacture of LED illuminating board of the present invention forms the lens of multiple LED elements installation light diffusion use of installing on substrate, comprise: inspection portion, by the carrier that maintains the substrate that described LED element is installed is carried out to optical identification, detect the position of the representative mark that forms in described carrier and in described carrier each LED element be arranged on the installation site on substrate; And lens installation portion, using the substrate keeping in the described carrier after detecting described installation site as object, each LED element is installed to described lens, described inspection portion is obtained position data and is transferred to described lens installation portion, wherein, this position data is the position data that described installation site is represented according to each LED element with respect to the relative position of described representative mark, described lens installation portion is based on only representing that to described mark has carried out the recognition result of location recognition and the described position data of transmitting, to each LED element mounted lens.
The LED illuminating board that the manufacture method manufacture of LED illuminating board of the present invention forms the lens of multiple LED elements installation light diffusion use of installing on substrate, comprise: check operation, by the carrier that maintains the substrate that described LED element is installed is carried out to optical identification, detect the position of the representative mark that forms in described carrier and in described carrier each LED element be arranged on the installation site on substrate, and lens installation procedure, using the substrate keeping in the described carrier after described installation site being detected as object, each LED element is installed to described lens, in described inspection operation, obtain position data and be transferred to described lens installation procedure, wherein, described position data is the position data that described installation site is represented according to each LED element with respect to the relative position of described representative mark, in described lens installation procedure, based on only representing that to described mark has carried out the recognition result of location recognition and the described position data of transmitting, to each LED element mounted lens.
Invention effect
According to the present invention, being formed in the inspection operation detecting in the position of the representative mark in carrier and each LED element is installed on substrate in carrier installation site, obtain position data and be fed forward to the lens installation procedure of rear operation, wherein, this position data is the data that installation site is represented according to each LED element with respect to the relative position of representative mark, in lens installation procedure, based on only to representing that mark has carried out the recognition result of location recognition and the position data of transmitting, each LED element alignment lens are installed, thereby in lens installation procedure, do not need to detect separately reference for installation position, when can guaranteeing the lighting quality of LED illuminating board, boost productivity.
Brief description of the drawings
Fig. 1 is the block diagram that represents the structure of the manufacturing system of the LED illuminating board of one embodiment of the present invention.
Fig. 2 is the flow chart that represents each operation of the manufacture method of the LED illuminating board of one embodiment of the present invention.
Fig. 3 is the specification figure of the manufacture method of the LED illuminating board of one embodiment of the present invention.
Fig. 4 is the specification figure of the manufacture method of the LED illuminating board of one embodiment of the present invention.
Fig. 5 is the specification figure of the manufacture method of the LED illuminating board of one embodiment of the present invention.
Fig. 6 is the specification figure of the manufacture method of the LED illuminating board of one embodiment of the present invention.
Fig. 7 is the specification figure of the manufacture method of the LED illuminating board of one embodiment of the present invention.
Embodiment
Below, with reference to the accompanying drawings of embodiments of the present invention.First, the structure of the manufacturing system 1 of LED illuminating board is described with reference to Fig. 1.The manufacturing system 1 of LED illuminating board has manufactures the function of multiple LED elements of installing being installed separately to the LED illuminating board that the lens of light diffusion use form on substrate.The manufacturing system 1 of LED illuminating board is roughly divided into LED hookup wire 1a and lens hookup wire 1b, wherein, LED hookup wire 1a has connected for carrying out the multiple substrate 4(that keep at carrier 5 with reference to Fig. 3) the upper LED of installation element 12(is with reference to Fig. 4) multiple devices of operation, lens hookup wire 1b has connected for carrying out mounted lens 26(on the substrate after LED element has been installed with reference to Fig. 7) multiple devices of operation.
The each device that forms LED hookup wire 1a, lens hookup wire 1b interconnects via LAN system 2, is also connected with supervisory computer 3.In addition, LED hookup wire 1a, lens hookup wire 1b both can be used as the manufacture line of connecting together and had configured, also can, using LED hookup wire 1a, lens hookup wire 1b as independently manufacturing line, between LED hookup wire 1a, lens hookup wire 1b, carry the substrate 4(arrow of intermediate products a).
Here the each device that forms LED hookup wire 1a is described.Printing equipment M1 be formed in carrier 5 state keeping illuminating board, printing unit engages the scolding tin of use on multiple substrates 4.Printing inspection apparatus M2 detects the printing state of the printing position or the soldering tin amount etc. that are printed on the scolding tin on substrate 4.On the substrate 4 of apparatus for mounting component M3 after solder printing, LED element 12 is installed.Installation check device M4 is taken and is identified carrier 5 by video camera, thereby carries out the inspection of the installment state of position of the LED element 12 on substrate 4 etc.Substrate 4 after reflow device M5 installs LED element heats and makes melts soldering tin, thus LED element 12 is engaged with substrate 4.
Then, the each device that forms lens hookup wire 1b is described.Bonding agent coating unit M6 applies the bonding agent for fixed lens 26 on substrate 4.Position detecting device M7 takes carrier 5 by video camera, carry out the inspection of the installment state of the position etc. of the LED element 12 on substrate 4, and detect representative mark MA, MB(that the location recognition that forms uses with reference to Fig. 5 on carrier 5) position and in carrier 5 each LED element 12 be arranged on the installation site on substrate 4.
; position detecting device M7 carries out optical identification by the carrier 5 to maintaining the substrate 4 that LED element 12 is installed; play the effect of inspection portion; wherein, this inspection portion detect the position of the representative mark MA, the MB that form on carrier 5 and in carrier 5 each LED element 12 be arranged on the installation site on substrate 4.In addition, shown here be used as inspection portion and the example of the position detecting device M7 of configuration independently, but also shoot function and identifying processing function can be set in other devices and make it carry out same check processing.
Lens erecting device M8(lens installation portion) using keeping and detecting installation site substrate 4 afterwards as object by position detecting device M7, carry out the operation to each LED element 12 mounted lens 26 in carrier 5.In addition, also can replace and in lens hookup wire 1b, configure independent bonding agent coating unit M6, and in lens erecting device M8, possess the bonding agent transfer section to lens 26 transfer printing bonding agents, the lens after transfer printing bonding agent 26 are installed to substrate 4.Solidification equipment M9, by heating lens 26 substrate 4 has afterwards been installed, makes bonding agent thermmohardening.
Then,, according to the flow process shown in Fig. 2, with reference to the each figure below Fig. 3, the manufacture handling process of LED illuminating board is described.As shown in Fig. 3 (a), in tabular carrier 5, maintain the multiple substrates 4 that become the basic elongated shape that forms illuminating board.In each substrate 4, be set with multiple component installation location 4a that LED element 12 is installed, be formed with the electrode 4b for engaging LED element 12 at each component installation location 4a.In addition, be formed with representative mark MA, MB at two diagonal positions of carrier 5, as two distinguishing marks of the integral position for detection of carrier 5.
First the substrate 4 keeping in carrier 5 is moved in printing equipment M1, multiple substrates 4 is carried out to silk screen printing (ST1) in batch as object here.Thus, as shown in Figure 3 (b), on the electrode 4b of each substrate 4, be printed the soldering paste S that part bonding is used.Then the carrier 5 that, maintains substrate 4 is moved in printing inspection apparatus M2., as shown in Fig. 3 (c), use video camera 6 to take the substrate 4 that is printed with soldering paste S by inspection here, by print inspection handling part 7, this shooting results is carried out to check processing, check the quality (ST2) of the printing state of the soldering paste S in substrate 4.Then, the substrate 4 that is judged to be quality product according to print inspection result is moved in apparatus for mounting component M3,, as shown in Fig. 3 (d), the LED packaging body 9 keeping in mounting head 8 is positioned on the soldering paste S being printed on substrate 4 (ST3) here.
(a) of Fig. 4 represents the schematic configuration of LED packaging body 9.Here, after being illustrated in the LED element 12 of monomer being installed on monolithic substrate 10 in the LED installation portion 11 arranging in advance, by luminiferous resin 13, LED element 12 is carried out to resin-encapsulated and form LED packaging body 9, the LED element 12 of the state of this LED packaging body 9 is installed to the example of substrate 4.Certainly can be also that the LED element of monomer 12 is directly engaged to the structure that is installed to substrate 4 and manufactures illuminating board by scolding tin.
Then the substrate 4 of, LED being installed is moved in installation check device M4.Here, as shown in Fig. 4 (b), use video camera 14 to take the substrate 4 that LED packaging body 9 is installed by inspection, by installation check handling part 15, this shooting results is carried out to check processing, the quality (ST4) of the installment state of the LED packaging body 9 in the substrate such as position or posture 4 of inspection LED packaging body 9.Then, as shown in Fig. 4 (c), the substrate 4 that is judged to be quality product in above-mentioned inspection is moved in reflow device M5, here, by substrate 4 being heated with the thermal map (profile) that adds of being scheduled to, by melting curing soldering paste S*, LED packaging body 9 engages (ST5) with substrate 4.
Then, the component installation location 4a of substrate 4 is applied for the bonding agent (bonding agent coating operation) of fixed lens 26 (ST6).That is, substrate 4 is moved in bonding agent coating unit M6, and as shown in the (a) and (b) of Fig. 5, around, the bonding agent 25 of epoxy resin etc. is by distributor (dispenser) 24 coated multiple spots for the LED packaging body 9 on substrate 4.
Then, afterwards, the substrate 4 keeping in carrier 5 is moved in position detecting device M7.Here, as shown in Fig. 5 (c), in carrier 5, being arranged on each LED packaging body 9 on substrate 4 becomes separately the object of location recognition.; by position probing handling part 17, the shooting results of the carrier 5 by identification video camera 16 is processed; according to each LED packaging body 9(i) obtain with respect to the relative position that represents mark MA, MB; particularly, obtain the central point 12C(i by the each LED element 12 in the orthogonal coordinate system of representative mark MA, MB defined) position coordinates (xi, yi).Then the coordinate data of, obtaining is exported (relative position detection operation) (ST7) as this LED element 12 of expression with respect to representing the position data 17a of the relative position that indicates MA, MB.Then, the position data 17a of output is fed forward to lens erecting device M8 via LAN system 2.
; position detecting device M7 as inspection portion is handled as follows: obtain position data 17a and be transferred to lens erecting device M8; wherein, this position data 17a represents with respect to the relative position of representative mark MA, MB the installation site of LED element 12 and data that reference for installation position when to this LED element 12 mounted lens 26 is used according to each LED element 12.Then, the carrier 5 that maintains the substrate 4 after bonding agent applies is moved into lens erecting device M8, and the substrate 4 after detecting installation site is as object, to each LED packaging body 9 mounted lens 26(ST8) (lens installation procedure).
Fig. 6 represents the structure of lens erecting device M8.That is, lens erecting device M8 has lens deployment mechanism 28, and the action of lens deployment mechanism 28 is to be mounted control part 29 to control, and wherein, this lens deployment mechanism 28 is kept lens 26 and covered LED packaging body 9 by mounting head 27 installing.In addition, lens erecting device M8 has for detection of the representative mark MA, the MB(that form on carrier 5 with reference to Fig. 5) the identification video camera 30 of position, by mark position test section 31, the result of being taken carrier 5 by identification video camera 30 is carried out to identifying processing, detect the position of representative mark MA, MB.
In addition, in the data store 32 with lens erecting device M8, store work pattern data 33 and the position data 17a from position detecting device M7 transmission.In the time lens 26 being installed to LED packaging body 9 by mounting head 27, control part 29 is installed according to position data 17a, the work pattern data 33 of the position probing result of the representative mark MA, the MB that are detected by mark position test section 31 and storage in data store 32, is controlled lens deployment mechanism 28.
Work pattern data 33 are following data: in the lens installation exercise of lens deployment mechanism 28, when existing the position offset with respect to normal place in the relative position obtained by installation check device M4 to exceed the data of selected work pattern (the first work pattern, the second work pattern) in the situation of LED element 12 of the feasible value of regulation.; in the situation that having selected the first work pattern; do not carry out the installation of the lens 26 to this LED element 12, in the situation that having selected the second work pattern, do not carry out the installation of the lens 26 of the whole LED elements 12 to belonging to the substrate 4 that this LED element 12 is installed.
In these lens are installed, as shown in Fig. 7 (a), the lens that kept 26 are covered to LED packaging body 9 and install by mounting head 27, and it is contacted with the bonding agent 25 applying on substrate 4.Lens 26 are installed as following object: by the illumination light that the LED element 12 of LED packaging body 9 sends is spread to horizontal direction, guarantee extremely wide illumination zone by the LED element 12 of minority.
As mentioned above, install the top that covers LED packaging body 9 due to lens 26, and therefore in the example shown in present embodiment, below lens 26, side is provided with for avoiding and the recess 26a of the interference of LED packaging body 9.In addition, as the shape of lens 26, except being provided with below the shape of recess 26a, also can being suitably chosen in side below and being provided with the various shapes such as the protuberance by bonding agent 25 bonding use and using.
In the installation of these lens 26, the lens deployment mechanism 28 of controlling for mounting head 27 is moved by control part 29 is installed, carries out the aligning of lens 26 for LED element 12.That is, control part 29 is installed by the representative mark MA of mark position test section 31, the recognition result of MB, is obtained and first move in lens erecting device M8 and carried out the integral position of the carrier 5 under the state of location.Then, according to the recognition result of these representative marks MA, MB and the representative mark MA, the MB that represent from the position data 17a of installation check device M4 feedforward and the relative position of each LED element 12, the position of the each LED element 12 of computing in lens installation action.
Then, by according to this position operation result control lens deployment mechanism 28, mounting head 27 lens 26 are registered to each LED packaging body 9 LED element 12 installation site accurately and install.Thus, as shown in Fig. 7 (b), the melatope 26b of lens 26 is registered to the reference for installation position of the LED element 12 detecting in advance.
Now, owing to storing the position data 17a that obtains and feedover by installation check device M4 in advance in data store 32, therefore in lens erecting device M8, according to only representative mark MA, MB having been carried out to the recognition result of location recognition and the position data 17a from position detecting device M7 transmission, lens 26 are installed in each LED element 12.Therefore, with obtain separately the prior art of reference for installation position in lens installation procedure compared with, do not need to carry out separately the location recognition of LED element 12, can shorten that lens are installed required operation pitch time and the productivity ratio that improves manufacturing process's entirety of LED illuminating board.
In addition, in the lens installation procedure of above-mentioned lens erecting device M8, when existing the position offset with respect to normal place in the relative position of being obtained by position detecting device M7 to exceed in the situation of LED element 12 of the feasible value of regulation, automatically judge and have or not lens to install according to the work pattern of selecting in advance.; in the situation that having selected the first work pattern in advance; do not carry out the installation of the lens 26 to this LED element 12, in the situation that having selected the second work pattern, do not carry out the installation of the lens 26 of the whole LED elements 12 to belonging to the substrate 4 that this LED element 12 has been installed.Thus, can get rid of the waste because LED element 12 mounted lens 26 that exceed the skew of permissible range position are produced as far as possible.
Afterwards, carry out the thermmohardening (ST8) of bonding agent 25.,, as shown in Fig. 7 (c), the carrier 5 that maintains the substrate 4 after lens are installed is moved in solidification equipment M9, here, heats with predetermined heat condition.Thus, bonding agent 25 carries out thermmohardening, as shown in Fig. 7 (d), (e), forms the resin fixed part 25* that lens 26 is fixed to substrate 4, and wherein, these lens 26 are be arranged on the LED packaging body 9 substrate 4 and install from top covering.
Bright as noted earlier, in the manufacturing system and manufacture method of the LED illuminating board shown in present embodiment, at the representative mark MA to formation on carrier 5, in the inspection operation that the position of MB and the installation site that each LED element 12 is installed on substrate 4 in carrier 5 are detected, obtain position data 17a and be fed forward to the lens installation procedure of rear operation, in lens installation procedure, based on only representative being indicated to MA, MB has carried out the recognition result of location recognition and the position data 17a being transmitted, lens 26 are registered to each LED element 12 and install, wherein, this position data 17a is with respect to representative mark MA by installation site, the data that the relative position of MB represents according to each LED element 12.Thus, need in lens installation procedure, not detect reference for installation position separately, when can guaranteeing the lighting quality of LED illuminating board, boost productivity.
Utilizability in industry
The effect of boosting productivity when the manufacturing system of LED illuminating board of the present invention and manufacture method have the lighting quality that can guarantee LED illuminating board, can be used in the technical field that is manufactured on the LED illuminating board of on substrate, multiple LED elements being installed and form.
The explanation of Reference numeral
The manufacturing system of 1 LED illuminating board
4 substrates
4a component installation location
4b electrode
5 carriers
9 LED packaging bodies
10 monolithic substrates
12 LED elements
25 bonding agents
26 lens
MA, MB represent mark
Claims (4)
1. a manufacturing system for LED illuminating board, the LED illuminating board that manufacture forms the lens of multiple LED elements installation light diffusion use of installing on substrate, is characterized in that,
Comprise:
Inspection portion, by the carrier that maintains the substrate that described LED element is installed is carried out to optical identification, detect the position of the representative mark that forms in described carrier and in described carrier each LED element be arranged on the installation site on substrate; And
Lens installation portion, using the substrate keeping in the described carrier after detecting described installation site as object, installs described lens to each LED element,
Described inspection portion is obtained position data and is transferred to described lens installation portion, and wherein, this position data is the position data that described installation site is represented according to each LED element with respect to the relative position of described representative mark,
Described lens installation portion is based on only representing that to described mark has carried out the recognition result of location recognition and the described position data of transmitting, to each LED element mounted lens.
2. the manufacturing system of LED illuminating board according to claim 1, is characterized in that,
Described lens installation portion is in the case of existing the position offset with respect to normal place in described relative position to exceed the LED element of feasible value of regulation, selects the first installation exercise pattern of the installation of not carrying out the lens to this LED element and do not carry out any in the second installation exercise pattern of installation of the lens of the whole LED elements to belonging to the described substrate that this LED element is installed and carry out.
3. a manufacture method for LED illuminating board, the LED illuminating board that manufacture forms the lens of multiple LED elements installation light diffusion use of installing on substrate, is characterized in that,
Comprise:
Check operation, by the carrier that maintains the substrate that described LED element is installed is carried out to optical identification, detect the position of the representative mark that forms in described carrier and in described carrier each LED element be arranged on the installation site on substrate; And
Lens installation procedure, using the substrate keeping in the described carrier after described installation site being detected as object, installs described lens to each LED element,
In described inspection operation, obtain position data and be transferred to described lens installation procedure, wherein, described position data is the position data that described installation site is represented according to each LED element with respect to the relative position of described representative mark,
In described lens installation procedure, based on only representing that to described mark has carried out the recognition result of location recognition and the described position data of transmitting, to each LED element mounted lens.
4. the manufacture method of LED illuminating board according to claim 3, is characterized in that,
In described lens installation procedure, in the case of existing the position offset with respect to normal place in described relative position to exceed the LED element of feasible value of regulation, select the first installation exercise pattern of the installation of not carrying out the lens to this LED element and do not carry out any in the second installation exercise pattern of installation of the lens of the whole LED elements to belonging to the described substrate that this LED element is installed and carry out.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-051332 | 2013-03-14 | ||
| JP2013051332A JP2014179186A (en) | 2013-03-14 | 2013-03-14 | Manufacturing system and manufacturing method for led illumination substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104053349A true CN104053349A (en) | 2014-09-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310525099.2A Pending CN104053349A (en) | 2013-03-14 | 2013-10-30 | System And Method For Manufacturing Led Lighting Substrate |
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| Country | Link |
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| JP (1) | JP2014179186A (en) |
| CN (1) | CN104053349A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106271564A (en) * | 2015-06-24 | 2017-01-04 | 威光自动化科技股份有限公司 | Automatic assembling method of LED lamp box |
| CN110301172A (en) * | 2017-02-20 | 2019-10-01 | 株式会社富士 | Component mounting system and component mounting method |
| CN112292024A (en) * | 2015-02-26 | 2021-01-29 | 松下知识产权经营株式会社 | Component mounting device and component mounting method |
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| JP6554800B2 (en) * | 2015-01-30 | 2019-08-07 | Tdk株式会社 | Electronic component mounting system and mounting method |
| JP6412051B2 (en) | 2016-04-18 | 2018-10-24 | ファナック株式会社 | Automatic assembly system and method for improving the yield of automatic assembly of printed boards |
| JP7343719B2 (en) * | 2020-11-20 | 2023-09-12 | ヤマハ発動機株式会社 | NC data generation method, NC data generation device and component mounting system |
| JP7406127B2 (en) | 2021-12-20 | 2023-12-27 | 日亜化学工業株式会社 | Manufacturing method of light emitting device |
| KR102558744B1 (en) * | 2023-01-05 | 2023-07-26 | (주)동영 | Automatic bonding device for diffusion lens on led board |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4322092B2 (en) * | 2002-11-13 | 2009-08-26 | 富士機械製造株式会社 | Calibration method and apparatus for electronic component mounting apparatus |
| JP2012238411A (en) * | 2011-05-10 | 2012-12-06 | Panasonic Corp | Method for manufacturing led illumination substrate |
-
2013
- 2013-03-14 JP JP2013051332A patent/JP2014179186A/en active Pending
- 2013-10-30 CN CN201310525099.2A patent/CN104053349A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112292024A (en) * | 2015-02-26 | 2021-01-29 | 松下知识产权经营株式会社 | Component mounting device and component mounting method |
| CN112292024B (en) * | 2015-02-26 | 2022-02-25 | 松下知识产权经营株式会社 | Component mounting device and component mounting method |
| CN106271564A (en) * | 2015-06-24 | 2017-01-04 | 威光自动化科技股份有限公司 | Automatic assembling method of LED lamp box |
| CN110301172A (en) * | 2017-02-20 | 2019-10-01 | 株式会社富士 | Component mounting system and component mounting method |
| CN110301172B (en) * | 2017-02-20 | 2022-02-01 | 株式会社富士 | Component mounting system and component mounting method |
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| Publication number | Publication date |
|---|---|
| JP2014179186A (en) | 2014-09-25 |
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Effective date of registration: 20151102 Address after: Osaka Applicant after: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co.,Ltd. Address before: Osaka Applicant before: Matsushita Electric Industrial Co.,Ltd. |
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Application publication date: 20140917 |