JP2012238410A - Method for manufacturing led illumination substrate - Google Patents

Method for manufacturing led illumination substrate Download PDF

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JP2012238410A
JP2012238410A JP2011104988A JP2011104988A JP2012238410A JP 2012238410 A JP2012238410 A JP 2012238410A JP 2011104988 A JP2011104988 A JP 2011104988A JP 2011104988 A JP2011104988 A JP 2011104988A JP 2012238410 A JP2012238410 A JP 2012238410A
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mounting
led
substrate
lens
reference position
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Toshihiko Nagaya
利彦 永冶
Kenji Okamoto
健二 岡本
Kenichiro Ishimoto
憲一郎 石本
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Panasonic Corp
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Panasonic Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing an LED illumination substrate that can secure superb illumination characteristics at low cost.SOLUTION: In manufacturing the LED illumination substrate structured by mounting a plurality of LED elements on a substrate, loading reference positions for loading light diffusion lenses are first detected targeting on the substrate with the plurality of LED elements mounted on element-mounting positions, and at loading of the lenses after application of adhesives on the substrate, each light diffusion lens is loaded on each LED element based on the loading reference position detected. With this, the light diffusion lens can be loaded at an appropriate position of the LED element, and superb illumination characteristics can be secured at low cost in manufacturing of the LED illumination substrate.

Description

本発明は、複数のＬＥＤ素子を基板に実装して構成されたＬＥＤ照明基板の製造方法に関するものである。   The present invention relates to a method for manufacturing an LED lighting board configured by mounting a plurality of LED elements on a board.

液晶パネルなどの表示パネルのバックライト用の光源装置として、ＬＥＤ素子を基板に実装したＬＥＤ照明基板が広く用いられる。表示パネルのバックライトには、パネル領域の各位置において均一な照度を与えることが求められ、この用途に用いられるＬＥＤ照明基板には一般に多数のＬＥＤ素子が高密度で配列される。このため、バックライト用のＬＥＤ照明基板はコスト高となることが避けられず、従来よりＬＥＤ照明基板の低コスト化が求められていた。このような要請に対応するため、ＬＥＤ素子の数量の低減によるコストダウンを図ることを目的として、ＬＥＤ素子に光拡散用のレンズを装着する方法が用いられるようになっている（例えば特許文献１参照）。特許文献１に示す先行技術には、ＬＥＤ発散光をレンズの中心方向、周辺および側方向に均一に拡散させるための光拡散レンズの例が示されている。   As a light source device for a backlight of a display panel such as a liquid crystal panel, an LED illumination board having LED elements mounted on the board is widely used. The backlight of a display panel is required to provide uniform illuminance at each position in the panel region, and a large number of LED elements are generally arranged at high density on the LED illumination substrate used for this purpose. For this reason, it is inevitable that the LED illumination substrate for backlight is expensive, and the cost reduction of the LED illumination substrate has been demanded conventionally. In order to respond to such a request, a method of attaching a light diffusion lens to the LED element is used for the purpose of reducing the cost by reducing the number of LED elements (for example, Patent Document 1). reference). The prior art disclosed in Patent Document 1 shows an example of a light diffusing lens for uniformly diffusing LED divergent light in the center direction, the periphery, and the side direction of the lens.

特開２００６−３３２０５４号公報JP 2006-332054 A

しかしながら上述の先行技術例を含め従来技術においては、ＬＥＤ素子に対して光拡散レンズを正しく位置合わせすることが困難であることに起因して、照明光の照度が不均一になるという問題が生じていた。すなわち従来技術では、複数のＬＥＤ素子が実装された基板に光拡散レンズを実装する実装過程において、予め設計段階で準備された実装位置データを用いた位置合わせを行っていた。   However, in the prior art including the above-described prior art examples, there is a problem that the illuminance of the illumination light becomes non-uniform due to the difficulty in correctly aligning the light diffusion lens with respect to the LED element. It was. That is, in the prior art, in the mounting process of mounting the light diffusing lens on the substrate on which the plurality of LED elements are mounted, alignment is performed using mounting position data prepared in advance at the design stage.

ところがＬＥＤ素子の実装後の位置は必ずしも実装位置データ通りであるとは限らず、幾分かの誤差が避けがたい。さらに個々のＬＥＤ素子の発光特性は一様ではなく、必ずしもＬＥＤ素子の中心位置に照明光の輝度中心が一致しているとは限らない。このため、光拡散レンズを実装位置データを用いてＬＥＤ素子に装着すると、バックライトとしての照明光の分布特性にばらつきが生じる結果となる。このように従来技術においては、低コストでＬＥＤ照明基板の良好な照明特性を確保することが困難であるという問題があった。   However, the position of the LED element after mounting is not necessarily the same as the mounting position data, and some errors are unavoidable. Furthermore, the light emission characteristics of the individual LED elements are not uniform, and the luminance center of the illumination light does not always coincide with the center position of the LED elements. For this reason, when the light diffusing lens is mounted on the LED element using the mounting position data, the distribution characteristics of the illumination light as the backlight will vary. As described above, the conventional technique has a problem that it is difficult to ensure good illumination characteristics of the LED illumination board at low cost.

そこで本発明は、低コストで良好な照明特性を確保することができるＬＥＤ照明基板の製造方法を提供することを目的とする。   Then, this invention aims at providing the manufacturing method of the LED lighting board which can ensure a favorable illumination characteristic at low cost.

本発明のＬＥＤ照明基板の製造方法は、基板に実装された複数のＬＥＤ素子を光源とし前記ＬＥＤ素子に個別に光拡散レンズを装着して成るＬＥＤ照明基板を製造するＬＥＤ照明基板の製造方法であって、前記複数のＬＥＤ素子が素子実装位置に実装された基板を対象として、前記光拡散レンズを装着する装着基準位置を検出する装着基準位置検出工程と、前記基板の前記素子実装位置に光拡散レンズを固着するための接着剤を塗布する接着剤塗布工程と、前記装着基準位置検出工程にて検出された装着基準位置に基づき、前記光拡散レンズを各ＬＥＤ素子に装着して前記接着剤に接触させるレンズ装着工程と、前記レンズ装着工程後の基板を加熱することにより前記接着剤を硬化させて前記光拡散レンズを基板に固着する接着剤硬化工程とを含む。   The manufacturing method of the LED lighting board of the present invention is a manufacturing method of an LED lighting board that manufactures an LED lighting board in which a plurality of LED elements mounted on a board are used as light sources and a light diffusion lens is individually attached to the LED elements. A mounting reference position detecting step for detecting a mounting reference position for mounting the light diffusing lens for a substrate on which the plurality of LED elements are mounted at an element mounting position; and light at the element mounting position of the substrate. An adhesive application step for applying an adhesive for fixing the diffusion lens, and the adhesive agent by attaching the light diffusion lens to each LED element based on the attachment reference position detected in the attachment reference position detection step. A lens mounting step for contacting the substrate, and an adhesive curing step for fixing the light diffusion lens to the substrate by curing the adhesive by heating the substrate after the lens mounting step. Including.

本発明によれば、複数のＬＥＤ素子が素子実装位置に実装された基板を対象として、光拡散レンズを装着する装着基準位置を検出しておき、基板への接着剤塗布後のレンズ装着に際しては、検出された装着基準位置に基づき光拡散レンズを各ＬＥＤ素子に装着することにより、ＬＥＤ素子に対して適正位置に光拡散レンズを装着することができ、ＬＥＤ照明基板の製造において低コストで良好な照明特性を確保することができる。   According to the present invention, a mounting reference position for mounting a light diffusing lens is detected for a substrate on which a plurality of LED elements are mounted at an element mounting position, and the lens is mounted after applying an adhesive to the substrate. By attaching a light diffusing lens to each LED element based on the detected mounting reference position, it is possible to attach the light diffusing lens at an appropriate position with respect to the LED element, and it is good at low cost in the manufacture of the LED lighting board Can be ensured.

本発明の一実施の形態のＬＥＤ照明基板の製造システムの構成を示すブロック図The block diagram which shows the structure of the manufacturing system of the LED illumination board of one embodiment of this invention 本発明の一実施の形態のＬＥＤ照明基板の製造方法の各工程を示すフロー図The flowchart which shows each process of the manufacturing method of the LED lighting board of one embodiment of this invention 本発明の一実施の形態のＬＥＤ照明基板の製造方法の工程説明図Process explanatory drawing of the manufacturing method of the LED lighting board of one embodiment of this invention 本発明の一実施の形態のＬＥＤ照明基板の製造方法の工程説明図Process explanatory drawing of the manufacturing method of the LED lighting board of one embodiment of this invention 本発明の一実施の形態のＬＥＤ照明基板の製造方法の工程説明図Process explanatory drawing of the manufacturing method of the LED lighting board of one embodiment of this invention 本発明の一実施の形態のＬＥＤ照明基板の製造方法の工程説明図Process explanatory drawing of the manufacturing method of the LED lighting board of one embodiment of this invention 本発明の一実施の形態のＬＥＤ照明基板の製造方法の工程説明図Process explanatory drawing of the manufacturing method of the LED lighting board of one embodiment of this invention 本発明の一実施の形態のＬＥＤ照明基板の製造方法の工程説明図Process explanatory drawing of the manufacturing method of the LED lighting board of one embodiment of this invention

次に本発明の実施の形態を図面を参照して説明する。まず図１を参照して、ＬＥＤ照明基板の製造システム１の構成を説明する。ＬＥＤ照明基板の製造システム１は、基板に実装された複数のＬＥＤ素子を光源とし、ＬＥＤ素子に個別に光拡散レンズを装着して成るＬＥＤ照明基板を製造する機能を有するものである。ＬＥＤ照明基板の製造システム１は、基板４（図３参照）にＬＥＤ素子１２（図４参照）を実装する作業を実行するための複数の装置を連結したＬＥＤ実装ライン１ａと、ＬＥＤ素子が実装された後の基板に光拡散レンズ２６（図７参照）を装着する作業を実行するための複数の装置を連結したレンズ装着ライン１ｂに大別される。   Next, embodiments of the present invention will be described with reference to the drawings. First, the configuration of the LED illumination board manufacturing system 1 will be described with reference to FIG. The LED illumination board manufacturing system 1 has a function of manufacturing an LED illumination board in which a plurality of LED elements mounted on a board are used as a light source and a light diffusion lens is individually attached to the LED elements. The LED illumination board manufacturing system 1 includes an LED mounting line 1a in which a plurality of devices for performing an operation of mounting an LED element 12 (see FIG. 4) on a board 4 (see FIG. 3) is connected, and the LED element is mounted. It is roughly divided into a lens mounting line 1b in which a plurality of devices for executing the operation of mounting the light diffusing lens 26 (see FIG. 7) on the substrate after being connected.

ＬＥＤ実装ライン１ａ、レンズ装着ライン１ｂを構成する各装置はＬＡＮシステム２を介して相互の接続されており、さらに管理コンピュータ３に接続されている。なおＬＥＤ実装ライン１ａ、レンズ装着ライン１ｂは一繋ぎの一連の製造ラインとして配置してもよく、ＬＥＤ実装ライン１ａ、レンズ装着ライン１ｂを独立した製造ラインとして、ＬＥＤ実装ライン１ａ、レンズ装着ライン１ｂ間で中間製品の基板４を搬送する（矢印ａ）ようにしてもよい。   The devices constituting the LED mounting line 1 a and the lens mounting line 1 b are connected to each other via the LAN system 2 and further connected to the management computer 3. The LED mounting line 1a and the lens mounting line 1b may be arranged as a series of manufacturing lines. The LED mounting line 1a and the lens mounting line 1b are independent manufacturing lines. The substrate 4 of the intermediate product may be conveyed between them (arrow a).

ここでＬＥＤ実装ライン１ａを構成する各装置について説明する。印刷装置Ｍ１は、照明基板を構成するベースとなる基板４に部品接合用の半田を印刷する。印刷検査装置Ｍ２は、基板４に印刷された半田の印刷位置や半田量などの印刷状態を検査する。部品実装装置Ｍ３は、半田印刷後の基板４にＬＥＤ素子１２を実装する。実装検査装置Ｍ４は、基板４におけるＬＥＤ素子１２の位置などの実装状態を検査する。リフロー装置Ｍ５は、ＬＥＤ素子実装後の基板４を加熱して半田を溶融させＬＥＤ素子１２を基板４に接合する。   Here, each apparatus which comprises LED mounting line 1a is demonstrated. The printing apparatus M1 prints solder for component joining on the substrate 4 serving as a base constituting the illumination substrate. The print inspection apparatus M2 inspects the printing state such as the printing position and the amount of solder printed on the substrate 4. The component mounting apparatus M3 mounts the LED element 12 on the board 4 after solder printing. The mounting inspection device M4 inspects the mounting state such as the position of the LED element 12 on the substrate 4. The reflow device M5 heats the substrate 4 after the LED elements are mounted, melts the solder, and joins the LED elements 12 to the substrate 4.

次いでレンズ装着ライン１ｂを構成する各装置について説明する。位置検出装置Ｍ６は、ＬＥＤ素子１２が実装された基板４を対象として所定の計測作業を行うことにより、光拡散レンズ２６を装着するための装着基準位置を検出する。接着剤塗布装置Ｍ７は、装着基準位置を検出後の基板４に光拡散レンズ２６を固着するための接着剤を塗布する。レンズ装着装置Ｍ８は、接着剤が塗布された後の基板４に光拡散レンズ２６を装着する。キュア装置Ｍ９は、光拡散レンズ２６が装着された後の基板４を加熱することにより接着剤を熱硬化させる。   Next, each device constituting the lens mounting line 1b will be described. The position detection device M6 detects a mounting reference position for mounting the light diffusion lens 26 by performing a predetermined measurement operation on the substrate 4 on which the LED element 12 is mounted. The adhesive application device M7 applies an adhesive for fixing the light diffusion lens 26 to the substrate 4 after detecting the mounting reference position. The lens mounting device M8 mounts the light diffusion lens 26 on the substrate 4 after the adhesive is applied. The curing device M9 heats the adhesive by heating the substrate 4 after the light diffusion lens 26 is mounted.

次に、ＬＥＤ照明基板の製造処理フローについて、図２に示すフローに則して図３以下の各図を参照しながら説明する。図３（ａ）に示すように、照明基板を構成するベースとなる基板４においてＬＥＤ素子１２が実装される素子実装位置には、ＬＥＤ素子を接合するための電極４ａが形成されている。なお、図示例では電極４ａが１つのみ図示されているが、実際に照明基板として用いられる基板４では複数の電極４ａのそれぞれについてＬＥＤ素子１２が実装される。   Next, the manufacturing process flow of the LED illumination board will be described in accordance with the flow shown in FIG. 2 with reference to FIGS. As shown in FIG. 3A, an electrode 4a for joining the LED element is formed at the element mounting position where the LED element 12 is mounted on the substrate 4 serving as a base constituting the illumination board. Although only one electrode 4a is illustrated in the illustrated example, the LED element 12 is mounted on each of the plurality of electrodes 4a on the substrate 4 that is actually used as the illumination substrate.

基板４はまず印刷装置Ｍ１に搬入され、ここで基板４を対象としてスクリーン印刷が行われる（ＳＴ１）。これにより、図３（ｂ）に示すように、電極４ａ上には部品接合用の半田ペースト５が印刷される。次いで基板４は印刷検査装置Ｍ２に搬入される。ここでは図３（ｃ）に示すように、半田ペースト５が印刷された基板４は検査用カメラ６によって撮像され、この撮像結果を印刷検査処理部７によって検査処理することにより、基板４における半田ペースト５の印刷状態の良否が検査される（ＳＴ２）。そして印刷検査結果により良品であると判定された基板４は、部品実装装置Ｍ３に搬入され、ここで図３（ｄ）に示すように、実装ヘッド８に保持されたＬＥＤパッケージ９を、基板４に印刷された半田ペースト５上に着地させる（ＳＴ３）。   The substrate 4 is first carried into the printing apparatus M1, where screen printing is performed on the substrate 4 (ST1). As a result, as shown in FIG. 3B, the solder paste 5 for component joining is printed on the electrode 4a. Next, the substrate 4 is carried into the printing inspection apparatus M2. Here, as shown in FIG. 3C, the substrate 4 on which the solder paste 5 is printed is imaged by the inspection camera 6, and the image pickup result is inspected by the print inspection processing unit 7, whereby the solder on the substrate 4 is soldered. The quality of the printing state of the paste 5 is inspected (ST2). Then, the substrate 4 determined to be a non-defective product based on the print inspection result is carried into the component mounting apparatus M3, where the LED package 9 held by the mounting head 8 is replaced with the substrate 4 as shown in FIG. Is landed on the solder paste 5 printed on (ST3).

図４（ａ）は、ＬＥＤパッケージ９の概略構成を示している。ここでは、単体のＬＥＤ素子１２を個片基板１０に設けられたＬＥＤ実装部１１内に予め実装した後に、ＬＥＤ素子１２を発光性の樹脂１３によって樹脂封止してＬＥＤパッケージ９を構成し、このＬＥＤパッケージ９の状態のＬＥＤ素子１２を基板４に実装する例を示している。もちろん、単体のＬＥＤ素子１２を直接基板４に半田接合により実装して照明基板を製造する構成であってもよい。   FIG. 4A shows a schematic configuration of the LED package 9. Here, after the single LED element 12 is mounted in advance in the LED mounting portion 11 provided on the individual substrate 10, the LED element 12 is resin-sealed with a light emitting resin 13 to form the LED package 9, The example which mounts the LED element 12 of the state of this LED package 9 on the board | substrate 4 is shown. Of course, the structure which manufactures an illumination board | substrate by mounting the single LED element 12 to the board | substrate 4 by solder joining directly may be sufficient.

次にＬＥＤ実装済みの基板４は実装検査装置Ｍ４に搬入される。ここでは図４（ｂ）に示すように、ＬＥＤパッケージ９が実装された基板４は検査用カメラ１４によって撮像され、この撮像結果を実装検査処理部１５によって検査処理することにより、ＬＥＤパッケージ９の位置や姿勢など基板４におけるＬＥＤパッケージ９の実装状態の良否が検査される（ＳＴ４）。実装検査結果により良品であると判定された基板４は、リフロー装置Ｍ５に搬入される。そしてここで所定の加熱プロファイルで基板４を加熱することにより、図４（ｃ）に示すように、半田ペースト５が溶融固化してＬＥＤパッケージ９を基板４に半田接合する半田接合部５＊が形成される（ＳＴ５）。   Next, the LED-mounted substrate 4 is carried into the mounting inspection apparatus M4. Here, as shown in FIG. 4B, the substrate 4 on which the LED package 9 is mounted is imaged by the inspection camera 14, and this imaging result is inspected by the mounting inspection processing unit 15, whereby the LED package 9. The mounting condition of the LED package 9 on the substrate 4 such as position and orientation is inspected (ST4). The substrate 4 determined to be a non-defective product based on the mounting inspection result is carried into the reflow apparatus M5. And by heating the board | substrate 4 with a predetermined heating profile here, as shown in FIG.4 (c), as shown in FIG.4 (c), the soldering joint 5 * which the solder paste 5 melts and solidifies and solders the LED package 9 to the board | substrate 4 is shown. It is formed (ST5).

図５（ａ）はこのようにしてＬＥＤパッケージ９が実装された基板４の平面を示している。このとき、部品実装装置Ｍ３における部品搭載位置精度や、リフロー装置Ｍ５における半田接合時のＬＥＤパッケージ９の表面張力による移動などに起因して、半田接合後のＬＥＤパッケージ９は必ずしも設計情報によって規定される正規位置にあるとは限らず、Ｘ方向、Ｙ方向のいずれについても幾分かの位置ずれが存在する。そしてこのような位置ずれ状態のＬＥＤパッケージ９に対して設計情報に示される正規位置に光拡散レンズ２６を装着すると、発光源であるＬＥＤ素子１２に対して光拡散レンズ２６の光軸が正しく位置合わせされず、光拡散特性にばらつきを生じる。このため本実施の形態においては、光拡散レンズ２６の装着に先立って、基板４におけるＬＥＤ素子１２の位置又はＬＥＤ素子１２による照明光の輝度中心位置を、光拡散レンズ２６を装着するための装着基準位置として予め検出するようにしている。   FIG. 5A shows the plane of the substrate 4 on which the LED package 9 is mounted in this way. At this time, the LED package 9 after solder bonding is not necessarily defined by the design information due to the component mounting position accuracy in the component mounting apparatus M3 and the movement due to the surface tension of the LED package 9 during solder bonding in the reflow apparatus M5. It is not necessarily in the normal position, and there is some misalignment in both the X direction and the Y direction. When the light diffusing lens 26 is mounted at the normal position shown in the design information with respect to the LED package 9 in such a misaligned state, the optical axis of the light diffusing lens 26 is correctly positioned with respect to the LED element 12 that is a light emitting source. The light diffusion characteristics are varied without being matched. Therefore, in the present embodiment, prior to mounting the light diffusing lens 26, the position of the LED element 12 on the substrate 4 or the luminance center position of the illumination light by the LED element 12 is mounted to mount the light diffusing lens 26. The reference position is detected in advance.

すなわちＬＥＤパッケージ９が実装された後の基板４は、位置検出装置Ｍ６に搬入される。ここでは図５（ｂ）に示すように、ＬＥＤパッケージ９が実装された基板４は位置検出用カメラ１６によって撮像され、この撮像結果を実装位置検出部１７によって位置検出処理することにより、基板４におけるＬＥＤパッケージ９の位置が検出される。この位置検出においては、図５（ｃ）に示すように、ＬＥＤパッケージ９におけるＬＥＤ素子１２の中心位置を、Ｘ方向、Ｙ方向の位置座標として検出する。   That is, the substrate 4 after the LED package 9 is mounted is carried into the position detection device M6. Here, as shown in FIG. 5B, the substrate 4 on which the LED package 9 is mounted is imaged by the position detection camera 16, and the image detection result is subjected to position detection processing by the mounting position detection unit 17. The position of the LED package 9 is detected. In this position detection, as shown in FIG. 5C, the center position of the LED element 12 in the LED package 9 is detected as position coordinates in the X direction and the Y direction.

そしてこの位置検出結果は、光拡散レンズ２６を装着するための装着基準位置としてレンズ装着装置Ｍ８の実装制御部へ、フィードフォワードデータとしてＬＡＮシステム２を介して出力される（ＳＴ６）。すなわち複数のＬＥＤ素子１２が素子実装位置に実装された基板４を対象として、光拡散レンズ２６を装着する装着基準位置を検出する（装着基準位置検出工程）。そして図５に示す例では、装着基準位置検出工程においてＬＥＤ素子１２の位置を光学的に検出した位置検出結果に基づいて、装着基準位置を検出するようにしている。   The position detection result is output as feedforward data via the LAN system 2 to the mounting control unit of the lens mounting apparatus M8 as a mounting reference position for mounting the light diffusing lens 26 (ST6). That is, the mounting reference position for mounting the light diffusion lens 26 is detected for the substrate 4 on which the plurality of LED elements 12 are mounted at the element mounting positions (mounting reference position detecting step). In the example shown in FIG. 5, the mounting reference position is detected based on the position detection result obtained by optically detecting the position of the LED element 12 in the mounting reference position detecting step.

なおＬＥＤ素子１２の位置を光学的に検出して、位置検出用カメラ１６の装着基準位置とする代わりに、図６に示すように、ＬＥＤ素子１２が発光する照明光の輝度分布を基準とするようにしてもよい。すなわち、図６（ａ）に示すように、ＬＥＤパッケージ９が実装された後の基板４は、位置検出装置Ｍ６Ａに搬入される。ここでは基板４の上方には暗室部２１を備えた光検出部２２が位置しており、光検出部２２をＬＥＤパッケージ９に対して下降させることにより、暗室部２１によって閉囲された計測空間が形成される。   Instead of optically detecting the position of the LED element 12 and setting it as the reference position for mounting the position detection camera 16, as shown in FIG. 6, the luminance distribution of the illumination light emitted from the LED element 12 is used as a reference. You may do it. That is, as shown in FIG. 6A, the substrate 4 after the LED package 9 is mounted is carried into the position detection device M6A. Here, the light detection unit 22 including the dark room part 21 is located above the substrate 4, and the measurement space enclosed by the dark room part 21 by lowering the light detection unit 22 with respect to the LED package 9. Is formed.

この状態で電源装置２０によってＬＥＤパッケージ９に電力を供給してＬＥＤ素子１２を発光させ、発光された照明光を光検出部２２によって受光する。そしてこの受光結果を輝度分布検出部２３が処理することにより、図６（ｂ）に示すように、ＬＥＤ素子１２から発光される照明光の輝度分布を示す計測曲線Ｌにおける輝度中心ＣＰが、Ｘ方向、Ｙ方向について求められる。そして輝度中心ＣＰを示すデータは、同様にレンズ装着装置Ｍ８の実装制御部へフィードフォワードデータとしてＬＡＮシステム２を介して出力される。   In this state, power is supplied to the LED package 9 by the power supply device 20 to cause the LED element 12 to emit light, and the emitted illumination light is received by the light detection unit 22. Then, the luminance distribution detection unit 23 processes the light reception result, so that the luminance center CP in the measurement curve L indicating the luminance distribution of the illumination light emitted from the LED element 12 becomes X as shown in FIG. It is obtained for the direction and the Y direction. Similarly, data indicating the luminance center CP is output via the LAN system 2 as feedforward data to the mounting control unit of the lens mounting device M8.

すなわち、図６に示す例では、装着基準位置検出工程において、ＬＥＤ素子１２が発光する照明光の輝度中心ＣＰを検出した輝度中心検出結果に基づいて、光拡散レンズ２６の装着基準位置を検出するようにしている。このような方法を採用することにより、ＬＥＤ素子１２の発光特性において輝度分布に偏りがある場合においても、光拡散レンズ２６を正しい位置に装着することができる。   That is, in the example illustrated in FIG. 6, in the mounting reference position detection step, the mounting reference position of the light diffusion lens 26 is detected based on the brightness center detection result obtained by detecting the brightness center CP of the illumination light emitted from the LED element 12. I am doing so. By adopting such a method, the light diffusing lens 26 can be mounted at the correct position even when the luminance distribution of the LED element 12 is uneven in luminance distribution.

次に、基板４の素子実装位置に光拡散レンズ２６を固着するための接着剤を光拡散レンズ２６に転写する（接着剤転写工程）（ＳＴ７）。すなわち、基板４は接着剤塗布装置Ｍ７に搬入され、図７（ａ）、（ｂ）に示すように、基板４の上面におけるＬＥＤパッケージ９の周囲には、ディスペンサ２４によってエポキシ樹脂などの接着剤２５が複数点塗布される。   Next, an adhesive for fixing the light diffusion lens 26 to the element mounting position of the substrate 4 is transferred to the light diffusion lens 26 (adhesive transfer step) (ST7). That is, the substrate 4 is carried into the adhesive application device M7, and as shown in FIGS. 7A and 7B, an adhesive such as an epoxy resin is provided around the LED package 9 on the upper surface of the substrate 4 by the dispenser 24. 25 is applied at a plurality of points.

次に接着剤塗布後の基板４に対して光拡散レンズ２６の装着が行われる（ＳＴ８）。すなわち基板４はレンズ装着装置Ｍ８に搬入され、実装ヘッド２７によって保持された光拡散レンズ２６をＬＥＤパッケージ９を覆って装着し、基板４に塗布された接着剤２５に接触させる。光拡散レンズ２６は、ＬＥＤパッケージ９のＬＥＤ素子１２が発光した照明光を水平方向に拡散させることにより、少ない数のＬＥＤ素子１２によって極力広い照明範囲を確保することを目的として装着されるものである。このように光拡散レンズ２６はＬＥＤパッケージ９の上方を覆って装着されるため、本実施の形態に示す例では、光拡散レンズ２６の下面側にはＬＥＤパッケージ９との干渉を避けるための凹部２６ａが設けられている。なお、光拡散レンズ２６の形状としては、下面に凹部２６ａが設けられたもの以外にも、下面側に接着剤２５による接着用の凸部が設けられたものなど、多様な形状のものを適宜選択して用いることができる。   Next, the light diffusion lens 26 is attached to the substrate 4 after application of the adhesive (ST8). That is, the substrate 4 is carried into the lens mounting device M8, the light diffusion lens 26 held by the mounting head 27 is mounted covering the LED package 9, and is brought into contact with the adhesive 25 applied to the substrate 4. The light diffusion lens 26 is mounted for the purpose of ensuring a wide illumination range as much as possible with a small number of LED elements 12 by diffusing the illumination light emitted by the LED elements 12 of the LED package 9 in the horizontal direction. is there. Thus, since the light diffusion lens 26 is mounted so as to cover the upper side of the LED package 9, in the example shown in the present embodiment, a recess for avoiding interference with the LED package 9 is provided on the lower surface side of the light diffusion lens 26. 26a is provided. As the shape of the light diffusing lens 26, in addition to those having a concave portion 26a on the lower surface, those having various shapes such as those having a convex portion for bonding with the adhesive 25 on the lower surface side are appropriately used. It can be selected and used.

この光拡散レンズ２６の装着においては、実装ヘッド２７を移動させるレンズ実装機構２８を実装制御部２９によって制御することにより、光拡散レンズ２６のＬＥＤ素子１２に対する位置合わせが行われる。このとき、実装制御部２９には位置検出装置Ｍ６の実装位置検出部１７、あるいは位置検出装置Ｍ６Ａの輝度分布検出部２３から、光拡散レンズ２６の装着基準位置を示すデータがフィードフォワードされており、レンズ実装機構２８はこの装着基準位置にしたがって、光拡散レンズ２６をＬＥＤ素子１２に対して位置合わせする。これにより、図７（ｄ）に示すように、光拡散レンズ２６の光軸点２６ｂは予め検出された装着基準位置に位置合わせされる。すなわちここでは、装着基準位置検出工程にて検出された装着基準位置に基づき、光拡散レンズ２６を各ＬＥＤパッケージ９が備えたＬＥＤ素子１２に装着して接着剤２５に接触させる（レンズ装着工程）。   In mounting the light diffusing lens 26, the lens mounting mechanism 28 that moves the mounting head 27 is controlled by the mounting control unit 29, thereby aligning the light diffusing lens 26 with the LED element 12. At this time, the mounting control unit 29 is fed forward with data indicating the mounting reference position of the light diffusion lens 26 from the mounting position detection unit 17 of the position detection device M6 or the luminance distribution detection unit 23 of the position detection device M6A. The lens mounting mechanism 28 aligns the light diffusing lens 26 with respect to the LED element 12 according to the mounting reference position. Accordingly, as shown in FIG. 7D, the optical axis point 26b of the light diffusing lens 26 is aligned with the mounting reference position detected in advance. That is, here, based on the mounting reference position detected in the mounting reference position detection step, the light diffusion lens 26 is mounted on the LED element 12 provided in each LED package 9 and brought into contact with the adhesive 25 (lens mounting step). .

この後接着剤２５の熱硬化が行われる（ＳＴ９）。すなわち図８（ａ）に示すように、レンズ装着後の基板４はキュア装置Ｍ９に搬入され、ここで所定加熱条件で加熱される。これにより、接着剤２５が熱硬化し、図８（ｂ）、（ｃ）に示すように、基板４に実装されたＬＥＤパッケージ９を上方から覆って装着された光拡散レンズ２６を基板４に固着する樹脂固着部２５＊が形成される（接着剤硬化工程）。   Thereafter, the adhesive 25 is thermally cured (ST9). That is, as shown in FIG. 8A, the substrate 4 after the lens is mounted is carried into the curing device M9, where it is heated under predetermined heating conditions. As a result, the adhesive 25 is thermally cured, and the light diffusion lens 26 mounted so as to cover the LED package 9 mounted on the substrate 4 from above is attached to the substrate 4 as shown in FIGS. 8B and 8C. A resin fixing part 25 * to be fixed is formed (adhesive curing step).

上記説明したように、本実施の形態に示すＬＥＤ照明基板の製造方法においては、複数のＬＥＤ素子１２が素子実装位置に実装された基板４を対象として、光拡散レンズ２６を装着する装着基準位置を予め検出しておき、基板４への接着剤２５塗布後のレンズ装着に際しては、検出された装着基準位置に基づき光拡散レンズ２６を各ＬＥＤ素子１２に装着するようにしている。これにより、ＬＥＤ素子１２に対して適正位置に光拡散レンズ２６を装着することができ、ＬＥＤ照明基板の製造において低コストで良好な照明特性を確保することができる。   As described above, in the method for manufacturing the LED illumination board shown in the present embodiment, the mounting reference position for mounting the light diffusion lens 26 on the substrate 4 on which the plurality of LED elements 12 are mounted at the element mounting position. Is detected in advance, and when the lens is mounted after the adhesive 25 is applied to the substrate 4, the light diffusion lens 26 is mounted on each LED element 12 based on the detected mounting reference position. Thereby, the light diffusion lens 26 can be attached to the LED element 12 at an appropriate position, and good illumination characteristics can be ensured at low cost in the manufacture of the LED illumination board.

本発明のＬＥＤ照明基板の製造方法は、低コストで良好な照明特性を確保することができるという効果を有し、複数のＬＥＤ素子を基板に実装して構成されたＬＥＤ照明基板を製造する技術分野において有用である。   The manufacturing method of the LED lighting board of the present invention has an effect that good lighting characteristics can be secured at low cost, and a technique for manufacturing an LED lighting board configured by mounting a plurality of LED elements on a board. Useful in the field.

１ ＬＥＤ照明基板の製造システム
４ 基板
４ａ 電極
５ 半田ペースト
５＊ 半田接合部
９ ＬＥＤパッケージ
１２ ＬＥＤ素子
２５ 接着剤
２６ 光拡散レンズ DESCRIPTION OF SYMBOLS 1 LED illumination board manufacturing system 4 Board | substrate 4a Electrode 5 Solder paste 5 * Solder junction part 9 LED package 12 LED element 25 Adhesive 26 Light diffusion lens

Claims (3)

基板に実装された複数のＬＥＤ素子を光源とし前記ＬＥＤ素子に個別に光拡散レンズを装着して成るＬＥＤ照明基板を製造するＬＥＤ照明基板の製造方法であって、
前記複数のＬＥＤ素子が素子実装位置に実装された基板を対象として、前記光拡散レンズを装着する装着基準位置を検出する装着基準位置検出工程と、
前記基板の前記素子実装位置に光拡散レンズを固着するための接着剤を塗布する接着剤塗布工程と、
前記装着基準位置検出工程にて検出された装着基準位置に基づき、前記光拡散レンズを各ＬＥＤ素子に装着して前記接着剤に接触させるレンズ装着工程と、
前記レンズ装着工程後の基板を加熱することにより前記接着剤を硬化させて前記光拡散レンズを基板に固着する接着剤硬化工程とを含むことを特徴とするＬＥＤ照明基板の製造方法。 A method of manufacturing an LED illumination board for producing an LED illumination board comprising a plurality of LED elements mounted on a substrate as a light source and individually attaching a light diffusion lens to the LED elements,
A mounting reference position detecting step for detecting a mounting reference position for mounting the light diffusing lens for a substrate on which the plurality of LED elements are mounted at an element mounting position;
An adhesive application step of applying an adhesive for fixing the light diffusion lens to the element mounting position of the substrate;
Based on the mounting reference position detected in the mounting reference position detection step, a lens mounting step of mounting the light diffusing lens on each LED element and contacting the adhesive,
A method of manufacturing an LED illumination board, comprising: an adhesive curing step of curing the adhesive by heating the substrate after the lens mounting step and fixing the light diffusion lens to the substrate. 前記装着基準位置検出工程において、前記ＬＥＤ素子の位置を光学的に検出した位置検出結果に基づいて、前記装着基準位置を検出することを特徴とする請求項１記載のＬＥＤ照明基板の製造方法。   2. The method of manufacturing an LED illumination board according to claim 1, wherein, in the mounting reference position detecting step, the mounting reference position is detected based on a position detection result obtained by optically detecting the position of the LED element. 前記装着基準位置検出工程において、前記ＬＥＤ素子が発光する照明光の輝度中心を検出した輝度中心検出結果に基づいて、前記装着基準位置を検出することを特徴とする請求項１記載のＬＥＤ照明基板の製造方法。   2. The LED illumination board according to claim 1, wherein, in the mounting reference position detecting step, the mounting reference position is detected based on a brightness center detection result obtained by detecting a brightness center of illumination light emitted from the LED element. Manufacturing method.
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130235187A1 (en) * 2012-03-07 2013-09-12 Hon Hai Precision Industry Co., Ltd. Position checking device of led of led light bar
JP2014135482A (en) * 2012-12-11 2014-07-24 Hitachi High-Tech Instruments Co Ltd Component mounting device
JP2015233121A (en) * 2014-06-09 2015-12-24 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． Defect inspection method of light source module, and manufacturing method of light source module
US10217675B2 (en) 2013-02-28 2019-02-26 A.B. Mikroelektronik Gesellschaft Mit Beschraenkter Haftung Placement method for circuit carrier and circuit carrier

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010245467A (en) * 2009-04-10 2010-10-28 Siix Corp Method of mounting transparent component
JP2011040376A (en) * 2009-07-14 2011-02-24 Sharp Corp Surface light-emitting unit, and manufacturing method therefor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010245467A (en) * 2009-04-10 2010-10-28 Siix Corp Method of mounting transparent component
JP2011040376A (en) * 2009-07-14 2011-02-24 Sharp Corp Surface light-emitting unit, and manufacturing method therefor

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130235187A1 (en) * 2012-03-07 2013-09-12 Hon Hai Precision Industry Co., Ltd. Position checking device of led of led light bar
US9151596B2 (en) * 2012-03-07 2015-10-06 Hon Hai Precision Industry Co., Ltd. Position checking device of LED of LED light bar
JP2014135482A (en) * 2012-12-11 2014-07-24 Hitachi High-Tech Instruments Co Ltd Component mounting device
US10217675B2 (en) 2013-02-28 2019-02-26 A.B. Mikroelektronik Gesellschaft Mit Beschraenkter Haftung Placement method for circuit carrier and circuit carrier
US10672672B2 (en) 2013-02-28 2020-06-02 Ab Mikroelektronik Gesellschaft Mit Beschraenkter Haftung Placement method for circuit carrier and circuit carrier
US10991632B2 (en) 2013-02-28 2021-04-27 Ab Mikroelektronik Gesellschaft Mit Beschraenkter Haftung Assembly process for circuit carrier and circuit carrier
JP2015233121A (en) * 2014-06-09 2015-12-24 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． Defect inspection method of light source module, and manufacturing method of light source module
US9546926B2 (en) 2014-06-09 2017-01-17 Samsung Electronics Co., Ltd. Method of inspecting a light source module for defects, method of manufacturing a light source module, and apparatus for inspecting a light source module

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