CN104037301B - 一种LED灯板的cob封装方法 - Google Patents
一种LED灯板的cob封装方法 Download PDFInfo
- Publication number
- CN104037301B CN104037301B CN201410210763.9A CN201410210763A CN104037301B CN 104037301 B CN104037301 B CN 104037301B CN 201410210763 A CN201410210763 A CN 201410210763A CN 104037301 B CN104037301 B CN 104037301B
- Authority
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- China
- Prior art keywords
- copper
- substrate
- clad plate
- pond
- radiating surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 9
- 238000012856 packing Methods 0.000 title claims abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 53
- 239000003292 glue Substances 0.000 claims abstract description 16
- 230000005855 radiation Effects 0.000 claims abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 17
- 239000010949 copper Substances 0.000 claims description 17
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 239000004411 aluminium Substances 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 5
- 230000009977 dual effect Effects 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410210763.9A CN104037301B (zh) | 2014-05-19 | 2014-05-19 | 一种LED灯板的cob封装方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410210763.9A CN104037301B (zh) | 2014-05-19 | 2014-05-19 | 一种LED灯板的cob封装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104037301A CN104037301A (zh) | 2014-09-10 |
CN104037301B true CN104037301B (zh) | 2017-06-30 |
Family
ID=51467998
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410210763.9A Expired - Fee Related CN104037301B (zh) | 2014-05-19 | 2014-05-19 | 一种LED灯板的cob封装方法 |
Country Status (1)
Country | Link |
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CN (1) | CN104037301B (zh) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102374506A (zh) * | 2010-08-26 | 2012-03-14 | 江苏均英光电有限公司 | 一种大功率led散热装置 |
CN102740592A (zh) * | 2012-07-09 | 2012-10-17 | 苏州港菱光电有限公司 | 一种改善散热性的电路板 |
CN102832324A (zh) * | 2012-09-04 | 2012-12-19 | 江苏尚明光电有限公司 | 一种大功率led封装结构 |
CN103066193A (zh) * | 2011-10-19 | 2013-04-24 | 北京瑞阳安科技术有限公司 | 一种新型led散热结构 |
CN203941949U (zh) * | 2014-05-19 | 2014-11-12 | 西安信唯信息科技有限公司 | 一种led灯板的cob封装装置 |
-
2014
- 2014-05-19 CN CN201410210763.9A patent/CN104037301B/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102374506A (zh) * | 2010-08-26 | 2012-03-14 | 江苏均英光电有限公司 | 一种大功率led散热装置 |
CN103066193A (zh) * | 2011-10-19 | 2013-04-24 | 北京瑞阳安科技术有限公司 | 一种新型led散热结构 |
CN102740592A (zh) * | 2012-07-09 | 2012-10-17 | 苏州港菱光电有限公司 | 一种改善散热性的电路板 |
CN102832324A (zh) * | 2012-09-04 | 2012-12-19 | 江苏尚明光电有限公司 | 一种大功率led封装结构 |
CN203941949U (zh) * | 2014-05-19 | 2014-11-12 | 西安信唯信息科技有限公司 | 一种led灯板的cob封装装置 |
Also Published As
Publication number | Publication date |
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CN104037301A (zh) | 2014-09-10 |
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Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20170522 Address after: 518001 Guangdong city of Shenzhen province Luohu District Garden Street Baoan Songyuan Road No. 48 West Hongling hotel room 208 Applicant after: Yver (Shenzhen) Optoelectronics Technology Co.,Ltd. Address before: 710077 Xi'an province hi tech West Road, Jin Jin Road, No. 69 apartment building Applicant before: Xi'an Xinwei Information Technology Co.,Ltd. |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20200302 Address after: Room 505, Block B, Gazelle Valley, 69 Banjinye Road, Zhangbajie, Xi'an High-tech Zone, Shaanxi Province, 710000 Patentee after: SHAANXI DENGLING INFORMATION TECHNOLOGY Co.,Ltd. Address before: 518001 Guangdong city of Shenzhen province Luohu District Garden Street Baoan Songyuan Road No. 48 West Hongling hotel room 208 Patentee before: Yver (Shenzhen) Optoelectronics Technology Co.,Ltd. |
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TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170630 |
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CF01 | Termination of patent right due to non-payment of annual fee |