CN104007797B

CN104007797B - Computer cooling device

Info

Publication number: CN104007797B
Application number: CN201410243228.3A
Authority: CN
Inventors: 颜鸣; 颜一鸣
Original assignee: Jishou University
Current assignee: Jishou University
Priority date: 2014-06-04
Filing date: 2014-06-04
Publication date: 2017-05-10
Anticipated expiration: 2034-06-04
Also published as: CN104007797A

Abstract

The invention relates to a computer cooling device. The computer cooling device comprises a plurality of annular cooling metal fins; each annular cooling metal fin comprises a base, a heat absorbing layer, a heat-conducting layer and a cooling layer, wherein the heat absorbing layer, the heat-conducting layer and the cooling layer are all arranged on the base, the heat absorbing layer is located at the center of the base, the heat-conducting layer covers the heat absorbing layer, the cooling layer covers the heat-conducting layer; the base and the heat absorbing layer are made of the same materials which include 20%-40% of silicon, 30%-50% of copper, 5%-15% of gold and 10%-30% of aluminum in percentage by weight, and all the materials are evenly mixed together and then molded in a die-casting manner; the heat-conducting layer is made of materials including 20%-60% of aluminum and 40%-80% of copper in percentage by weight, and the materials are evenly mixed together and then molded in a die-casting manner; the cooling layer is made of aluminum. The computer cooling device is good in cooling effect and low in cost.

Description

A kind of computer heat radiating device

Technical field

The present invention relates to computer realm, more particularly to a kind of computer heat radiating device.

Background technology

The use of computer has obtained very big popularization, but the computer heat dispersion person of being used mostly most pays close attention to A bit, in hot summer, or in the region of work intensity concentration, such as Internet bar, intensive operational place etc., it is easy to make calculating Machine itself generates heat, when hot soak condition, it is easy to makes computer blue screen, or burns internal electronic devices and components, Cause the loss of vital document, lose great, and need repairing, cost of idleness and resource.

In prior art, people are radiated using the cooperation of aluminium base and fan, it is well known that, although aluminium Cost it is relatively low, but heat conductivility is not best, it is impossible to the very efficient temperature conduction by computer hardware goes out Come, so as to after long-term use, hardware comes because temperature cannot be transferred out effectively, so as to cause to burn.

The content of the invention

In view of this, it is necessary to which a kind of computer heat radiating device that can be effectively conducted and reduce hardware temperatures is provided.

The present invention is achieved in that a kind of computer heat radiating device, including multiple ring-type heat dissipation metal plates, the plurality of The diameter single-candidate of ring-type heat dissipation metal plate is successively decreased, and the little ring-type heat dissipation metal plate of diameter is arranged on the big ring-type heat radiating metal of diameter In piece inner chamber, and multiple ring-type heat dissipation metal plates are co-axially mounted, in the plurality of ring-type heat dissipation metal plate, in the ring-type of periphery Less than the interior ring-type heat dissipation metal plate for enclosing is in, the cross section of the ring-type heat dissipation metal plate is in bullet to the height of heat dissipation metal plate Shape, ring-type heat dissipation metal plate includes pedestal, heat-sink shell, heat-conducting layer and heat dissipating layer, and the heat-sink shell, heat-conducting layer and heat dissipating layer are all provided with On pedestal, and heat-sink shell is in the center of pedestal, and heat-conducting layer is wrapped on the outer surface of heat-sink shell, and heat dissipating layer is wrapped in leads On the outer surface of thermosphere；

The pedestal is identical with the material of heat-sink shell, by distributing by weight, by silicon 20%～40%, copper 30%～ 50%th, gold 5%～15% and aluminium 10%～30% are constituted, the die cast after uniform mixing；

The material of the heat-conducting layer is：By distributing by weight, it is made up of aluminium 20%～60% and copper 40%～80%, is led to Cross die cast after uniform mixing；

The material of the heat dissipating layer is aluminium.

Further, the pedestal is identical with the material of heat-sink shell, by distributing by weight, by silicon 30%, copper 40%, gold 10% and aluminium 20% constitute, the die cast after uniform mixing.

Further, the material of the heat-conducting layer is：By distributing by weight, it is made up of aluminium 40% and copper 60%, is passed through Die cast after uniform mixing.

The advantage of a kind of computer heat radiating device that the present invention is provided is：Present configuration advantages of simple, by by ring Shape heat dissipation metal plate is divided into the combining form of pedestal, heat-sink shell, heat-conducting layer and heat dissipating layer, because the material of pedestal and heat-sink shell is The combining form of silicon, copper, gold and aluminium, because the heat conductivility of silicon, copper, gold is far longer than the heat conductivility of aluminium, so as to be easy to The temperature on hardware is derived to come, lift the radiating rate of hardware, heat-conducting layer is mainly the combination of aluminium and copper, acts primarily as conduction The effect of heat, the material of heat dissipating layer is aluminium, the effect of radiating is acted primarily as, by the way that ring-type heat dissipation metal plate is designed to into bullet Shape, primarily to the area of dissipation outside increase, improves radiating efficiency, so as to avoid because hardware temperatures are too high, causes zero The phenomenon that part burns occurs, and saves great amount of cost resource.

Description of the drawings

Fig. 1 is a kind of front view of computer heat radiating device of the invention；

Fig. 2 is the top view in Fig. 1；

Fig. 3 is the A-A in Fig. 2 to sectional view.

Specific embodiment

In order that the objects, technical solutions and advantages of the present invention become more apparent, it is right below in conjunction with drawings and Examples The present invention is further elaborated.It should be appreciated that specific embodiment described herein is only to explain the present invention, and It is not used in the restriction present invention.

Fig. 1, Fig. 2 and Fig. 3 are seen also, wherein Fig. 1 is a kind of front view of computer heat radiating device of the invention；Fig. 2 For the top view in Fig. 1；Fig. 3 is the A-A in Fig. 2 to sectional view.

A kind of computer heat radiating device, including multiple ring-type heat dissipation metal plates 10, the plurality of ring-type heat radiating metal The diameter single-candidate of piece 10 is successively decreased, and the little ring-type heat dissipation metal plate 10 of diameter is arranged on the big inner chamber of ring-type heat dissipation metal plate 10 of diameter In, and multiple ring-type heat dissipation metal plates 10 are co-axially mounted, in the plurality of ring-type heat dissipation metal plate 10, the ring-type in periphery dissipates Less than the interior ring-type heat dissipation metal plate 10 for enclosing is in, the cross section of the ring-type heat dissipation metal plate 10 is in the height of thermometal piece 10 Bullet shaped, ring-type heat dissipation metal plate 10 includes pedestal 11, heat-sink shell 12, heat-conducting layer 13 and heat dissipating layer 14, the heat-sink shell 12, leads Thermosphere 13 and heat dissipating layer 14 are on pedestal 11, and center of the heat-sink shell 12 in pedestal 11, and heat-conducting layer 13 is wrapped in suction On the outer surface of thermosphere 12, heat dissipating layer 14 is wrapped on the outer surface of heat-conducting layer 13；

The pedestal 11 is identical with the material of heat-sink shell 12, by distributing by weight, by silicon 20%～40%, copper 30%～ 50%th, gold 5%～15% and aluminium 10%～30% are constituted, the die cast after uniform mixing；

The material of the heat-conducting layer 13 is：By distributing by weight, it is made up of aluminium 20%～60% and copper 40%～80%, The die cast after uniform mixing；

The material of the heat dissipating layer 14 is aluminium.

In practical operation, the pedestal 11 is identical with the material of heat-sink shell 12, by distributing by weight, by silicon 30%, copper 40%th, gold 10% and aluminium 20% are constituted, the die cast after uniform mixing, and the material of the heat-conducting layer 13 is：By by weight Score is matched somebody with somebody, and is made up of aluminium 40% and copper 60%, the die cast after uniform mixing, thus, required cost minimization, and thermal conductivity Can be splendid.

Present configuration advantages of simple, by the way that ring-type heat dissipation metal plate 10 is divided into into pedestal 11, heat-sink shell 12, heat-conducting layer 13 With the combining form of heat dissipating layer 14, due to pedestal 11 and heat-sink shell 12 material for silicon, copper, gold and aluminium combining form, due to Silicon, copper, the heat conductivility of gold are far longer than the heat conductivility of aluminium, so as to easily that the temperature derivation on hardware is next, are lifted The radiating rate of hardware, heat-conducting layer 13 is mainly the combination of aluminium and copper, acts primarily as the effect of conduction heat, the material of heat dissipating layer 14 For aluminium, the effect of radiating is acted primarily as, by the way that ring-type heat dissipation metal plate 10 is designed to into bullet shaped, primarily to outside increase Area of dissipation, improves radiating efficiency, so as to avoid because hardware temperatures are too high, causes the phenomenon that parts burn to occur, and saves Great amount of cost resource.

Presently preferred embodiments of the present invention is the foregoing is only, not to limit the present invention, all essences in the present invention Any modification, equivalent and improvement made within god and principle etc., should be included within the scope of the present invention.

Claims

1. a kind of computer heat radiating device, including multiple ring-type heat dissipation metal plates (10), it is characterised in that the plurality of ring-type dissipates The diameter single-candidate of thermometal piece (10) is successively decreased, and the little ring-type heat dissipation metal plate (10) of diameter is installed in the big ring-type radiating gold of diameter In category piece (10) inner chamber, and multiple ring-type heat dissipation metal plates (10) are co-axially mounted, in the plurality of ring-type heat dissipation metal plate (10), The height of the ring-type heat dissipation metal plate (10) in periphery dissipates less than the interior ring-type heat dissipation metal plate (10) for enclosing, the ring-type is in The cross section of thermometal piece (10) is in bullet shaped, and ring-type heat dissipation metal plate (10) includes pedestal (11), heat-sink shell (12), heat-conducting layer (13) and heat dissipating layer (14), the heat-sink shell (12), heat-conducting layer (13) and heat dissipating layer (14) are on pedestal (11), and absorb heat Center of the layer (12) in pedestal (11), heat-conducting layer (13) is wrapped on the outer surface of heat-sink shell (12), heat dissipating layer (14) bag It is rolled on the outer surface of heat-conducting layer (13)；

The pedestal (11) is identical with the material of heat-sink shell (12), by distributing by weight, by silicon 20%～40%, copper 30%～ 50%th, gold 5%～15% and aluminium 10%～30% are constituted, the die cast after uniform mixing；

The material of the heat-conducting layer (13) is：By distributing by weight, it is made up of aluminium 20%～60% and copper 40%～80%, is led to Cross die cast after uniform mixing；

The material of the heat dissipating layer (14) is aluminium.

2. a kind of computer heat radiating device according to claim 1, it is characterised in that the pedestal (11) and heat-sink shell (12) material is identical, by distributing by weight, is made up of silicon 30%, copper 40%, gold 10% and aluminium 20%, by uniform mixing Die cast afterwards.

3. a kind of computer heat radiating device according to claim 1, it is characterised in that the material of the heat-conducting layer (13) For：By distributing by weight, it is made up of aluminium 40% and copper 60%, the die cast after uniform mixing.