CN103994359B - A kind of processing method of Modular LED lamp bar - Google Patents
A kind of processing method of Modular LED lamp bar Download PDFInfo
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- CN103994359B CN103994359B CN201410255859.7A CN201410255859A CN103994359B CN 103994359 B CN103994359 B CN 103994359B CN 201410255859 A CN201410255859 A CN 201410255859A CN 103994359 B CN103994359 B CN 103994359B
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Abstract
The invention discloses a kind of Modular LED lamp bar and preparation method, comprise the cathode metal wire and negative metal wire that connect rectifier input, also comprise the cathode metal baseline and negative metal baseline that connect LED chip and rectifier output end, wherein cathode metal wire, negative metal wire, cathode metal baseline, negative metal baseline is parallel arrangement, and be provided with multiple by cathode metal wire, negative metal wire, cathode metal baseline, the plastic cement pedestal that negative metal baseline is laterally coated, plastic cement pedestal top has one for the storage tank of accommodating LED chip, the part of the exposed cathode metal baseline and negative metal baseline in order to weld LED chip electrode in bottom of this storage tank, in storage tank LED core unilateral on be also packaged with a photic zone.Adopt this technical scheme can effectively reduce the height of LED etc., such that processing is more simple and easy, working (machining) efficiency is higher, effectively reduce production cost, eliminates the trouble of circumscripted power line, make application more perfect.
Description
Technical field
The present invention relates to LED technical field, refer to paster LED, particularly one modular bonded LED lamp bar structure.
Background technology
Existing paster LED mainly adopts and sticks in PCB surface to realize luminescence, be applicable to SMT processing, can Reflow Soldering, the adopting surface mounted LED of this mode well solves brightness, visual angle, flatness, reliability, conforming problem, relative to the LED device of other form, it has the advantages such as vibration resistance is strong, welding point defect is low, high frequency characteristics is good, and can be implemented on very little area and encapsulate multiple LED chip.Adopt the LED after the encapsulation of PCB surface patch formula by contrast, electronic product volume-diminished, weight saving can be made, finally make application more perfect.But also to there is processing technology complexity in this PCB adopting surface mounted LED cause that difficulty of processing is large, efficiency is low, owing to needing to be applied to the thickness that PCB not only increases LED, also add production cost, the circumscripted power line connecting rectifier input in addition will pass through whole lamp support to realize the supply of power supply, particularly the LED daylight lamp of strip, increases difficulty of processing undoubtedly.
Summary of the invention
Need to be applied to the thickness that PCB not only increases LED to overcome existing paster LED, also add production cost and difficulty of processing, main purpose of the present invention is to provide a kind of modularity paster LED, this modularity paster LED structure is simple, broken away from the constraint of PCB, effectively reduce the height of LED, make processing more simple and easy, cost reduces.
Above-mentioned purpose is achieved by the following technical solution:
According to an aspect of the present invention, the invention provides a kind of modularity paster LED lamp bar, comprise: the cathode metal wire and the negative metal wire that connect rectifier input, also comprise the cathode metal baseline and negative metal baseline that connect LED chip and rectifier output end, by cathode metal wire, negative metal wire, cathode metal baseline, the micro-interval of negative metal baseline is parallel arrangement, and be arranged at intervals with multiple by its laterally completely coated plastic cement pedestal on these wires, this plastic cement pedestal top has a storage tank for accommodating LED chip and packaging plastic, the part of exposed cathode metal baseline and negative metal baseline in order to connect LED chip electrode bottom this storage tank, in storage tank LED core unilateral on be also packaged with a photic zone.
Break away from owing to adopting the modularity paster LED of above technical scheme LED to be sticked and to have realized luminous deficiency in PCB surface, be parallel arrangement by cathode metal wire, negative metal wire, cathode metal baseline, negative metal baseline, effectively reduce the height of LED, make that processing is more simple and easy, working (machining) efficiency is higher, effectively reduce production cost, finally make application more perfect.
Above technical scheme is further improved by following measures:
In some embodiments, cathode metal wire, negative metal wire are laid in respectively the both sides of cathode metal baseline and negative metal baseline.Be welded on respectively on rectifier input these two line one end, which solves pulls strings in addition connects rectifier input and passes through the trouble that whole lamp support brings.
In some embodiments, in order to improve light efficiency as much as possible, reduce the diffuse scattering of LED light source, cathode metal baseline end exposed bottom storage tank is provided with an optically focused groove.
In some embodiments, in order to the work piece operations of injection machine, add the efficiency of note of hurrying up, needing equidistant for plastic cement pedestal spaced apart and be wrapped on cathode metal wire, negative metal wire, cathode metal baseline, negative metal baseline according to design.
In some embodiments, PPA plastics have high temperature resistant and fire-retardant and intensity is high and the advantage of resistance to deformation, and therefore the material of plastic cement pedestal is adopted PPA plastics and completed by injection machine injection moulding.
In some embodiments, convenient in order to make plastic cement pedestal arrange, the design of negative metal baseline side is had the extension relative with cathode metal baseline end.
In some embodiments, for the ease of the processing of mould, ensure that LED module has frivolous characteristic, cathode metal wire, negative metal wire, cathode metal baseline, negative metal baseline adopt the metal wire rods such as thin iron, copper, aluminium.In order to ensure that these thin metal wire rods have good electric conductivity and are not corroded, be provided with an electrodeposited coating at these metal wire material surfaces.
Based on a processing molding method for above-mentioned modularity paster LED lamp bar, comprise following step:
A. foil is pressed into multiple the hollow out bodies be anyhow connected through Presser Dashing, this hollow out body comprises: cathode metal wire, negative metal wire, cathode metal baseline, negative metal baseline, the end punching press of cathode metal baseline wherein forms optically focused groove, negative metal baseline in hollow out body is L-shaped, and its terminal part is corresponding with cathode metal baseline end optically focused groove and disconnect;
B. the foil with engraved structure completed by step a does electroplating surface process;
C. thermosetting resin selected by the plastic cement that insulate, by injection machine, thermosetting resin is also laterally wrapped in centered by each optically focused groove the middle part of cathode metal wire, negative metal wire, cathode metal baseline, negative metal baseline, and on foil, be formed with multiple the plastic cement pedestals with pattern, described plastic cement pedestal has one for the storage tank of accommodating LED chip, the exposed optically focused groove in bottom of this storage tank and negative metal baseline are in order to weld LED chip electrode foot.
D. LED chip is fixed in the storage tank of plastic cement pedestal, with bonding wire board, LED chip electrode foot is welded with optically focused groove and negative metal baseline and conducting.
E. a photic zone is encapsulated again after applying layer of fluorescent powder on LED core is unilateral.
F. oven cooking cycle sizing is put into.
G. the modularity paster LED lamp bar that rear formation many has multiple LED washed open by the last tie point punch press by each cathode metal wire anyhow connected for the foil after baking sizing, negative metal wire, cathode metal baseline, negative metal baseline
Accompanying drawing explanation
Fig. 1 is the routing planes schematic diagram of modularity paster LED of the present invention.
Fig. 2 is the planar structure schematic diagram of invention modularity paster LED.
Fig. 3 is the hollow out body plane structural representation that foil of the present invention is formed through punching press.
Fig. 4 is the structure for amplifying schematic diagram in Fig. 3 A portion.
Fig. 5 is the planar structure schematic diagram of foil hollow out body injection moulding plastic pedestal of the present invention.
Fig. 6 is the structure for amplifying schematic diagram in Fig. 5 B portion.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation.
Referring to figs. 1 to Fig. 6; The invention provides a kind of modularity paster LED lamp bar, the cathode metal wire 3 adopted, negative metal wire 4 correspondence connects rectifier input, cathode metal baseline 1, negative metal baseline 2 one end connect the electrode of LED chip, and the other end connects rectifier output end electrode.Cathode metal baseline 1, negative metal baseline 2, cathode metal wire 3, negative metal wire 4 are the metallic flat thin wires such as thin iron, copper, aluminium, in order to ensure that these thin metal wire rods have good electric conductivity and are not corroded, these iron, copper, the thin metal wire material surface of aluminium are electroplated one deck anti-corrosion conductive layer.In addition, the side of negative metal baseline 2 is designed with the extension 21 of a bending, in order to improve light efficiency as much as possible, reduce the diffuse scattering of LED light source, an optically focused groove 11 is provided with in the end of cathode metal baseline 1, the extension 21 of negative metal baseline 2 is relative with optically focused groove 11 interval of cathode metal baseline 1 and form the positive and negative connecting portion of a lamp, on these lines can arrange several positive and negative connecting portion so more, just constitute many lamps modular structure on line according to needs.According to the width design requirement of module LED lamp, these 4 thin metallic flat thin wires is spaced apart and place in parallel arrangement, and cathode metal wire 3, negative metal wire 4 are laid in respectively the both sides of cathode metal baseline 1 and negative metal baseline 2.PPA plastics are injection-moulded in cathode metal wire 3 by injection machine, negative metal wire 4, cathode metal baseline 1, on negative metal baseline 2, horizontal complete coated above-mentioned wire rod also forms plastic cement pedestal 5, this plastic cement pedestal 5 top is provided with a storage tank 51 for accommodating LED chip and packaging plastic, the exposed optically focused groove 11 of the cathode metal baseline 1 in order to connect LED chip electrode in bottom of this storage tank 51 and the end of the extension 21 of negative metal baseline 2, in the storage tank 51 of plastic cement pedestal 5, the positive pole of LED chip is welded on the optically focused groove 11 of cathode metal baseline 1, the negative pole correspondence of LED chip is welded on the end of the extension 21 of exposed negative metal baseline 2, and in storage tank 51 LED core unilateral on be also packaged with a photic zone.Break away from owing to adopting the modularity paster LED of above technical scheme LED to be sticked and realized luminous deficiency in PCB surface, by cathode metal wire 3, negative metal wire 4, cathode metal baseline 1, negative metal baseline 2 in parallel arrangement, effectively reduce the height of LED, make processing more simple and easy, working (machining) efficiency is higher, effectively reduce production cost, also eliminate the trouble of circumscripted power line, finally make application more perfect.
Above-mentioned modularity paster LED adopts following steps to complete: a. foil 10 is pressed into multiple hollow out bodies through Presser Dashing, this hollow out body comprises: cathode metal wire 3, negative metal wire 4, cathode metal baseline 1, negative metal baseline 2 and phase mutual tie point are connected, the end punching press of cathode metal baseline 1 wherein forms optically focused groove 11, negative metal baseline 2 in hollow out body is L-shaped, and its terminal part is corresponding with cathode metal baseline 1 end optically focused groove 11 and disconnect; B. the foil 10 with engraved structure completed by step a does electroplating surface process; C. thermosetting resin selected by the plastic cement that insulate, by injection machine by thermosetting resin centered by each optically focused groove 11, the middle part of cathode metal wire 3, negative metal wire 4, cathode metal baseline 1, negative metal baseline 2 is directly laterally wrapped in completely to reserved line 50, and on foil 10, be formed with multiple the plastic cement pedestals 5 with pattern, described plastic cement pedestal 5 has one for the storage tank 51 of accommodating LED chip, the exposed optically focused groove 11 in bottom of this storage tank 51 and the extension 21 of negative metal baseline 2 part are in order to weld LED chip electrode foot.D. LED chip is fixed in the storage tank 51 of plastic cement pedestal 5, with bonding wire board, the extension 21 of LED chip electrode foot with optically focused groove 11 and negative metal baseline 2 part is welded and conducting.E. a photic zone is encapsulated again after applying layer of fluorescent powder on LED core is unilateral.F. oven cooking cycle sizing is put into.G. the modularity paster LED lamp bar that rear formation many has multiple LED washed open by the last tie point punch press by each cathode metal wire 3 anyhow connected for the foil 10 after baking sizing, negative metal wire 4, cathode metal baseline 1, negative metal baseline 2.
Above-described is only some embodiments of the present invention.For the person of ordinary skill of the art, without departing from the concept of the premise of the invention, can also make multiple distortion and improvement, these all belong to protection scope of the present invention.
Claims (1)
1. the processing method of a Modular LED lamp bar, described Modular LED lamp bar, comprise the cathode metal wire and negative metal wire that connect rectifier input, also comprise the cathode metal baseline and negative metal baseline that connect LED chip and rectifier output end, described cathode metal wire, negative metal wire, cathode metal baseline, negative metal baseline is parallel arrangement, and be provided with multiple by cathode metal wire, negative metal wire, cathode metal baseline, the plastic cement pedestal that negative metal baseline is laterally coated, described plastic cement pedestal top has one for the storage tank of accommodating LED chip, the part of the exposed cathode metal baseline and negative metal baseline in order to weld LED chip electrode in bottom of this storage tank, in storage tank LED core unilateral on be also packaged with a photic zone, it is characterized in that, comprise following step:
A, foil are pressed into multiple hollow out body be anyhow connected through Presser Dashing, this hollow out body comprises: cathode metal wire, negative metal wire, cathode metal baseline, negative metal baseline, the end punching press of cathode metal baseline wherein forms optically focused groove, negative metal baseline in hollow out body is L-shaped, and its terminal part is corresponding with cathode metal baseline end optically focused groove and disconnect;
B, the foil with engraved structure completed by step a do electroplating surface process;
Thermosetting resin selected by c, insulation plastic cement, by injection machine, thermosetting resin is also laterally wrapped in centered by each optically focused groove the middle part of cathode metal wire, negative metal wire, cathode metal baseline, negative metal baseline, foil is formed with the plastic cement pedestal of multiple same pattern, described plastic cement pedestal has one for the storage tank of accommodating LED chip, bottom this storage tank, the part of exposed optically focused groove and negative metal baseline is in order to weld LED chip electrode foot;
D, LED chip is fixed in the storage tank of plastic cement pedestal, with bonding wire board, the part of LED chip electrode foot with optically focused groove and negative metal baseline is welded and conducting;
E, on LED core is unilateral, apply layer of fluorescent powder after encapsulate a photic zone again;
F, put into oven cooking cycle sizing;
The modularity paster LED lamp bar that rear formation many has multiple LED washed open by the tie point punch press of g, each cathode metal wire be finally anyhow connected by the foil after baking sizing, negative metal wire, cathode metal baseline, negative metal baseline.
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| CN201410255859.7A CN103994359B (en) | 2014-06-10 | 2014-06-10 | A kind of processing method of Modular LED lamp bar |
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| CN201410255859.7A CN103994359B (en) | 2014-06-10 | 2014-06-10 | A kind of processing method of Modular LED lamp bar |
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| CN103994359B true CN103994359B (en) | 2016-04-27 |
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| CN104930372A (en) * | 2015-06-11 | 2015-09-23 | 吴少健 | LED (light-emitting diode) bulb with arched lens |
| CN105047787A (en) * | 2015-06-11 | 2015-11-11 | 吴少健 | Packaging support for LED lamp |
| CN105276534A (en) * | 2015-09-25 | 2016-01-27 | 吴少健 | LED circuit board |
| CN105390454B (en) * | 2015-10-22 | 2019-02-01 | 深圳市敏杰电子科技有限公司 | Water-proof line element device and its production equipment and method |
| CN107023809A (en) * | 2016-01-30 | 2017-08-08 | 深圳市环基实业有限公司 | A kind of LED board manufacturing method |
| CN105508916A (en) * | 2016-02-22 | 2016-04-20 | 深圳市敏杰电子科技有限公司 | Waterproof LED lamp strip and equipment and method for producing waterproof LED lamp strip |
| CN107477377B (en) * | 2017-08-24 | 2023-11-03 | 深圳市圣心照明科技有限公司 | LED light source plate, LED glass lamp tube and manufacturing method |
| CN108278517A (en) * | 2018-02-28 | 2018-07-13 | 杭州小太阳农业科技有限公司 | A kind of double, multiple rows of LED light strip |
| CN108278515A (en) * | 2018-02-28 | 2018-07-13 | 杭州小太阳农业科技有限公司 | A kind of double, multiple rows of LED light base band |
| CN108361574A (en) * | 2018-02-28 | 2018-08-03 | 杭州小太阳农业科技有限公司 | A kind of production method of LED light strip |
| CN108302354A (en) * | 2018-02-28 | 2018-07-20 | 杭州小太阳农业科技有限公司 | A kind of single LED light strip |
| CN108361573A (en) * | 2018-02-28 | 2018-08-03 | 杭州小太阳农业科技有限公司 | A kind of production method of light bar |
| CN109742215A (en) * | 2019-01-10 | 2019-05-10 | 广东品美电子科技有限公司 | A kind of LED support preparation process |
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| CN103994359A (en) | 2014-08-20 |
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