CN103974598A - Circuit board - Google Patents

Circuit board Download PDF

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Publication number
CN103974598A
CN103974598A CN201310045973.2A CN201310045973A CN103974598A CN 103974598 A CN103974598 A CN 103974598A CN 201310045973 A CN201310045973 A CN 201310045973A CN 103974598 A CN103974598 A CN 103974598A
Authority
CN
China
Prior art keywords
circuit board
heat dissipation
electrode zone
dissipation region
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310045973.2A
Other languages
Chinese (zh)
Inventor
杨江辉
陈鹏
明玉生
陈海泉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Priority to CN201310045973.2A priority Critical patent/CN103974598A/en
Priority to PCT/EP2013/077489 priority patent/WO2014121878A1/en
Publication of CN103974598A publication Critical patent/CN103974598A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10204—Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The invention relates to a circuit board (10) used for an electronic device (100). The circuit board (10) comprises an insulated substrate (1) and an electroconductive layer (2) arranged on one side of the substrate (1). The circuit board is characterized in that the electroconductive layer (2) comprises an electrode area (21) and at least radiating area (22) separated from the electrode area (21), at least one through hole (23) is formed in each radiating area (22), and at least one electrically-isolated heat conducting structure is arranged between the electrode area (21) and the radiating areas (22).

Description

Circuit board
Technical field
The present invention relates to a kind of for the circuit board of electronic device, especially for the circuit board of lighting device.
Background technology
Along with electronic installation, the lighting apparatus that particularly relates to LED technology is by more and more extensive use, this kind of electronic installation also improved in the requirement aspect electric property thereupon.For example, lighting device taking LED as light source has the drive circuit of special design for LED device, this LED drive circuit can be arranged on (PCB technology) on printed circuit board (PCB), and the circuit board of this routine can be for LED drive circuit, particularly provided stable electric energy by the LED chip of its control., because the heat dispersion of circuit board is one of principal element of the luminous efficiency of the performance that affects electronic installation, for example LED matrix, have good heat dispersion at circuit board meanwhile, can ensure that LED drive circuit is stable and work reliably.In addition, user has also had increasing concern for the insulation property of circuit board.If can ensure that circuit board self has good heat dispersion, and there is good insulating performance with respect to the LED drive circuit of printing thereon simultaneously, use so the electronic installation of sort circuit plate, for example LED lighting device can run on more stable and reliably various occasions.
A solution of prior art proposes, and uses existing printed circuit board (PCB), the circuit board of for example FR4 or CEM-3, and this kind of circuit board has lower thermal conductivity, this thermal conductivity is at 0.4W/(m*K) left and right.In order to reduce as much as possible the thermal resistance of this kind of circuit board, to increase the thermal conductivity of this circuit board, can effectively on this circuit board, offer multiple through holes for dispelling the heat.Fig. 1 shows according to the schematic plan of an embodiment of the circuit board 10 of prior art.As shown in Figure 1, in this embodiment, circuit board 10 has the conductive layer 2 for settling electronic device, this conductive layer 2 comprises electrode zone 21, this electrode zone is divided into positive electrode region and negative electrode area, and these two electrode zones can be electrically connected with anodal pin and the negative pole pin of electronic device, for example LED chip respectively.In addition in order to reduce the thermal resistance of this circuit board, also in the outer peripheral areas of conductive layer 2, offer especially multiple through holes 23, these through holes can be arranged with array.
Fig. 2 shows the sectional view of the circuit board in Fig. 1.As shown in Figure 2, a side of circuit board 10 (in figure for end face) carries LED chip, between the substrate 1 of circuit board 10 and LED chip, is provided with conductive layer 2.Can identify at this, four through holes 23 shown in Fig. 1 are symmetrically located at respectively LED chip both sides, and these through holes 23 run through whole circuit board 10, that is to say, successively through conductive layer 2 and substrate 1.Disadvantageously, the through hole 23 of offering on circuit board 10 can form unnecessary electrical connection approach, and these electrical connection approach will reduce the electrical insulation capability of this circuit board.So although this solution can reduce thermal resistance, the increase thermal conductivity of circuit board comparatively significantly, but meanwhile but reduce the electric simulation strength of circuit board, thereby bring adverse influence can to the electronic installation that is equipped with sort circuit plate, for example, stability and reliability while having reduced electronic installation work.This unfavorable range of application that greatly limits circuit board of the prior art.
Summary of the invention
In order to solve problems of the prior art, the present invention proposes a kind of novel circuit board for electronic device.Plate has the characteristic of low thermal resistance in a circuit according to the invention, to ensure having good radiating effect during circuit board in working order.In addition, this kind of circuit board also can have high insulation resistance simultaneously, thus can advantageously meet user to it in the requirement aspect insulation property.
One object of the present invention realizes by a kind of like this circuit board for electronic device, this circuit board comprises the substrate of insulation and is arranged on the conductive layer of described substrate one side, it is characterized in that, described conductive layer comprises electrode zone and at least one heat dissipation region separating with electrode zone, in wherein said heat dissipation region, offer at least one through hole, between described electrode zone and described at least one heat dissipation region, there is the conductive structure of at least one electricity isolation.The invention provides and a kind of the circuit board of prior art is carried out to improved design, this design will be designed to the electrode zone of conductive layer of end face of circuit board and heat dissipation region by arranging and be divided at least two regions separated from one another according to the integral type of prior art, thereby forms electrode zone and at least one heat dissipation region with the isolation of electrode zone electricity.In order to make plate in a circuit according to the invention there is good radiating effect, according to actual needs, preferably in this heat dissipation region, offer at least one, also can be multiple through holes, this or these through hole can be used as typical radiator structure in circuit board circuit board is dispelled the heat.In order to make plate in a circuit according to the invention also there is good insulation effect in thering is good radiating effect, particularly preferably between described electrode zone and described at least one heat dissipation region, be provided with the conductive structure of at least one electricity isolation, this conductive structure passes to heat dissipation region with the form of " heat-conductive bridges " by the heat of electrode zone, but the electric charge of electrode zone can't be delivered to heat dissipation region in the lump with heat.Not only realize additional radiating effect by means of this conductive structure, and embodied good electric isolating effect.Therefore, plate provides the possibility that simultaneously ensures good heat dispersion and good insulation property in a circuit according to the invention.
In a preferred design according to the present invention, described conductive structure is the heat carrier that two edge overlaps respectively described electrode zone and the described heat dissipation region of attaching troops to a unit.Like this, when electrode zone and heat dissipation region have electricity isolation, the electric isolation performance that the conductive structure of design can have because of itself like this, thus in not affecting insulation property, provide a kind of effective and be the mode of simple transferring heat.
Preferably, described heat carrier is ceramic wafer.Pottery has good heat conductivility, and has good insulation property.Make heat carrier according to the size of international standard in the case of using ceramic material, not only can effectively save space limited on circuit board, make circuit board obtain favourable topology layout, but also can make heat carrier in not affecting the insulation property of this circuit board, improve the radiating effect of this circuit board.In addition, the heat carrier of this specification also can be promoted the use of on other lighting devices with sufficient space, improves its radiating effect.
Preferably, described through hole runs through described substrate.By offer through hole on the conductive layer of this circuit board, and make this through hole run through the substrate of this circuit board, like this, can form effectively and directly heat conduction approach.This heat conduction approach has improved the radiating effect of this circuit board.In addition,, owing to there is safe and reliable insulation spacing between through hole and the electrode zone of circuit board, therefore realized through hole and be arranged on the electric insulating effect between the electric assembly on electrode zone.Ensure that thus circuit board self has good dielectric strength, thereby ensured to use the electronic installation of this circuit board to there is stable operational environment.
Preferably, described heat carrier utilizes surface mounting technology to be fixed on described conductive layer.This technology can, in the case of do not affect the original layout of circuit board as far as possible, be arranged on this heat carrier on conductive layer, and securely this heat carrier is fixed on this layer.In addition, utilize the mounting technique of this main flow can reduce manufacturing cost and the manufacturing time of whole circuit board.
Preferably, the side towards electrode zone of described heat carrier is provided with the first thermal land, and the side towards heat dissipation region of described heat carrier is provided with the second thermal land.This heat carrier is connected with the second thermal land by this first thermal land and is fixed on the conductive layer of described circuit board, and can be used as the approach of transferring heat effectively, such design can also make to exist between electrode zone and heat dissipation region enough insulation spacing.
Preferably, described ceramic wafer is by Al 2o 3or AlN wherein a kind of or its mixture make.Aluminium oxide and aluminium nitride have higher thermal conductivity and good dielectric strength, use the ceramic wafer of being made up of above-mentioned two kinds of materials or its mixture to be used as heat-conducting plate, can improve widely thus the thermal conductivity of this heat-conducting plate.This ceramic wafer can pass to heat dissipation region as far as possible in large quantities by the heat in electrode zone, to reduce the temperature of high-temperature area (being electrode zone) of circuit board, has realized good radiating effect.
Preferably, described electronic device is fixed on described electrode zone.Electrode zone on this circuit board has the space of installing and fixing described electronic device, this electronic device is arranged on this position, realize electrical connection effectively, and can utilize high heat dispersion and the high insulating property of this circuit board, realize the effect that good operational environment is provided to this electronic device.
Preferably, described electrode zone comprises positive pole zone separated from one another and negative pole region, and the positive and negative pin of described electronic device is electrically connected with described positive pole zone and negative pole region respectively.The conductive layer of this circuit board is divided into positive pole zone separated from one another and negative pole region, can provide the directly approach of electrical connection to electronic device thus, like this, can be so that the positive and negative pin of electronic device be electrically connected with corresponding positive pole zone and negative pole region on circuit board respectively, such electrical connection directly, simple and effectively.
Preferably, described conductive layer comprises two heat dissipation region, and described two heat dissipation region are symmetrically located at the both sides of described electrode zone.By multiple heat dissipation region are set, can reach the effect of the radiating effect that improves this circuit board, and the both sides at this electrode zone are provided with heat dissipation region, like this, can on circuit board, form evenly and the approach that comprehensively dispels the heat, thereby realize the effect of this circuit board being carried out to integral heat sink, ensured the good operational environment of this circuit board.
Preferably, described substrate is FR4 or CEM-3 base material.This base material has good resistance to fuel efficiency fruit, can tackle fully some severe applied environment, has ensured the useful life of this circuit board.And this FR4 or CEM-3 base material are comparatively general materials, not only can be applied on a large scale, with the radiating effect of intensifier circuit plate, but also the manufacturing cost that can effectively save circuit board.
Brief description of the drawings
Accompanying drawing forms the part of this specification, for helping further to understand the present invention.These accompanying drawings illustrate embodiments of the invention, and are used for illustrating principle of the present invention together with specification.Identical parts represent with identical label in the accompanying drawings.Shown in figure:
Fig. 1 shows according to the schematic plan of an embodiment of circuit board of prior art;
Fig. 2 shows the sectional view of the circuit board shown in Fig. 1;
Fig. 3 shows the sectional view of an embodiment of plate in a circuit according to the invention;
Fig. 4 shows the schematic plan of an embodiment of plate in a circuit according to the invention.
Embodiment
Circuit board 10 for electronic device 100 according to the present invention comprises the substrate 1 of insulation and is arranged on the conductive layer 2 of described substrate 1 one sides, it is characterized in that, described conductive layer 2 comprises electrode zone 21 and at least one heat dissipation region 22 separating with electrode zone 21, in wherein said heat dissipation region 22, offer at least one through hole 23, between described electrode zone 21 and described at least one heat dissipation region 22, there is the conductive structure of at least one electricity isolation.
Fig. 3 shows the sectional view of an embodiment of plate 10 in a circuit according to the invention.As shown in Figure 3, this circuit board 10 comprises substrate 1 and conductive layer 2, this conductive layer 2 also comprises electrode zone 21 and at least one (being in the present embodiment two) heat dissipation region 22, this electrode zone 21 is preferably located between two heat dissipation region 22, and keeps each other a determining deviation with these two heat dissipation region 22.
In addition, in this heat dissipation region 22, also offer at least one through hole 23, between this electrode zone 21 and heat dissipation region 22, be provided with at least one conductive structure, in Fig. 3, only schematically show two through holes 23 and two and be designed to the conductive structure of heat carrier 3.This heat carrier 3 has electrode zone 21 and heat dissipation region 22 effect electrically isolated from one.Therefore, two heat carriers 3 be overlapped on symmetrically electrode zone 21 respectively and the heat dissipation region 22 of attaching troops to a unit between.Further, this heat carrier 3 can be by aluminium oxide (Al 2o 3) or the ceramic wafer made of aluminium nitride (AlN) or its mixture.The ceramic wafer with this composition has higher thermal conductivity and good dielectric strength.Use ceramic material to be sized to this heat carrier according to international standard, not only can effectively save space limited on circuit board, make this circuit board obtain favourable physical structure layout, but also can make this heat carrier in not affecting the insulation property of this circuit board, transferring heat as far as possible efficiently, improves the radiating effect of this circuit board.
Certainly,, in a unshowned embodiment, also can consider to select other suitable materials to form substrate.In addition, also can in the one or both sides of electrode zone, more heat dissipation region be asymmetricly set as required.The size and shape of through hole also can carry out corresponding change according to actual requirement.
Fig. 3 also shows, and offers the through hole 23 that runs through circuit board 10 in each heat dissipation region 22, and this through hole 23 is successively through conductive layer 2 and conductive layer 2 substrate 1 below.In addition, heat carrier 3 utilizes the both sides in the horizontal direction that the first thermal land 4 illustrates respectively in the drawings with the second thermal land 5 to be fixedly connected with heat dissipation region 22 with electrode zone 21.The first thermal land 4 is arranged on the side towards electrode zone 21 particularly, and described the second thermal land 5 is arranged on the side towards heat dissipation region 22 particularly.
Fig. 4 shows the schematic plan of an embodiment of plate 10 in a circuit according to the invention.This figure just illustrates described circuit board.As shown in Figure 4, the substrate of this circuit board 10 has adopted FR4 or CEM-3 base material, and is provided with the heat carrier 3 that carries out insulating heat-conductive with " heat-conductive bridges " form on the conductive layer 2 of this circuit board 10.Particularly, two of this heat carrier 3 edges have utilized respectively surface mounting technology (SMT) to be fixed on the electrode zone 21 and heat dissipation region 22 of conductive layer 2.
Fig. 4 also shows, and is provided with two heat dissipation region 22 on this conductive layer 2, and this heat dissipation region 22 is symmetrically located at the both sides of described electrode zone 21.Improve the object of the radiating effect of plate 10 in a circuit according to the invention by multiple heat dissipation region 22 being set, can reaching.And because the both sides at this electrode zone are provided with heat dissipation region, therefore the local heat producing on circuit board evenly and all sidedly can be passed to the region that other temperature are lower, thereby realize the effect of this circuit board being carried out to integral heat sink, ensured the good operational environment of this circuit board.
In addition, electronic device 100 can be arranged on the electrode zone 21 on this circuit board 10, like this, realizes simple and is easy to be electrically connected.This electrode zone 21 also comprises positive pole zone 211 and negative pole region 212, and this positive pole zone 211 and negative pole region 212 separated from one another, the positive and negative pin of electronic device 100 is electrically connected with described positive pole zone 211 and negative pole region 212 respectively.Like this, realize to electronic device 100 the directly approach of electrical connection is provided, like this, can be so that the positive and negative pin of electronic device 100 be electrically connected with corresponding positive pole zone 211 and negative pole region 212 on circuit board, such electrical connection directly, simple and effectively.
These are only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.All any amendments of doing within the spirit and principles in the present invention, be equal to replacement, improvement etc., within protection scope of the present invention all should be included in.
Reference number
1 substrate
2 conductive layers
3 heat carriers
4 first thermal lands
5 second thermal lands
10 circuit boards
21 electrode zones
22 heat dissipation region
23 through holes
100 electronic devices
211 positive pole zone
212 negative pole regions

Claims (11)

1. the circuit board for electronic device (100) (10), comprise the substrate (1) of insulation and be arranged on the conductive layer (2) of described substrate (1) one side, it is characterized in that, described conductive layer (2) comprises electrode zone (21) and at least one heat dissipation region (22) separating with described electrode zone (21), in wherein said heat dissipation region (22), offer at least one through hole (23), between described electrode zone (21) and described at least one heat dissipation region (22), there is the conductive structure of at least one electricity isolation.
2. circuit board according to claim 1, is characterized in that, described conductive structure is that two edge overlaps respectively described electrode zone (21) and the heat carrier (3) of the described heat dissipation region (22) of attaching troops to a unit.
3. circuit board according to claim 2, is characterized in that, described heat carrier (3) is ceramic wafer.
4. according to the circuit board described in any one in claim 1-3, it is characterized in that, described through hole (23) runs through described substrate (1).
5. circuit board according to claim 3, is characterized in that, described heat carrier (3) utilizes surface mounting technology to be fixed on described conductive layer (2).
6. circuit board according to claim 5, it is characterized in that, a side towards electrode zone (21) of described heat carrier (3) is provided with the first thermal land (4), and the side towards heat dissipation region (22) of described heat carrier (3) is provided with the second thermal land (5).
7. circuit board according to claim 3, is characterized in that, described ceramic wafer is by Al 2o 3or AlN wherein a kind of or its mixture make.
8. according to the circuit board described in any one in claim 1-3, it is characterized in that, described electronic device (100) is fixed on described electrode zone (21).
9. circuit board according to claim 8, it is characterized in that, described electrode zone (21) comprises positive pole zone separated from one another (211) and negative pole region (212), and the positive and negative pin of described electronic device (100) is electrically connected with described positive pole zone (211) and negative pole region (212) respectively.
10. according to the circuit board described in any one in claim 1-3, it is characterized in that, described conductive layer (2) comprises two heat dissipation region (22), and described two heat dissipation region (22) are symmetrically located at the both sides of described electrode zone (21).
11. according to the circuit board described in any one in claim 1-3, it is characterized in that, described substrate (1) is FR4 or CEM-3 base material.
CN201310045973.2A 2013-02-05 2013-02-05 Circuit board Pending CN103974598A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201310045973.2A CN103974598A (en) 2013-02-05 2013-02-05 Circuit board
PCT/EP2013/077489 WO2014121878A1 (en) 2013-02-05 2013-12-19 Circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310045973.2A CN103974598A (en) 2013-02-05 2013-02-05 Circuit board

Publications (1)

Publication Number Publication Date
CN103974598A true CN103974598A (en) 2014-08-06

Family

ID=49880780

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310045973.2A Pending CN103974598A (en) 2013-02-05 2013-02-05 Circuit board

Country Status (2)

Country Link
CN (1) CN103974598A (en)
WO (1) WO2014121878A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105101613A (en) * 2014-11-19 2015-11-25 芜湖蓝宙电子科技有限公司 Method for improving heat conduction capability of printed board of surface-mounted device
WO2016101625A1 (en) * 2014-12-23 2016-06-30 中兴通讯股份有限公司 Heat sink apparatus, circuit board and method of designing same
CN106714510A (en) * 2015-11-13 2017-05-24 柯惠有限合伙公司 System and method for thermal management of electronic devices
WO2017128212A1 (en) * 2016-01-28 2017-08-03 深圳市嘉合劲威电子科技有限公司 Circuit board and memory using same
CN107810368A (en) * 2015-05-04 2018-03-16 江森自控科技公司 User control with the shell comprising angled circuit board

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106488686B (en) * 2015-08-31 2020-09-29 上海伯乐电子有限公司 Lighting device, electrical assembly, flexible circuit and heat transfer method
CN111447728B (en) * 2020-04-17 2022-02-25 歌尔微电子有限公司 Flexible circuit board and electronic equipment

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2259408A (en) * 1991-09-07 1993-03-10 Motorola Israel Ltd A heat dissipation device
US20040226696A1 (en) * 2003-02-28 2004-11-18 Hong Huang Surface mount resistors as heat transfer augmentation devices
US7806574B2 (en) * 2006-04-16 2010-10-05 Albeo Technologies, Inc. Thermal management of LED-based lighting systems
EP2276329A1 (en) * 2009-07-16 2011-01-19 ABB Research Ltd. Electronic circuit board with a thermal capacitor

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105101613A (en) * 2014-11-19 2015-11-25 芜湖蓝宙电子科技有限公司 Method for improving heat conduction capability of printed board of surface-mounted device
WO2016101625A1 (en) * 2014-12-23 2016-06-30 中兴通讯股份有限公司 Heat sink apparatus, circuit board and method of designing same
CN105792597A (en) * 2014-12-23 2016-07-20 中兴通讯股份有限公司 Heat-dissipation device, circuit board and design method of heat-dissipation device
CN107810368A (en) * 2015-05-04 2018-03-16 江森自控科技公司 User control with the shell comprising angled circuit board
CN106714510A (en) * 2015-11-13 2017-05-24 柯惠有限合伙公司 System and method for thermal management of electronic devices
US10123460B2 (en) 2015-11-13 2018-11-06 Covidien LLP System and method for thermal management of electronic devices
WO2017128212A1 (en) * 2016-01-28 2017-08-03 深圳市嘉合劲威电子科技有限公司 Circuit board and memory using same

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Application publication date: 20140806