CN103952224B - For water base free abrasive cutting liquid that solar silicon wafers manufactures and preparation method thereof - Google Patents
For water base free abrasive cutting liquid that solar silicon wafers manufactures and preparation method thereof Download PDFInfo
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- CN103952224B CN103952224B CN201410074974.4A CN201410074974A CN103952224B CN 103952224 B CN103952224 B CN 103952224B CN 201410074974 A CN201410074974 A CN 201410074974A CN 103952224 B CN103952224 B CN 103952224B
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Abstract
The invention discloses a kind of water base free abrasive cutting liquid for solar silicon wafers manufacture and preparation method thereof, in this cutting liquid, include acrylic thickener, trolamine, defoamer, trihydroxy ethylamine oleate soap and deionized water, wherein, trihydroxy ethylamine oleate soap can strengthen crush resistance and the oilness of described cutting liquid on the one hand, on the other hand can be anticorrosion, extend the quality guaranteed period of described cutting liquid, strengthen its stability.Meanwhile, cutting liquid, containing a large amount of deionized water, because of the large specific heat capacity of water, make it have good cooling, and the aqueous solution easily rinses.In addition, deionized waters a large amount of in component greatly reduces cutting liquid production cost, decreases the pollution to environment, cut crystal easy cleaning, and dirty sheet is few, and silicon chip yield rate is high.Finally, the present invention has that preparation is simple to operation, and production cost is low, and cutting silicon wafer yield rate is high, and follow-up cleaning is easy, to features such as equipment are pollution-free.
Description
Technical field
The invention belongs to silicon chip cutting technique field, relate to a kind of cutting liquid, be specifically related to a kind of water base free abrasive cutting liquid for solar silicon wafers manufacture and preparation method thereof.
Background technology
Along with global energy shortage and the problem such as environmental pollution become increasingly conspicuous, solar energy power generating because of its clean, safety, facility, the feature such as efficient, the new industry having become countries in the world common concern and given priority to.And in photovoltaic solar silicon chip cutting process, silicon chip cutting fluid as a kind of auxiliary material consumptive material product that must use in silicon chip cutting process, its consumption also along with the silicon chip processing industry of photovoltaic solar industry and China growth and expand.Cutting liquid is responsible for the multiple actions such as cooling, suspension, dispersion, lubrication in silicon chip cutting process, and it must have outstanding cooling performance: can effective distribute heat, reduces cutting stress; Outstanding suspending power: can Effective Suspension silicon-carbide particle, improves cutting efficiency, reduces cutting and consumes; Good dispersive ability: silicon-carbide particle can be made to be more evenly distributed when mixing with cutting liquid; Outstanding lubricity: can form protective membrane at silicon chip surface, reduces Cutting Drag, and ensures that the finished surface cut out is smooth.
Cutting liquid mainly comprises oiliness cutting liquid and the large class of water-based cutting liquid two by composition classification.First kind cutting liquid product is mainly the oiliness cutting liquid of main component with mineral oil, wherein containing mineral oil, anticorrosive agent, the material such as anti-extrusion dose; Cutting liquid itself is inflammable, and environmental pollution is comparatively large, needs fluorine-containing alkane solvent during cleaning silicon chip simultaneously.Equations of The Second Kind water-based cutting liquid product can be water-soluble or by water-dispersion, cleaning silicon chip use water, without organic solvent, to human body and environment harmless.On the one hand because oiliness cutting liquid cost is high, not environmentally, on the other hand because cutting liquid organic efficiency is low and competition among enterprises fierce, so the high-moisture silicon chip cutting fluid of the economic environmental protection of development of new receives publicity day by day.
Such as, application number is 201010500968.2, and denomination of invention is in the Chinese patent of " a kind of cutting liquid with antioxidant property and its preparation method and application ", and the cutting liquid water ratio provided is 0 ~ 20%, fruitful in the dirty sheet rate of improvement.Application number is 201010500973.3, and denomination of invention is that in the Chinese patent of " the water base cutting liquid of a kind of hard brittle material ", the cutting liquid water ratio provided is 5% ~ 20%, and the tolerance for temperature and humidity is strong.But above-mentioned patent also existence and stability is not high, and water content is lower, production cost is the problem such as higher still.Application number is 201110174484.8, denomination of invention is in the Chinese patent of " a kind of water-base type line cutting liquid for silicon chip ", provide the high-moisture cutting liquid that a kind of water ratio reaches 89.95% ~ 98%, but its essential substance playing suspended dispersed effect is polyvinyl alcohol, polyvinyl alcohol has excellent film forming properties, easy contaminated equipment, and be unfavorable for later stage Wafer Cleaning.
Summary of the invention
The object of the invention is to solve above-mentioned the problems of the prior art, a kind of water base free abrasive cutting liquid and preparation method thereof manufactured for solar silicon wafers with suitable viscosity, good distribution suspension and hanging wire ability for silicon chip cutting is provided, this cutting liquid is high without stria, yield rate when cutting silicon wafer, has the advantages such as easy cleaning, low cost and high-moisture.
To achieve these goals, the technical solution adopted in the present invention is:
For the water base free abrasive cutting liquid that solar silicon wafers manufactures, it is characterized in that: according to mass fraction meter, comprise following component:
Described acrylic thickener is ACULYN22/23, XC-190, Aculyn33 or T-901.
Described defoamer is silicone antifoam agent SRECN, silicone antifoam agent SE-47, organic silicone oil or cutting fluid foam control agent DF-965.
For a preparation method for the water base free abrasive cutting liquid that solar silicon wafers manufactures, comprise the following steps:
1) acrylic thickener of 0.5 ~ 1.2 part is dissolved in the deionized water of 98 ~ 99 parts, is stirred to acrylic thickener and is well-dispersed in deionized water, obtain mixing solutions;
2) pH value to 7.0 of mixing solutions is regulated with trolamine;
3) to pH value be 7.0 mixing solutions in add the defoamer of 0.10 ~ 0.20 part and the trihydroxy ethylamine oleate soap of 0.15 ~ 0.25 part, be then stirred to solute and dissolve completely, obtain for solar silicon wafers manufacture water base free abrasive cutting liquid.
Compared with prior art, the present invention has following beneficial effect:
The present invention is used in the component of the water base free abrasive cutting liquid that solar silicon wafers manufactures, include acrylic thickener, trolamine, defoamer, trihydroxy ethylamine oleate soap and deionized water, wherein, trihydroxy ethylamine oleate soap can strengthen crush resistance and the oilness of described cutting liquid on the one hand, on the other hand can be anticorrosion, extend the quality guaranteed period of described cutting liquid, strengthen its stability.Meanwhile, cutting liquid, containing a large amount of deionized water, because of the large specific heat capacity of water, make it have good cooling, and the aqueous solution easily rinses.In addition, deionized waters a large amount of in component greatly reduces cutting liquid production cost, decreases the pollution to environment, cut crystal easy cleaning, and dirty sheet is few, and silicon chip yield rate is high.Finally, the present invention has that preparation is simple to operation, and production cost is low, and cutting silicon wafer yield rate is high, and follow-up cleaning is easy, to features such as equipment are pollution-free.
Further, acrylic thickener of the present invention is non-associated anion alkali swelling type thickening material T-901, and its composition is polyacrylic acid, through in trolamine and after, become the polyacrylate with good thickening effectiveness, regulate suitable viscosity, its aqueous solution can be made to have excellent suspended dispersed.
Further, defoamer of the present invention adopts silicone antifoam agent SRECN, and its defoaming effect is remarkable, also has very strong to press down bubble ability.
Embodiment
Below in conjunction with specific embodiment and experimental data, the present invention is further illustrated, but the present invention is not limited in the following example.
Described in the following example, chemical reagent is commercially available prod, and free abrasive silicon carbide (1500#) used be product on sale for our company produces.Described water is deionized water.
The present invention is used for the preparation method of the water base free abrasive cutting liquid that solar silicon wafers manufactures, and comprises the following steps:
1) ACULYN22/23, XC-190, Aculyn33 or T-901 of 0.5 ~ 1.2 part are dissolved in the deionized water of 98 ~ 99 parts, are stirred to it and are well-dispersed in deionized water, obtain mixing solutions;
2) pH value to 7.0 of mixing solutions is regulated with trolamine;
3) to pH value be 7.0 mixing solutions in add silicone antifoam agent SRECN, the silicone antifoam agent SE-47 of 0.10 ~ 0.20 part, the trihydroxy ethylamine oleate soap of organic silicone oil or cutting fluid foam control agent DF-965 and 0.15 ~ 0.25 part, then be stirred to solute to dissolve completely, obtain the water base free abrasive cutting liquid manufactured for solar silicon wafers.
Enumerate specific embodiments of the invention below
Embodiment 1
Get 0.5 part by Shanghai apart from the T-901 of zero Chemical Manufacture, be dissolved in the deionized water of 99 parts, with JJ-1, accurate reinforcement is electronic mixes device stirring 30 minutes, and T-901 emulsion is well-dispersed in water.Use trolamine, as neutralizing agent, pH value is adjusted to 7.0.In system, add the trihydroxy ethylamine oleate soap of 0.15 part silicone antifoam agent SRECN and 0.2 part again, continue to be stirred to the accurate reinforcement electric mixer of JJ-1 and dissolve completely.Obtain the water base free abrasive cutting liquid manufactured for solar silicon wafers.
Embodiment 2
Get the T-901 of 0.6 part, be dissolved in the deionized water of 98.8 parts, stir 30 minutes with the accurate reinforcement electric mixer of JJ-1, T-901 emulsion is well-dispersed in water.Use trolamine, as neutralizing agent, pH value is adjusted to 7.0.In system, add the trihydroxy ethylamine oleate soap of 0.15 part silicone antifoam agent SRECN and 0.2 part again, continue to be stirred to the accurate reinforcement electric mixer of JJ-1 and dissolve completely.Obtain the water base free abrasive cutting liquid manufactured for solar silicon wafers.
Embodiment 3
Get the T-901 of 0.8 part, be dissolved in the deionized water of 98.5 parts, stir 30 minutes with the accurate reinforcement electric mixer of JJ-1, T-901 emulsion is well-dispersed in water.Use trolamine, as neutralizing agent, pH value is adjusted to 7.0.In system, add the trihydroxy ethylamine oleate soap of 0.15 part silicone antifoam agent SRECN and 0.2 part again, continue to be stirred to the accurate reinforcement electric mixer of JJ-1 and dissolve completely.Obtain the water base free abrasive cutting liquid manufactured for solar silicon wafers.
Embodiment 4
Get the T-901 of 1 part, be dissolved in the deionized water of 98.2 parts, stir 30 minutes with the accurate reinforcement electric mixer of JJ-1, T-901 emulsion is well-dispersed in water.Use trolamine, as neutralizing agent, pH value is adjusted to 7.0.In system, add the trihydroxy ethylamine oleate soap of 0.15 part silicone antifoam agent SRECN and 0.2 part again, continue to be stirred to the accurate reinforcement electric mixer of JJ-1 and dissolve completely.Obtain the water base free abrasive cutting liquid manufactured for solar silicon wafers.
Embodiment 5
Get the T-901 of 1.2 parts, be dissolved in the deionized water of 98 parts, stir 30 minutes with the accurate reinforcement electric mixer of JJ-1, T-901 emulsion is well-dispersed in water.Use trolamine, as neutralizing agent, pH value is adjusted to 7.0.In system, add the trihydroxy ethylamine oleate soap of 0.15 part silicone antifoam agent SRECN and 0.2 part again, continue to be stirred to the accurate reinforcement electric mixer of JJ-1 and dissolve completely.Obtain the water base free abrasive cutting liquid manufactured for solar silicon wafers.
The 1500# silicon carbide micro-powder that above-mentioned cutting liquid and our company are produced is made into mortar (liquid and sand mass ratio are 1:1) respectively, after stirring, the cutting viscosity of mortar, suspended dispersed, Wafer Cleaning performance is analysed and compared by the following method.Meanwhile, the now widely used PEG cutting liquid produced with our company as a comparison case.Acquired results lists in table 1.
Properties and specifications detects
1. the measurement of viscosity
Use the mortar of NDJ-5S Digital Viscometer to new preparation to carry out viscosity measurement, the results are shown in Table 1.
2. the measurement of suspension property
Newly prepare mortar is poured into 50mL groove place in 50mL graduated cylinder by above-mentioned, leave standstill under fixed temperature and humidity condition, measure supernatant liquor height under different time, supernatant liquor height smaller, then have good suspension.The results are shown in Table 1.
3. the measurement of cleaning performance
Get clean silicon chip, under fixed temperature and humidity condition, soak 8 hours respectively in above-mentioned new preparation mortar, after taking out, use deionized water rinsing 5 ~ 10 minutes, dry at 100 DEG C.Any surface finish noresidue to be considered as cleaning performance excellent, surface not bright and clean or have colored sheet, a relic be considered as difficult cleaning.The results are shown in Table 1.
Table 1. cuts mortar performance and compares
As can be seen from the above table, five embodiment gained cutting mortars, along with T-901 concentration increases, mortar viscosity increases gradually, and suspension improves gradually, but easy cleaning degree declines to some extent.Wherein cutting liquid three is with conventional PEG cutting liquid is the most close at present, but other cutting liquids also can meet Production requirement.
Embodiment 6
Get the ACULYN22/23 produced by LG-DOW company of 0.7 part, be dissolved in the deionized water of 98.4 parts, stir 30 minutes with the accurate reinforcement electric mixer of JJ-1, ACULYN22/23 emulsion is well-dispersed in water.Use trolamine, as neutralizing agent, pH value is adjusted to 7.0.In system, add the trihydroxy ethylamine oleate soap of 0.1 part silicone antifoam agent SE-47 and 0.15 part again, continue to be stirred to the accurate reinforcement electric mixer of JJ-1 and dissolve completely.Obtain the water base free abrasive cutting liquid manufactured for solar silicon wafers.
Embodiment 7
Get 0.9 part by the XC-190 of Korea S's brocade lake day beautiful production, be dissolved in the deionized water of 98.6 parts, stir 30 minutes with the accurate reinforcement electric mixer of JJ-1, XC-190 emulsion is well-dispersed in water.Use trolamine, as neutralizing agent, pH value is adjusted to 7.0.In system, add the organic silicone oil of 0.2 part and the trihydroxy ethylamine oleate soap of 0.25 part again, continue to be stirred to the accurate reinforcement electric mixer of JJ-1 and dissolve completely.Obtain the water base free abrasive cutting liquid manufactured for solar silicon wafers.
Embodiment 8
Get the Aculyn33 produced by ROHM AND HAAS of 1.1 parts, be dissolved in the deionized water of 99 parts, stir 30 minutes with the accurate reinforcement electric mixer of JJ-1, Aculyn33 emulsion is well-dispersed in water.Use trolamine, as neutralizing agent, pH value is adjusted to 7.0.In system, add the trihydroxy ethylamine oleate soap of 0.1 part cutting fluid foam control agent DF-965 and 0.15 part again, continue to be stirred to the accurate reinforcement electric mixer of JJ-1 and dissolve completely.Obtain the water base free abrasive cutting liquid manufactured for solar silicon wafers.
Embodiment 9
Get the ACULYN22/23 of 0.5 part, be dissolved in the deionized water of 98 parts, stir 30 minutes with the accurate reinforcement electric mixer of JJ-1, ACULYN22/23 emulsion is well-dispersed in water.Use trolamine, as neutralizing agent, pH value is adjusted to 7.0.In system, add the trihydroxy ethylamine oleate soap of 0.2 part silicone antifoam agent SE-47 and 0.25 part again, continue to be stirred to the accurate reinforcement electric mixer of JJ-1 and dissolve completely.Obtain the water base free abrasive cutting liquid manufactured for solar silicon wafers.
Above content is only and technological thought of the present invention is described; protection scope of the present invention can not be limited with this; every technological thought proposed according to the present invention, any change that technical scheme basis is done, within the protection domain all falling into claims of the present invention.
Claims (3)
1., for the water base free abrasive cutting liquid that solar silicon wafers manufactures, it is characterized in that: according to mass fraction meter, comprise following component:
Wherein, acrylic thickener is polyacrylic acid.
2. the water base free abrasive cutting liquid manufactured for solar silicon wafers according to claim 1, is characterized in that: described defoamer is silicone antifoam agent SRECN, silicone antifoam agent SE-47, organic silicone oil or cutting fluid foam control agent DF-965.
3., as claimed in claim 1 or 2 for a preparation method for the water base free abrasive cutting liquid of solar silicon wafers manufacture, it is characterized in that, comprise the following steps:
1) acrylic thickener of 0.5 ~ 1.2 part is dissolved in the deionized water of 98 ~ 99 parts, is stirred to acrylic thickener and is well-dispersed in deionized water, obtain mixing solutions;
2) pH value to 7.0 of mixing solutions is regulated with trolamine;
3) to pH value be 7.0 mixing solutions in add the defoamer of 0.10 ~ 0.20 part and the trihydroxy ethylamine oleate soap of 0.15 ~ 0.25 part, be then stirred to solute and dissolve completely, obtain for solar silicon wafers manufacture water base free abrasive cutting liquid.
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| CN107030904A (en) * | 2017-05-11 | 2017-08-11 | 济源石晶光电频率技术有限公司 | Crystalline substance stone roller cutting method |
| CN110459506A (en) * | 2018-05-08 | 2019-11-15 | 山东浪潮华光光电子股份有限公司 | A method of improving LED chip cutting pollution |
| CN110872538B (en) * | 2018-08-30 | 2021-11-12 | 比亚迪股份有限公司 | Silicon wafer cutting fluid, preparation method and application thereof, and sand slurry for cutting silicon wafer |
| CN110511811A (en) * | 2019-08-20 | 2019-11-29 | 山东大海新能源发展有限公司 | A kind of photovoltaic silicon wafer aqueous cutting fluid and preparation method thereof |
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| US6054422A (en) * | 1999-02-19 | 2000-04-25 | Ppt Research, Inc. | Cutting and lubricating composition for use with a wire cutting apparatus |
| CN102363738A (en) * | 2011-06-27 | 2012-02-29 | 镇江市港南电子有限公司 | Water base cutting fluid for cutting silicon wafers |
| CN102382712A (en) * | 2011-09-22 | 2012-03-21 | 江苏凯兴塑化有限公司 | Special water-based cutting fluid for diamond wire saw |
| CN103525532B (en) * | 2013-10-18 | 2016-01-06 | 山东昊达化学有限公司 | A kind of carborundum line cutting liquid and preparation method thereof |
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