CN103926807B - A kind of silicon slice alignment method - Google Patents
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Abstract
The open a kind of silicon slice alignment method of the present invention, including: position on silicon chip of step 1, input fine alignment coordinate points and the coordinate up and down of fine alignment flow process work stage motion；Step 2, using the distance between the upper station of fine alignment flow process and next station as the constraint function of zero distance, or will first find the nearest-neighbors point between a upper station of fine alignment flow process and next station, and they are connected with each other as constraint function, then use travelling salesman's algorithm optimization, increase by a penalty when meeting constraints as weight；Step 3, searching algorithm is utilized to carry out problem solving；Step 4, output solving result.
Description
Technical field
The present invention relates to a kind of integrated circuit equipment manufacturing field, particularly relate to a kind of silicon chip for lithographic equipment and be directed at
Method.
Background technology
In litho machine field, the productivity Throughout of complete machine is one of big core index of litho machine three, for improving productivity
Each litho machine manufacturer is continually striving to exploit potentialities, and has invented double-workpiece-table system, wherein in overall measurement position in prior art
On silicon chip 16 alignment marks are carried out fine alignment, to improve alignment precision.
In super large IC manufacturing field, for solving the routing problem of complicated multiple spot punching, such as United States Patent (USP)
US7054798 proposes one and combines traveling salesman problem algorithm (Traveling Sales Problem, TSP) to single in plane
One punching path carries out approximate calculation, it is thus achieved that a machining path the shortest, improves working (machining) efficiency with this.
Research to this problem can be divided into tripartite face influence factor, and first is system trajectory and program planning；The second is
Work stage exercise performance；3rd is Pointing strategy and monotechnics.Analyze in conjunction with basic exercise time formula T=S/V, its
Middle T is the time that motion is required, and S is the move distance needing to reach, and V is movement velocity.Wherein combine concrete station and work
Workflow T of sequence has can be divided into two classes, and T1 is to move the required time between two stations, and T2 is at a certain station
Time required for work.I.e. T=T1+T2.
One of influence factor is system trajectory and program planning, i.e. refers to use which kind of scheme and method to realize many on silicon chip
The alignment of individual labelling point, and their precedence and the track of motion.Transport between any two points in system trajectory is planned
The dynamic time consumed belongs to T1, is and moves the required time between two stations.
The two of influence factor are work stage exercise performance.About the background content of work stage exercise performance, refer to paper,
Author: Mu Haihua etc., ultraprecise point-to-point motion three rank trajectory planning precision controlling, " mechanical engineering journal ", Vol. 44
(1), 2008, pp.127-132. generally work stage motion model is planned to third-order and fourthorder model and emulates.Such as Fig. 1
Shown in, Fig. 1 is work stage motion model concept map in litho machine.It it is a kind of typical work stage exercise performance shown in table one
Parameter.
Table one
For the motion of spaced (10mm-100mm) close together of point-to-point transmission, according to work stage motion model and rule
Rule, according to as shown in table 1, the acceleration and deceleration between usual short distance rise to a bigger fortune insufficient for work stage speed
Dynamic speed, generally only rises to 200 mm/s to 400mm/s in this distance segment work stage maximal rate.It is to say, at this
In LAP, although work stage possesses the ability (more than 1000mm/s) reaching bigger stepping rate, but actually it is still located
Duty in relatively low movement velocity.Herein, it needs to be noted for short distance work stage step motion, at light
When machine exposure at quarter and the work of measurement position, the micropositioner of work stage is in startup and the process of stopping of slowing down accelerated frequently, all
For most of the time duty, the actual motion speed of work stage is the highest.The work stage model of above performance is carried out
Decomposing and calculate, can obtain following step-by-step system, the approximate model of move distance correspondence movement time and curve, such as Fig. 2 institute
Show.
The three of influence factor are Pointing strategy and monotechnics.Generally silicon chip alignment mark has multi-motion mode, as regarded
Frequency capture labelling, shown in Fig. 3, first X is to scanning then Y-direction scanning；Or first Y-direction scan then X to scanning.Such as institute in Fig. 4
Show, such as aerial image imaging labelling, or along 45 degree of angle sweep alignment marks.Owing to the actual size of alignment mark is minimum, generally
Between 400 microns to 500 microns, compared with the physical distance between labelling, proportion is less than 1%, therefore markers align unit
The diversity that the difference of technology and motion mode is caused, is negligible in Practical Project.
The most also because during alignment scanning, its movement velocity relatively low generally 3mm/s to 30mm/s, this speed
Compared with spending the average speed (400mm/s to 600mm/s) with work stage motion, numerical value is less, and therefore only 4%-5% is entering
In row model simplification and engineering calculation, we can assume that to be static to punctual work stage, and carry out alignment mark point
Unit is directed at.The time consumed in aligned units technology belongs to T2, is the time required for a certain station works.
As shown in Figure 5, this alignment methods specifically includes for silicon chip fine alignment flow process used in prior art and algorithm:
Silicon chip fine alignment uses according to n silicon chip fine alignment labelling existing on silicon chip and simply bends algorithm (simple meander
Algorithm) the alignment scanning pattern being effectively shortened interferometer improves alignment precision.This algorithm is by all silicon chip fine alignment marks
Remember and be substantially divided into m group to increasing along y, group number be the scanning pattern of even number along x to increasing, odd number is the most contrary.Then according to it is each
Group number is ascending is coupled together by scanning pattern for group.The most i.e. cook up the scanning alignment path of silicon chip fine alignment labelling.
Its detailed planning parameters of scanning paths process of traditional silicon chip fine alignment path calculation method can be divided into following step:
Alignment mark is divided into A1, A2 according to y direction by step 1. ... An set:
A) quantity of set is set as 0 (not comprising any one silicon chip alignment mark in set)；
B) select not in set, the position (xj, yj) that in all silicon chip alignment marks, y value is minimum；
C) select in all labellings (xk, yk) and be set at the beginning of yk-yj < y_tolerance, y_tolerance scope
More than 0, less than or equal to 100 (mm)；
D) labelling selected is set to new set Ai；
E) repeat above b, c, Step d until on silicon chip all of alignment mark all choose.
Labelling in step 2. each set Ai is pressed x forward and is arranged: the most ascending arrangement of Ai, if i is that odd number is by Ai
In labelling reversed arrangement.
For particular problem, use prior art simply bends algorithm, and its total distance is more than 1500 mm.
In sum, prior art needs a kind of new alignment methods, can improve while ensureing alignment accuracy
Alignment efficiency.
Summary of the invention
In order to overcome defect present in prior art, the present invention provides a kind of silicon slice alignment method, can ensure alignment
Alignment efficiency is improved while degree of accuracy.
In order to realize foregoing invention purpose, the open a kind of silicon slice alignment method of the present invention, including: step 1, input fine alignment
Coordinate points position on silicon chip and the coordinate up and down of fine alignment flow process work stage motion；Step 2, upper by fine alignment flow process
Distance between one station and next station is as the constraint function of zero distance, or will first find the upper of fine alignment flow process
Nearest-neighbors point between one station and next station, and they are connected with each other as constraint function, then adopt
Use travelling salesman's algorithm optimization, increase by a penalty when meeting constraints as weight；Step 3, searching algorithm is utilized to enter
Row problem solving；Step 4, output solving result.
This step 1 specifically includes: the step 1.1 arbitrary preparation station p0 (x0, y0) place from silicon wafer exposure operation opens
Beginning, motion control unit drives silicon wafer stage to drive silicon chip opsition dependent p1, p2 ..., order corresponding for pn, by this preparation station phase
The n of the silicon chip surface closed lays respectively at p1 (x1, y1), p2 (x2, y2) ..., the alignment mark of pn (xn, yn) move one by one
To the vertical direction of mark scan unit, this order is characterised by connecting, with straight line, each mark position that this order is traveled through
The total kilometres constituted are the shortest, and i.e. in this traversal order, the most front and back the coordinate (xi, yi) of 2 pi, pj, (xj, yj) meet
Total kilometres are the shortest, i=0～n-1, j=i+1～n；
Step 1.2 computing formula is as follows:, wherein
WithRepresent X value and the Y value of the position of last coordinate of working position；WithRepresent the next one
The X value of the position coordinates of first coordinate of work and Y value；On this, a working position is for carry out by leveling position, field to silicon chip, under this
One working position is that two work stage swap wait position.
Using the distance between the upper station of fine alignment flow process and next station as the pact of zero distance in this step 2
Bundle function specifically includes: pre-during distance between upper one and the next one of fine alignment working position that calculate fine alignment working position
It is set to 0；First find the nearest-neighbors point between a upper station of fine alignment flow process and next station, and they are interconnected mutually
Pick up and be used as constraint function and specifically include；First look for nearest with on it working position coordinate of 16 coordinate points of fine alignment
Neighbours, then find 16 coordinate points of fine alignment with the nearest-neighbors of its next working position coordinate, the evaluation function in step 2
For euclidean function or chessboard function.
When this evaluation function is euclidean function, its computing formula is as follows:, sum total
Distance is the shortest,WithRepresent X value and the Y value of working position coordinate ps (xs, ys) in a working position；Or work in the middle of representing
In Wei, working position coordinate p1 (x1, y1) arrives X value and the Y value of pn (xn, yn)；Or represent working position coordinate pe in next working position
The X value of (xe, ye) and Y value, this middle working position is silicon chip fine alignment working position.
When this evaluation function is chessboard function, its computing formula is as follows:, sum up distance
It is the shortest,WithRepresent X value and the Y value of working position coordinate ps (xs, ys) in a working position；Or work is in the middle of representing
Middle working position coordinate p1 (x1, y1) arrives X value and the Y value of pn (xn, yn)；This middle working position is silicon chip fine alignment working position.
In this step 3 use searching algorithm be the one in following algorithm: greedy algorithm, two to exchange, three to exchange,
Heuritic approach, simulated annealing, ant cave algorithm or genetic algorithm.
In this step 1.1, the angle of scanning is in X direction or Y-direction or 45 degree of angular direction.
Compared with prior art, the technical program has the advantage that as follows: the first, guarantee complete machine alignment precision, 16
Silicon chip alignment mark point carries out successively being directed at.The second, simultaneously improve fine alignment efficiency, and then improve overall efficiency.3rd, essence is right
Quasi-Link Efficiency improves 5-25%, improves overall efficiency+2 tablets h.4th, shorten work stage motion path, reduce work
Part platform is lost, and extends complete machine service life.5th, compatible ATHENA and SMASH alignment sensor.6th, compatible essence
Close alignment relates to X and scans to Y-direction, it is possible to compatibility is applicable to 45 degree of angle sweep alignment marks.
Accompanying drawing explanation
Can be described in detail by invention below about the advantages and spirit of the present invention and institute's accompanying drawings obtains further
Solve.
Fig. 1 is work stage motion model concept map in litho machine；
Fig. 2 is approximate model and the curve of move distance correspondence movement time in work stage motion model；
Fig. 3 during being in alignment with first X to the scheme schematic diagram of Y-direction passing marker again；
Fig. 4 be in alignment with during along the scheme schematic diagram of 45 degree of scanning direction labellings；
Fig. 5 is the alignment pathway figure used in prior art under simple bending algorithm；
Fig. 6 is litho machine complete machine architecture system figure；
Fig. 7 is double-workpiece-table litho machine workflow diagram；
Fig. 8 is the algorithm flow chart of the first embodiment shown by the present invention；
Fig. 9 is to wait the position alignment pathway figure at X forward in the first embodiment；
Figure 10 is to wait the position alignment pathway figure at X negative sense in the first embodiment；
Figure 11 is the algorithm flow chart of the second embodiment shown by the present invention；
Figure 12 is to wait the position alignment pathway figure at X forward in the second embodiment；
Figure 13 is to wait the position alignment pathway figure at X negative sense in the second embodiment.
Detailed description of the invention
Describe the specific embodiment of the present invention below in conjunction with the accompanying drawings in detail.
In order to the technical program is better described, below will be defined as follows to help to understand the technical program.
Silicon chip alignment device (Wafer Alignment, WA): the function of silicon chip alignment device has been to silicon chip and to cover
The horizontal level alignment of mould.Described radiant flux B incides the described pattern shape being maintained on supporting construction (such as mask platform) MT
Become on device (such as, mask) MA, and be patterned by the patterning device.Oneself is through through patterning device (such as, mask)
After MA, described radiant flux B passes through optical projection system PS, and described PS is by radiation beam to the target part C of substrate w.Pass through
The help of the second positioner PW and position sensor IF (such as, interferometric device, linear encoder or capacitance sensor), can
Accurately to move described substrate table WT, such as so that different target part C is positioned in the path of described radiant flux PB.
Similarly, such as after obtaining from the machinery of mask library, or during scanning, can be by described first positioner PM with another
One position sensor is for being precisely located the patterning device MA path relative to described radiant flux PB.Generally, may be used
Long-stroke module (coarse positioning) and short stroke module with the part by forming described first positioner PM are (accurately fixed
Position) help realize the movement of patterning device supporting construction (such as, mask platform) MT.It is similar to, substrate table WT or lining
The end support movement can by utilize formed described second positioner PW a part long-stroke module (coarse positioning) and
Short stroke module (being accurately positioned) realizes.In the case of a stepper (contrary with scanning device), described supporting construction MT is permissible
Only it is connected with short-stroke actuator, can be maybe fixing.Mask alignment marks M1, M2 and substrate can be used
Alignment mark P1, although P2 is directed at substrate alignment mark shown for patterning device MA and substrate Wo and takies special mesh
Mark part, they can be arranged on the position between target part (the line alignment mark known).It is similar to, many providing
In the situation of a tube core to patterning device (such as, mask) MA, mask alignment marks can be arranged on
Between tube core.
The function of silicon chip sports platform (Wafer Stage, WS) silicon chip sports platform (or claiming work stage) is to carry silicon chip and transport
Move the position (at station) specified and carry out the operation of corresponding operation.Described lithographic equipment can be to have two (dual stage) or more
The type two of many substrate tables or " substrate support " (and/or two or more mask platform or " mask support part ") is this
In the machine of " multiple stage ", additional platform and/or supporting construction can be used concurrently, or can be by one or more other
Platform and or supporting construction for exposure while, on one or more and/or supporting construction perform preliminary step.
The technical program proposes a kind of efficiently silicon chip fine alignment flow process and method.Silicon chip is carried out 16 silicon chips to fiducial mark
Flow process and the path of note are optimized method, and this method is by the alignment mark working position of about the 16 of fine alignment and fine alignment
A upper station of flow process and next station linkage consider altogether, it be a kind of global optimization be applied in the flow process of local excellent
Change thought scheme so that it is the working trajectory being suitable for work stage reaches the shortest, improves work stage sport efficiency and complete machine productivity with this.
Fig. 6 is litho machine complete machine architecture system figure, especially a kind of typical double-workpiece-table litho machine.With this in the present invention
Illustratively, but the present invention is not merely applicable to the litho machine of the type to litho machine.This litho machine includes a photoetching
Machine silicon wafer exposure system.Photo-etching machine silicon chip exposure system includes: a kind of silicon chip alignment device and system (Wafer Alignment,
WA) 300, it includes a silicon chip alignment device, it is possible to achieve (at silicon on silicon chip mark (at silicon chip upper surface) and TIS version
The upper surface of sheet micropositioner) alignment, set up relation between the two.It includes a work stage, and work stage 100 is by micropositioner
110 and coarse motion platform 120 form.Silicon chip 4 is placed in workpiece platform micro-motion platform 110 top, and micropositioner 110 can deliver silicon chip 4 and move.This
Also include outward a kind of measurement system such as laser interferometer 210(Interferometer, IF), or plane grating chi (Encoder)
Deng sensor, it is possible to realize micropositioner 110 and the measurement of the nano-precision of silicon chip 4.
Fig. 7 describes a kind of double-workpiece-table workflow.It includes following job step: a. bottom sheet mechanical hand is from silicon chip
Silicon chip is taken away on platform；B. go up a mechanical hand silicon chip is positioned on silicon wafer stage；D. searching for accurate zero-bit, laser interferometer resets；
E. alignment is used for setting up worktable coordinate system；F. silicon chip is carried out overall situation leveling；G. coarse alignment is used for setting up silicon chip coordinate system；h.
Silicon chip is carried out by field leveling；I. with reference to alignment mark, silicon chip is carried out fine alignment；J. two work stage swap；K. search for
Accurately zero-bit, laser interferometer resets；L. coaxial alignment is implemented；M. silicon chip is carried out local alignment；N. optimal focal plane 1 is determined；
O. optimal focal plane 2 is determined；P. scan exposure is implemented.
The technical program, based on traveling salesman problem algorithm, uses two kinds of optimized algorithms.The first is weight of zero algorithm, i.e. essence
Distance between a upper station and the next station of alignment flow process is as the constraint function of zero distance, namely first up and down
Working position first couples together, and uses traveling salesman problem algorithm to be optimized subsequently.The second is nearest neighbor algorithm, the most first finds
Nearest-neighbors point between a upper station and the next station of fine alignment flow process, and they are connected with each other as about
Bundle function, uses traveling salesman problem algorithm to be optimized subsequently.
This silicon chip accurate alignment method, including:
1, arbitrary preparation station p0 (x0, the y0) place from silicon wafer exposure operation starts, and motion control unit drives silicon chip
Platform drives silicon chip opsition dependent p1, p2 ..., order corresponding for pn, by n difference position of silicon chip surface relevant for this preparation station
The Vertical Square to mark scan unit is moved one by one in p1 (x1, y1), p2 (x2, y2) ..., the alignment mark of pn (xn, yn)
Downwards, to be characterised by connecting, with straight line, the total kilometres that each mark position that this order traveled through constituted the shortest, i.e. for this order
In described traversal order arbitrarily before and after the coordinate (xi, yi) of 2 pi, pj, (xj, yj) meet total kilometres for the shortest, wherein, i
=0～n-1, j=i+1～n；
And its computing formula comprises following feature, first:
OrDistance is the shortest, wherein
WithRepresent the X of working position coordinate ps (xs, ys) in job sequence (silicon chip is carried out by field leveling by h.)
Value and Y value；WithRepresent X value and the Y value of working position coordinate p1 (x1, y1) in next work sequence (i. silicon chip fine alignment)；
And its computing formula comprises following feature, second:
OrDistance is the shortest, whereinWithGeneration
The X value of working position coordinate pn (xn, yn) and Y value in job sequence (i. silicon chip fine alignment) on table；WithRepresent the next one
The X value of working position coordinate pe (xe, ye) and Y value in work sequence (j. work stage swaps wait).
2, mark scan unit scans correspondence markings the most one by one and records the space characteristics of mark of correlation, directly
To completing the scanning to the n-th alignment mark and feature record.
3, registration signal processing unit by the above-mentioned spatial signature information of n alignment mark that recorded by matching to quasi wave
Shape method, need to determine that the matching of each sinusoidal cycles waveform is counted, to obtain preferable matching waveform.Current work is drawn after calculating
Silicon chip alignment correction data △ x, the △ y of position, passes data to motion control unit；
4, △ x, △ y is converted into silicon wafer stage and drives signal by motion control unit, drives silicon wafer stage carrying silicon chip to move to
Fine alignment position completes fine alignment.
5, last, motion control unit drives silicon chip to prepare station pn+1 (xn+1, yn+ to next of silicon wafer exposure operation
1), such as the operating coordinates of sports platform exchange position.
The first embodiment shown by the present invention described below i.e. weight of zero algorithm.Fig. 8 is shown by the present invention
The algorithm flow chart of the first embodiment.The method includes four steps, and respectively input data S801, restrained boundary sets
Put S802, problem solving S803 and output result S804.The method specifically includes:
S801: input data.They include carrying out in fine alignment flow process with reference to alignment mark to silicon chip, fine alignment coordinate points
(such as 16 or 32) position on silicon chip, and work stage drives silicon chip should move to the underface of alignment sensor, its
Secondary should include a upper coordinate that fine alignment flow process work stage moves and next coordinate.As it is shown in fig. 7, a job on it
Position is that silicon chip is carried out by field leveling by h., and its next working position, two work stage of j. swap the coordinate points waiting position.
Its computing formula is as follows:, wherein
WithRepresent a working position h. silicon chip to be carried out by leveling position, field, position (the X value of last coordinate
And Y value)；
WithRepresent lower two work stage of j. and swap wait position, (X value and the Y of the position coordinates of first coordinate
Value)；
S802: restrained boundary is arranged, and refers to that the upper coordinate to fine alignment working position and the fine alignment working position next one are sat
Distance between mark is weight of zero.When next of upper one and fine alignment working position needing to calculate fine alignment working position in program
During distance between individual, they have been assumed equal to 0.In algorithm process, for meeting specific constraints, increase
Penalty controls this relation.The penalty application herein is to a kind of weight of distance in traveling salesman problem.As
Fruit meets the condition of punishment, just applies penalty value in this distance；If not meeting this condition, the most do not apply penalty value.
Evaluation function uses two kinds of optional schemes, and the first is euclidean function, and the second is chessboard function.
Evaluation function one: use Euclidean distance function (Euclidean Distance), calculates the physics of point-to-point transmission
Distance.
Its computing formula is as follows:, sum total distance is the shortest, whereinWithRepresent one
The X value of coordinate and Y value.
WithRepresent the X of working position coordinate ps (xs, ys) in job sequence (silicon chip is carried out by field leveling by h.)
Value and Y value；
Or in the middle of representing in work sequence (i. silicon chip fine alignment) working position coordinate p1 (x1, y1) to pn (xn, yn) X value with
Y value；
Or represent in next work sequence (j. work stage swaps wait) the X value of working position coordinate pe (xe, ye) with
Y value.
Evaluation function two: use chessboard distance function (Chessboard Distance), according to work stage X and Y-direction long row
Journey can independent parallel run feature, calculate X and Y distance between two points maximum, as evaluation function.
Its computing formula is as follows:, sum total distance is the shortest, whereinWithRepresent one
The X value of coordinate and Y value.
WithRepresent the X of working position coordinate ps (xs, ys) in job sequence (silicon chip is carried out by field leveling by h.)
Value and Y value；
Or in the middle of representing in work sequence (i. silicon chip fine alignment) working position coordinate p1 (x1, y1) to pn (xn, yn) X value with
Y value.
S803: problem solving.Optional searching algorithm includes: greedy algorithm, two to exchange, three to exchange, heuristic calculation
Method, simulated annealing, ant cave algorithm, genetic algorithm.Generally speaking they are all a kind of approximate datas, but for as 16-20
Point, the problem of this low combination complexity, usual approximate data can obtain gratifying solving result.
S804: output result, they include export optimal case, calculate total distance, designated firing duration, calculating productivity,
Graphics path visualizes.Its result may refer to silicon chip fine alignment mark path and flow process and table 2 many algorithms meter in Fig. 9, Figure 10
Calculate the contrast of result path.Fig. 9 is to wait the position alignment pathway figure at X forward in the first embodiment；Figure 10 is the first enforcement
Mode waits the position alignment pathway figure at X negative sense.In Fig. 9 Figure 10, the numeral in coordinate points represents path planning successively and is traveled through
The order of coordinate points.
The most compatible fine registration of this embodiment relates to X and scans to Y-direction, it is possible to compatibility is applicable to 45 degree of angle sweeps
Alignment mark.
Second embodiment is a kind of nearest neighbor algorithm, and it is based on global optimization thought, lower work position arest neighbors
The path optimizing design cycle occupied, as shown in Figure 11 programming and algorithm flow chart.
Being 1101: input data, they include carrying out in fine alignment flow process with reference to alignment mark to silicon chip, fine alignment coordinate
The point (such as 16) position on silicon chip, work stage drives silicon chip should move to the underface of alignment sensor, secondly
A upper coordinate that fine alignment flow process work stage moves and next coordinate should be included.As it is shown in fig. 7, a working position on it
Should be that silicon chip is carried out by field leveling by h., its next working position, two work stage of j. swap the coordinate points waiting position.
Second step: restrained boundary is arranged, first looks for 16 coordinate points of fine alignment with on it working position coordinate
Neighbour occupy, to and lock.Then find 16 coordinate points of fine alignment with the nearest-neighbors of its next working position coordinate, and lock
Fixed.In algorithm process, for meeting specific constraints, increase penalty and control this relation.Penalty is at this
The application at place is to a kind of weight of distance in traveling salesman problem.If meeting the condition of punishment, just apply in this distance
Penalty value；If not meeting this condition, the most do not apply penalty value.
Evaluation function uses two kinds of optional schemes, and the first is euclidean function, and the second is chessboard function.
Evaluation function one: use Euclidean distance function (Euclidean Distance), calculates the physics of point-to-point transmission
Distance.
Its computing formula is as follows:Sum total distance is the shortest, whereinWithRepresent one
The X value of coordinate and Y value.
WithRepresent the X of working position coordinate ps (xs, ys) in job sequence (silicon chip is carried out by field leveling by h.)
Value and Y value；Or in the middle of representing in work sequence (i. silicon chip fine alignment) working position coordinate p1 (x1, y1) to pn (xn, yn) X value with
Y value；Or represent X value and the Y value of working position coordinate pe (xe, ye) in next work sequence (j. work stage swaps wait).
Evaluation function two: use chessboard distance function (Chessboard Distance), according to work stage X and Y-direction long row
Journey can independent parallel run feature, calculate X and Y distance between two points maximum, as evaluation function.
Its computing formula is as follows:Sum total distance is the shortest, whereinWithRepresent one
The X value of coordinate and Y value.
WithRepresent the X of working position coordinate ps (xs, ys) in job sequence (silicon chip is carried out by field leveling by h.)
Value and Y value；Or in the middle of representing in work sequence (i. silicon chip fine alignment) working position coordinate p1 (x1, y1) to pn (xn, yn) X value with
Y value；Or represent X value and the Y value of working position coordinate pe (xe, ye) in next work sequence (j. work stage swaps wait).
3rd step: problem solving.Optional searching algorithm includes: greedy algorithm, two to exchange, three to exchange, heuristic
Algorithm, simulated annealing, ant cave algorithm, genetic algorithm.Generally speaking they are all a kind of approximate datas, but for as 16-20
Individual, the problem of this low combination complexity, usual approximate data can obtain gratifying solving result.
4th step: output result, they include exporting optimal case, calculating total distance, designated firing duration, calculating product
Rate, graphics path visualize.Its result may refer to silicon chip fine alignment mark path and flow process and table more than 2 in Figure 12, Figure 13 and plants calculation
The contrast in method result of calculation path.Figure 12 is to wait the position alignment pathway figure at X forward in the first embodiment；Figure 13 is first
Embodiment waits the position alignment pathway figure at X negative sense.In Figure 12 Figure 13, the numeral in coordinate points represents path planning successively
The order of traveled through coordinate points.
The most compatible fine registration of present embodiment relates to X and scans to Y-direction, it is possible to compatibility is applicable to 45 degree of angle sweeps
Alignment mark.
Table 2
Compared with prior art, the technical program has the advantage that as follows: the first, guarantee complete machine alignment precision, 16
Silicon chip alignment mark point carries out successively being directed at.The second, simultaneously improve fine alignment efficiency, and then improve overall efficiency.3rd, essence is right
Quasi-Link Efficiency improves 5-25%, improves overall efficiency+2 tablets h.4th, shorten work stage motion path, reduce work
Part platform is lost, and extends complete machine service life.5th, compatible ATHENA and SMASH alignment sensor.6th, compatible essence
Close alignment relates to X and scans to Y-direction, it is possible to compatibility is applicable to 45 degree of angle sweep alignment marks.
The preferred embodiment of the simply present invention described in this specification, above example is only in order to illustrate the present invention
Technical scheme rather than limitation of the present invention.All those skilled in the art are under this invention's idea by logical analysis, reasoning
Or the available technical scheme of limited experiment, all should be within the scope of the present invention.
Claims (6)
1. a silicon slice alignment method, it is characterised in that including:
Step 1, input fine alignment coordinate points position on silicon chip and the coordinate up and down of fine alignment flow process work stage motion；
Step 2, using the distance between the upper station of fine alignment flow process and next station as the constraint function of zero distance,
Or will first find the nearest-neighbors point between a upper station of fine alignment flow process and next station, and they are interconnected mutually
Pick up and be used as constraint function, then use travelling salesman's algorithm optimization, increase by a penalty conduct when meeting constraints
Weight；
Step 3, searching algorithm is utilized to carry out problem solving；
Step 4, output solving result；Wherein,
Described step 1 specifically includes:
The step 1.1 arbitrary preparation station p0 (x0, y0) place from silicon wafer exposure operation starts scanning, and motion control unit drives
Dynamic silicon wafer stage drives silicon chip opsition dependent p1, p2 ..., order corresponding for pn, by n of silicon chip surface relevant for this preparation station
Lay respectively at p1 (x1, y1), p2 (x2, y2) ..., the alignment mark of pn (xn, yn) move one by one to mark scan unit
Under vertical direction, this order is characterised by connecting total kilometres that each mark position that this order traveled through constituted with straight line
Short, in the most described traversal order arbitrarily before and after the coordinate (xi, yi) of 2 pi, pj, (xj, yj) meet total kilometres for the shortest, i
=0～n-1, j=i+1～n；
Step 1.2 computing formula is as follows:, wherein,WithRepresent one
The X value of the position of last coordinate of working position and Y value；WithThe position representing next first coordinate of working position is sat
Target X value and Y value；A described upper working position is for carry out by leveling position, field to silicon chip, and described next working position is two works
Part platform swaps wait position.
2. silicon slice alignment method as claimed in claim 1, it is characterised in that by upper the one of fine alignment flow process in described step 2
Distance between individual station and next station specifically includes as the constraint function of zero distance: calculating fine alignment working position
It is preset as 0 during distance between upper one and the next one of fine alignment working position；First find a upper station of fine alignment flow process
And the nearest-neighbors point between next station, and they are connected with each other as constraint function and specifically include；First look for
To 16 coordinate points of fine alignment with the nearest-neighbors of on it working position coordinate, then find 16 coordinate points of fine alignment with it
The nearest-neighbors of next working position coordinate.
3. silicon slice alignment method as claimed in claim 1, it is characterised in that described weight distance in-service evaluation function calculates and obtains
, when described evaluation function is euclidean function, its computing formula is as follows:, sum up away from
From the shortest,WithRepresent X value and the Y value of working position coordinate ps (xs, ys) in a working position；Or work in the middle of representing
In Wei, working position coordinate p1 (x1, y1) arrives X value and the Y value of pn (xn, yn)；Or represent working position coordinate pe in next working position
The X value of (xe, ye) and Y value,WithRepresent X value and the Y value of working position coordinate p1 (x1, y1) in next working position, described
Middle working position is silicon chip fine alignment working position.
4. silicon slice alignment method as claimed in claim 1, it is characterised in that described weight distance in-service evaluation function calculates and obtains
, when described evaluation function is chessboard function, its computing formula is as follows:, sum total distance is
It is short,WithRepresent X value and the Y value of working position coordinate ps (xs, ys) in a working position；Or during in the middle of representing, work is
Working position coordinate p1 (x1, y1) arrives X value and the Y value of pn (xn, yn),WithRepresent working position coordinate in next working position
The X value of p1 (x1, y1) and Y value；Described middle working position is silicon chip fine alignment working position.
5. silicon slice alignment method as claimed in claim 1, it is characterised in that the searching algorithm used in described step 3 be with
One in lower algorithm: greedy algorithm, two to exchange, three to exchange, heuritic approach, simulated annealing, ant cave algorithm or heredity
Algorithm.
6. silicon slice alignment method as claimed in claim 1, it is characterised in that in described step 1.1, the angle of scanning is along X side
To or Y-direction or 45 degree of angular direction.
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| CN101004556A (en) * | 2006-12-21 | 2007-07-25 | 上海微电子装备有限公司 | Method for optimizing route for exposing wafer |
| CN101086627A (en) * | 2007-04-29 | 2007-12-12 | 上海微电子装备有限公司 | Bump photolithographic machine exposal method |
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| EP0862089A3 (en) * | 1997-02-28 | 2000-05-10 | Nikon Corporation | Method of determining movement sequence and apparatus for realizing it |
| JP3816815B2 (en) * | 2001-09-27 | 2006-08-30 | 株式会社東芝 | Charged particle beam exposure method and charged particle beam exposure data creation method |
| JP2011138829A (en) * | 2009-12-25 | 2011-07-14 | Canon Inc | Determination method, exposure method, aligner, method of manufacturing device, and program |
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| CN101004556A (en) * | 2006-12-21 | 2007-07-25 | 上海微电子装备有限公司 | Method for optimizing route for exposing wafer |
| CN101086627A (en) * | 2007-04-29 | 2007-12-12 | 上海微电子装备有限公司 | Bump photolithographic machine exposal method |
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