CN103924196A - Vapor plating apparatus - Google Patents
Vapor plating apparatus Download PDFInfo
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- CN103924196A CN103924196A CN201310753959.8A CN201310753959A CN103924196A CN 103924196 A CN103924196 A CN 103924196A CN 201310753959 A CN201310753959 A CN 201310753959A CN 103924196 A CN103924196 A CN 103924196A
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Abstract
The invention relates to the technical field of film formation, and especially relates to a vapor plating apparatus. The apparatus comprises at least one first line evaporation unit, at least one second line evaporation unit, a first surface evaporation box and a second surface evaporation box; the first surface evaporation box and the second surface evaporation box are respectively provided with a groove, the first line evaporation unit is arranged in the groove of the first surface evaporation box, and the second line evaporation unit is arranged in the groove of the second surface evaporation box; and the first surface evaporation box and the second surface evaporation box are arranged in a staggered manner in order to make the first line evaporation unit arranged in the first surface evaporation box and the second line evaporation unit in the second surface evaporation box not positioned in a same plane. The vapor plating apparatus improves the contour overlapping rate of a film formed by depositing a material in order to improve the quality of the formed film.
Description
Technical field
The present invention relates to film and form technical field, relate in particular to a kind of evaporation coating device.
Background technology
For the formation of Thin Film Transistor (TFT) (Thin Film Transistor, TFT) organic light emission layer film, the evaporation of electrode, or the evaporation of other electronic component film, need an evaporation coating device to complete.
Shown in Fig. 1 is the evaporation coating device structural representation being comprised of linear evaporation source in prior art; With reference to figure 1, comprise First Line evaporation element 11 and the second line evaporation element 12, wherein be arranged on the first deposition material nozzle 111 on First Line evaporation element 11, be arranged on the second deposition material nozzle 121 on the second line evaporation element 12, crucible (not shown) and for crucible deposition material being transferred to passage 112 and the passage 122 of the first deposition material nozzle 111 and the second deposition material nozzle 121.In evaporate process, the crucible that holds the first deposition material evaporates the first deposition material and the second deposition material with the crucible that holds the second deposition material, through passage 121 and passage 122, transfer to the first deposition material nozzle 111 and the second deposition material nozzle 121, and then after mask plate 13, act on substrate 14 and complete evaporation.
Shown in Fig. 1 a be in prior art evaporation coating device along A-A
1line cross section structure schematic diagram; With reference to figure 2, in prior art, the first deposition material nozzle 111 and the second deposition material nozzle 121 are obliquely installed in First Line evaporation element 11 and the second line evaporation element 12.
Shown in Fig. 1 b is that prior art medium dip arranges nozzle generation shadow zone schematic diagram; With reference to figure 1b, the shadow zone 1 that the first deposition material nozzle ejection line 111a that prior art medium dip arranges and the second deposition material nozzle 121a spray line form and 2 sizes are inhomogeneous.
Mainly there is following shortcoming in evaporation coating device of the prior art:
1, because First Line evaporation element and the second line evaporation element need be avoided the impact that heat is disturbed each other, it is more remote that both needs keep, the film profile variation that causes the first deposition material and the second deposition material to form on substrate is larger, and overlapping rate is low, makes the membrane quality of formation poor.Heat is disturbed and to be referred to because dissimilar deposition material vaporization temperature is different, and with this, when the evaporation source setting of two kinds of deposition material of evaporation is nearer, temperature each other can phase mutual interference, and then can affect evaporation effect.Film profile refers to that deposition material is after forming film, and the distribution profile presenting in film, for evaluating deposition material doping effect; The two kinds of deposition material of take are example, and the film profile forming in the film that two kinds of deposition material are forming more trends towards overlapping, and the effect of adulterating is better.
2, because the first deposition material nozzle and the second deposition material nozzle are obliquely installed, though can realize doping effect preferably at First Line evaporation element and the second line evaporation element region intermediate; But First Line evaporation element and the second line evaporation element region intermediate both sides, doping effect is poor, and making to form film can not use, and has wasted deposition material, and material use efficiency is low.
3, the first deposition material nozzle and the second deposition material nozzle is obliquely installed that also to make to form film shadow zone inhomogeneous.For the formation of TFT organic light emission layer film, be unfavorable for the production of high-resolution products.Film shade refers to the existence because of mask plate, at mask plate split shed place, because of blocking of the edge of opening cause can not Effective Doping region.
Summary of the invention
The object of the invention is to propose a kind of evaporation coating device, to improve the overlapping rate of the film profile of deposition material formation, reduce the deviation of film profile, and then promote film forming quality.
The embodiment of the present invention provides a kind of evaporation coating device to comprise: at least one First Line evaporation element, at least one second line evaporation element, first surface evaporation tank and second evaporation tank;
Described first surface evaporation tank and described second evaporation tank are respectively arranged with fluting, and described First Line evaporation element is arranged in the fluting of described first surface evaporation tank, and described the second line evaporation element is arranged in the fluting of described second evaporation tank;
Described second evaporation tank and described first surface evaporation tank staggered floor arrange, so that the First Line evaporation element being arranged in first surface evaporation tank is not positioned at same plane with the second line evaporation element being arranged in second evaporation tank.
The evaporation coating device that the embodiment of the present invention provides, second evaporation tank and first surface evaporation tank staggered floor arrange, and with this, make the second line evaporation element that is arranged at the First Line evaporation element of first surface evaporation tank and is arranged at second evaporation tank not be positioned at same plane; First Line evaporation element and the second line evaporation element are not positioned at same plane, make First Line evaporation element and the second line evaporation element when avoiding heat interference each other, can remain on nearer distance, and then the first deposition material and the second deposition material can fully be adulterated, therefore, the overlapping rate that has improved the film profile of deposition material formation, has reduced the deviation of film profile, and then has promoted film forming quality.
Accompanying drawing explanation
Accompanying drawing described herein is used to provide a further understanding of the present invention, forms a part of the present invention, does not form limitation of the invention.In the accompanying drawings:
Shown in Fig. 1 is evaporation coating device structural representation in prior art;
Shown in Fig. 1 a be in prior art evaporation coating device along A-A in Fig. 1
1line schematic cross-section;
Shown in Fig. 1 b is that prior art medium dip arranges nozzle generation shadow zone schematic diagram;
Shown in Fig. 2 is evaporation coating device structural representation in one embodiment of the invention;
Shown in Fig. 2 a is evaporation coating device STRUCTURE DECOMPOSITION schematic diagram in one embodiment of the invention;
Shown in Fig. 2 b is First Line evaporation element and first surface evaporation tank STRUCTURE DECOMPOSITION schematic diagram in one embodiment of the invention;
Shown in Fig. 2 c be in one embodiment of the invention one second line evaporation element along B-B in Fig. 2 a
1line cross section structure schematic diagram;
Shown in Fig. 2 d be in one embodiment of the invention in one second line evaporation element one second deposition material nozzle along C-C in Fig. 2 a
1line cross section structure schematic diagram;
Shown in Fig. 2 e is that in one embodiment of the invention, vertical nozzle produces shadow zone schematic diagram;
Shown in Fig. 3 is evaporation coating device structural representation in another embodiment of the present invention;
Shown in Fig. 3 a is one second line evaporation element cross section structure schematic diagram in evaporation coating device in another embodiment of the present invention;
Shown in Fig. 4 is evaporation coating device structural representation in another embodiment of the present invention;
Shown in Fig. 5 is evaporation coating device structural representation in another embodiment of the present invention;
Shown in Fig. 6 is evaporation coating device structural representation in another embodiment of the present invention;
Shown in Fig. 6 a be in another embodiment of the present invention evaporation coating device cover plate along D-D in Fig. 6
1line cross section structure schematic diagram;
Shown in Fig. 6 b be in another embodiment of the present invention a preferred evaporation coating device cover plate along D-D in Fig. 6
1line cross section structure schematic diagram;
Shown in Fig. 7 is evaporation coating device structural representation in another embodiment of the present invention.
Embodiment
Below in conjunction with drawings and the specific embodiments, the present invention is carried out more in detail and complete explanation.Be understandable that, specific embodiment described herein is only for explaining the present invention, but not limitation of the invention.It also should be noted that, for convenience of description, in accompanying drawing, only show part related to the present invention but not full content.
Shown in Fig. 2 is evaporation coating device structural representation in one embodiment of the invention.
Shown in Fig. 2 a is evaporation coating device STRUCTURE DECOMPOSITION schematic diagram in one embodiment of the invention.
With reference to figure 2 and Fig. 2 a, in the present embodiment, evaporation coating device comprises: three First Line evaporation elements 212, four the second line evaporation elements 222, first surface evaporation tank 21 and second evaporation tank 22.It will be understood by those skilled in the art that in other embodiments, evaporation coating device should comprise at least one First Line evaporation element 212 and at least one second line evaporation element 222.
First surface evaporation tank 21 and second evaporation tank 22 are respectively arranged with fluting, slot as holding First Line evaporation element 212 and the second line evaporation element 222 parts in Fig. 2 a.First Line evaporation element 212 is arranged in the fluting of first surface evaporation tank 21, and the second line evaporation element 222 is arranged in the fluting of second evaporation tank 22.
First surface evaporation tank 21 and second evaporation tank 22 staggered floor setting, so that the First Line evaporation element 212 being arranged in first surface evaporation tank 21 is not positioned at same plane with the second line evaporation element 222 being arranged in second evaporation tank 22; Wherein, staggered floor setting is to make first surface evaporation tank 21 and second evaporation tank 22 not be positioned at same plane.
Optionally, in the present embodiment, first surface evaporation tank 21 is provided with perforate, and the second line evaporation element 222 upper surfaces are provided with the second deposition material nozzle 221, for the perforate through first surface evaporation tank 21, evaporates the second deposition material; First Line evaporation element 212 upper surfaces are provided with the first deposition material nozzle 211, for evaporating the first deposition material.
In the present embodiment, the upper surface of the second line evaporation element 222 or First Line evaporation element 212 refers to that First Line evaporation element 212 or the second line evaporation element 222 are towards a side of substrate to be deposited.In the present embodiment, First Line evaporation element 212 and the second line evaporation element 222 comprise respectively the housing of target and accommodating this target; Wherein, on the housing of First Line evaporation element 212, be provided with the first deposition material nozzle 211 and on the housing of first channel 213, the second line evaporation elements 222 of the first deposition material, be provided with the second deposition material nozzle 221 and for transmitting the second deposition material second passage 223 for transmitting.In addition, evaporation element also comprises and is positioned at housing, and accommodates the container of target.
First deposition material nozzle 211 evaporation the first deposition material that First Line evaporation element 212 upper surfaces arrange.
Optionally, in the present embodiment, arrange the first deposition material nozzle 211 spaces that arrange with First Line evaporation element 212 upper surfaces after the perforate that the second deposition material nozzle 221 that the second line evaporation element 22 upper surfaces arrange arranges through first surface evaporation tank 21 correspondences.Arrange the space of the first deposition material nozzle 211 and the second deposition material nozzle 221, has improved doping level, has better promoted film profile Duplication.
Further, in the present embodiment, the first deposition material crucible of the first deposition material and second deposition material the second crucible are arranged on first surface evaporation tank 21 and second evaporation tank 22 outside, by first channel 213 and the second passage 223 of opening on First Line evaporation element 212 and the second line evaporation element 222, the first deposition material and the second deposition material are transferred to the first deposition material nozzle 211 and the second deposition material nozzle 221, and then on substrate, form film.Those skilled in the art should understand that and be, in other embodiment, the first deposition material crucible of the first deposition material and second deposition material the second crucible also can be arranged on first surface evaporation tank 21 and second evaporation tank 22 inside, so that the first deposition material and the second deposition material to be provided.
Shown in Fig. 2 b is First Line evaporation element and the second evaporation tank STRUCTURE DECOMPOSITION schematic diagram in one embodiment of the invention; With reference to figure 2b, three First Line evaporation elements 212 are separately positioned in the fluting 215 in first surface evaporation tank 21.
Optionally, in the present embodiment, the second line evaporation element 222 also can adopt the mode shown in Fig. 2 b to be arranged in second evaporation tank 22.
Shown in Fig. 2 c be in one embodiment of the invention one second line evaporation element along in Fig. 2 a along B-B
1line cross section structure schematic diagram; With reference to figure 2c, be arranged on the second deposition material nozzle 221 of the second line evaporation element 222 upper surfaces, the second deposition material that receives the second deposition material crucible evaporation of transmitting through second passage 223 carries out evaporation.
Optionally, in the present embodiment, First Line evaporation element 212 also can adopt the mode shown in Fig. 2 c to arrange.
Shown in Fig. 2 d be in the embodiment of the present invention one in one second line evaporation element one second deposition material nozzle along C-C line cross section structure schematic diagram in Fig. 2 a; With reference to figure 2d, be arranged on the second deposition material nozzle 221 of the second line evaporation element 222 upper surfaces, the second deposition material that receives the second deposition material crucible evaporation of transmitting through second passage 223 carries out evaporation.
Optionally, in the present embodiment, First Line evaporation element 212 also can adopt the mode shown in Fig. 2 d to arrange.
Optionally, in the present embodiment, First Line evaporation element 212 upper surfaces are provided with at least one first deposition material nozzle 211; And/or second line evaporation element 222 upper surfaces be provided with at least one second deposition material nozzle 221.
Optionally, in the present embodiment, the first deposition material nozzle 211 is vertically arranged on First Line evaporation element 212 upper surfaces; And/or second deposition material nozzle 221 be vertically arranged on described the second line evaporation element 222 upper surfaces.The vertical setting of the first deposition material nozzle 211 and the second deposition material nozzle 221, has effectively reduced because of the stopping of mask plate formed shadow zone.
Shown in Fig. 2 e is that in one embodiment of the invention, vertical nozzle produces shadow zone schematic diagram; With reference to figure 2e, in the present embodiment, the shadow zone 3 that the spray line 211a of the first deposition material nozzle vertically arranging and the spray line 221a of the second deposition material nozzle form and 4 sizes evenly, are beneficial to the manufacture of high-resolution products.
Optionally, in the present embodiment, on the second deposition material nozzle of the second line evaporation element upper surface setting, be provided with heater coil.Because the second deposition material nozzle need to pass first surface evaporation tank, length is longer; With this, arranging of heater coil can be avoided, the cooling situation of the second deposition material in evaporate process causing because the second deposition material nozzle is long.The evaporation coating device that the present embodiment provides, second evaporation tank and first surface evaporation tank staggered floor arrange, and with this, make the second line evaporation element that is arranged at the First Line evaporation element of first surface evaporation tank and is arranged at second evaporation tank not be positioned at same plane; First Line evaporation element and the second line evaporation element are not positioned at same plane, make First Line evaporation element and the second line evaporation element when avoiding heat interference each other, can remain on nearer distance, and then the first deposition material and the second deposition material can fully be adulterated, therefore, the overlapping rate that has improved the film profile of deposition material formation, has reduced the deviation of film profile, and then has promoted film forming quality.
Shown in Fig. 3 is evaporation coating device structural representation in another embodiment of the present invention.
Shown in Fig. 3 a is one second line evaporation element cross section structure schematic diagram in evaporation coating device in another embodiment of the present invention.
With reference to figure 3 and Fig. 3 a, in the present embodiment, evaporation coating device also comprises at least one first deposition material crucible and at least one the second deposition material crucible matching with First Line evaporation element and the second line evaporation element.
In two ends of each First Line evaporation element each end arrange respectively a mouth of pot level towards the first deposition material crucible and mouth of pot vertically towards the first deposition material crucible; And
In two ends of each the second line evaporation element each end arrange respectively a mouth of pot level towards the second deposition material crucible and mouth of pot vertically towards the second deposition material crucible.
In the present embodiment, the first deposition material crucible and the second deposition material crucible can be arranged on X region, Y region, Z region and the O region of the surrounding of the first evaporation tank 21 and the second evaporation tank 22.
In conjunction with Fig. 3 a, the second line evaporation element 222 of take, it is example, in the two ends of the second line evaporation element 222, one end be respectively arranged with mouth of pot level towards the second deposition material crucible 224a and mouth of pot vertically towards the second deposition material crucible 224b, the other end be respectively arranged with mouth of pot level towards the second deposition material crucible 225a and mouth of pot vertically towards the second deposition material crucible 225b.
In the present embodiment, evaporation coating device is improving the overlapping rate of the film profile of deposition material formation, reduce the deviation of film profile, and then when promoting film forming quality, in two ends of each First Line evaporation element and the second line evaporation element, each end is respectively arranged with two deposition crucibles, improve the abundant intensity of deposition material, extended the evaporation time.
Shown in Fig. 4 is evaporation coating device structural representation in one embodiment of the invention.With reference to Fig. 4, in the present embodiment, also comprise that one has the thermal baffle 25 in hole 251; Thermal baffle 25 is arranged between first surface evaporation tank 21 and second evaporation tank 22, after the perforate of the second deposition material nozzle 221 of the second line evaporation element 222 upper surface settings through the corresponding perforate 251 arranging on thermal baffle 25 and the 21 corresponding settings of first surface evaporation tank, evaporates the second deposition material.
Optionally, in the present embodiment, thermal baffle adopts stupalith to make.
In the present embodiment, evaporation coating device is improving the overlapping rate of the film profile of deposition material formation, reduce the deviation of film profile, and then when promoting film forming quality, because of the setting of thermal baffle, further avoided the heat between First Line evaporation element and the second line evaporation element to disturb, and then the overlapping rate of the film profile of more effective raising deposition material formation, the deviation that reduces film profile, promotes film forming quality.
Shown in Fig. 5 is one embodiment of the invention evaporation coating device structural representation; With reference to Fig. 5, in the present embodiment, also comprise: one has the cover plate 26 in hole 261.
Cover plate 26 is arranged on first surface evaporation tank 21 tops, and the second deposition material nozzle 211 of the second line evaporation element 212 upper surface settings evaporates the second deposition material after through the corresponding perforate 261 arranging on the corresponding perforate 251 arranging, cover plate 26 on thermal baffle 25 and the corresponding perforate arranging of first surface evaporation tank 21.
First Line evaporation element 212 upper surfaces arrange the first deposition material nozzle 211 through corresponding rear evaporation the first deposition material of perforate 261 arranging on cover plate 26.
In the present embodiment, evaporation coating device, improving the overlapping rate of the film profile that deposition material forms, reduces the deviation of film profile, and then when promoting film forming quality, the protection having arranged effectively of cover plate the impact of evaporating materials on evaporation source.
Shown in Fig. 6 is evaporation coating device structural representation in one embodiment of the invention; With reference to Fig. 6, in the present embodiment, first surface evaporation tank and/or second evaporation tank are provided with cooling-water flowing circulation passage.And in the present embodiment, thermal baffle or cover plate also can be provided with cooling-water flowing circulation passage.
Take in thermal baffle and cooling water structure is set as example is in evaporation coating device in the present embodiment, the water coolant circulating channel structure arranging in first surface evaporation tank, second evaporation tank, cover plate or thermal baffle describes.
Shown in Fig. 6 a be in one embodiment of the invention evaporation coating device cover plate along D-D
1line cross section structure schematic diagram.
With reference to Fig. 6 a, in the present embodiment, cooling-water flowing circulation passage 263 is arranged evenly in the first deposition material nozzle 211 or the second line deposition material nozzle 221 both sides, the opening 262 by cooling-water flowing circulation passage respectively be arranged on first surface evaporation tank 21 and be connected with the water coolant water source of second evaporation tank 22 surrounding.
Shown in Fig. 6 b be in the embodiment of the present invention five a preferred evaporation coating device cover plate along D-D line cross section structure schematic diagram; With reference to Fig. 6 b, in this preferred implementation, cooling-water flowing circulation passage 263, respectively around the first deposition material nozzle 211 or the second deposition material nozzle 221, the opening 262 by cooling-water flowing circulation passage respectively be arranged on first surface evaporation tank 21 and be connected with the water coolant water source of second evaporation tank 22 both sides.
In the present embodiment, evaporation coating device is improving the overlapping rate of the film profile of deposition material formation, reduce the deviation of film profile, and then when promoting film forming quality, because of the cooling-water flowing circulation passage arranging in first surface evaporation tank, second evaporation tank, thermal baffle or cover plate, by the continuous circulation of water coolant, further avoided the heat between First Line evaporation element and the second line evaporation element to disturb, and then the overlapping rate of the film profile of more effective raising deposition material formation, the deviation that reduces film profile, promotes film forming quality.
Shown in Fig. 7 is evaporation coating device structural representation in one embodiment of the invention; With reference to Fig. 7, in the present embodiment, comprising:
At least one the 3rd line evaporation element (not shown) and the 3rd evaporation tank 27.
The 3rd evaporation tank 27 is provided with fluting, and the 3rd line evaporation element is arranged in described fluting.
The 3rd evaporation tank 27 and second evaporation tank 22 staggered floor setting, so that the second line evaporation element arranging in the 3rd linear evaporation source arranging in the 3rd evaporation tank and second evaporation tank is not positioned at same plane.
After the perforate of the 3rd deposition material nozzle 271 of the 3rd line evaporation element upper surface setting through the corresponding perforate arranging of second evaporation tank and the corresponding setting of first surface evaporation tank, evaporate the 3rd deposition material.
Optionally, in the present embodiment, the 3rd deposition material nozzle 271 arranging on the 3rd line evaporation element is provided with heater coil.
Optionally, in the present embodiment, arrange the second deposition material nozzle 221 spaces that the first deposition material nozzle 211 arranging with First Line evaporation element upper surface after the perforate that the 3rd deposition material nozzle 271 that the 3rd line evaporation element upper surface arranges arranges through the first evaporation tank 21 correspondences and the second line evaporation element upper surface arrange.
Optionally, in the present embodiment, the 3rd line evaporation element upper surface is provided with at least one the 3rd deposition material nozzle 271.
Optionally, in the present embodiment, the 3rd deposition material nozzle 271 is vertically arranged on the 3rd line evaporation element upper surface.
Optionally, in the present embodiment, the 3rd evaporation tank 27 is provided with cooling-water flowing circulation passage.
Optionally, in the present embodiment, a thermal baffle that has a hole can also be set; Thermal baffle is arranged between second evaporation tank 22 and the 3rd evaporation tank 27, after the perforate that the 3rd deposition material nozzle 271 of the 3rd line evaporation element upper surface setting arranges through the corresponding perforate arranging on thermal baffle, first surface evaporation tank 21 correspondences and second corresponding perforate arranging of evaporation tank 22, evaporates the second deposition material.
Optionally, in this example, at least one the 3rd deposition material crucible can also be set, in two ends of each the 3rd line evaporation element each end arrange respectively a mouth of pot level towards the 3rd deposition material crucible and mouth of pot vertically towards the 3rd deposition material crucible.
The evaporation coating device that the embodiment of the present invention provides, second evaporation tank first surface evaporation tank staggered floor arranges, the 3rd evaporation tank and second evaporation tank staggered floor arrange, with this make to be arranged at first surface evaporation tank First Line evaporation element, be arranged at the second line evaporation element of second evaporation tank and arrange and the 3rd line evaporation element of the 3rd evaporation tank is not positioned at same plane; First Line evaporation element, the second line evaporation element and the 3rd line evaporation element are not positioned at same plane, make First Line evaporation element, the second line evaporation element and the 3rd line evaporation element when avoiding heat interference each other, can remain on nearer distance, and then the first deposition material, the second deposition material and the 3rd deposition material can fully be adulterated, therefore, improved the overlapping rate of the film profile of deposition material formation, reduce the deviation of film profile, and then promoted film forming quality.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, to those skilled in the art, the present invention can have various changes and variation.All any modifications of doing, be equal to replacement, improvement etc., within protection scope of the present invention all should be included within spirit of the present invention and principle.
Claims (14)
1. an evaporation coating device, is characterized in that, comprises at least one First Line evaporation element, at least one second line evaporation element, first surface evaporation tank and second evaporation tank;
Described first surface evaporation tank and described second evaporation tank are respectively arranged with fluting, and described First Line evaporation element is arranged in the fluting of described first surface evaporation tank, and described the second line evaporation element is arranged in the fluting of described second evaporation tank;
Described second evaporation tank and described first surface evaporation tank staggered floor arrange, so that the First Line evaporation element being arranged in first surface evaporation tank is not positioned at same plane with the second line evaporation element being arranged in second evaporation tank.
2. evaporation coating device as claimed in claim 1, is characterized in that, described first surface evaporation tank is provided with perforate, and described the second line evaporation element upper surface is provided with the second deposition material nozzle, for the perforate through first surface evaporation tank, evaporates the second deposition material; Described First Line evaporation element upper surface is provided with the first deposition material nozzle, for evaporating the first deposition material.
3. evaporation coating device as claimed in claim 2, is characterized in that, described First Line evaporation element upper surface is provided with at least one first deposition material nozzle; And/or described the second line evaporation element upper surface is provided with at least one second deposition material nozzle.
4. evaporation coating device as claimed in claim 3, is characterized in that, described the first deposition material nozzle is vertically arranged on described First Line evaporation element upper surface; And/or described the second deposition material nozzle is vertically arranged on described the second line evaporation element upper surface.
5. the evaporation coating device as described in claim 2-4 any one, is characterized in that, on the second deposition material nozzle of described the second line evaporation element upper surface setting, is provided with heater coil.
6. evaporation coating device as claimed in claim 1, it is characterized in that, arrange the first deposition material nozzle space arranging with described First Line evaporation element upper surface after the perforate that the second deposition material nozzle that described the second line evaporation element upper surface arranges arranges through described first surface evaporation tank correspondence.
7. evaporation coating device as claimed in claim 1, is characterized in that, described first surface evaporation tank and/or described second evaporation tank are provided with cooling-water flowing circulation passage.
8. the evaporation coating device as described in claim 2-4,6-7 any one, is characterized in that, also comprises that one has the thermal baffle in hole;
Described thermal baffle is arranged between first surface evaporation tank and second evaporation tank, and the second deposition material nozzle of described the second line evaporation element upper surface setting is through evaporating the second deposition material after the corresponding perforate arranging of the corresponding perforate arranging and first surface evaporation tank on described thermal baffle.
9. evaporation coating device as claimed in claim 8, is characterized in that, also comprises: one has the cover plate in hole;
Described cover plate is arranged on described first surface evaporation tank top, and the second deposition material nozzle of described the second line evaporation element upper surface setting is through evaporating the second deposition material after the corresponding perforate arranging of the corresponding perforate arranging and first surface evaporation tank on the corresponding perforate arranging, described cover plate on described thermal baffle; And
Described First Line evaporation element upper surface arranges the first deposition material nozzle through evaporating the first deposition material after the corresponding perforate arranging on described cover plate.
10. evaporation coating device as claimed in claim 9, is characterized in that, also comprises at least one first deposition material crucible and at least one second deposition material crucible;
In two ends of each First Line evaporation element each end arrange respectively a mouth of pot level towards the first deposition material crucible and mouth of pot vertically towards the first deposition material crucible; And
In two ends of each the second line evaporation element each end arrange respectively a mouth of pot level towards the second deposition material crucible and mouth of pot vertically towards the second deposition material crucible.
11. evaporation coating devices as claimed in claim 1, is characterized in that, also comprise: at least one the 3rd line evaporation element and the 3rd evaporation tank;
Described the 3rd evaporation tank is provided with fluting, and described the 3rd line evaporation element is arranged in described fluting;
Described the 3rd evaporation tank and second evaporation tank staggered floor arrange, so that the second line evaporation element arranging in the 3rd linear evaporation source arranging in described the 3rd evaporation tank and second evaporation tank is not positioned at same plane.
12. evaporation coating devices as claimed in claim 11, it is characterized in that, after the perforate of the 3rd deposition material nozzle of described the 3rd line evaporation element upper surface setting through the corresponding perforate arranging of described second evaporation tank and the corresponding setting of first surface evaporation tank, evaporate the 3rd deposition material.
13. evaporation coating devices as claimed in claim 12, is characterized in that, the 3rd deposition material nozzle arranging on described the 3rd line evaporation element is provided with heater coil.
14. evaporation coating devices as claimed in claim 12, it is characterized in that, arrange the second deposition material nozzle space that the first deposition material nozzle arranging with First Line evaporation element upper surface after the perforate that the 3rd deposition material nozzle that described the 3rd line evaporation element upper surface arranges arranges through described first surface evaporation tank correspondence and the second line evaporation element upper surface arrange.
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| CN105088147A (en) * | 2015-09-11 | 2015-11-25 | 京东方科技集团股份有限公司 | Crucible structure |
| US10280502B2 (en) | 2015-09-11 | 2019-05-07 | Boe Technology Group Co., Ltd. | Crucible structure |
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