CN103917074A - Display for special purpose - Google Patents

Display for special purpose Download PDF

Info

Publication number
CN103917074A
CN103917074A CN201410114031.XA CN201410114031A CN103917074A CN 103917074 A CN103917074 A CN 103917074A CN 201410114031 A CN201410114031 A CN 201410114031A CN 103917074 A CN103917074 A CN 103917074A
Authority
CN
China
Prior art keywords
heat
closed box
display
conducting part
special purpose
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201410114031.XA
Other languages
Chinese (zh)
Other versions
CN103917074B (en
Inventor
李春圃
尚军辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hisense Visual Technology Co Ltd
Original Assignee
Qingdao Hisense Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qingdao Hisense Electronics Co Ltd filed Critical Qingdao Hisense Electronics Co Ltd
Priority to CN201410114031.XA priority Critical patent/CN103917074B/en
Publication of CN103917074A publication Critical patent/CN103917074A/en
Application granted granted Critical
Publication of CN103917074B publication Critical patent/CN103917074B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention discloses a display for a special purpose, and relates to the technical field of displays. The display solves the problem that due to the fact that a closed structure exists, the heat dissipation cost is high when heat dissipation is conducted. The display comprises a closed box body, a display device arranged on the front side of the closed box body, a heat exchanger arranged on the rear side of the closed box body, a heat source arranged inside the closed box body, and a heat conduction portion arranged inside the closed box body. The heat source comprises a power device integrated on a printed circuit board. The heat conduction portion is connected with a rear shell of the closed box body. The rear shell is attached and connected to a bottom plate of a heat exchanger. A plurality of cylindrical air flues arrayed in parallel are arranged on the bottom plate of the heat exchanger. The display is provided with the closed box body structure.

Description

The display of special purpose
Technical field
The present invention relates to display technology field, relate in particular to a kind of display of special purpose.
Background technology
The video display apparatus using under some special climate environment often needs to have corresponding special construction.For example,, south or the area such as coastal, in order to prevent the adverse effects of factor to electronic devices and components such as humidity, salt fog and mould, video display apparatus need to be designed to closed structure in the wild.But after video display apparatus is designed to closed structure, the heat producing when display device work cannot distribute timely, display device temperature raises can affect the performance and used life of electronic devices and components.
In order to solve the heat dissipation problem of display device of closed structure, in prior art, be by heat pipe, heat to be exported on semiconductor chilling plate and dispelled the heat.For example, by thermal source produce heat be delivered to be close to thermal source surface first heat sink on, again by with the first heat sink heat pipe being connected be delivered to second heat sink on, finally cooling to the second heat sink enforcement by fitting in the second semiconductor chilling plate on heat sink, second heat sink be a part for airtight cabinet exterior, semiconductor chilling plate is positioned at casing outside.
State in realization in the process of heat radiation, inventor finds that in prior art, at least there are the following problems: the assembly that heat pipe is a kind of complex structure, conductivity of heat is fabulous, and its cost is higher, is not easy to dismounting, and semiconductor chilling plate belongs to active device, and cost is higher.
Summary of the invention
Embodiments of the invention provide a kind of display of special purpose, solve because having the higher problem of cost of dispelling the heat when closed structure dispels the heat, and in ensureing radiating efficiency, reduce production costs.
For achieving the above object, embodiments of the invention adopt following technical scheme:
A kind of display of special purpose, comprise closed box, be arranged on described closed box front side display device, be arranged on the heat exchanger of described closed box rear side and be arranged on thermal source and the heat-conducting part of described closed box inside, described thermal source comprises the power device being integrated on printed circuit board (PCB), described heat-conducting part is connected with the back cover of described closed box, the base plate of described back cover and described heat exchanger is fitted and connected, the base plate of described heat exchanger is provided with the air flow channel of multiple parallel arranged, and described air flow channel is tubular construction.
Preferably, on described printed circuit board (PCB), offer at least one via hole, between described power device and described heat-conducting part, be connected by described via hole.
Preferably, described heat-conducting part comprises the first heat-conducting part, the second heat-conducting part and the first heat-conduction insulation spacer, described power device is connected with described the first heat-conducting part that is positioned at described printed circuit board (PCB) homonymy and covers described via hole by Heat Conduction Material, described the first heat-conducting part is connected with described the second heat-conducting part that is positioned at described printed circuit board (PCB) opposite side and covers described via hole by the Heat Conduction Material in described via hole, and described the second heat-conducting part is connected with the back cover of described closed box by described the first heat-conduction insulation spacer.
Preferably, the diameter of described via hole is 0.3~1 millimeter.
Preferably, described thermal source also comprises the chip being integrated on printed circuit board (PCB), and described heat-conducting part also comprises the second heat-conduction insulation spacer, and described chip is connected with the back cover of described closed box by the second heat-conduction insulation spacer.
Preferably, described heat-conducting part also comprises the 3rd heat-conduction insulation spacer, and described display device is connected with the back cover of described closed box by the 3rd heat-conduction insulation spacer.
Preferably, on the sidewall housing of described closed box or back cover, offer bar hole, the elastic sheet as earth pressure release expansion joint is installed in described bar hole.
Preferably, described elastic sheet is plastic tab or rubber sheet.
Preferably, described heat exchanger also comprises shell, and described shell is connected on described base plate and covers the main part of described air flow channel, exposes the two ends port of described air flow channel, scribbles heat loss through radiation material on described shell.
The display of the special purpose that the embodiment of the present invention provides, comprise closed box, be arranged on described closed box front side display device, be arranged on the heat exchanger of described closed box rear side and be arranged on thermal source and the heat-conducting part of described closed box inside, described thermal source comprises the power device being integrated on printed circuit board (PCB), described heat-conducting part is connected with the back cover of described closed box, the base plate of described back cover and described heat exchanger is fitted and connected, the base plate of described heat exchanger is provided with the air flow channel of multiple parallel arranged, and described air flow channel is tubular construction.The heat that the display of special purpose provided by the invention produces power device on printed circuit board (PCB) by heat-conducting part exports in the air in the air flow channel of the heat exchanger outside closed box, when the temperature in the air flow channel of heat exchanger is during higher than ambient temperature, in air flow channel, the warm-up movement of air diminishes atmospheric density, hot-air rises naturally along air flow channel, the upper port that sees through air flow channel spreads out, air flow channel internal gas pressure is reduced, and air pressure outside air flow channel is higher, therefore outside air is infiltrated and is added in air flow channel by the lower port of air flow channel, make air flow channel become fixing air circulation duct.Conventional is the equal of to heat for the air in a sheet of space to air heat radiation, air is on average heated less, its warm-up movement not as the air warm-up movement in air flow channel strong, therefore, atmospheric density is larger with respect to the air in air flow channel, be not easy to form ascending air, therefore be also difficult to form draught head.Compared with dispelling the heat with conventional air, air flow channel is the space of sealing, and its inside and outside draught head is more much bigger than the conventional draught head to air heat radiation formation, and therefore cross-ventilation speed is faster, has accelerated radiating rate; In addition, because this body structure of air flow channel guides air, make air more easily form regular circulating, further improved radiating rate.The display of the special purpose that therefore embodiment of the present invention provides can be realized high efficiency heat radiation with simple structure, has reduced manufacturing cost simultaneously.
Brief description of the drawings
Fig. 1 is the plan structure figure of atresia casing heat abstractor provided by the invention;
Fig. 2 is the plan structure figure of atresia casing heat abstractor provided by the invention;
Fig. 3 is the three-dimensional structure diagram of atresia casing heat abstractor provided by the invention;
Fig. 4 is the structural representation of heat exchanger provided by the invention.
Reference numeral:
1-closed box, 11-fore shell, 12-back cover, 13-earth pressure release expansion joint, 2-thermal source, 21-power device, 22-chip, 3-heat-conducting part, 31-the first heat-conducting part, 32-the second heat-conducting part, 33-the first heat-conduction insulation spacer, 34-the second heat-conduction insulation spacer, 35-the 3rd heat-conduction insulation spacer, 4-printed circuit board (PCB), 41-via hole, 5-heat exchanger, 51-base plate, 52-air flow channel, 53-shell, 6-display device.
Embodiment
Be described in detail below in conjunction with accompanying drawing heat exchanger and atresia casing heat abstractor.
The invention provides a kind of display of special purpose, shown in Fig. 1, comprise closed box 1, be arranged on the display device 6 of described closed box 1 front side, be arranged on the heat exchanger 5 of described closed box 1 rear side, and be arranged on thermal source 2 and the heat-conducting part 3 of described closed box 1 inside, described thermal source 2 comprises the power device 21 being integrated on printed circuit board (PCB) 4, described heat-conducting part 3 is connected with the back cover 12 of described closed box 1, described back cover 12 is fitted and connected with the base plate 51 of described heat exchanger 5, the base plate 51 of described heat exchanger 5 is provided with the air flow channel 52 of multiple parallel arranged, described air flow channel 52 is tubular construction.In use, power device 4 produces heat, heat is delivered to back cover 12 by heat-conducting part 3, and then be delivered to heat exchanger 5 to base plate 51, air themperature in air flow channel 52 is raise, when the temperature in the air flow channel 52 of heat exchanger 5 is during higher than ambient temperature, the warm-up movement of air flow channel 52 interior air diminishes atmospheric density, hot-air rises naturally along air flow channel 52, the upper port that sees through air flow channel 52 spreads out, air flow channel 52 internal gas pressures are reduced, and air pressure outside air flow channel 52 is higher, therefore outside air is infiltrated and is added in air flow channel 52 by the lower port of air flow channel 52, make air flow channel 52 become fixing air circulation duct.Conventional is the equal of to heat for the air in a sheet of space to air heat radiation, air is on average heated less, its warm-up movement not as the air warm-up movement in air flow channel 52 strong, therefore, atmospheric density is larger with respect to the air in air flow channel 52, be not easy to form ascending air, therefore be also difficult to form draught head.Compared with the heat radiation of conventional air, air flow channel 52 be the space of sealing, and its inside and outside draught head is more much bigger than the conventional draught head to air heat radiation formation, and therefore cross-ventilation speed is faster, has accelerated radiating rate; In addition, because 52 body structures of air flow channel guide air, make air more easily form regular circulating, further improved radiating rate; In addition, whole display simple in structure, production cost is low.
Preferably, shown in Fig. 2, on described printed circuit board (PCB) 4, offer at least one via hole 41, between described power device 21 and described heat-conducting part 3, be connected by described via hole 41.On printed circuit board (PCB) 4, offering via hole is in order to be more convenient for, the heat that on printed circuit board (PCB) 4, the power device away from back cover 12 1 sides produces to be delivered to back cover 12 from via hole 41, in this process, only need on printed circuit board (PCB) 4, arrange, can not have influence on the layout of other components and parts in closed box 1.
Preferably, shown in Fig. 2, described heat-conducting part 3 comprises the first heat-conducting part 31, the second heat-conducting part 32 and the first heat-conduction insulation spacer 33, described power device 21 is connected with described the first heat-conducting part 31 that is positioned at described printed circuit board (PCB) 4 homonymies and covers described via hole 41 by Heat Conduction Material, described the first heat-conducting part 31 is connected with described the second heat-conducting part 32 that is positioned at described printed circuit board (PCB) 4 opposite sides and covers described via hole 41 by the Heat Conduction Material in described via hole 41, described the second heat-conducting part 32 is connected with the back cover 12 of described closed box 1 by described the first heat-conduction insulation spacer 33.By the cooperation of the first heat-conducting part 31, via hole 41 and the second heat-conducting part 32, the heat that can easily power device 4 be produced transmits out, and only need on printed circuit board (PCB) 4, arrange, can not have influence on the layout of other components and parts in closed box 1; In addition, heat-conduction insulation spacer 33 can solve the problem that can not fit completely when the second heat-conducting part 32 directly contacts with back cover 12, increases the contact area of the second heat-conducting part 32 and back cover 12, improves heat transfer efficiency.Wherein, the first heat-conducting part 31 and the second heat-conducting part 32 can be can heat conduction metal, be preferably Copper Foil.
It should be noted that, can offer a via hole 41 on printed circuit board (PCB) 4, also can offer multiple via holes 41, each via hole 41 is combined with the first heat-conducting part 31 and the second heat-conducting part 32 carries out heat conduction, and the quantity of via hole 41 can be set according to radiating requirements.The size of via hole 41 need to consider the factor aspect the efficiency two of the layout of components and parts on printed circuit board (PCB) 4 and heat radiation, if via hole 41 is oversize, may impact components and parts layout integrated on printed circuit board (PCB) 4, if via hole 41 is undersized, possibly cannot reach the radiating effect of expection, meeting under this prerequisite requiring aspect two, the diameter of via hole 41 is preferably 0.3~1 millimeter, putting before this, the quantity of via hole 41 is more, and heat dispersion is better.
Preferably, shown in Figure 2, on the two side housing of described closed box 1 or back cover 12, offer bar hole, the size of for example bar hole can be 10mm*100mm, earth pressure release expansion joint 13 is installed in bar hole, wherein earth pressure release expansion joint 13 is elastic sheet, while causing internal pressure to increase for increasing when the heat in closed box 1, outwards heave generation elastic deformation and discharge internal pressure, in the time that recovering normal, internal pressure is also returned to nature thereupon, thereby the printed circuit board (PCB) 4 in protection closed box 1, matching relationship between components and parts and structural member can not be subject to the impact of internal pressure and reduction of service life.Preferably, the elastic sheet that earth pressure release expansion joint 13 uses is plastic tab or rubber sheet.
It should be noted that, above-mentioned heat radiation process has provided a wherein heat pipeline, states in the use on the basis of heat pipeline, and the heat radiation process in closed box 1 can also comprise two other heat pipeline.Shown in Figure 3, on the one hand, on printed circuit board (PCB) 4, be also integrated with chip 22, chip 22 and the second heat-conduction insulation spacer 34 are fitted and connected, and the second heat-conduction insulation spacer 34 is fitted and connected on back cover 12, and the heat that therefore chip 22 can be produced is delivered to heat exchanger 5, in this diabatic process, the second heat-conduction insulation spacer 34 smoothly chip 22 with the problem that can not fit completely while directly contacting of back cover 12, increase chip 22 and the contact area of back cover 12, improve heat transfer efficiency; On the other hand, fore shell 11 inner sides of closed box 1 are provided with display device 6, display device 6 and the 3rd heat-conduction insulation spacer 35 are fitted and connected, and the 3rd heat-conduction insulation spacer 35 is fitted and connected on back cover 12, the heat that therefore display device 6 can be produced is delivered to heat exchanger 10, in this diabatic process, the 3rd heat-conduction insulation spacer 35 can flow display device 6 with the problem that can not fit completely while directly contacting of back cover 12, increase display device 6 and the contact area of back cover 12, improve heat transfer efficiency.
Preferably, shown in Fig. 4, heat exchanger 5 also comprises shell 53, and described shell 53 is connected on described base plate 51 and covers the main part of described air flow channel 52, exposes the two ends port of described air flow channel 52, on described shell 53, scribbles heat loss through radiation material.The structure of air flow channel 52 is very applicable for the closed box 1 at vertical direction with certain altitude, utilize air flow channel 52 can strengthen cross-ventilation, after mobile the speeding of air, the heat being gone out by closed box 1 internal delivery can be dispersed in air faster, has improved the radiating efficiency of heat exchanger 5; In addition, scribble heat loss through radiation material on shell 53, the heat that this heat loss through radiation material can pass over closed box 1 is dispersed in air with electromagnetic form, further improves the radiating efficiency of heat exchanger 5.
It should be noted that, between above-mentioned closed box 1 and heat exchanger 5, formed the heat-exchange system of a natural heat dissipation, can efficiently heat be conducted to heat exchanger 5 by three heat radiation approach, carry out natural heat dissipation by heat exchanger 5.Thereby under need not the support of active radiator part, can realize closed box 1 is carried out to high efficiency heat radiation with lower cost.
It should be noted that, the front side of the printed circuit board (PCB) 4 of describing in the present embodiment refers to the side towards the fore shell 13 of closed box 1, and rear side refers to a side of the fore shell 13 of closed box 1 dorsad.
It should be noted that, printed circuit board (PCB) 4 and on it integrated power device 21 can see assembling printed circuit board (PCB) (Assembly of PCB, english abbreviation is PCBA) as, can think and form after PCBA assembles power device on PCB.
The above; be only the specific embodiment of the present invention, but protection scope of the present invention is not limited to this, any be familiar with those skilled in the art the present invention disclose technical scope in; can expect easily changing or replacing, within all should being encompassed in protection scope of the present invention.Therefore, protection scope of the present invention should described be as the criterion with the protection range of claim.

Claims (9)

1. a display for special purpose, comprise closed box, be arranged on described closed box front side display device, be arranged on the heat exchanger of described closed box rear side and be arranged on thermal source and the heat-conducting part of described closed box inside, it is characterized in that,
Described thermal source comprises the power device being integrated on printed circuit board (PCB), described heat-conducting part is connected with the back cover of described closed box, the base plate of described back cover and described heat exchanger is fitted and connected, the base plate of described heat exchanger is provided with the air flow channel of multiple parallel arranged, and described air flow channel is tubular construction.
2. the display of special purpose according to claim 1, is characterized in that, offers at least one via hole on described printed circuit board (PCB), between described power device and described heat-conducting part, is connected by described via hole.
3. the display of special purpose according to claim 2, it is characterized in that, described heat-conducting part comprises the first heat-conducting part, the second heat-conducting part and the first heat-conduction insulation spacer, described power device is connected with described the first heat-conducting part that is positioned at described printed circuit board (PCB) homonymy and covers described via hole by Heat Conduction Material, described the first heat-conducting part is connected with described the second heat-conducting part that is positioned at described printed circuit board (PCB) opposite side and covers described via hole by the Heat Conduction Material in described via hole, described the second heat-conducting part is connected with the back cover of described closed box by described the first heat-conduction insulation spacer.
4. the display of special purpose according to claim 3, is characterized in that, the diameter of described via hole is 0.3~1 millimeter.
5. the display of special purpose according to claim 1, it is characterized in that, described thermal source also comprises the chip being integrated on printed circuit board (PCB), and described heat-conducting part also comprises the second heat-conduction insulation spacer, and described chip is connected with the back cover of described closed box by the second heat-conduction insulation spacer.
6. the display of special purpose according to claim 1, is characterized in that, described heat-conducting part also comprises the 3rd heat-conduction insulation spacer, and described display device is connected with the back cover of described closed box by the 3rd heat-conduction insulation spacer.
7. the display of special purpose according to claim 1, is characterized in that, on the sidewall housing of described closed box or back cover, offers bar hole, and the elastic sheet as earth pressure release expansion joint is installed in described bar hole.
8. the display of special purpose according to claim 7, is characterized in that, described elastic sheet is plastic tab or rubber sheet.
9. according to the display of the special purpose described in claim 1-8 any one, it is characterized in that, described heat exchanger also comprises shell, described shell is connected on described base plate and covers the main part of described air flow channel, the two ends port that exposes described air flow channel, scribbles heat loss through radiation material on described shell.
CN201410114031.XA 2014-03-25 2014-03-25 The display of special purpose Active CN103917074B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410114031.XA CN103917074B (en) 2014-03-25 2014-03-25 The display of special purpose

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410114031.XA CN103917074B (en) 2014-03-25 2014-03-25 The display of special purpose

Publications (2)

Publication Number Publication Date
CN103917074A true CN103917074A (en) 2014-07-09
CN103917074B CN103917074B (en) 2017-06-23

Family

ID=51042368

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410114031.XA Active CN103917074B (en) 2014-03-25 2014-03-25 The display of special purpose

Country Status (1)

Country Link
CN (1) CN103917074B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105555098A (en) * 2014-10-24 2016-05-04 Gsr有限公司 Radiant heat pad and method for manufacturing the same
CN109379882A (en) * 2018-12-03 2019-02-22 惠州市华星光电技术有限公司 Display module radiator structure and display module

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005134591A (en) * 2003-10-30 2005-05-26 Sharp Corp Thin display device
CN1702810A (en) * 2004-05-18 2005-11-30 三星Sdi株式会社 Plasma display device
CN1946277A (en) * 2006-10-30 2007-04-11 陈鸿文 High efficiency heat radiator without fan
CN2898908Y (en) * 2005-12-14 2007-05-09 上海环达计算机科技有限公司 Structure improvement of military-industry rule notebook computer
JP2009104858A (en) * 2007-10-23 2009-05-14 Hitachi Ltd Liquid crystal display device
CN201293295Y (en) * 2008-11-14 2009-08-19 青岛海信电器股份有限公司 Radiating structure
JP2009244652A (en) * 2008-03-31 2009-10-22 Pioneer Electronic Corp Display
CN102230588A (en) * 2011-07-08 2011-11-02 深圳市华星光电技术有限公司 Backlight module and liquid crystal display

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201622789U (en) * 2010-02-09 2010-11-03 深圳市洲明科技股份有限公司 Double-layer protective LED display screen box

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005134591A (en) * 2003-10-30 2005-05-26 Sharp Corp Thin display device
CN1702810A (en) * 2004-05-18 2005-11-30 三星Sdi株式会社 Plasma display device
CN2898908Y (en) * 2005-12-14 2007-05-09 上海环达计算机科技有限公司 Structure improvement of military-industry rule notebook computer
CN1946277A (en) * 2006-10-30 2007-04-11 陈鸿文 High efficiency heat radiator without fan
JP2009104858A (en) * 2007-10-23 2009-05-14 Hitachi Ltd Liquid crystal display device
JP2009244652A (en) * 2008-03-31 2009-10-22 Pioneer Electronic Corp Display
CN201293295Y (en) * 2008-11-14 2009-08-19 青岛海信电器股份有限公司 Radiating structure
CN102230588A (en) * 2011-07-08 2011-11-02 深圳市华星光电技术有限公司 Backlight module and liquid crystal display

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105555098A (en) * 2014-10-24 2016-05-04 Gsr有限公司 Radiant heat pad and method for manufacturing the same
CN109379882A (en) * 2018-12-03 2019-02-22 惠州市华星光电技术有限公司 Display module radiator structure and display module
WO2020113818A1 (en) * 2018-12-03 2020-06-11 惠州市华星光电技术有限公司 Heat dissipation structure for display module and display module

Also Published As

Publication number Publication date
CN103917074B (en) 2017-06-23

Similar Documents

Publication Publication Date Title
CN111213439B (en) Electronic device
CN101600325B (en) Combination heat sink of closed shell electronic equipment
CN206165063U (en) Unmanned aerial vehicle and cooling system thereof
CN203301847U (en) Heat radiation circuit board for unmanned plane
US11540428B2 (en) Network equipment power supply and heat dissipation system therefor
CN201467613U (en) Combined radiator for electronic device with enclosed shell
CN204578961U (en) Radiator structure and there is the electronic installation of this radiator structure
CN203840687U (en) Heat radiator, circuit board heat radiation structure, and electronic device
CN204392739U (en) Radiator structure and use the image transmission of this radiator structure
CN107943254A (en) A kind of portable computer device and its radiating module
CN103717041A (en) Heat-radiating device, heat-radiating device manufacturing method and electronic device
JP2018006642A (en) Electronic device
CN103917074A (en) Display for special purpose
CN201726633U (en) Hollow laminar type cooling plate unit structure
CN101600329B (en) TV set with radiator
CN210555610U (en) Unmanned aerial vehicle's heat radiation structure
CN103249282A (en) Heat pipe water cooling combined heat dissipation device
CN107041109B (en) Semiconductor system based on monitoring temperature
CN102958326A (en) Radiating device
CN106163223A (en) A kind of radiating subassembly
CN204498550U (en) Radiating subassembly
CN211019806U (en) Heat radiator for electronic device
CN104066298A (en) Electronic device and heat radiating structure of electronic device
CN205052045U (en) Cooling system of on -vehicle product
CN210744103U (en) Built-in heat dissipation module of mobile phone and sealing device thereof

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: 266100 Zhuzhou Road, Laoshan District, Shandong, No. 151, No.

Patentee after: Hisense Visual Technology Co., Ltd.

Address before: 266100 Zhuzhou Road, Laoshan District, Shandong, No. 151, No.

Patentee before: QINGDAO HISENSE ELECTRONICS Co.,Ltd.

CP01 Change in the name or title of a patent holder