CN103895281B - A kind of high heat conductive insulating laminar composite and preparation method thereof - Google Patents
A kind of high heat conductive insulating laminar composite and preparation method thereof Download PDFInfo
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- CN103895281B CN103895281B CN201210567802.1A CN201210567802A CN103895281B CN 103895281 B CN103895281 B CN 103895281B CN 201210567802 A CN201210567802 A CN 201210567802A CN 103895281 B CN103895281 B CN 103895281B
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Abstract
The invention belongs to electronic technology field, particularly a kind of high heat conductive insulating laminar composite and preparation method thereof.High heat conductive insulating laminar composite of the present invention is welded through highly heat-conductive material and dielectric material, this composite is except having low-density, high strength, wear-resistant, erosion-resisting premium properties, also have highly heat-conductive material thermal conductivity concurrently high, heat Quick diffusing in electronic device can be gone out, and the character such as electrical insulating property and low-k that dielectric material is good.Therefore the high heat conductive insulating laminar composite adopting the method for welding highly heat-conductive material and dielectric material to be linked together is used for the application scenario simultaneously requiring to have high heat conductance, low-k, electrical insulating property.<!--1-->
Description
Technical field
The invention belongs to electronic technology field, particularly a kind of high heat conductive insulating laminar composite and preparation method thereof.
Background technology
In electronic industry, the production of substrate is important part.Substrate has following function in the electronic device: (1) it provide the various electronic devices and components such as integrated circuit to fix, the machinery assembled makes, and can realize the Auto-mounting of components and parts; (2) it realizes electrical connection between the various electronic original parts such as integrated circuit or electric insulation, provides the required opering characteristic of electric apparatus, as characteristic impedance etc.Along with electronic product is to the future development such as high integration, high reliability, require more and more higher to the insulation of substrate and heat dispersion.Require that baseplate material has higher thermal conductivity on the one hand, to be distributed in time by heat, to meet powerful requirement, there is distribution capacity in IC substrate package on the other hand, is delayed to ultra-high frequency signal, its time delay
(L is signal transmitting range, and ε is the dielectric constant of substrate or insulating barrier, and c is the light velocity in vacuum), this just requires that baseplate material should have low dielectric coefficient.
AlN has higher thermal conductivity (200W/mK), and its thermal coefficient of expansion is close with semiconductor Si, contributes to by chip attach in AlN ceramic, and the dielectric constant of AlN is lower, can be applied to high-frequency circuit substrate.The shortcoming of AlN ceramic is that it is at high-temperature atmosphere lower surface oxidizable one-tenth Al
2o
3.Due to Al
2o
3layer thermal conductivity is low, thermal coefficient of expansion is high, and there is thermal expansion misfit stress between AlN substrate, makes substrate easily forms micro-crack, thus reduces the thermal property of substrate.Metal substrate has the incomparable heat dispersion of ceramic substrate, can be satisfied with high density integrated circuit, high power device better to the requirement of the heat dispersion of substrate, but metal substrate cannot realize being applied to occasion insulating properties being had to requirement.Therefore, in order to have high heat conduction and good insulating properties concurrently simultaneously, meet the high performance requirements of electronic equipment, the preparation method finding a kind of novel high heat conductivity insulation composite seems particularly important.
Summary of the invention
The present invention can not meet the demand of low-k, certain applications that electrical insulating property is good in order to solve existing high-heat-conductive composite material, provide a kind of high heat conductive insulating laminar composite.
High heat conductive insulating laminar composite provided by the invention, it is characterized in that: high-heat-conductive composite material is through Electroless Plating Ni process, namely high heat conductive insulating laminar composite is obtained through soldering again with dielectric material, described high-heat-conductive composite material is particle or fibre-reinforced copper, the composite of aluminium or silver, this composite is high heat conduction, the composite of low bulk, the volume fraction strengthening particle or fiber is 25% ~ 70%, described dielectric material is aluminium nitride, the dielectric material that the insulating properties such as boron nitride or cvd diamond (diamond prepared by chemical gaseous phase depositing process) are good, or be aluminium nitride, at least two kinds of composite dielectric materials formed in boron nitride or cvd diamond, the thickness range of dielectric material is 1 ~ 3mm.
High-heat-conductive composite material can be diamond/copper, carbon fiber/copper, diamond miscellaneous granules/copper, carbon fiber hybrid Particles/Cu, diamond/aluminum, diamond/silver and other particles or fibre-reinforced copper, aluminium or silver-colored high heat conduction, the composite of low bulk, diamond miscellaneous granules/copper, the reinforcement of carbon fiber hybrid Particles/Cu is that diamond or carbon fiber and other particles are as two kinds of blend of granules whose mixed such as SiC particles, other particles or fibre-reinforced copper, aluminium or silver-colored high heat conduction, the composite of low bulk comprises the reinforcement as SiC particle or SiC fiber etc.
A preparation method for high heat conductive insulating laminar composite, comprises the steps:
Step one: prepare the high heat conduction of particle or fibre-reinforced copper, aluminium or silver, the composite sample of low bulk, the volume fraction strengthening particle or fiber is 25% ~ 70%;
Step 2: prepare dielectric material, the thickness range of dielectric material is 1 ~ 3mm;
Step 3: high-heat-conductive composite material and dielectric material sample are roughly ground, refined;
Step 4: adopt the method for chemical plating to carry out metallization plating Ni to high-heat-conductive composite material sample, plating Ni layer thickness is 10 μm ~ 100 μm;
Step 5: adopt vacuum brazing method to weld the high-heat-conductive composite material sample after metallization and dielectric material, weld layer thickness is 0.1mm ~ 0.5mm.
In said method, described high-heat-conductive composite material is the composite of particle or fibre-reinforced copper, aluminium or silver, and this composite is the composite of high heat conduction, low bulk, and the volume fraction strengthening particle or fiber is 25% ~ 70%.
In said method, high-heat-conductive composite material can be diamond/copper, carbon fiber/copper, diamond miscellaneous granules/copper, carbon fiber hybrid Particles/Cu, diamond/aluminum, diamond/silver and other particles or fibre-reinforced copper, aluminium or silver-colored high heat conduction, the composite of low bulk, diamond miscellaneous granules/copper, the reinforcement of carbon fiber hybrid Particles/Cu is that diamond or carbon fiber and other particles are as two kinds of blend of granules whose mixed such as SiC particles, other particles or fibre-reinforced copper, aluminium or silver-colored high heat conduction, the composite of low bulk comprises the reinforcement as SiC particle or SiC fiber etc.
Highly heat-conductive material and dielectric material are welded high heat conductive insulating laminar composite of the present invention, this composite is except having low-density, high strength, wear-resistant, erosion-resisting premium properties, also have highly heat-conductive material thermal conductivity concurrently high, heat Quick diffusing in electronic device can be gone out, and the character such as electrical insulating property and low-k that dielectric material is good.Therefore the high heat conductive insulating laminar composite adopting the method for welding highly heat-conductive material and dielectric material to be linked together is used for the application scenario simultaneously requiring to have high heat conductance, low-k, electrical insulating property.High heat conductive insulating laminar composite in the present invention solves the problem of high-heat-conductive composite material at the high heat conductive insulating of the application scenario that specific insulating properties require, be applicable to IGBT(insulatedgatebipolartransistor, insulated gate bipolar transistor) substrate or CPV(concentratingphotovoltaic, condensation photovoltaic) solar energy, integrated circuit (IC) substrate, microwave high power device heat radiation support member, multi-chip assembling (MCM) substrate etc.
Detailed description of the invention
Below by detailed description of the invention, the present invention will be further described, but and do not mean that limiting the scope of the invention.
Embodiment 1
The preparation method of high heat conductive insulating laminar composite comprises following step:
Step one: prepare diamond/copper composite sample, adamantine volume fraction is 60%, is processed into the cylinder of 50mm × 5mm, generally speaking, the shape of composite sample does not limit, and is not limited to any thickness, but is preferably thickness with more than 3mm;
Step 2: preparation CVD diamond material, thickness is 2mm;
Step 3: diamond/copper composite and CVD diamond material sample are roughly ground, refined;
Step 4: adopt the method for chemical plating to carry out metallization plating Ni to diamond/copper composite sample, plating Ni layer thickness is 20 μm;
Step 5: adopt vacuum brazing method to weld the diamond/copper composite sample of plating Ni and CVD diamond material, weld layer thickness is 0.2mm, and after welding, the dielectric constant of laminar composite is 5.5, dielectric loss Tan δ≤2 × 10
-4(35GHz), room temperature thermal conductivity is 550W/mK.
Embodiment 2
The preparation method of high heat conductive insulating laminar composite comprises following step:
Step one: prepare diamond/copper composite sample, adamantine volume fraction is 65%, is processed into the cylinder of 30mm × 3mm;
Step 2: adopt chemical gaseous phase depositing process to prepare aluminium nitride material, thickness is 2mm;
Step 3: diamond/copper composite sample and aluminium nitride material are roughly ground, refined;
Step 4: adopt the method for chemical plating to carry out metallization plating Ni to diamond/copper composite sample, plating Ni layer thickness is 10 μm;
Step 5: adopt vacuum brazing method to weld the diamond/copper composite sample of plating Ni and aluminium nitride material, weld layer thickness is 0.1mm, and after welding, the dielectric constant of laminar composite is 5.3, dielectric loss Tan δ≤2 × 10
-4(35GHz), room temperature thermal conductivity is 450W/mK.
Embodiment 3
The preparation method of high heat conductive insulating laminar composite comprises following step:
Step one: prepare diamond/aluminum composite sample, adamantine volume fraction is 60%, is processed into the cylinder of 50mm × 5mm;
Step 2: preparation CVD diamond material, thickness is 3mm;
Step 3: diamond/aluminum composite and CVD diamond material sample are roughly ground, refined;
Step 4: adopt the method for chemical plating to carry out metallization plating Ni to diamond/aluminum composite sample, plating Ni layer thickness is 20 μm;
Step 5: adopt vacuum brazing method to weld the diamond/aluminum composite sample of plating Ni and cvd diamond, weld layer thickness is 0.2mm, and after welding, the dielectric constant of laminar composite is 5.5, dielectric loss Tan δ≤2 × 10
-4(35GHz), room temperature thermal conductivity is 380W/mK.
Embodiment 4
The preparation method of high heat conductive insulating laminar composite comprises following step:
Step one: prepare diamond/silver composite material sample, adamantine volume fraction is 65%, is processed into the cylinder of 40mm × 4mm;
Step 2: preparation CVD diamond material, thickness is 3mm;
Step 3: diamond/silver composite material and CVD diamond material sample are roughly ground, refined;
Step 4: adopt the method for chemical plating to carry out metallization plating Ni to diamond/silver composite material sample, plating Ni layer thickness is 25 μm;
Step 5: adopt vacuum brazing method to weld the diamond/silver composite material sample of plating Ni and cvd diamond, weld layer thickness is 0.15mm, and after welding, the dielectric constant of laminar composite is 5.5, dielectric loss Tan δ≤2 × 10
-4(35GHz), room temperature thermal conductivity is 400W/mK.
The above; be only the present invention's preferably detailed description of the invention, but protection scope of the present invention is not limited thereto, is anyly familiar with those skilled in the art in the technical scope that the present invention discloses; the change that can expect easily or replacement, all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain of claim.
Claims (4)
1. a high heat conductive insulating laminar composite, it is characterized in that: high-heat-conductive composite material is through Electroless Plating Ni process, namely high heat conductive insulating laminar composite is obtained through soldering again with dielectric material, described high-heat-conductive composite material is particle or fibre-reinforced copper, the composite of aluminium or silver, the volume fraction strengthening particle or fiber is 25% ~ 70%, described dielectric material is aluminium nitride, boron nitride or cvd diamond, or be aluminium nitride, at least two kinds of composite dielectric materials formed in boron nitride or cvd diamond, the thickness range of dielectric material is 1 ~ 3mm.
2. high heat conductive insulating laminar composite according to claim 1; it is characterized in that: described high-heat-conductive composite material is the composite of diamond/copper, carbon fiber/copper, diamond miscellaneous granules/copper, carbon fiber hybrid Particles/Cu, diamond/aluminum, diamond/silver and other particles or fibre-reinforced copper, aluminium or silver-colored high heat conduction, low bulk, and other particles described or fiber comprise SiC particle and SiC fiber.
3. a preparation method for high heat conductive insulating laminar composite, is characterized in that comprising the steps:
Step one: prepare the high heat conduction of particle or fibre-reinforced copper, aluminium or silver, the composite sample of low bulk, the volume fraction strengthening particle or fiber is 25% ~ 70%;
Step 2: prepare dielectric material, the thickness range of dielectric material is 1 ~ 3mm;
Step 3: high-heat-conductive composite material and dielectric material sample are roughly ground, refined;
Step 4: adopt the method for chemical plating to carry out metallization plating Ni to high-heat-conductive composite material sample, plating Ni layer thickness is 10 μm ~ 100 μm;
Step 5: adopt vacuum brazing method to weld the high-heat-conductive composite material sample after metallization and dielectric material, weld layer thickness is 0.1mm ~ 0.5mm;
Described dielectric material is aluminium nitride, boron nitride or cvd diamond, or is the composite dielectric material that in aluminium nitride, boron nitride or cvd diamond, at least two kinds are formed.
4. preparation method according to claim 3; it is characterized in that: described high-heat-conductive composite material is the composite of diamond/copper, carbon fiber/copper, diamond miscellaneous granules/copper, carbon fiber hybrid Particles/Cu, diamond/aluminum, diamond/silver and other particles or fibre-reinforced copper, aluminium or silver-colored high heat conduction, low bulk, and other particles described or fiber comprise SiC particle or SiC fiber.
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| CN106137017A (en) * | 2016-07-04 | 2016-11-23 | 安徽省宁国市天宇电器有限公司 | A kind of intelligent sanitary appliance electric heater unit |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6447923B1 (en) * | 1997-09-03 | 2002-09-10 | Sumitomo Electric Industries, Ltd. | Metallized silicon nitride ceramic and fabricating process thereof as well as metallizing composite for the process |
| CN102738377A (en) * | 2012-06-05 | 2012-10-17 | 星弧涂层科技(苏州工业园区)有限公司 | Superhigh heat conduction metal-based circuit board as well as preparation method and applications thereof |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6447923B1 (en) * | 1997-09-03 | 2002-09-10 | Sumitomo Electric Industries, Ltd. | Metallized silicon nitride ceramic and fabricating process thereof as well as metallizing composite for the process |
| CN102738377A (en) * | 2012-06-05 | 2012-10-17 | 星弧涂层科技(苏州工业园区)有限公司 | Superhigh heat conduction metal-based circuit board as well as preparation method and applications thereof |
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Effective date of registration: 20190305 Address after: 101407 No. 11 Xingke East Street, Yanqi Economic Development Zone, Huairou District, Beijing Patentee after: Research Institute of engineering and Technology Co., Ltd. Address before: No. 2, Xinjie street, Xicheng District, Beijing, Beijing Patentee before: General Research Institute for Nonferrous Metals |