CN103884217A - Heat dissipation device for low-melting-point metal through composite phase change - Google Patents
Heat dissipation device for low-melting-point metal through composite phase change Download PDFInfo
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- CN103884217A CN103884217A CN201410138656.XA CN201410138656A CN103884217A CN 103884217 A CN103884217 A CN 103884217A CN 201410138656 A CN201410138656 A CN 201410138656A CN 103884217 A CN103884217 A CN 103884217A
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Abstract
The invention relates to a heat dissipation device for low-melting-point metal through composite phase change. The heat dissipation device is characterized by being composed of a vacuum copper pipe, a phase change working medium, low-melting-point metal liquid drops, a copper powder sinter layer (on the inner wall of the vacuum copper pipe) and fins. The vacuum copper pipe is filled with the phase change working medium and the low-melting-point metal liquid drops. The copper powder sinter layer is attached to the inner wall of the vacuum copper pipe, and the fins are arranged on the outer side of the vacuum copper pipe. Due to the low-melting-point metal liquid drops, the boiling heat transfer area of the bottom surface of the vacuum copper pipe is enlarged, and meanwhile the pulsation of the metal liquid drops under the impact of bubbles can further enhance heat convection. Due to the fine structure of the copper powder sinter layer, the adhesion ability of the low-melting-point metal to a wall can be lowered, and the situation that because the low-melting-point metal liquid drops are prone to adhesion to the inner wall of the vacuum copper pipe during pulsation, the effect is lowered cannot occur. Meanwhile, the copper powder sinter layer can accelerate the backflow of the phase change working medium and enhance the heat transfer ability. According to the heat dissipation device, the boiling heat transfer performance of the phase change working medium and excellent pulsation heat transfer performance of the low-melting-point metal liquid drops are fully combined, so that the heat exchange effect of the heat dissipation device is greatly improved compared with that of a traditional device. The heat dissipation device for the low-melting-point metal through composite phase change can effectively dissipate heat of a CPU, an LED and a laser device.
Description
Technical field
The present invention relates to a kind of low-melting-point metal composite phase-change heat abstractor, this device fully combines the boiling heat transfer of phase-change working substance and the heat transfer property of low-melting-point metal drop excellence, and its heat transfer effect is greatly improved compared with prior device; And the fine structure of the copper powder sintering layer that vacuum copper pipe inwall adheres to can reduce the adhesive capacity of low-melting-point metal at wall, make low-melting-point metal drop not reduce effect because easily sticking on vacuum copper pipe inwall in the time of pulsation.Meanwhile, copper powder sintering layer can strengthen the liquid backflow of phase-change working substance, strengthens heat transfer potential.Low-melting-point metal composite phase-change heat abstractor provided by the invention can be realized the efficiently radiates heat of CPU, LED and laser instrument.
Background technology
Heat pipe can be widely used in aerospace, military project and radiator manufacturing.Traditional heat pipe is made up of shell, liquid-sucking core and end cap, is inside filled with appropriate hydraulic fluid.When work, at the evaporator section of heating heat pipe, the hydraulic fluid in tube core is subject to thermal evaporation, and takes away heat, this heat is the evaporation latent heat of hydraulic fluid, and steam flows to the condensation segment of heat pipe from central passage, condense into liquid, emit latent heat, under the effect of capillary force, liquid backflow is to evaporator section simultaneously.Complete a closed circulation, thereby a large amount of heats is passed to radiating segment from bringing-up section.But traditional heat pipe is subject to the restriction of its volume and hydraulic fluid latent heat of phase change, its heat-transfer capability is very limited.Along with improving constantly of the electronic product integrated levels such as chip, its power density constantly increases, and traditional heat pipe can not meet the demands.
For this reason, the present invention proposes a kind of low-melting-point metal composite phase-change heat abstractor.By low-melting-point metal drop being filled in to the bottom of vacuum copper pipe temperature-uniforming plate, reach the effect that increases heat exchange area, promotes the coefficient of heat transfer; Simultaneously, utilize existing sintering process, on vacuum copper pipe inwall, adhere to one deck copper powder sintering layer, the fine structure of its copper powder sintering layer can reduce the adhesive capacity of low-melting-point metal at wall, makes low-melting-point metal drop not reduce effect because easily sticking on vacuum copper pipe inwall in the time of pulsation.Meanwhile, copper powder sintering layer can strengthen the liquid backflow of phase-change working substance, strengthens heat transfer potential.
Summary of the invention
The object of the present invention is to provide a kind of low-melting-point metal composite phase-change heat abstractor, this device fully combines the boiling heat transfer of phase-change working substance and the heat transfer property of low-melting-point metal drop excellence, and its heat transfer effect is greatly improved compared with prior device; Meanwhile, the fine structure of the copper powder sintering layer that vacuum copper pipe inwall adheres to can reduce the adhesive capacity of low-melting-point metal at wall, makes low-melting-point metal drop not reduce effect because easily sticking on vacuum copper pipe inwall in the time of pulsation.Meanwhile, copper powder sintering layer can strengthen the liquid backflow of phase-change working substance, strengthens heat transfer potential.Low-melting-point metal composite phase-change heat abstractor provided by the invention can be realized the efficiently radiates heat of CPU, LED and laser instrument.
Technical scheme of the present invention is as follows:
A kind of low-melting-point metal composite phase-change heat abstractor provided by the invention, as shown in Figure 1, it is composed as follows:
One vacuum copper pipe 1, fills phase-change working substance and low-melting-point metal drop in described vacuum copper pipe, vacuum copper pipe outside is connected with fin;
One phase-change working substance 2, described phase-change working substance is filled in vacuum copper pipe, and working medium realizes flash heat transfer by phase transformation;
One low-melting-point metal drop 3, described low-melting-point metal drop is filled in vacuum copper pipe inner bottom part, in order to increase heat transfer area and strengthening convection heat transfer' heat-transfer by convection effect;
One copper powder sintering layer 4, described copper powder sintering layer invests vacuum copper pipe inwall, the fine structure of copper powder sintering layer can reduce the adhesive capacity of low-melting-point metal at wall, makes low-melting-point metal drop not reduce effect because easily sticking on vacuum copper pipe inwall in the time of pulsation.Meanwhile, copper powder sintering layer can strengthen the liquid backflow of phase-change working substance, strengthens heat transfer potential;
One fin 5, described fin is positioned at vacuum copper pipe outside, and the heat in vacuum copper pipe is passed to surrounding environment.
The preparation method of described copper powder sintering layer 4 is: choose the copper powder of 99.5% purity, copper powder monomer particle diameter is between 75～150 μ m.First use instrument to remove totally inner described vacuum copper pipe, remove burr, pour appropriate dilute sulfuric acid into and use Ultrasonic Cleaning.After cleaning up, obtain inner wall smooth, oxide-free vacuum copper pipe.A steel pipe is placed in to vacuum copper pipe, vacuum copper pipe one side is sealed with copper sheet.Then, pure copper powder is poured in the gap of vacuum copper pipe and iron and steel.Load and put into sintering furnace after complete and carry out sintering.In sintering process, sintering furnace peak temperature is controlled at 800～850 degree.After sintering completes, use an aid that vacuum copper pipe is clamped, use instrument pulls out steel pipe.
Described vacuum copper pipe 1 is shaped as cylindrical shape.
Described phase-change working substance 2 is ammonia, water, acetone, hexane, freon or ethanol.
Described low-melting-point metal drop 3 mainly comprises gallium base bianry alloy, gallium based multicomponent alloy, indium-base alloy or bismuth-base alloy.
Described gallium base bianry alloy is gallium indium alloy, gallium bismuth alloy or gallium ashbury metal.
Described gallium based multicomponent alloy is gallium-indium-tin alloy or gallium indium tin kirsite.
When work, the heat at thermal source 6 places is passed to vacuum copper pipe 1 bottom and heats phase-change working substance 2 and low-melting-point metal drop 3, phase-change working substance 2 is subject to thermal evaporation, its steam moves to whole vacuum copper pipe and realizes heat transfer, in the time that the steam wall lower with vacuum copper pipe 1 temperature contacts, be condensed into liquid and fall back the 1 bottom participation circulation next time of vacuum copper pipe; Meanwhile, the low-melting-point metal drop 3 being heated carries out heat exchange with phase-change working substance 2 on the one hand; On the other hand, the steam that low-melting-point metal drop 3 is evaporated carries pulsation, reaches the effect of augmentation of heat transfer; The fine structure of copper powder sintering layer 4 can reduce the adhesive capacity of low-melting-point metal at wall, makes low-melting-point metal drop not reduce effect because easily sticking on vacuum copper pipe inwall in the time of pulsation.Meanwhile, copper powder sintering layer can strengthen the liquid backflow of phase-change working substance, strengthens heat transfer potential.
A kind of low-melting-point metal composite phase-change heat abstractor tool of the present invention has the following advantages:
(1) fine structure of the copper powder sintering layer that vacuum copper pipe inwall adheres to can reduce the adhesive capacity of low-melting-point metal at wall, makes low-melting-point metal drop not reduce effect because easily sticking on vacuum copper pipe inwall in the time of pulsation.Meanwhile, copper powder sintering layer can strengthen the liquid backflow of phase-change working substance, strengthens heat transfer potential.
(1) filling of low-melting-point metal drop can increase the heat exchange area of vacuum copper pipe temperature-uniforming plate bottom, makes vacuum copper pipe more abundant with contacting of phase-change working substance.
(2) low-melting-point metal drop pulsation up and down along with the evaporation and condensation of phase-change working substance, plays the effect of strengthening heat convection.
(3) low-melting-point metal drop heat conductivility excellence, can significantly reduce the thermal contact resistance of vacuum copper pipe temperature-uniforming plate and phase-change working substance.
(4) low-melting-point metal drop stable in properties, nontoxic, thereby system stability is reliable.
Accompanying drawing explanation
Fig. 1 is a kind of low-melting-point metal composite phase-change construction for heat radiating device schematic diagram in embodiment 1.
Wherein: 1 is vacuum copper pipe, 2 is phase-change working substance, and 3 is low-melting-point metal drop, and 4 is copper powder sintering layer, and 5 is fin, and 6 is thermal source.
The specific embodiment
Further describe the present invention below in conjunction with drawings and the specific embodiments.
Embodiment 1
Embodiment 1 has shown the one typical case application of low-melting-point metal composite phase-change heat abstractor of the present invention.Fig. 1 is low-melting-point metal composite phase-change construction for heat radiating device schematic diagram.
As shown in Figure 1, the low-melting-point metal composite phase-change heat abstractor of the present embodiment is made up of vacuum copper pipe 1, phase-change working substance 2, low-melting-point metal drop 3, copper powder sintering layer 4 and fin 5.
In the present embodiment, vacuum copper pipe external diameter 10cm, wall thickness 1cm, in it, vacuum is 1.2 × 10
-2pa.
Phase-change working substance is deionized water, and the volume filling rate in vacuum copper pipe is 10%.
Low-melting-point metal drop is gallium indium tin kirsite (mass fraction: 61% Ga, 25% In, 13% Sn, 1%Zn), its safety non-toxic, and fusing point is 8oC, the volume filling rate in vacuum copper pipe is 5%.
Fin material is aluminium, and total area of dissipation is 1.2m
2.
When work, the heat at thermal source 6 places is passed to vacuum copper pipe 1 bottom and heats phase-change working substance 2 and low-melting-point metal drop 3, phase-change working substance 2 is subject to thermal evaporation, its steam moves to whole vacuum copper pipe and realizes heat transfer, in the time that the steam wall lower with vacuum copper pipe 1 temperature contacts, be condensed into liquid and fall back the 1 bottom participation circulation next time of vacuum copper pipe; Meanwhile, the low-melting-point metal drop 3 being heated carries out heat exchange with phase-change working substance 2 on the one hand; On the other hand, the steam that low-melting-point metal drop 3 is evaporated carries pulsation, reaches the effect of augmentation of heat transfer; Copper powder sintering layer 4 can prevent that low-melting-point metal drop 3 from reducing effect because adhering to vacuum copper pipe 1 inwall.
Assess the heat-transfer effect of low-melting-point metal composite phase-change heat abstractor involved in the present invention below by typical case.
Experiment shows, the use of low-melting-point metal drop can make the area of dissipation of vacuum copper pipe bottom increase by 10%, and the flow-disturbing effect of the low-melting-point metal drop convection transfer rate that can make to seethe with excitement improves 30% ~ 50%, in the situation that thermal source heat flow density is constant, from heat transfer formula (1):
Known
Wherein, Q is the heat at thermal source place, and h is convection transfer rate, and A is heat convection area, is the heat convection temperature difference.Subscript 1 represents traditional vacuum copper pipe radiator, and subscript 2 represents low-melting-point metal composite phase-change heat abstractor of the present invention.
If the boiling heat transfer temperature difference at traditional vacuum copper pipe radiator vacuum copper pipe base plate place is 10 ℃, according to formula (2), the vacuum copper pipe boiling temperature difference in the present invention is only 7 ℃, has the temperature drop of 3 ℃ compared to traditional vacuum copper pipe radiator, and augmentation of heat transfer effect is remarkable.
Finally it should be noted that above embodiment is only unrestricted in order to technical scheme of the present invention to be described.Although the present invention is had been described in detail with reference to embodiment, those of ordinary skill in the art is to be understood that, technical scheme of the present invention is modified or is equal to replacement, do not depart from the spirit and scope of technical solution of the present invention, it all should be encompassed in the middle of claim scope of the present invention.
Claims (7)
1. a low-melting-point metal composite phase-change heat abstractor, is characterized in that, it is composed as follows:
One vacuum copper pipe, fills phase-change working substance and low-melting-point metal drop in described vacuum copper pipe, vacuum copper pipe outside is connected with fin;
One phase-change working substance, described phase-change working substance is filled in vacuum copper pipe, and working medium realizes flash heat transfer by phase transformation;
One low-melting-point metal drop, described low-melting-point metal drop is filled in vacuum copper pipe inner bottom part, in order to increase heat transfer area and strengthening convection heat transfer' heat-transfer by convection effect;
One copper powder sintering layer, described copper powder sintering layer invests vacuum copper pipe inwall, the fine structure of described copper powder sintering layer can reduce the adhesive capacity of low-melting-point metal at wall, makes low-melting-point metal drop not reduce effect because easily sticking on vacuum copper pipe inwall in the time of pulsation; Meanwhile, described copper powder sintering layer can strengthen the liquid backflow of phase-change working substance, strengthens heat transfer potential;
One fin, described fin is positioned at vacuum copper pipe outside, and the heat in vacuum copper pipe is passed to surrounding environment.
2. by low-melting-point metal composite phase-change heat abstractor claimed in claim 1, it is characterized in that, the copper powder monomer particle diameter of described copper powder sintering layer is 75～150 μ m.
3. by a kind of low-melting-point metal composite phase-change heat abstractor claimed in claim 1, it is characterized in that, described vacuum copper pipe is shaped as cylindrical shape.
4. by a kind of low-melting-point metal composite phase-change heat abstractor claimed in claim 1, it is characterized in that, described phase-change working substance is ammonia, water, acetone, hexane, freon or ethanol.
5. by a kind of low-melting-point metal composite phase-change heat abstractor claimed in claim 1, it is characterized in that, described low-melting-point metal drop is gallium base bianry alloy, gallium based multicomponent alloy, indium-base alloy or bismuth-base alloy.
6. by a kind of low-melting-point metal composite phase-change heat abstractor claimed in claim 5, it is characterized in that, described gallium base bianry alloy is gallium indium alloy, gallium bismuth alloy or gallium ashbury metal.
7. by a kind of low-melting-point metal composite phase-change heat abstractor claimed in claim 5, it is characterized in that, described gallium based multicomponent alloy is gallium-indium-tin alloy or gallium indium tin kirsite.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410138656.XA CN103884217A (en) | 2014-04-09 | 2014-04-09 | Heat dissipation device for low-melting-point metal through composite phase change |
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| CN201410138656.XA CN103884217A (en) | 2014-04-09 | 2014-04-09 | Heat dissipation device for low-melting-point metal through composite phase change |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020073668A1 (en) * | 2018-10-10 | 2020-04-16 | 郑州云海信息技术有限公司 | Siphon-based heat sink for server |
| CN115077290A (en) * | 2022-06-16 | 2022-09-20 | 天津大学 | Apparatus and method for processing metal frost |
| CN115077290B (en) * | 2022-06-16 | 2024-05-14 | 天津大学 | Apparatus and method for processing metal frost |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61153489A (en) * | 1984-12-27 | 1986-07-12 | Matsushita Refrig Co | Forming of wall surface of heat transfer tube |
| CN1621772A (en) * | 2003-11-27 | 2005-06-01 | 鸿富锦精密工业（深圳）有限公司 | Heat pipe and manufacturing method thereof |
| CN1804532A (en) * | 2005-01-11 | 2006-07-19 | 钰成化工有限公司 | Heat pipe |
| CN1932426A (en) * | 2005-09-16 | 2007-03-21 | 富准精密工业(深圳)有限公司 | Heat tube and powder and method for sintering forming the same heat tube capillary structure |
| CN103277769A (en) * | 2013-06-09 | 2013-09-04 | 北京依米康科技发展有限公司 | LED (Light Emitting Diode) radiator with liquid metal isothermal chamber |
| CN203785500U (en) * | 2014-04-09 | 2014-08-20 | 北京依米康科技发展有限公司 | Low-melting-point metal composite phase change radiating device |
-
2014
- 2014-04-09 CN CN201410138656.XA patent/CN103884217A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61153489A (en) * | 1984-12-27 | 1986-07-12 | Matsushita Refrig Co | Forming of wall surface of heat transfer tube |
| CN1621772A (en) * | 2003-11-27 | 2005-06-01 | 鸿富锦精密工业（深圳）有限公司 | Heat pipe and manufacturing method thereof |
| CN1804532A (en) * | 2005-01-11 | 2006-07-19 | 钰成化工有限公司 | Heat pipe |
| CN1932426A (en) * | 2005-09-16 | 2007-03-21 | 富准精密工业(深圳)有限公司 | Heat tube and powder and method for sintering forming the same heat tube capillary structure |
| CN103277769A (en) * | 2013-06-09 | 2013-09-04 | 北京依米康科技发展有限公司 | LED (Light Emitting Diode) radiator with liquid metal isothermal chamber |
| CN203785500U (en) * | 2014-04-09 | 2014-08-20 | 北京依米康科技发展有限公司 | Low-melting-point metal composite phase change radiating device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020073668A1 (en) * | 2018-10-10 | 2020-04-16 | 郑州云海信息技术有限公司 | Siphon-based heat sink for server |
| US11853133B2 (en) | 2018-10-10 | 2023-12-26 | Zhengzhou Yunhai Information Technology Co., Ltd. | Siphon-based heat sink for server |
| CN115077290A (en) * | 2022-06-16 | 2022-09-20 | 天津大学 | Apparatus and method for processing metal frost |
| CN115077290B (en) * | 2022-06-16 | 2024-05-14 | 天津大学 | Apparatus and method for processing metal frost |
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Application publication date: 20140625 |