CN103277769A - LED (Light Emitting Diode) radiator with liquid metal isothermal chamber - Google Patents
LED (Light Emitting Diode) radiator with liquid metal isothermal chamber Download PDFInfo
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- CN103277769A CN103277769A CN2013102297446A CN201310229744A CN103277769A CN 103277769 A CN103277769 A CN 103277769A CN 2013102297446 A CN2013102297446 A CN 2013102297446A CN 201310229744 A CN201310229744 A CN 201310229744A CN 103277769 A CN103277769 A CN 103277769A
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Abstract
The invention relates to an LED (Light Emitting Diode) radiator with a liquid metal isothermal chamber. The LED radiator with the liquid metal isothermal chamber is characterized by comprising a vacuum chamber, phase transition working mediums, liquid metal liquid drops and radiating fins; the phase transition working mediums and liquid metal liquid drops are filled inside the vacuum chamber; and the external side of the vacuum chamber is provided with the radiating fins. The liquid metal liquid drops enable the boiling heat transferring area of the vacuum chamber bottom surface to be increased and heat convection is further intensified due to pulsation of the liquid metal liquid drops under bubble impact. According to the LED radiator with the liquid metal isothermal chamber, the heat transferring effect is greatly improved in comparison with a traditional device due to the fact that the boiling heat transferring performance of the phase transition and good pulsation heat transferring performance of the liquid metal liquid drops are fully combined and effective heat radiating of the LED is achieved.
Description
Technical field
The present invention relates to a kind of LED radiator, this radiator fully combines the boiling heat transfer of phase-change working substance and the heat transfer property of liquid metal droplet excellence, makes its heat exchange effect be greatly improved than conventional apparatus.The present invention can realize the efficiently radiates heat of LED device.
Background technology
There are close relationship in junction temperature and life-span in the photoelectric field, LED lamp.Generally speaking, the every reduction of the temperature 10oC life-span can prolong 2 times, so the LED heat radiation is link very important in the LED Design of Luminaires.The heat at LED thermal source place will overcome the thermal contact resistance between thermal source and radiator, the diffusion thermal resistance of radiator and the free convection thermal resistance between radiator and environment in being passed to the process of environment.At each link, industrial quarters has all been carried out effective exploration, as develops the heat-conducting cream that series reduces thermal contact resistance, reduces the temperature-uniforming plate of radiator diffusion thermal resistance, and the structure optimization of minimizing free convection thermal resistance etc.
Temperature-uniforming plate is a kind of enhance heat technology of typical solution diffusion thermal resistance.Temperature-uniforming plate commonly used is fine copper temperature-uniforming plate or embedding heat pipe-type copper temperature-uniforming plate, and it has certain limitation.The samming mode of fine copper temperature-uniforming plate is mainly heat conduction, and its equal temp effect is unsatisfactory when heat flow density raises.Embedding heat pipe-type copper temperature-uniforming plate embeds heat pipe in the copper base, can significantly improve the samming ability of substrate, but adopting heat pipes for heat transfer is anisotropy, and is better along the temperature-uniforming plate heat transfer of heat pipe direction, and relatively poor perpendicular to the equal temp effect of heat pipe direction.Develop the vacuum chamber temperature-uniforming plate that in recent years and can realize omnibearing equal temp effect, it fills phase-change liquid in the cavity of vacuum, the liquid of vacuum chamber bottom is behind the heat that absorbs the LED thermal source, and evaporation diffuses in the whole vacuum chamber, realizes the multidimensional rapid diffusion of heat.At present, the vacuum chamber temperature-uniforming plate is the comparatively advanced equal temperature technique of LED, but along with the improving constantly of LED integrated level, its power density constantly increases, and the heat-transfer capability of vacuum chamber temperature-uniforming plate is needed further lifting badly.
For this reason, the present invention proposes a kind of liquid metals samming chamber LED radiator.By liquid metal droplet being filled in the bottom of vacuum chamber temperature-uniforming plate, reach the effect that increases heat exchange area, promotes the coefficient of heat transfer.Its typical advantages is as follows: the filling of (1) liquid metal droplet can increase the heat exchange area of vacuum chamber temperature-uniforming plate bottom, makes vacuum chamber more abundant with contacting of phase-change working substance; (2) effect of strengthening heat convection is played in liquid metal droplet pulsation up and down along with the evaporation and condensation of phase-change working substance; (3) liquid metal droplet heat conductivility excellence can significantly reduce the thermal contact resistance of vacuum chamber temperature-uniforming plate and phase-change working substance; (4) the liquid metal droplet stable in properties is nontoxic, thereby system stability is reliable.
Summary of the invention
The object of the present invention is to provide a kind of LED radiator, this radiator fully combines the boiling heat transfer of phase-change working substance and the heat transfer property of liquid metal droplet excellence, makes its heat exchange effect be greatly improved than conventional apparatus.The present invention can realize the efficiently radiates heat of LED device.
Technical scheme of the present invention is as follows:
A kind of liquid metals samming provided by the invention chamber LED radiator, as shown in Figure 1, it is composed as follows:
One vacuum chamber 1 is filled phase-change working substance and liquid metal droplet in the described vacuum chamber 1, and the vacuum chamber outside links to each other with fin;
One phase-change working substance 2, described phase-change working substance 2 is filled in the described vacuum chamber 1, and working medium realizes flash heat transfer by phase transformation;
One liquid metal droplet 3, described liquid metal droplet 3 are filled in described vacuum chamber 1 inner bottom part, in order to increase heat transfer area and to strengthen the convection heat transfer' heat-transfer by convection effect; The surface tension of liquid metals is bigger, can present liquid pearl attitude under the effect of the bubble period impact that the liquid evaporation produces always;
One fin 4, described fin 4 are positioned at described vacuum chamber 1 outside, and the heat in the described vacuum chamber 1 is passed to surrounding environment.
Described vacuum chamber 1 shape can be cylindrical shape or cuboid, and material can be aluminium, copper, stainless steel and carbon steel.
Described phase-change working substance 2 can be ammonia, water, acetone, hexane, freon and ethanol.
Described liquid metals 3 mainly comprises gallium base bianry alloy, gallium based multicomponent alloy, indium-base alloy or bismuth-base alloy.
Described gallium base bianry alloy is the gallium indium alloy, gallium bismuth alloy or gallium ashbury metal.
Described gallium based multicomponent alloy is gallium-indium-tin alloy or gallium indium tin kirsite.
Described bismuth-base alloy is bismuth indium stannum alloy or bismuth ashbury metal.
During work, the heat at thermal source 5 places is passed to vacuum chamber 1 bottom and heats phase-change working substance 2 and liquid metal droplet 3, phase-change working substance 2 is subjected to thermal evaporation, its steam moves to whole vacuum chamber and realizes conducting heat, when the lower wall of steam and vacuum chamber temperature contacts, be condensed into liquid and fall back vacuum chamber bottom participation circulation next time; The liquid metal droplet 3 of meanwhile, being heated is carried out heat exchange with phase-change working substance 2 on the one hand; On the other hand, the steam that liquid metal droplet 3 is evaporated carries pulsation, reaches the effect of augmentation of heat transfer.
A kind of liquid metals samming of the present invention chamber LED radiating appliance has following advantage:
(1) filling of liquid metal droplet can increase the heat exchange area of vacuum chamber temperature-uniforming plate bottom, makes vacuum chamber more abundant with contacting of phase-change working substance;
(2) effect of strengthening heat convection is played in liquid metal droplet pulsation up and down along with the evaporation and condensation of phase-change working substance;
(3) liquid metal droplet heat conductivility excellence can significantly reduce the thermal contact resistance of vacuum chamber temperature-uniforming plate and phase-change working substance;
(4) the liquid metal droplet stable in properties is nontoxic, thereby system stability is reliable.
Description of drawings
Fig. 1 is a kind of liquid metals samming chamber LED heat spreader structures schematic diagram among the embodiment 1.
The specific embodiment
Further describe the present invention below in conjunction with drawings and the specific embodiments.
As shown in Figure 1, the liquid metals samming chamber LED radiator of present embodiment is made up of vacuum chamber 1, phase-change working substance 2, liquid metal droplet 3 and fin 4.
In the present embodiment, vacuum chamber 1 is cylindrical shape, external diameter 10cm, and wall thickness 1cm, copper material, vacuum is 1.2 * 10 in it
-2Pa.
Phase-change working substance 2 is deionized water, and the volume filling rate in vacuum chamber is 10%.
Fin 4 materials are aluminium, and total area of dissipation is 1.2m
2
During work, the heat at thermal source 5 places is passed to the vacuum chamber bottom and adds hot deionized water 2 and liquid metal droplet 3, deionized water 2 is subjected to thermal evaporation, steam moves to whole vacuum chamber and realizes conducting heat, when the lower wall of steam and vacuum chamber temperature contacts, be condensed into liquid water and fall back vacuum chamber bottom participation circulation next time; The liquid metal droplet 3 of meanwhile, being heated is carried out heat exchange with deionized water 2 on the one hand; On the other hand, the steam that liquid metal droplet 3 is evaporated carries pulsation, reaches the effect of augmentation of heat transfer.
Assess the heat-transfer effect of liquid metals samming chamber LED radiator involved in the present invention below by typical case.
Experiment shows, the use of liquid metal droplet 3 can make the area of dissipation of vacuum chamber bottom increase by 10%, and the flow-disturbing effect of liquid metal droplet 3 can make the boiling convection transfer rate improve 30% ~ 50%, under the constant situation of thermal source heat flow density, by heat transfer formula (1) as can be known:
As can be known
Wherein, Q is the heat at thermal source place, and h is convection transfer rate, and A is the heat convection area, is the heat convection temperature difference.Subscript 1 represents traditional vacuum chamber LED radiator, subscript 2 representatives liquid metals samming of the present invention chamber LED radiator.
If the boiling heat transfer temperature difference at LED radiator vacuum chamber base plate place, traditional vacuum chamber is 20 ℃, according to formula (2), the vacuum chamber boiling temperature difference among the present invention only is 14 ℃, compared to traditional LED radiator 6 ℃ temperature drop is arranged, and the augmentation of heat transfer effect is remarkable.
It should be noted that at last above embodiment is only unrestricted in order to technical scheme of the present invention to be described.Although the present invention has been described in detail with reference to embodiment, those of ordinary skill in the art is to be understood that, technical scheme of the present invention is made amendment or is equal to replacement, do not break away from the spirit and scope of technical solution of the present invention, it all should be encompassed in the middle of the claim scope of the present invention.
Claims (7)
1. liquid metals samming chamber LED radiator is characterized in that it is composed as follows:
Fill phase-change working substance and liquid metal droplet in one vacuum chamber, described vacuum chamber, the vacuum chamber outside links to each other with fin;
One phase-change working substance, described phase-change working substance is filled in the vacuum chamber, and working medium realizes flash heat transfer by phase transformation;
One liquid metal droplet, described liquid metal droplet is filled in the vacuum chamber inner bottom part, in order to increase heat transfer area and to strengthen the convection heat transfer' heat-transfer by convection effect;
One fin, described fin are positioned at the vacuum chamber outside, and the heat in the vacuum chamber is passed to surrounding environment.
2. by the described a kind of liquid metals samming of claim 1 chamber LED radiator, it is characterized in that described vacuum chamber shape can be cylindrical shape or cuboid, material can be aluminium, copper, stainless steel and carbon steel.
3. by the described a kind of liquid metals samming of claim 1 chamber LED radiator, it is characterized in that described phase-change working substance can be ammonia, water, acetone, hexane, freon and ethanol.
4. by the described a kind of liquid metals samming of claim 1 chamber LED radiator, it is characterized in that described liquid metals mainly comprises gallium base bianry alloy, gallium based multicomponent alloy, indium-base alloy or bismuth-base alloy.
5. by the described liquid metals of claim 4, it is characterized in that described gallium base bianry alloy is the gallium indium alloy, gallium bismuth alloy or gallium ashbury metal.
6. by the described liquid metals of claim 4, it is characterized in that described gallium based multicomponent alloy is gallium-indium-tin alloy or gallium indium tin kirsite.
7. by the described liquid metals of claim 4, it is characterized in that described bismuth-base alloy is bismuth indium stannum alloy or bismuth ashbury metal.
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Cited By (7)
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CN103775965A (en) * | 2014-01-28 | 2014-05-07 | 邱旭堂 | Cold-end direct radiating glass heat pipe LED lamp |
CN103884217A (en) * | 2014-04-09 | 2014-06-25 | 北京依米康科技发展有限公司 | Heat dissipation device for low-melting-point metal through composite phase change |
CN104540373A (en) * | 2014-12-23 | 2015-04-22 | 江苏大学 | Low-melting-point alloy-silicon-based miniature cooler used for smartphone heat dissipation |
CN108155282A (en) * | 2017-11-27 | 2018-06-12 | 安徽西马新能源技术有限公司 | A kind of LED cooling stands |
CN110290686A (en) * | 2019-07-24 | 2019-09-27 | 中国科学院理化技术研究所 | A kind of composite radiating system |
CN114234689A (en) * | 2021-11-25 | 2022-03-25 | 苏州浪潮智能科技有限公司 | Enhanced boiling heat exchange structure and temperature-equalizing plate |
CN117423796A (en) * | 2023-12-18 | 2024-01-19 | 长春工程学院 | High-power LED illumination phase-change radiator with pulsating hot plate extension body |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103775965A (en) * | 2014-01-28 | 2014-05-07 | 邱旭堂 | Cold-end direct radiating glass heat pipe LED lamp |
CN103884217A (en) * | 2014-04-09 | 2014-06-25 | 北京依米康科技发展有限公司 | Heat dissipation device for low-melting-point metal through composite phase change |
CN104540373A (en) * | 2014-12-23 | 2015-04-22 | 江苏大学 | Low-melting-point alloy-silicon-based miniature cooler used for smartphone heat dissipation |
CN108155282A (en) * | 2017-11-27 | 2018-06-12 | 安徽西马新能源技术有限公司 | A kind of LED cooling stands |
CN110290686A (en) * | 2019-07-24 | 2019-09-27 | 中国科学院理化技术研究所 | A kind of composite radiating system |
CN114234689A (en) * | 2021-11-25 | 2022-03-25 | 苏州浪潮智能科技有限公司 | Enhanced boiling heat exchange structure and temperature-equalizing plate |
CN114234689B (en) * | 2021-11-25 | 2023-09-01 | 苏州浪潮智能科技有限公司 | Enhanced boiling heat exchange structure and temperature equalization plate |
CN117423796A (en) * | 2023-12-18 | 2024-01-19 | 长春工程学院 | High-power LED illumination phase-change radiator with pulsating hot plate extension body |
CN117423796B (en) * | 2023-12-18 | 2024-03-19 | 长春工程学院 | High-power LED illumination phase-change radiator with pulsating hot plate extension body |
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