CN103874773A - 压接端子 - Google Patents

压接端子 Download PDF

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CN103874773A
CN103874773A CN201280049283.8A CN201280049283A CN103874773A CN 103874773 A CN103874773 A CN 103874773A CN 201280049283 A CN201280049283 A CN 201280049283A CN 103874773 A CN103874773 A CN 103874773A
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crimping
particulate
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conductor
fit component
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H.施密特
C.格雷戈尔
G.范德伯格特
U.布卢梅尔
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TE Connectivity Germany GmbH
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Tyco Electronics AMP GmbH
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/10—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation
    • H01R4/18—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/01—Alloys based on copper with aluminium as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/10—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation
    • H01R4/18—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping
    • H01R4/183—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping for cylindrical elongated bodies, e.g. cables having circular cross-section
    • H01R4/184—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping for cylindrical elongated bodies, e.g. cables having circular cross-section comprising a U-shaped wire-receiving portion
    • H01R4/185—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping for cylindrical elongated bodies, e.g. cables having circular cross-section comprising a U-shaped wire-receiving portion combined with a U-shaped insulation-receiving portion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H01R4/62—Connections between conductors of different materials; Connections between or with aluminium or steel-core aluminium conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/04—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for forming connections by deformation, e.g. crimping tool
    • H01R43/048—Crimping apparatus or processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49218—Contact or terminal manufacturing by assembling plural parts with deforming

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Powder Metallurgy (AREA)

Abstract

本发明涉及一种用于产生压接连接的方法和一种电导体和压接至导体的压接元件之间的压接连接，其中导电微粒布置在导体和压接元件之间。

Description

压接端子
技术领域
本发明涉及一种根据权利要求1的压接连接，以及根据权利要求13的用于一种产生压接连接的方法。
背景技术
在现有技术中已经有多种类型的压接连接，其中导电压接元件，通常是压接套管，以机械和导电的方式被连接到电导体。电导体通常具有多根导线。压接连接的一个重要的功能是在压接元件和电导体之间产生低的电阻。
发明内容
本发明的目的是使得压接元件和电导体之间的导电连接能够得到改善。
本发明的目的通过根据权利要求1的压接连接以及根据权利要求13的用于产生压接连接的方法达到。
本发明的其他有优势的实施例在从属权利要求中阐明。
所描述的压接连接的一个优势是减小了电导体和压接元件之间的电阻。此外，在电导体和压接元件之间的导电连接具有时间上的高度的稳定性。这些优势通过将导电微粒布置在电导体和压接元件之间达到。导电微粒在压接元件和电导体之间被挤压，并且在导体和压接元件之间产生机械和导电连接。
测试表明微粒优选具有小于100微米，特别地小于60微米的直径。微粒优选具有这样的尺寸使得其直径小于60微米并且优选大于10微米。由于所选择的大小量级的缘故，微粒尤其适合于在压接元件和导体之间产生导电连接，而不会有损于压接操作或是损坏压接元件和/或电导体。
在另一个实施例中，微粒构造为机械粉碎的形式，特别是压碎的，粉末。这种机械粉碎产生了微粒的带角结构，这种微粒的带角结构对于在导体和压接元件之间的导电连接的形成是有优势的。
在另一个实施例中，导电的微粒是至少部分地由导电的金属形成的，特别是由铜形成的。由于微粒的金属构造的缘故，在压接过程中在金属导体和金属压接元件之间产生了金属间连接。
铜合金尤其适合于微粒的构造。在这种情况下，可以优选使用铜和锌的二元混合物或是包括铜和锌和一种附加元素的三元混合物，这种附加元素来自于下面的组中：锡、铝、铁、镍、银、钛、镁或铬。
通过包括黄铜的微粒可获得好的导电性，锌的含量优选地在10%到70%之间。
在另一个实施例中，使用由锌层包围的压接元件。锌层实现在电气微粒和导体的机械连接的区域中相对于空气中的氧气对电导体的防护以及对微粒和压接元件的机械连接的防护。电导体和压接元件之间的导电连接的长期稳定性从而得到改善。
在另一个实施例中，电导体由铝或具有铝含量大于90%的铝合金制成。多个股线优选地形成电导体。
在另一实施例中，压接元件由下面材料之一构造：Cu、CuSn、CuZn、CuZnSn、CuFe、CuNiSi、CuNiZn。
在压接操作之前，电气微粒被引入压接元件和电导体之间。在这种情况下，电气微粒可以粉末的形式或例如和电气微粒混合于其中的载体剂一起被施加到电导体和/或压接元件。作为示例，有机溶剂，特别是苯、醇、丙酮、油或油脂也适合于作为载体剂。
电气微粒可通过使用刷子、压印器或使用气流而被施加。
与载体剂混合的电气微粒可借由喷涂或点胶的方法，诸如例如，喷墨或微点胶的方式而被施加。
附图说明
以下参考附图以更详细的方式说明本发明：
图1和图2示出了压接操作的多个步骤，并且，
图3示出了具有附接的压接元件的电缆。
具体实施方式
图1是包括砧座1和压印器2的压接工具的示意性图解。压接元件3布置在砧座1上。在压接元件3之上，电导体4被示出并且由多个导线5构造，称作股线。导电微粒7被施加到导体4和/或施加到压接元件3的一个接触侧6上。
在另一个实施例中，电气微粒是至少部分地由导电的金属制成的，具体的是至少部分地由铜制成的。例如，微粒包括黄铜，锌的含量优选地在10%到70%之间。
如果三元铜合金用于导电微粒，可以使用铜和锌和一种其他的元素的合金，这种其他的元素来自于下面的组中：锡、铝、铁、镍、银、钛、镁或铬。
例如，导电微粒至少部分地由下面的铜合金中的一种制成：CuSn、CuFe、CuNiSi、CuAl+XY。
压接元件3由导电材料制成，例如，由金属制成。根据选择的实施例，压接元件3至少在一个接触侧6上提供有锡层8。
压接元件3和/或导体4可由例如以下材料中的一种制成：Cu、CuSn、CuZn、CuZnSn、CuFe、CuNiSi、CuNiZn。
根据选择的实施例，导体由铝或具有铝含量大于90%的铝合金制成，多个导体股线5优选地被提供作为导体4。
电气微粒7优选地具有不大于单根股线5的直径的5%到30%的直径，优选的在个体股线直径的5%到20%的范围内。根据导体股线5的常规的大小量级，这对应于近似在10微米到100微米之间的直径，优选地在10微米到60微米之间。
微粒7优选地借由机械粉碎而产生为粉末。在机械粉碎的过程中，微粒提供有边缘，这使得在压接元件3和导体4之间的机械和电气接触得到改善。
根据选择的实施例，也可使用具有球形表面的微粒7。
电气微粒7例如借由气流的方式被施加到导体4和/或施加到压接元件3的一个接触侧6上。此外，电气微粒7的施加也可使用刷子或压印器实施。此外，可以使用载体剂，其中引入电气微粒。有机溶剂，诸如例如苯、醇、丙酮、油等等是例如适于作为载体剂的。此外，微粒可使用或不使用有机溶剂被引入油脂中，其然后以定量的方式被施加到导体4或接触面6上。该定量可借由喷涂或点胶（dispense）的方法，诸如例如，喷墨或微点胶的方式而被施加。
由于优选在压接元件3上设置锡层8，所以微粒7的金属间接触面相对于导体的金属或压接元件的金属而被遮蔽，使得很少或者没有氧气能够达到该金属间的接触面。任意引入的氧气首先被氧化成氧化锡的锡层约束。因此，使氧气远离微粒7和导体或微粒7和压接元件3之间的金属间接触面。
在电气微粒7被引入后，压印器2在朝向砧座1的方向上下压。在这种情况下，压印器2下压线4成为压接元件3并且接合压接元件3的压接侧翼。被压接的侧翼内卷，导体被均匀地挤压并且压接连接形成。由于机械压力，微粒被压进压接元件3的接触侧6和股线4的表面。
图2图示了导体4与压接元件3和微粒7被挤压在一起的端部位置。
图3是图2的压接连接的一个例子的示例性视图。这里图示了具有呈多根股线5的形式的电导体4的电气线10，电导体4由电气绝缘遮罩11包围。压接元件3附接到绝缘已经被移除的股线5的端部。压接元件3具有被提供用以配合至对立触头的触头元件12。此外，压接元件3具有附加侧翼13，其当张力释放时与遮罩11压在一起。

Claims (15)

1.铝或铝合金的电导体（4、5）和压接至所述导体（4、5）的压接元件（3）之间的压接连接，包括铜合金（7）的导电微粒布置在所述导体（4、5）和所述压接元件（3）之间。
2.根据权利要求1所述的压接连接，所述微粒（7）具有小于100微米，特别是小于60微米的直径。
3.根据前述权利要求中任意一项所述的压接连接，所述微粒（7）大于10微米，并且小于60微米。
4.根据前述权利要求中任意一项所述的压接连接，所述微粒（7）构造为机械粉碎的粉末的形式。
5.根据前述权利要求中任意一项所述的压接连接，所述微粒（7）具有边缘。
6.根据权利要求1所述的压接连接，所述微粒（7）构造为至少部分地由下面的铜合金中的一种构成：CuSn、CuZnxSny、CuFe、CuNiSi、CuAlxy。
7.根据权利要求1所述的压接连接，所述微粒（7）由铜和锌和一种附加元素的三元混合物构成，所述附加元素来自于下面的组：Sn、Al、Fe、Ni、Ag、Ti、Mg或Cr。
8.根据权利要求1所述的压接连接，所述微粒（7）包括黄铜，锌含量优选地在10%和70%之间。
9.根据前述权利要求中任意一项所述的压接连接，所述压接元件（3）由锡层包围。
10.根据前述权利要求中任意一项所述的压接连接，所述导体（4、5）由铝形成。
11.根据前述权利要求中任意一项所述的压接连接，所述导体（4、5）由包括大于90%的铝的铝合金形成。
12.根据权利要求1-10中任意一项所述的压接连接，所述压接元件（3）由下面材料中的一种构成：Cu、CuSn、CuZn、CuZnSn、CuFe、CuNiSi、CuNiZn。
13.用于在压接元件和电导体之间产生压接连接的方法，导电的微粒被引入所述导体和所述压接元件之间，所述压接元件随后被压接至所述导体。
14.根据权利要求13的方法，所述微粒被引入载体剂并且所述载体剂和微粒一起被施加到所述导体上和/或所述压接元件上。
15.根据权利要求14的方法，所述载体剂为有机溶剂的形式，特别地为苯、醇、丙酮、油或为油脂的形式。
CN201280049283.8A 2011-10-07 2012-10-01 压接端子 Pending CN103874773A (zh)

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DE102011084174A DE102011084174A1 (de) 2011-10-07 2011-10-07 Crimpverbindung
DE102011084174.1 2011-10-07
PCT/EP2012/069368 WO2013050328A2 (en) 2011-10-07 2012-10-01 Crimped terminal

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CN103874773A true CN103874773A (zh) 2014-06-18

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US (1) US9640876B2 (zh)
EP (1) EP2764129B1 (zh)
JP (1) JP2014534560A (zh)
CN (1) CN103874773A (zh)
BR (1) BR112014007997A2 (zh)
DE (1) DE102011084174A1 (zh)
TW (1) TW201324990A (zh)
WO (1) WO2013050328A2 (zh)

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