CN103872033A - 一种led灯丝及照明器 - Google Patents
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Abstract
本发明适用于照明技术领域,提供了一种LED灯丝及照明器,所述LED灯丝包括金属骨架和荧光胶,所述金属骨架中部为固晶区,多个LED芯片设于所述固晶区,所述固晶区两端各设一用以防止液态荧光胶外溢的塑胶件,所述液态荧光胶固化后包裹住固晶区所在的部分金属骨架。这样位于所述固晶区的LED芯片发出的光激发周边荧光胶产生所需颜色的光,从而解决LED灯丝漏蓝的问题。因而,本LED灯丝可广泛应用于各种照明器,照明效果极佳。
Description
技术领域
本发明属于照明技术领域,尤其涉及一种LED灯丝及照明器。
背景技术
目前,LED灯丝光源产品主要是通过在透明陶瓷或是玻璃基板成型线路板,从而达到大角度发光的目的。但是透明陶瓷与玻璃基板价格昂贵,制成复杂,导热率低,一般使用功率<1W,而且封装成品无法从根本上解决漏蓝问题。
发明内容
本发明实施例的目的在于提供一种LED灯丝,旨在解决现有LED灯丝存在漏蓝的问题。
本发明实施例是这样实现的,一种LED灯丝,包括金属骨架和荧光胶,所述金属骨架中部为固晶区,多个LED芯片设于所述固晶区,所述固晶区两端各设一用以防止液态荧光胶外溢的塑胶件,所述液态荧光胶固化后包裹住固晶区所在的部分金属骨架。
本发明实施例的另一目的在于提供一种照明器,所述照明器采用上述LED灯丝。
本发明实施例将固晶区设于金属骨架,于所述固晶区两端各设一用以抵挡液态荧光胶外溢的塑胶件,所述液态荧光胶固化后包裹住固晶区所在的部分金属骨架,这样位于所述固晶区的LED芯片发出的光激发周边荧光胶产生所需颜色的光,从而解决LED灯丝漏蓝的问题。因而,本LED灯丝可广泛应用于各种照明器,照明效果极佳。
附图说明
图1是本发明实施例提供的金属骨架的结构示意图;
图2是于图1所示金属骨架上成型塑胶件的结构示意图;
图3是图2A-A剖视图;
图4是图2B-B剖视图;
图5是图2C-C剖视图;
图6是本发明实施例提供的LED灯丝的俯视图;
图7是本发明实施例提供的LED灯丝的侧视图;
图8是于图7所示固晶区横截面示意图。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白,以下结合附图及实施例,对本发明进行进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本发明,并不用于限定本发明。
本发明实施例将固晶区设于金属骨架,于所述固晶区两端各设一用以抵挡液态荧光胶外溢的塑胶件,所述液态荧光胶固化后包裹住固晶区所在的部分金属骨架,这样位于所述固晶区的LED芯片发出的光激发周边荧光胶产生所需颜色的光,从而解决LED灯丝漏蓝的问题。
以下结合具体实施例对本发明的实现进行详细描述。
如图1~8所示,本发明实施例提供的LED灯丝包括金属骨架1和荧光胶2,所述金属骨架1中部为固晶区11,多个LED芯片3设于所述固晶区11,所述固晶区11两端各设一用以防止液态荧光胶外溢的塑胶件4,所述液态荧光胶固化后包裹住固晶区11所在的部分金属骨架。此处由所述塑胶件4抵挡液态荧光胶,防止其外溢,并使之在所述固晶区11固化,从而包裹住固晶区11所在的部分金属骨架。这样位于所述固晶区11的LED芯片3发出的光激发周边荧光胶产生所需颜色的光,从而解决LED灯丝漏蓝的问题。另外,此处将所述金属骨架1作为芯片支撑、散热、电气互联的通道,导热率及强度均较高,提升了本LED灯丝的可靠性,或者说可以制作更大功率的LED灯丝。
如图3~5所示,本发明实施例中所述塑胶件4外端为圆柱形,里端的横截面为多边形,所述圆柱形的直径大于多边形任一对角线的长度,如此利于节省塑胶材料,同时增强了荧光胶2与塑胶件4的结合强度。为进一步增强荧光胶2与塑胶件4的结合强度,于所述塑胶件4里端设一凹陷部40。
通常,所述金属骨架1先通过机械加工、化学蚀刻或是其它成型方法加工而成。接着,于所述固晶区11设计使LED芯片3与外部电气互联的线路。然后,于所述固晶区11两端通过注塑或是模压等工艺分别成型塑胶件4,由所述塑胶件4抵挡液态荧光胶,防止其外溢。最后,通过注塑或是模压等工艺成型所述荧光胶2,使之完全包裹LED芯片3以及固晶区11(即固晶区所在的部分金属骨架),从而实现线性发光体,类似白炽灯发光效果。
应当说明的是,所述LED灯丝既可以是双边单电极,也可以是单边双电极,设计灵活。如图1、2所示,本实施例提供的LED灯丝采取双边单电极样式,其中所述金属骨架1两端为焊接区12,所述固晶区11有一端与焊接区12断开,如此将本LED灯丝的正、负极断开,而且对整个金属骨架1破坏较小。当然,所述固晶区11两端均与相应的焊接区12断开亦可。
其中,所述固晶区11与焊接区12断开的那一端设一延展部13,与所述固晶区11断开的焊接区12设一延伸部14,所述延伸部14平行于延展部13,如图1、2所示。在此通过所述塑胶件4定位延伸部14与延展部13,使之分开一定距离,且相互平行。所述延伸部14和延展部13优选为锯齿状,用以增强塑胶件4与延伸部14和延展部13的连接强度。同时,由固化后的塑胶件4对所述延伸部14、延展部13定位,使所述延伸部14平行于延展部13,从而衔接断开的正、负极。如此使所述延伸部14和延展部13完全嵌在塑胶件4中,保证了正、负极位置相对稳定,在断开处不易断裂,同时提高了本LED灯丝的整体强度。另外,所述塑胶件4可以由透明的或是其它有色塑胶(如热塑或是热固性材质)制成。
如图6、7所示,为增强扣胶力,保证所述塑胶件4与金属骨架1结合强度,于所述焊接区12靠近固晶区11的端部设用以填充熔融塑胶的透孔15。该增加的透孔15减小了所述熔融塑胶溢胶的面积,亦可缩短所述熔融塑胶在金属骨架1表面溢胶的距离。为优化本LED灯丝结构,所述金属骨架1总长b不小于8mm,所述焊接区的宽度大于0.2mm,厚度大于0.1mm、小于0.5mm;所述固晶区11的长度c大于金属骨架1总长b的50%,所述固晶区11的宽度a大于0.3mm。所述固晶区11的表面镀有镍膜、银膜或金膜,这样增强了本LED灯丝光取出率。所述荧光胶2为混合有荧光粉的热固性材料(如硅胶或环氧树脂),其横截面可为方形、圆形或椭圆形。本实施例中所述荧光胶2固化后呈圆柱状,其长度大于所述固晶区11的长度,直径不小于所述固晶区11的宽度,以将固晶区11所在的部分金属骨架包裹住。
此外,还可于所述固晶区11设多个用以填充荧光胶的通孔17,各通孔17位于相邻LED芯片3之间,如图1、2、8所示。这样所述LED芯片3发出的部分光线在荧光胶2内全反射后经由通孔17从金属骨架1(亦称基板)的背面出射,从而改善本LED灯丝正、反面光色一致性,同时增加了荧光胶2与金属骨架1的结合强度。
以上所述仅为本发明的较佳实施例而已,并不用以限制本发明,凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本发明的保护范围之内。
Claims (10)
1.一种LED灯丝,其特征在于,包括金属骨架和荧光胶,所述金属骨架中部为固晶区,多个LED芯片设于所述固晶区,所述固晶区两端各设一用以防止液态荧光胶外溢的塑胶件,所述液态荧光胶固化后包裹住固晶区所在的部分金属骨架。
2.如权利要求1所述的LED灯丝,其特征在于,所述塑胶件外端为圆柱形,里端的横截面为多边形,所述圆柱形的直径大于多边形任一对角线的长度。
3.如权利要求1或2所述的LED灯丝,其特征在于,所述塑胶件里端设一凹陷部。
4.如权利要求3所述的LED灯丝,其特征在于,所述金属骨架两端均为焊接区,所述固晶区至少有一端与焊接区断开。
5.如权利要求4所述的LED灯丝,其特征在于,所述固晶区与焊接区断开的那一端设一延展部,与所述固晶区断开的焊接区设一延伸部,所述延伸部平行于延展部。
6.如权利要求5所述的LED灯丝,其特征在于,由其中一个塑胶件对所述延伸部、延展部定位衔接,使所述延伸部平行于延展部。
7.如权利要求1或2所述的LED灯丝,其特征在于,所述固晶区设多个用以填充荧光胶的通孔,各通孔位于相邻LED芯片之间。
8.如权利要求7所述的LED灯丝,其特征在于,所述固晶区的表面镀有镍膜、银膜或金膜。
9.如权利要求3所述的LED灯丝,其特征在于,所述金属骨架总长b不小于8mm,所述焊接区的宽度大于0.2mm,厚度大于0.1mm、小于0.5mm;所述固晶区的长度c大于金属骨架总长b的50%,所述固晶区的宽度a大于0.3mm。
10.一种照明器,其特征在于,所述照明器采用如权利要求1~9中任一项所述的LED灯丝。
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3190328A1 (en) * | 2016-01-06 | 2017-07-12 | Shandong Prosperous Star Optoelectronics Co., Ltd | A led light simulating the structure of incandescent light |
RU2822102C1 (ru) * | 2023-12-15 | 2024-07-01 | Павел Павлович Малков | Светодиодный модуль высокой плотности с гибридным охлаждением |
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CN107101093B (zh) * | 2017-03-13 | 2023-09-01 | 浙江鼎鑫工艺品有限公司 | 一种灯具 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW540168B (en) * | 2002-03-11 | 2003-07-01 | Harvatek Corp | LED package with metal substrates protrusion outside the glue |
CN201204201Y (zh) * | 2008-01-31 | 2009-03-04 | 东莞市科锐德数码光电科技有限公司 | 超大功率led模组光源支架 |
KR20100052031A (ko) * | 2008-11-10 | 2010-05-19 | 서울반도체 주식회사 | Led모듈 |
US20120112236A1 (en) * | 2009-07-17 | 2012-05-10 | Denki Kagaku Kogyo Kabushiki Kaisha | Led chip assembly, led package, and manufacturing method of led package |
CN203367277U (zh) * | 2013-07-01 | 2013-12-25 | 临安市新三联照明电器有限公司 | 一种柱状led灯丝 |
CN203787425U (zh) * | 2014-02-26 | 2014-08-20 | 深圳市瑞丰光电子股份有限公司 | 一种led灯丝及照明器 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020176259A1 (en) * | 1999-11-18 | 2002-11-28 | Ducharme Alfred D. | Systems and methods for converting illumination |
US8587185B2 (en) * | 2010-12-08 | 2013-11-19 | Cree, Inc. | Linear LED lamp |
CN103035820A (zh) * | 2012-12-18 | 2013-04-10 | 浙江中宙光电股份有限公司 | 立体led白光器件 |
CN103322525B (zh) * | 2013-06-17 | 2015-04-22 | 深圳市源磊科技有限公司 | Led灯及其灯丝 |
-
2014
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW540168B (en) * | 2002-03-11 | 2003-07-01 | Harvatek Corp | LED package with metal substrates protrusion outside the glue |
CN201204201Y (zh) * | 2008-01-31 | 2009-03-04 | 东莞市科锐德数码光电科技有限公司 | 超大功率led模组光源支架 |
KR20100052031A (ko) * | 2008-11-10 | 2010-05-19 | 서울반도체 주식회사 | Led모듈 |
US20120112236A1 (en) * | 2009-07-17 | 2012-05-10 | Denki Kagaku Kogyo Kabushiki Kaisha | Led chip assembly, led package, and manufacturing method of led package |
CN203367277U (zh) * | 2013-07-01 | 2013-12-25 | 临安市新三联照明电器有限公司 | 一种柱状led灯丝 |
CN203787425U (zh) * | 2014-02-26 | 2014-08-20 | 深圳市瑞丰光电子股份有限公司 | 一种led灯丝及照明器 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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EP3190328A1 (en) * | 2016-01-06 | 2017-07-12 | Shandong Prosperous Star Optoelectronics Co., Ltd | A led light simulating the structure of incandescent light |
RU2822102C1 (ru) * | 2023-12-15 | 2024-07-01 | Павел Павлович Малков | Светодиодный модуль высокой плотности с гибридным охлаждением |
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WO2015127698A1 (zh) | 2015-09-03 |
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