CN103871975A - 一种芯片封装散热方式 - Google Patents
一种芯片封装散热方式 Download PDFInfo
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- CN103871975A CN103871975A CN201410066209.8A CN201410066209A CN103871975A CN 103871975 A CN103871975 A CN 103871975A CN 201410066209 A CN201410066209 A CN 201410066209A CN 103871975 A CN103871975 A CN 103871975A
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CN201410066209.8A CN103871975B (zh) | 2014-02-26 | 2014-02-26 | 一种芯片封装散热方法 |
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CN201410066209.8A CN103871975B (zh) | 2014-02-26 | 2014-02-26 | 一种芯片封装散热方法 |
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CN103871975A true CN103871975A (zh) | 2014-06-18 |
CN103871975B CN103871975B (zh) | 2017-02-01 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104159436A (zh) * | 2014-08-15 | 2014-11-19 | 韩百萍 | 一种自清洁散热翅片散热器 |
CN108926793A (zh) * | 2018-04-20 | 2018-12-04 | 宁波工程学院 | 一种基于热应变来自动释放干粉灭火剂的灭火装置 |
CN109027821A (zh) * | 2018-08-23 | 2018-12-18 | 重庆秉为科技有限公司 | 一种led灯的灯壳 |
CN109291655A (zh) * | 2018-12-10 | 2019-02-01 | 合肥菲力姆科技有限公司 | 一种具有散热功能的热敏打印头 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6864574B1 (en) * | 1999-11-29 | 2005-03-08 | Matsushita Electric Industrial Co., Ltd. | Semiconductor package |
CN101131982A (zh) * | 2007-09-13 | 2008-02-27 | 江苏长电科技股份有限公司 | 半导体器件无脚封装结构及其封装工艺 |
US20090115075A1 (en) * | 2006-07-14 | 2009-05-07 | Kessel Carl R | Method for manufacturing thin substrate using a laminate body |
US20120074586A1 (en) * | 2010-09-27 | 2012-03-29 | Samsung Electronics Co., Ltd | Methods of fabricating package stack structure and method of mounting package stack structure on system board |
CN103206683A (zh) * | 2012-01-12 | 2013-07-17 | 长广科技有限公司 | 发光装置的led3d曲面导线架 |
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- 2014-02-26 CN CN201410066209.8A patent/CN103871975B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6864574B1 (en) * | 1999-11-29 | 2005-03-08 | Matsushita Electric Industrial Co., Ltd. | Semiconductor package |
US20090115075A1 (en) * | 2006-07-14 | 2009-05-07 | Kessel Carl R | Method for manufacturing thin substrate using a laminate body |
CN101131982A (zh) * | 2007-09-13 | 2008-02-27 | 江苏长电科技股份有限公司 | 半导体器件无脚封装结构及其封装工艺 |
US20120074586A1 (en) * | 2010-09-27 | 2012-03-29 | Samsung Electronics Co., Ltd | Methods of fabricating package stack structure and method of mounting package stack structure on system board |
CN103206683A (zh) * | 2012-01-12 | 2013-07-17 | 长广科技有限公司 | 发光装置的led3d曲面导线架 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104159436A (zh) * | 2014-08-15 | 2014-11-19 | 韩百萍 | 一种自清洁散热翅片散热器 |
CN108926793A (zh) * | 2018-04-20 | 2018-12-04 | 宁波工程学院 | 一种基于热应变来自动释放干粉灭火剂的灭火装置 |
CN109027821A (zh) * | 2018-08-23 | 2018-12-18 | 重庆秉为科技有限公司 | 一种led灯的灯壳 |
CN109291655A (zh) * | 2018-12-10 | 2019-02-01 | 合肥菲力姆科技有限公司 | 一种具有散热功能的热敏打印头 |
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Effective date of registration: 20160523 Address after: 343000 Jinggangshan export processing zone, Jiangxi, No. Torch Road, No. 192 Applicant after: JIANGXI CHUANGCHENG ELECTRONIC CO., LTD. Address before: 343000 Jinggangshan export processing zone, Ji'an, Jiangxi (Jiangxi, Ji'an) Applicant before: JIANGXI CHUANGCHENG SEMICONDUCTOR CO., LTD. |
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Effective date of registration: 20170829 Address after: 343000 Torch Road 192, Jinggangshan economic and Technological Development Zone, Ji'an, Jiangxi Patentee after: Jiangxi creation Microelectronics Co., Ltd. Address before: 343000 Jinggangshan export processing zone, Jiangxi, No. Torch Road, No. 192 Patentee before: JIANGXI CHUANGCHENG ELECTRONIC CO., LTD. |
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