CN103871937B - A kind of overflow tank body structure for cleaning silicon chip - Google Patents
A kind of overflow tank body structure for cleaning silicon chip Download PDFInfo
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- CN103871937B CN103871937B CN201410125549.3A CN201410125549A CN103871937B CN 103871937 B CN103871937 B CN 103871937B CN 201410125549 A CN201410125549 A CN 201410125549A CN 103871937 B CN103871937 B CN 103871937B
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- wall
- overflow
- cleanout fluid
- cell wall
- silicon chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/048—Overflow-type cleaning, e.g. tanks in which the liquid flows over the tank in which the articles are placed
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Sewage (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
A kind of overflow tank body structure for cleaning silicon chip, including cell wall, base plate, the base bearing silicon chip and cleanout fluid inlet ductwork, cell wall includes bottom inwall, outer wall, cell wall top, cell wall and cell wall top is to the buffering changeover portion between outer wall, cell wall top and the cleanout fluid contact site when overflow are linearly or undulate or U-shaped or the arrangement of curves of V-arrangement, straight line or arrangement of curves portion are all located at the top of inwall；The layout that inwall top is the gradient or radian or the gradient to the transition part of outer wall and radian combines, outer wall is provided with at least 3 guiding gutters, and the cleanout fluid in cell body enters from base plate, and after cleaning silicon chip, at the notch of cell wall, smooth and easy overflow goes out cell body.Instant invention overcomes the problem that overflow channel has some setbacks, it is to avoid the problem accumulating foul at notch, also save the cost of clean-in-place liquid, improve the cleaning quality of silicon chip.
Description
Technical field
The present invention relates to ic manufacturing technology field, particularly relate to a kind of be applied to silicon chip after cmp
Clean overflow tank body structure.
Background technology
At present, Ge Jia cmp enterprise has been widely used a kind of overflow launder, at chemistry in its production process
In mechanical milling tech, such as silicon chip after grinding, need to remove through over cleaning to be retained on silicon chip in process of lapping
Granule.And the equipment cleaned is made up of different rinse baths in one line, including an overflow launder, such as Fig. 1
Shown in Fig. 2, wherein, 1 is sensor, and 2 is cleanout fluid, and 3 is silicon chip, and 4 is the top of former overflow launder cell body cell wall
Portion, 5 is outer wall, and 6 is cleanout fluid inlet ductwork, and 7 is base, and 8 is base plate, and 9 is bottom cell wall, and 10 is cell wall,
11 is inwall, and cleanout fluid 2 enters in cell body after cleaning silicon chip 3 from cleanout fluid inlet ductwork 6, from former overflow launder groove
Top 4 overflow of wall goes out slot device, and whether sensor 1 exists the effect of silicon chip in playing detection cell body, originally
Overflow groove device in, former cell wall top 4 and the cleanout fluid 2 contact site when overflow are the situation of EDS maps, and because of
Tension force for cleanout fluid surface is big, so not reaching optimal flushing effect, easily accumulating foul at notch, notably working as stream
When speed reaches certain speed, overflow cleanout fluid can the external wall of angled spout and be splashed in the cell body on side,
Have impact on the cleaning performance of other cell body.
Owing to overflow launder requires Wafer Cleaning totally, and require that overflow is smooth and easy, to ensure the clear of cleanout fluid in cell body
Cleanliness and the cleaning quality of silicon chip, in order to reach object above, currently available technology is:
1), the cell wall of overflow tank body is changed into the steel plate material that intensity is big, with reducing thin groove wall thickness；
2) flow of overflow cleanout fluid, is increased.
But along with increasing of cleanout fluid kind, employ mordant cleanout fluid the most in a large number, though so steel plate intensity
Greatly, but it is unsuitable to apply in the design of mordant cell body, and uses the anticorrosive property material of Kynoar, in order to
Proof strength and compressive resistance, then need to increase the cell wall thickness of its cell body, and cell wall thickness add, and it is clear with overflow
The contact area of washing liquid increases；And use the method increasing cleanout fluid flow, cause the waste of cleanout fluid, increase
Add the Material Cost at scene.
In sum, the overflow launder trough body structure of this cleaning silicon chip at present both at home and abroad used, there is a following shortcoming:
1, former cell wall top and the cleanout fluid contact site when overflow are the situation of EDS maps because cleanout fluid surface
Power is big, so causing the overflow of overflow launder to have some setbacks；
2, easily accumulate foul in original overflow launder top side wall, affect the cleaning performance of silicon chip in overflow launder；
3, when cleanout fluid flow increase time, cleanout fluid can the external wall of angled spout and be splashed to the groove on side
Internal, have impact on the cleaning performance of other cell body；
Though 4, the steel plate that cell wall uses is thinned cell wall thickness, but steel plate is unsuitable to apply to the design of mordant cell body
In；
5, cell body design uses the method increasing cleanout fluid flow in order to overflow is smooth and easy, cause the wave of cleanout fluid
Take, add the Material Cost at scene.
Summary of the invention
The problems referred to above existing during in order to solve the overflow launder cleaning silicon chip under prior art, the invention provides one
For the overflow tank body structure of cleaning silicon chip, this overflow tank body structure is when cleaning silicon chip, it is possible to realize the suitable of cleanout fluid
Smooth overflow, to eliminate the cleanout fluid accumulating foul or overflow at the overflow adverse effect to other cell bodies.The present invention's
Concrete scheme is as described below:
A kind of overflow tank body structure for cleaning silicon chip, including cell wall and base plate, described cell wall includes inner and outer wall,
Described base plate has penetrated cleanout fluid inlet ductwork, is imported in described cell body by cleanout fluid；Described cleanout fluid is with to be cleaned
After silicon chip contact, overflow from the top of described cell wall；It is characterized in that, at least partly overflow the cell wall of described cleanout fluid
The inner and outer wall of tip position intersect together formed linear contact portion so that described cleanout fluid when overflow with described
The contact at cell wall top is linear contact；Wherein, described linear contact portion is that the outer wall at described cell wall top upwardly extends
Be crossed to form with described inwall, from linear contact portion to described outer wall also have one section buffering changeover portion, described linearly
Contact site is curve linear contact site, described buffering changeover portion in buffering the gradient ease up arc making degree combine layout.
A kind of overflow tank body structure for cleaning silicon chip according to the present invention, it is characterised in that described curve linear
Contact site undulate or U-shaped or V-arrangement are arranged, the bottommost of described curve linear contact site is not less than the gradient
Bottommost.
Purpose of design is herein, and cleanout fluid is curve linear contact site when overflow with contacting of cell wall top, it is to avoid
Former cell wall top and the cleanout fluid contact site when overflow are the situation of EDS maps, decrease cell wall top and cleanout fluid
Contact area when overflow, reduces cleanout fluid surface tension to adverse effect during cleanout fluid overflow, makes cleanout fluid
Flow more smooth and easy, it also avoid the problem of foul accumulation at overflow.Buffering changeover portion in buffering the gradient ease up arc making degree knot
The layout closed, can flow to bottom cell wall along outer wall after making cleanout fluid overflow, it is to avoid the cleanout fluid of overflow is splashed to
The pollution problem caused in other cell bodies.Cell wall top and the cleanout fluid curved layout of the contact site when overflow, can adjust
The flow of joint overflow cleanout fluid, enters into the cleanout fluid flow hour in cell body, and cell body can first pass through the end of notch curve
Portion carries out the overflow that flow is little, and when the cleanout fluid flow entered in cell body increases, cell body can pass through notch curve
Middle and upper part carries out the overflow that flow is big.The bottommost of cell wall top curve is not less than the bottommost of the gradient, can guarantee that cleaning
Liquid will not overflow to outside wall portions in the horizontal direction, thus what the cleanout fluid avoiding overflow caused in being splashed to other cell bodies
Pollution problem.
A kind of overflow tank body structure for cleaning silicon chip according to the present invention, it is characterised in that described linear contact
Portion is straight linear contact site or the straight linear contact site at gradient top at radian top, the straight line line at radian top
Property contact site be the layout of radian to the buffering changeover portion of outer wall, the straight linear at gradient top touches the buffering of outer wall
Changeover portion is the layout of the gradient.
A kind of overflow tank body structure for cleaning silicon chip according to the present invention, it is characterised in that set on described outer wall
It is equipped with at least 3 guiding gutters, the portion that the arc making degree that eases up above guiding gutter is combined with the gradient or radian or the buffering gradient
It is connected, extends to bottom cell wall below guiding gutter.
A kind of overflow tank body structure for cleaning silicon chip according to the present invention, it is characterised in that use on described outer wall
Thread connecting mode installs a sensor.
Purpose of design is herein, cleanout fluid when overflow with cell wall top contact be straight linear contact, it is to avoid
Former cell wall top and the cleanout fluid contact site when overflow are the situation of EDS maps, decrease cell wall top and exist with cleanout fluid
Contact area during overflow, reduces cleanout fluid surface tension to adverse effect during cleanout fluid overflow, makes wash liquid stream
Dynamic more smooth and easy, it also avoid the problem of foul accumulation at overflow；And utilize guiding gutter can the cleanout fluid of overflow be played to lead
To drainage, can flow to bottom cell wall along outer wall after cleanout fluid overflow can be made, it is to avoid the cleanout fluid of overflow splashes
The pollution problem caused in other cell bodies；Whether sensor exists the effect of silicon chip in playing detection cell body.
A kind of overflow tank body structure for cleaning silicon chip according to the present invention, it is characterised in that also include bearing silicon chip
Base, described base is the crescent shape of band v-depression, and directly bears on the base plate within described cell body；
Described cell wall, base plate, the base bearing silicon chip and cleanout fluid inlet ductwork use Kynoar material.
A kind of overflow tank body structure for cleaning silicon chip according to the present invention, it is characterised in that described cell wall and base plate
First use fitting surface entirety bonding, then reinforce and the method connection of water-proofing treatment with welding rod at seam crossing.
A kind of overflow tank body structure for cleaning silicon chip according to the present invention, it is characterised in that described cleanout fluid import
Pipeline is fixed on the bottom of cell body base plate with welding manner or thread connecting mode.
Purpose of design is herein, uses conventional Kynoar material can play antisepsis, and cell wall is with base plate first
Use fitting surface entirety bonding, then reinforce and the method connection of water-proofing treatment with welding rod at seam crossing, can guarantee that connection
Reliability, moreover it is possible to play and prevent leakage effect, cleanout fluid by described cleanout fluid inlet ductwork from cell body base plate
Perforate enter in cell body, then carry out overflow by the notch on cell wall, make overflow cleanout fluid flowing more smooth and easy,
Also ensure that cleanout fluid is fully utilized in cell body, reduce cleanout fluid waste problem.
A kind of overflow tank body structure for cleaning silicon chip using the present invention obtains following beneficial effect:
(1) a kind of overflow tank body structure for cleaning silicon chip of the present invention, its cell wall top and cleanout fluid are when overflow
Contact site linearly or arrangement of curves, it is to avoid former cell wall top is that face is divided with the cleanout fluid contact site when overflow
The situation of cloth, decreases cell wall top and the cleanout fluid contact area when overflow, reduces cleanout fluid surface tension pair
Adverse effect during cleanout fluid overflow, makes cleanout fluid flowing more smooth and easy, it also avoid the problem of foul accumulation at overflow；
(2) a kind of overflow tank body structure for cleaning silicon chip of the present invention, the transition part at its cell wall top to outer wall in
The gradient or radian or the buffering gradient are eased up the layout that arc making degree combines, and utilize the guiding gutter can be to the cleanout fluid of overflow
Play guiding drainage, can flow to bottom cell wall along outer wall after cleanout fluid overflow can be made, it is to avoid the cleaning of overflow
The pollution problem that liquid causes in being splashed to other cell bodies；
(3) a kind of overflow tank body structure for cleaning silicon chip of the present invention, cell wall top and cleanout fluid are when overflow
The curved layout of contact site, can regulate the flow of overflow cleanout fluid, enters into the cleanout fluid flow hour in cell body, groove
Cognition first passes through the base portion of notch curve and carries out the overflow that flow is little, and the cleanout fluid flow in entering into cell body increases
Time, cell body can carry out, by the middle and upper part of notch curve, the overflow that flow is big.The bottommost of cell wall top curve is not less than
The bottommost of the gradient, can guarantee that overflow cleanout fluid will not overflow to outside wall portions in the horizontal direction, it is to avoid the cleaning of overflow
The pollution problem that liquid causes in being splashed to other cell bodies；
(4) a kind of overflow tank body structure for cleaning silicon chip of the present invention, can play and prevent cleanout fluid leakage problem,
Use conventional Kynoar material can play antisepsis, cleanout fluid by described cleanout fluid inlet ductwork from groove
Perforate on body base plate enters in cell body, then carries out overflow by the notch on cell wall, makes overflow cleanout fluid flow
More smooth and easy, moreover it is possible to ensure that cleanout fluid is fully utilized in cell body, reduce cleanout fluid waste problem, also improve
The cleaning quality of silicon chip.
Accompanying drawing explanation
Fig. 1 is the front view of former overflow launder cell body；
Fig. 2 is the A-A sectional view of former overflow launder cell body；
Fig. 3 is cell wall top to the transition part of outer wall is the gradient and radian combines the front view arranged；
Fig. 4 be cell wall top to the transition part of outer wall be the B-B sectional view that the gradient and radian combine the front view arranged；
Fig. 5 be cell wall top to the transition part of outer wall be the front view that radian is arranged；
Fig. 6 is cell wall top to the transition part of outer wall is the C-C sectional view of the front view that radian is arranged；
Fig. 7 be cell wall top to the transition part of outer wall be the front view that the gradient is arranged；
Fig. 8 is cell wall top to the transition part of outer wall is the D-D sectional view of the front view that the gradient is arranged；
In figure: 1-sensor, 2-cleanout fluid, 3-silicon chip, the top of 4-former overflow launder cell wall, 5-outer wall, 6-cleans
Liquid inlet ductwork, 7-base, 8-base plate, bottom 9-cell wall, 10-cell wall, 11-inwall, the straight line at 12-radian top
Linear contact portion, the 13-buffering gradient, 14-buffer radian, the straight linear contact at 15-gradient top, 16-radian,
The bottommost of the 17-gradient, the 18-gradient, 19-guiding gutter, 20-curve linear contact site.
Detailed description of the invention
With embodiment, a kind of overflow tank body structure for cleaning silicon chip of the present invention is done further below in conjunction with the accompanying drawings
Describe.
Embodiment
As shown in Figures 3 to 8, a kind of overflow tank body structure for cleaning silicon chip, including cell wall 10 and base plate 8,
Described cell wall 10 includes inwall 11 and outer wall 5, and described base plate 8 has penetrated cleanout fluid inlet ductwork 6, by cleanout fluid 2
Import in described cell body；After cleanout fluid 2 contacts with silicon chip 3 to be cleaned, overflow from the top of described cell wall 10；Extremely
The inwall 11 of cell wall 10 tip position of the small part described cleanout fluid 2 of spilling is formed linearly together with intersecting with outer wall 5
Contact site, so that described cleanout fluid 2 is linear contact when overflow with contacting of described cell wall 10 top.
Linear contact portion is that the outer wall 5 at cell wall 10 top upwardly extends and is crossed to form, from linearly connecing with described inwall 11
Contact portion also has one section of buffering changeover portion between described outer wall 5.
One of which linear contact portion is curve linear contact site 20, and its buffering changeover portion in the buffering gradient 13 and buffers
The layout that radian 14 combines.
Curve linear contact site 20 undulate or U-shaped or V-arrangement are arranged, the end of curve linear contact site 20
Portion is not less than the bottommost 17 of the gradient.
Cleanout fluid 2 is curve linear contact site 20 when overflow with contacting of cell wall 10 top, it is to avoid former cell wall top
Portion 4 and the cleanout fluid 2 contact site when overflow are the situation of EDS maps, decrease cell wall 10 top and cleanout fluid 2
Contact area when overflow, reduces cleanout fluid 2 surface tension to adverse effect during cleanout fluid overflow, makes cleaning
Liquid stream is dynamic more smooth and easy, it also avoid the problem of foul accumulation at overflow.Buffering changeover portion eases up arc making in the buffering gradient 13
The layouts of degree 14 combination, can flow to bottom cell wall 9 along outer wall 5 after making cleanout fluid overflow, it is to avoid overflow clear
The pollution problem that washing liquid causes in being splashed to other cell bodies.Cell wall 10 top and the cleanout fluid 2 contact site when overflow in
Arrangement of curves 20, can regulate the flow of cleanout fluid 2, enters into cleanout fluid 2 flow hour in cell body, and cell body can be first
The overflow that flow is little is carried out by the base portion of notch curve 20, when cleanout fluid 2 flow entered in cell body increases,
Cell body can carry out, by the middle and upper part of notch curve 20, the overflow that flow is big.The bottommost of cell wall 10 top curve is the lowest
In the bottommost 17 of the gradient, can guarantee that cleanout fluid will not overflow to outer wall 5 in the horizontal direction, it is to avoid overflow clear
The pollution problem that washing liquid 2 causes in being splashed to other cell bodies.
Another kind of linear contact portion is the straight linear contact site 12 at radian top or the straight linear at gradient top connects
Contact portion 15, the buffering changeover portion of the straight linear contact site 12 at radian top to outer wall 5 is the layout of radian 16, slope
The layout that the buffering changeover portion of outer wall 5 is the gradient 18 is arrived in the straight linear contact 15 at degree top.
Be provided with at least 3 guiding gutters 19 on outer wall 5, above guiding gutter 19 with the gradient 18 or radian 16 or
The buffering gradient 13 portion that arc making degree 14 combines that eases up is connected, and extends to bottom cell wall 9 below guiding gutter 19.
With thread connecting mode, one sensor 1 is installed on outer wall 5.
Cleanout fluid 2 is straight linear contact when overflow with contacting of cell wall 10 top, it is to avoid former cell wall top 4
It is the situation of EDS maps with the cleanout fluid 2 contact site when overflow, decreases cell wall 10 top with cleanout fluid 2 in overflow
Time contact area, reduce cleanout fluid surface tension to adverse effect during cleanout fluid overflow, make cleanout fluid flow more
Smooth and easy, it also avoid the problem of foul accumulation at overflow；And utilize guiding gutter 19 cleanout fluid of overflow can be played guiding
Drainage, can flow to bottom cell wall 9 along outer wall 5 after making cleanout fluid overflow, it is to avoid the cleanout fluid of overflow flies
The pollution problem caused in splashing other cell bodies；Whether sensor 1 exists the effect of silicon chip 3 in playing detection cell body.
Overflow tank body structure also includes the base 7 bearing silicon chip 3, and base 7 is the crescent shape of band v-depression, and
Directly bear on the base plate 8 within described cell body；Cell wall 10, base plate 8, the base 7 bearing silicon chip 3 and cleaning
Liquid inlet ductwork 6 uses Kynoar material.
Cell wall 10 and base plate 8 first use fitting surface entirety to bond, and then reinforce and water-proofing treatment at seam crossing welding rod
Method connects.
Cleanout fluid inlet ductwork 6 is fixed on the bottom of cell body base plate 8 with welding manner or thread connecting mode.
Cell wall 10, base plate 8, the base 7 bearing silicon chip 3 and cleanout fluid inlet ductwork 6 use conventional polyvinylidene fluoride
Alkene material can play antisepsis, and cell wall 10 and base plate 8 first use fitting surface entirety to bond, and then weld at seam crossing
Bar is reinforced and the method for water-proofing treatment connects, and can guarantee that the reliability of connection, moreover it is possible to play the leakage problem that prevents, and cleans
Liquid 2 enters in cell body by the perforate from cell body base plate 8 of the described cleanout fluid inlet ductwork 6, then passes through groove
Notch on wall 10 carries out overflow, makes cleanout fluid flowing more smooth and easy, moreover it is possible to ensure that cleanout fluid obtains sufficiently in cell body
Utilize, reduce cleanout fluid waste problem.
A kind of overflow tank body structure for cleaning silicon chip of the present invention, it is to avoid former cell wall top and cleanout fluid are in overflow
Time contact site be the situation of EDS maps, decrease cell wall top and the cleanout fluid contact area when overflow, reduce
Cleanout fluid surface tension, to adverse effect during cleanout fluid overflow, makes cleanout fluid flowing more smooth and easy, it also avoid at overflow
The problem of foul accumulation；Cell wall top and the cleanout fluid curved layout of the contact site when overflow, can regulate cleanout fluid
Flow；The cleanout fluid flow direction at cell body and the smooth and easy overflow of overflow notch, moreover it is possible to ensure that cleanout fluid is in cell body
To sufficiently utilizing, reduce cleanout fluid waste problem, also improve the cleaning quality of silicon chip.The present invention is applicable to various
Cell body after chemical machinery parts grind cleans field.
Claims (8)
1. for an overflow tank body structure for cleaning silicon chip, including cell wall (10) and base plate (8), described cell wall (10)
Including inwall (11) and outer wall (5), described base plate (8) has penetrated cleanout fluid inlet ductwork (6), by cleanout fluid (2)
Import in described cell body；After described cleanout fluid (2) contacts with silicon chip to be cleaned (3), from described cell wall (10)
Top overflow；It is characterized in that, at least partly cell wall (10) tip position of the described cleanout fluid of spilling (2) is interior
Wall (11) and outer wall (5) intersect and form linear contact portion together so that described cleanout fluid (2) when overflow with
The contact at described cell wall (10) top is linear contact；Wherein, described linear contact portion is described cell wall (10) top
The outer wall (5) in portion upwardly extends and is crossed to form with described inwall (11), from linear contact portion to described outer wall (5)
Between also have one section buffering changeover portion, described linear contact portion is curve linear contact site (20), described buffering changeover portion
The layout that gentle arc making degree (14) combines in the buffering gradient (13).
Overflow tank body structure the most according to claim 1, it is characterised in that described curve linear contact site (20)
Undulate or U-shaped or V-arrangement are arranged, the bottommost of described curve linear contact site (20) is not less than the gradient
Bottommost (17).
Overflow tank body structure the most according to claim 1, it is characterised in that described linear contact portion is radian
The straight linear contact site (12) at top or the straight linear contact site (15) at gradient top, the straight line at radian top
Linear contact portion (12) arrives the layout that the buffering changeover portion of outer wall (5) is radian (16), the straight line line at gradient top
Property contact (15) be the layout of the gradient (18) to the buffering changeover portion of outer wall (5).
4. according to the arbitrary described overflow tank body structure of claims 1 to 3, it is characterised in that described outer wall (5)
On be provided with at least 3 guiding gutters (19), guiding gutter (19) top and the gradient (18) or radian (16) or
The portion that the gentle arc making degree (14) of the buffering gradient (13) combines is connected, and guiding gutter (19) lower section extends to bottom cell wall
(9)。
5. according to the arbitrary described overflow tank body structure of claims 1 to 3, it is characterised in that described outer wall (5)
On with thread connecting mode, one sensor (1) is installed.
6. according to the arbitrary described overflow tank body structure of claims 1 to 3, it is characterised in that also include bearing silicon chip
(3) base (7), described base (7) is the crescent shape of band v-depression, and directly bears in described groove
On the base plate (8) in internal portion；Described cell wall (10), base plate (8), bear the base (7) of silicon chip (3) and clear
Washing liquid inlet ductwork (6) uses Kynoar material.
Overflow tank body structure the most according to claim 6, it is characterised in that described cell wall (10) and base plate (8)
First use fitting surface entirety bonding, then reinforce and the method connection of water-proofing treatment with welding rod at seam crossing.
Overflow tank body structure the most according to claim 6, it is characterised in that described cleanout fluid inlet ductwork (6)
The bottom of cell body base plate (8) it is fixed on welding manner or thread connecting mode.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410125549.3A CN103871937B (en) | 2014-03-31 | 2014-03-31 | A kind of overflow tank body structure for cleaning silicon chip |
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| CN107954402A (en) * | 2017-12-14 | 2018-04-24 | 攀枝花市德铭再生资源开发有限公司 | Fluid erosion prevention sulfuric acid tank blanking system |
| CN108568427A (en) * | 2018-06-22 | 2018-09-25 | 中国振华集团永光电子有限公司（国营第八七三厂） | A kind of ultrasonic cleaning equipment of silicon chip |
| CN110479685A (en) * | 2019-08-28 | 2019-11-22 | 西安奕斯伟硅片技术有限公司 | A kind of silicon chip cleaning device, silicon wafer cleaning method and silicon wafer store vehicle |
| CN113116121B (en) * | 2019-12-31 | 2022-07-29 | 浙江苏泊尔家电制造有限公司 | Cooking appliance, cooking method, and computer storage medium |
| CN112058774B (en) * | 2020-08-24 | 2021-11-30 | 台州市亿源塑业有限公司 | Overflow groove structure of wet etching cleaning mechanism |
| CN112779605B (en) * | 2021-01-26 | 2022-12-02 | 徐州中辉光伏科技有限公司 | Photovoltaic texturing device with drying function |
| CN115582338A (en) * | 2022-09-05 | 2023-01-10 | 上海中欣晶圆半导体科技有限公司 | Method for enhancing silicon wafer cleaning effect |
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| DE102007020449A1 (en) * | 2006-12-13 | 2008-06-19 | Rena Sondermaschinen Gmbh | Device for the wet chemical, electrochemical or electrolytic treatment or for cleaning the lower side of a flat material comprises a treatment chamber with an overflow edge which forms a gap with a support for the material |
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| CN103871937A (en) | 2014-06-18 |
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