CN103855496B - Actuation mechanism for electrical interconnection - Google Patents
Actuation mechanism for electrical interconnection Download PDFInfo
- Publication number
- CN103855496B CN103855496B CN201310656348.1A CN201310656348A CN103855496B CN 103855496 B CN103855496 B CN 103855496B CN 201310656348 A CN201310656348 A CN 201310656348A CN 103855496 B CN103855496 B CN 103855496B
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- China
- Prior art keywords
- base portion
- pin
- collar
- spring
- electronic installation
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The invention relates to an actuation mechanism for electrical interconnection. Some embodiments described herein include apparatuses and methods of forming such apparatuses. In one such embodiment, an apparatus may include an electronic arrangement, a first die, and a second die coupled to the first die and the electronic arrangement. The electronic arrangement may include an opening. At least a portion of the die may occupy at least a portion of the opening in the electronic arrangement. Other embodiments including additional apparatuses and methods are described.
Description
Technical field
Embodiment as described herein is with regard to electronic device.Some embodiments are about being related to ic package and circuit
The electric interconnection structure of plate.
Background technology
Many electronic articles, including desk computer, notebook and tablet PC, cell phone and other electricity
Sub- article, generally with one or more electronic devices, such as the memorizer of storage information, for the process of processing information
Device, or memorizer and processor.The device can be integrated circuit（IC）A part for packaging part.In the device of IC package part
Information between part and other devices is exchanged can be conducted as electronic signals, and the electric signal streams are through IC package part
Electric connection structure and other devices between.The electric connection structure can partly by being conductively connected on IC package part
Structure（Such as soldered ball）Formed with the interconnection structure on circuit board.In some cases, this electrical connection can be temporarily formed,
For the device is tested in test process.The factor of such as warpage of packaging assembly and manufacturing tolerance may make the product of electric connection structure
Qualitative change is poor.These factors are considered sometimes so that constituting a kind of challenge when electric interconnection structure is designed.
Description of the drawings
Fig. 1 illustrates the block diagram of the electronic installation according to some embodiments described herein, the electronic installation include for
The interconnection structure of the electrical connection between electronic building brick and base portion is provided.
Fig. 2A, Fig. 2 B, Fig. 2 C and Fig. 2 D illustrate according to some embodiments described herein, including the mutual of crank shape spring
Link the different views of structure.
Fig. 3 A, Fig. 3 B, Fig. 3 C and Fig. 3 D illustrate according to some embodiments described herein, including the interconnection of bar and spring
The different views of structure.
Fig. 4 A, Fig. 4 B, Fig. 4 C and Fig. 4 D illustrate interconnection according to some embodiments described herein, including scroll spring
The different views of structure.
Specific embodiment
Fig. 1 illustrates the block diagram of the electronic installation 100 according to some embodiments described herein, and electronic installation 100 includes mutually
Link structure 110, interconnection structure 110 is used to provide the electrical connection between electronic building brick 120 and base portion 130.Base portion 130 may include electricity
Road plate（For example, the printed circuit board (PCB) of such as motherboard）.Electronic building brick 120 may include integrated circuit（IC）Packaging part or other electronics
Device.Electronic building brick 120 may include the conductive contact for being coupled to each interconnection structure 110（Such as soldered ball）121.
Electronic building brick 120 may include device 122, and which passes through conductive contact（Such as soldered ball）124 are attached to substrate（For example,
Package substrate）123.Substrate 123 may include the conducting wire for being connected to conductive contact 121 and 124（It is not shown）.Device 122 can
Including quasiconductor（For example, silicon）Chip.The chip is may include for performing the circuit of one or more functions, such as at execution
The circuit of reason information, storage information or other functions.For example, the chip in device 122 may include processor（For example, wrap
Include transistor, arithmetic logical unit and other parts）, which may include CPU（CPU）, Graphics Processing Unit
（GPU）Or the two.The processor may also include special IC（ASIC）.
In electronic building brick 120, the example of IC package part may include BGA（BGA）Encapsulated type, Grid Array（LGA）
Encapsulated type, pin grid array（PGA）Encapsulated type or other encapsulated types.Electronic building brick 120 may include in electronic article,
Such as desk computer, notebook and tablet PC, electronic reader（For example, E-book reader）, individual number
Word assistant（PDAs）, cell phone, smart mobile phone, server, the network equipment, Set Top Box（STBs）, network router, network open
Pass, bridge or other types of electronic article.
As shown in figure 1, base portion 130 can be connected to analyser 140 by interface 150.Interface 150 may include to be connected to interconnection
The conducting wire of structure 110（For example, electric conductor）To allow by interconnection structure 110 and interface 150 in analyser 140 and electronics
Communicate between component 120（For example in the form of a signal）.Analyser 140 may include tester（Such as computer）To test electronics
Component 120（For example, device 122 is tested）, base portion 130 or the two.Thus, in electronic installation 100, device 122
It can be measured device（DUT）.
Used as example, Fig. 1 only illustrates 5 interconnection structures.The quantity of interconnection structure 110 can change.For example, electronic installation
The 100 many interconnection structures 110 that may include in a row and arrange in column.For simplicity, Fig. 1 is only shown at base portion 130
A part（Such as upper part）In interconnection structure 110.However, interconnection structure 110 is may include positioned at other portions of base portion 130
Point（Such as middle part and base section）In part.For example, interconnection structure 110 is may include with detailed below with reference to Fig. 2A to 4D
The interconnection structure of the part of description.
Fig. 2A, Fig. 2 B, Fig. 2 C and Fig. 2 D illustrate the interconnection structure 210 and base portion according to some embodiments described herein
230 different views.Fig. 2A illustrates the side view of interconnection structure 210 and base portion 230.Fig. 2 B illustrate one of interconnection of Fig. 2A
The perspective view of a part for structure 210（Relative to x, y and z direction）.Fig. 2 C illustrate the interconnection structure 210 and base portion 230 of Fig. 2A
A part cross section.Fig. 2 D illustrate the path of the base portion 230 of Fig. 2 C（via）234.
Interconnection structure 210 and base portion 230 in Fig. 2A to Fig. 2 D can correspond to the interconnection structure 110 and base portion of Fig. 1 respectively
130.Used as example, Fig. 2A only illustrates three interconnection structures 210.The quantity of interconnection structure 210 can change.
As shown in Figure 2 A, base portion 230 may include surface（Such as top surface and basal surface）231 and 232, and it is mutual at each
Link structure 210 and be in the opening 233 extend between surface 231 and 232.Base portion 230 may include the path being associated with opening 233
234（Fig. 2 C and Fig. 2 D）.Path 234 may include conductive path（For example, metal pathway）.At least a portion of path 234 can position
On the inside of opening 233（For example, it is close to the surface 231）.Path 234 may include side wall 235, and side wall 235 has cylinder
Shape（Such as cylindrical side wall 235）.Base portion 230 may include the conducting wire for being connected to path 234（It is not shown）It is logical to provide
Path 234 is crossed to and from the electrical communication of one or more interconnection structures 210（For example in the form of a signal）.This electricity
Gas communication may include the signal of the information for transmitting supply of electric power, data message, control information or other species.
Each interconnection structure 210（Fig. 2A, Fig. 2 B and Fig. 2 C）May include electric member and mechanical component.The electric member
May include by conductive material（For example, the metal of such as copper）The collar 211 and pin 215 of formation.The mechanical component may include
Spring 260.
As illustrated by figures 2 b and 2 c, the collar 211 may include part 212 and 213.Part 212（Fig. 2 B）Shape with cylinder
Shape, which can form slender cylinder.Part 212（Fig. 2 C）Can be located on the inside of the opening 233 of base portion 230 and be connected to path
234.Part 212 can directly contact path 234 side wall 235 and accompany in side wall 235.Part 212 can be plugged into path 234
In, so as to part 212 can be connected to path 234 by METALWORKING HARDENING.Part 213（Fig. 2 B）There can be annular shape, its
Size（Such as overall diameter）More than the diameter of opening 233.This can allow part 213 to form backstop（For example, mechanical interceptor）With
Prevent the collar 211（For example, the whole collar 211）Slide in path 234.Thus, as shown in Figure 2 C, part 213 can be located at logical
On the outside of road 234 and on the outside of opening 233.
As shown in Figure 2 B, the collar 211 may include the length along the collar 211（For example, in a z-direction）The slit of extension
214.Part 212 can be separated by slit 214, so as to part 212 can not be continuous part（At least the one of such as part 212
Part does not have material at slit 214）.Part 213 can also be separated by slit 214, so as to part 213 can not be continuously
Part（For example, at least a portion of part 213 does not have material at slit 214）.In alternative construction, the collar 211 is in portion
Divide（For example, slit 214）.Thus, in alternative construction, part
212 can be continuous part, and part 213 can be continuous part, or part 212 and 213 can all be continuous portion
Point.
Pin 215（Fig. 2 B and Fig. 2 C）Including end（For example, pin head）216 and 217.End 216（Fig. 2 C）Can be located at
On the outside of base portion 230（For example, on the outside of the opening 233 of base portion 230）.End 217 is can be located on the inside of base portion 230（For example, base portion 230
Opening 233 on the inside of）.Pin 215 can be electrically connected（For example, directly contact）The collar 211.For example, as shown in Figure 2 C, pin 215
End 216 and 217 between part（Such as body）Can the directly contact collar 211 part 212.Pin 215 may be disposed to
In a direction between end 216 and 217（Such as z directions）Upper movement, while maintaining to make electrical contact with the collar 211.
The collar 211, pin 215 and path 234 can set up electrical connection（For example, set up in test process and be electrically connected temporarily
Connect）, to allow to monitor up to and come from the device being coupled on the pin 215 of each interconnection structure 210（For example, DUT,
Such as the device 122 of Fig. 1）Electrical communication.
Spring 260（Fig. 2A）May include crank shape spring.For example, spring 260 may include substantially straight multiple sections（Example
Such as, as shown in Figure 2 A, three sections）.The plurality of section can form different angles in spring 260（For example different is curved
Head）.Spring 260 includes end 261 and 262.End 261 can couple（For example, directly contact）The end 217 of pin 215（Figure
2C）.End 262 can couple（For example fix）To a fixing device 239.Spring 260 may include conductive material（For example, metal）.
Alternatively, spring 260 may include electrically non-conductive material（For example, nonmetallic materials）, so as to spring 260 can not be electrically coupled to pin
215。
Spring 260 can form mechanical actuator, so as to when power be applied at least one of end 216 and 217 it is upper when, energy
Enough move up a side of the pin 215 between end 216 and 217（For example, slide）.For example, work as electronic building brick（For example,
The electronic building brick 120 of Fig. 1）It is attached to the pin 215 of each interconnection structure 210（For example in a z-direction against pin 215）
When, spring 260 can be compressed（For example, in a z-direction）.Thus, the arrangement of spring 260 and pin 215 can be suitable with what is be distributed
Answering property mechanism is associated, to provide the function of spring and load transmission.
The arrangement of spring 260, the collar 211 and pin 215 can make spring 260 electrically isolate from by pin 215, the collar 211 and lead to
The electric line that road 234 is formed.Thus, compared with conventional interconnection structures, each interconnection structure 210 can be with than by pin 215, set
The shorter electric line of electric line that ring 211 and path 234 are formed, wherein the conventional interconnection structures have and are included in two and insert
Foot head（For example, spring thimble（pogo-pin））Between electric line in spring.This can cause relatively low profile（For example, in z
Interconnection structure size less on direction）For between base portion 230 and other electronic devices（For example, in base portion 230 and Fig. 1
Between electronic building brick 120）Interconnection structure 210.Relatively low profile can improve the electric property of device, for example signal integrity and
Power output.
Each interconnection structure 210 can have relatively large pin stroke, while with enough power with another device（Example
Electronic building brick 120 such as with Fig. 1）Form electrical contact.Pin stroke refers to that pin 215 can be moved from datum mark（For example slide）Arrive
Another point（For example move in a z-direction）Distance.In some cases, thinner and less device formative factor（For example exist
Device 120 thinner in Fig. 1, substrate 122 or the two）Can be to semiconductor package part（The electronic building brick 120 of such as Fig. 1）Plane
Degree has a negative impact.In some such situations, it may be necessary to relatively large pin stroke, stuck up there is encapsulation with improving
The electrical connection that may be compromised during the factor of bent and manufacturing tolerance（Such as company between the electronic building brick 120 of base portion 230 and Fig. 1
Connect）Quality.In conventional interconnection structures（Such as spring thimble）In, do not reduce pin power or increase the premise of tang length
Under be likely difficult to（Or cannot realize in some cases）Increase pin stroke.If however, reducing this pin power（For example
In spring thimble）To increase pin stroke, the electrical contact between pin and the contact of device（It is connected to the pin）May
Quality variation（For example resistance increases）.
However, in interconnection structure 210, by the spring mechanism of the stress distribution that will cause because of displacement and load to distribution
In, the arrangement of spring 260 and pin 215 can realize big pin stroke（For example compared with spring thimble）.Thus, mutual
Link in structure 210, in the length for not increasing pin 215 or on the premise of not reducing pin power, the pin of pin 215 can be increased
Stroke.There is packaging part warpage, manufacturing tolerance or base portion 230 and other devices can improved during factor that other are undesirable in this
（The electronic building brick 120 of such as Fig. 1）Between electrical connection quality.
Fig. 3 A, Fig. 3 B, Fig. 3 C and Fig. 3 D illustrate the interconnection structure 310 and base portion of some embodiments according to described by these
330 different views, wherein interconnection structure 310 have positioned at the bar 370 between pin 215 and spring 360.In Fig. 3 A to Fig. 3 D
Interconnection structure 310 and base portion 330 can correspond to the interconnection structure 110 and base portion 130 of Fig. 1 respectively.Used as example, Fig. 3 A are only illustrated
Three interconnection structures 310.The quantity of interconnection structure 310 can change.
Element included by interconnection structure 310 and base portion 330 can respectively with interconnection structure 210 and base portion 230（Fig. 2A is to figure
2D）Element it is similar or identical.Thus, for simplicity, the similar or similar elements between interconnection structure 210 and 310 with
Similar or similar elements between base portion 230 and 330 give identical reference.The description of these similar or similar elements
Do not repeat in the description of Fig. 3 A to Fig. 3 D.
As shown in Fig. 3 B and Fig. 3 C, each interconnection structure 310 may include the electric structure formed by the collar 211 and pin 215
Part and the mechanical component formed by spring 360 and bar 370.The arrangement of spring 360, bar 370 and pin 215 can be suitable with lump
Answering property mechanism is associated.Spring 360 can pass through the end 217 that bar 370 is connected to pin 215, and spring load can be transmitted by bar 370
To pin 215.Bar 370 may include conductive material（Such as metal）.Alternatively, bar 370 may include electrically non-conductive material（For example, it is non-
Metal material）, so as to spring 360 can not be electrically coupled to pin 215.
Spring 360（Fig. 3 C）May include the helical spring with end 361 and 362.End 361 can couple（For example it is direct
Contact）To the end 372 of bar 370.End 362 can couple（For example fix）To base portion 330（The bottom of base portion 330 is positioned at for example
In portion）.Alternatively, spring 360 may include plane spring.
Used as example, Fig. 3 A and Fig. 3 C only illustrates a spring 360.Multiple springs can be used.For example, it is not with only one
Individual spring 360, but the two or more springs of or identical similar with spring 360 can be arranged one above the other（Stacking）In opening
On the inside of 233.
With conventional interconnection structures（Such as spring thimble）Compare, the arrangement of spring 360, bar 370 and pin 215 can be allowed mutually
Link structure 310 with than relatively low profile and bigger pin stroke, the profile and pin of they and spring 260 and pin 215
Stroke is similar to, as described by above with reference to Fig. 2A to Fig. 2 D.
Fig. 4 A, Fig. 4 B, Fig. 4 C and Fig. 4 D illustrate the interconnection structure 410 and base portion according to some embodiments described herein
430 different views.Fig. 4 A illustrate the side view of interconnection structure 410 and base portion 430.Fig. 4 B illustrate one of interconnection of Fig. 4 A
The perspective view of a part for structure 410（Relative to x, y and z direction）.Fig. 4 C illustrate the interconnection structure 410 and base portion 430 of Fig. 4 A
A part cross section.Fig. 4 D illustrate the top view of the path 434 of the base portion 430 of Fig. 4 C.
The interconnection structure 410 and base portion 430 of Fig. 4 A to Fig. 4 D can correspond to the interconnection structure 110 and base portion 130 of Fig. 1 respectively.
Used as example, Fig. 4 A only illustrate three interconnection structures 410.The quantity of interconnection structure 410 can change.
Element included by base portion 430 can be with the element of base portion 230（Fig. 2A, Fig. 2 C and Fig. 2 D）It is similar or identical.For example,
Base portion 430 may include surface 431 and 432 at each interconnection structure 410, opening 433 and path 434（With side wall 435）.
Base portion 430 may include the conducting wire for being connected to path 434（It is not shown）, to provide by path 434 to and from one
The electrical communication of individual or multiple interconnection structures 410.
As shown in Fig. 4 A, Fig. 4 B and Fig. 4 C, each interconnection structure 410 may include electric member and mechanical component.The electricity
Gas component is may include with conductive material（For example, the metal of such as copper）The collar 411（Fig. 4 B）With pin 415（Fig. 4 B and figure
4c）.The mechanical component may include the scroll spring 460 with conductive material（Fig. 4 B and 4C）.Scroll spring 460 can be provided and be connect
The relative large access area of the tactile collar 411 and pin 415 and provide pin lateral stability.
The collar 411（Fig. 4 B）May include part 412 and 413（Fig. 4 B and Fig. 4 C）.Part 412 can have the shape of cylinder
Shape, can form at least one of straight barrel around scroll spring 460.Part 412（Fig. 4 C）Can be located at the opening of base portion 430
On the inside of 433 and it is connected to path 434.Part 412 can directly contact path 434 side wall 435（Fig. 4 D）And accompany in side
Wall 435.Part 412 is can be plugged in path 434, so as to part 412 can be connected to path 434 by METALWORKING HARDENING.Set
The part 413 of ring 411 is can be located on the outside of opening 433.Part 413（Fig. 4 B）Can have annular shape, its size（For example it is outer straight
Footpath）More than the diameter of opening 433.This can allow part 413 to form stop part（Such as mechanical interceptor）, to prevent the collar 411
（For example, the whole collar 411）Slide in path 434.The stop part can also be at the top of base portion 430（Surface is close to for example
431）Place arranges benchmark z to height, and this can eliminate the manufacturing tolerance with regard to 430 thickness of base portion.
As shown in Figure 4 B, the collar 411 may include the length along the collar 411（For example in a z-direction）The slit of extension
414.Part 412 can be separated by slit 414, so that part 412 can not be continuous part（For example, part 412 is extremely
A few part does not have material at slit 414）.Slit 414 can also separate section 413, so as to part 413 can not be continuously
Part（For example, at least part of part 413 does not have material at slit 414）.In alternative construction, the collar 411 may not include
Slit in one or two in part 412 and 413（Such as slit 414）.Thus, in alternative construction, part 412 is to connect
Continuous part, part 413 are continuous parts, or can all be continuous parts both part 412 and 413.
Pin 415（Fig. 4 B and Fig. 4 C）Including end（Such as pin head）416 and 417.End 416 can be located at base portion 430
Outside（For example on the outside of the opening 433 of base portion 430）.End 417 is can be located on the inside of base portion 430（The opening 433 of such as base portion 430
Inner side）.End 417 may include to allow pin 415 to be inserted into（For example engage）To the structure in scroll spring 460 and the collar 411
（Such as buckle structure）.Pin 415（Fig. 4 A and Fig. 4 C）Can electrically connect（Such as directly contact）The collar 411.For example, such as Fig. 4 C institutes
Show, the part between the end 41 and 417 of pin 415（Such as body）Can the directly contact collar 411 part 412.Pin 415
May be disposed to a direction between end 416 and end 417（Such as z directions）Upper movement（For example slide）, while maintaining
Make electrical contact with scroll spring 460 and the collar 411.
As shown in Figure 4 B and 4C, at least a portion of scroll spring 460 can be looped around the pin between end 416 and 417
415 at least a portion.Part 412 can keep and surround a part at least a part for scroll spring 460 and pin 415,
Can be located at so as at least a portion of scroll spring 460 between the part 412 of the collar 411 and a part for pin 415.
The collar 411, pin 415, scroll spring 460 and path 434 can set up electrical connection（It is for example interim to electrically connect）, to permit
Permitted to monitor up to and come from the device of the pin 415 for being connected to each interconnection structure 410（For example, the device of DUT, such as Fig. 1
122）Electrical communication（For example as electronic signals）.
Scroll spring 460 can form mechanical actuator, to be applied at least one of end 416 and 417 when power
When can make pin 415 between end 416 and 417 a direction movement（For example slide）.For example, work as electronic building brick（Example
Such as the electronic building brick 120 of Fig. 1）It is attached to the pin 415 of each interconnection structure 410（For example in a z-direction against pin 415）
When, scroll spring 460 can be compressed（For example in a z-direction）.
With conventional interconnection structures（Such as spring thimble）Compare, each interconnection structure 410 there can be shorter electric line（Example
Such as formed by pin 415, spring 460, the collar 411 and path 434）.This can cause in base portion 430 and other electronic devices
Between（For example between the electronic building brick 120 of base portion 430 and Fig. 1）Interconnection structure 410 more low profile.Mutually link with traditional
Structure（Such as spring thimble）Compare, each interconnection structure 410 can also have relatively large pin stroke.
As described above, the invention discloses a kind of electronic installation, including：It is electrically coupled to the collar of base portion；It is electrically coupled to institute
The pin of the collar is stated, the pin includes the first end on the outside of the base portion and the second end on the inside of the base portion
Portion；And the pin is enable along the component moved positioned at a direction between its first end and the second end.
Preferably, the base portion includes path, and the collar at least includes the part on the inside of the path.
Preferably, the component includes spring, and the spring has first end and the second end, the first end contact of the spring
The second end of the pin, and the second end of the spring is connected to a fixing device.Preferably, the component includes bullet
Spring, and the spring do not electrically connected with the pin.Preferably, the component includes spring, and the spring at least around position
A part for the pin between the first and second ends of the pin.Preferably, the electronic installation also includes：Electricity
It is connected to the adapter ring of the base portion；The additional pins of the adapter ring are electrically coupled to, the additional pins include being located at
First end on the outside of the base portion and the second end on the inside of the base portion；And the additional pins are enable along institute
State the additional member that a direction between the first and second ends of additional pins is moved.Preferably, the base portion bag
Include printed circuit board (PCB).Preferably, the base portion includes an interface, and which is arranged to.Preferably,
The pin is connected to an electronic building brick in being arranged in the test.
Additionally, the invention also discloses a kind of electronic installation, including：The collar, which at least has the opening in base portion
A part for inner side；Pin, which is electrically coupled to the collar, the pin include the first end on the outside of the base portion and
The second end on the inside of base portion；And spring, if which is arranged in order to power be applied in first and second end
At least one on, then enable the pin along being moved positioned at a direction between its first end and the second end
It is dynamic, wherein the spring is coupled indirectly to the collar.
Preferably, the collar includes cylindrical part, and the opening of the base portion includes path, and the cylindrical portion
At least a portion divided accompanies the side wall in the path.Preferably, the collar includes the open outer side positioned at the base portion
Extention, the diameter of the size of the extention more than the opening of the base portion.Preferably, the spring shows as song
The form of handle type spring, wherein the first end of the crank shape spring contacts the second end of the pin, and the song
The second end of handle type spring is connected to a fixing device.Preferably, the spring shows as the form of helical spring.The bullet
Spring shows as the form of plane spring.The spring Jing is located at the bar between the second end and the spring of the pin and joins
It is connected to the second end of the pin.The spring is not electrically connected with the pin.
The invention also discloses a kind of electronic installation, including：It is connected to the collar of base portion；It is electrically coupled to inserting for the collar
Foot；And scroll spring, its part around the pin.Preferably, the base portion includes path, and the collar includes
A part on the inside of the path.Preferably, the collar is at least around a part for the scroll spring.Preferably,
At least a portion of the scroll spring is located between the part of a part and the pin for the collar.It is preferred that
, the scroll spring is arranged to enables the pin a certain between the first end and the second end of the pin
Direction moves.
Above description and accompanying drawing have fully illustrated specific embodiment, so that those skilled in the art can implement it
.Other embodiments can include structure, logic, electric, method and other changes.The part of some embodiments and feature
May include in the part of other embodiments and feature or replaced them.Illustrated embodiment includes in the claims
The all available equivalent of these claim.
Present invention also provides summary, with it is proposing in accordance with 37C.F.R.Section1.72 (b), make reader's acquisition technology
The requirement of the summary of disclosed property and main points.Draw attention to, summary is understood to be not used in restriction or explains right
The scope and meaning of requirement.The claims below is merged in detailed description hereby, wherein each claim conduct itself
One single embodiment.
Claims (16)
1. a kind of electronic installation, including：
It is electrically coupled to the collar of base portion；
The pin of the collar is electrically coupled to, the pin includes the first end on the outside of the base portion and is located at the base
The second end on the inside of portion；With
The pin is enable along the component moved positioned at a direction between its first end and the second end, its
It is characterised by, the component includes spring, and the spring includes first end, the second end and multiple straight sections, described
Multiple straight sections are relative to each other in different angles, and the first end of the spring contacts the second end of the pin
Portion, and the second end of the spring is connected to the fixing device of the open outer side of the base portion.
2. electronic installation according to claim 1, it is characterised in that the base portion includes path, and the collar bag
Include at least a portion on the inside of the path.
3. electronic installation according to claim 1, it is characterised in that the collar includes on the outside of the base portion
A part and the Part II on the inside of the base portion.
4. electronic installation according to claim 1, it is characterised in that the spring is not electrically connected with the pin.
5. electronic installation according to claim 1, it is characterised in that the electronic installation also includes：
It is electrically coupled to the adapter ring of the base portion；
The additional pins of the adapter ring are electrically coupled to, the additional pins include the first end on the outside of the base portion
With the second end on the inside of the base portion；And
The a direction of the additional pins between the first end and the second end of the additional pins is enable to be moved
Dynamic additional member.
6. electronic installation according to claim 1, it is characterised in that the base portion includes printed circuit board (PCB).
7. electronic installation according to claim 1, it is characterised in that the base portion includes an interface, and which is arranged in
Analyser is connected in test.
8. electronic installation according to claim 7, it is characterised in that the pin couples in being arranged in the test
To an electronic building brick.
9. electronic installation according to claim 1, it is characterised in that the base portion includes opening, and the collar bag
Include positioned at the part of the open outer side and the another part positioned at the opening inner side.
10. electronic installation according to claim 1, it is characterised in that the base portion includes conductive path, and the set
Ring includes being electrically coupled to the conductive path and at least a portion on the inside of the conductive path.
11. electronic installations according to claim 10, it is characterised in that the collar is included outside the conductive path
Another part of side.
12. electronic installations according to claim 1, it is characterised in that the base portion includes opening, the collar includes position
In the collar portion of the open outer side of the base portion, and the size of the collar portion is straight more than the opening of the base portion
Footpath.
A kind of 13. electronic installations, including：
It is electrically coupled to the collar of base portion；
The pin of the collar is electrically coupled to, the pin includes the first end on the outside of the base portion and is located at the base
The second end on the inside of portion；With
The pin is enable along the component moved positioned at a direction between its first end and the second end, its
It is characterised by, the base portion includes opening, and the component includes spring, and the spring includes multiple straight sections, described
The end of multiple straight sections section always relative to each other in different angles, and the plurality of straight section
It is connected to the fixing device of the open outer side of the base portion.
14. electronic installations according to claim 13, it is characterised in that the base portion includes conducting wire, to provide
To and from the electrical communication of the collar.
15. electronic installations according to claim 13, it is characterised in that the base portion includes conducting wire, to provide
To and from the electrical communication of the pin.
16. electronic installations according to claim 13, it is characterised in that the base portion includes conducting wire, to provide
To and from the electrical communication of the interface coupled with analyser.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/707,032 US9674943B2 (en) | 2012-12-06 | 2012-12-06 | Actuation mechanisms for electrical interconnections |
| US13/707,032 | 2012-12-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103855496A CN103855496A (en) | 2014-06-11 |
| CN103855496B true CN103855496B (en) | 2017-04-26 |
Family
ID=50862857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310656348.1A Expired - Fee Related CN103855496B (en) | 2012-12-06 | 2013-12-06 | Actuation mechanism for electrical interconnection |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US9674943B2 (en) |
| KR (1) | KR101602023B1 (en) |
| CN (1) | CN103855496B (en) |
| SG (1) | SG2013086624A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9674943B2 (en) | 2012-12-06 | 2017-06-06 | Intel Corporation | Actuation mechanisms for electrical interconnections |
| GB2510142B (en) * | 2013-01-25 | 2016-06-08 | Rolls Royce Plc | Contact device for contoured surfaces |
| CN104460061B (en) * | 2014-12-09 | 2018-06-05 | 京东方科技集团股份有限公司 | Test probe and test equipment |
| US10197599B2 (en) | 2015-12-16 | 2019-02-05 | Infineon Technologies Ag | Test pin configuration for test device for testing devices under test |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101160532A (en) * | 2005-04-28 | 2008-04-09 | 日本发条株式会社 | Conductive contact holder and conductive contact unit |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3148356A (en) * | 1959-09-14 | 1964-09-08 | Jr George A Hedden | Printed circuit connector |
| US4181385A (en) * | 1978-03-30 | 1980-01-01 | Motorola, Inc. | Low profile socket for circuit board with gas vents for fixed position soldering |
| US4200351A (en) * | 1978-06-12 | 1980-04-29 | Everett/Charles, Inc. | Straight through electrical spring probe |
| FR2565737B3 (en) * | 1984-06-12 | 1986-09-19 | Feinmetall Gmbh | CONTACT ELEMENT FOR A TEST ADAPTER FOR PERFORMING ELECTRICAL TESTS OF WORKPIECES IN PARTICULAR OF PRINTED CIRCUITS |
| US4650933A (en) * | 1985-07-15 | 1987-03-17 | At&T Bell Laboratories | Jack and test plug |
| SE457838B (en) * | 1987-06-11 | 1989-01-30 | Ericsson Telefon Ab L M | STYLE WANTED TO BE FIXED BY A CIRCUIT THROUGH WELDING |
| US5530375A (en) * | 1992-12-24 | 1996-06-25 | International Business Machines Corporation | Method of testing circuits and/or burning-in chips |
| DE69405435T2 (en) * | 1993-03-16 | 1998-01-22 | Hewlett Packard Co | Method and device for the production of electrically interconnected circuits |
| JPH06308156A (en) * | 1993-04-22 | 1994-11-04 | Meikoo:Kk | Pin socket for contact probe |
| JPH09178772A (en) * | 1995-12-26 | 1997-07-11 | Tokyo Kasoode Kenkyusho:Kk | Spring probe |
| US5929373A (en) | 1997-06-23 | 1999-07-27 | Applied Materials, Inc. | High voltage feed through |
| JP4124520B2 (en) * | 1998-07-30 | 2008-07-23 | 日本発条株式会社 | Conductive contact holder and method of manufacturing the same |
| EP1329991B1 (en) | 2000-10-26 | 2007-12-12 | Shin-Etsu Polymer Co., Ltd. | Compression type connector and the connecting structure thereof |
| US6685492B2 (en) * | 2001-12-27 | 2004-02-03 | Rika Electronics International, Inc. | Sockets for testing electronic packages having contact probes with contact tips easily maintainable in optimum operational condition |
| JP2004138592A (en) * | 2002-10-17 | 2004-05-13 | Adorinkusu:Kk | Spring contact and spring probe |
| JP2004138583A (en) * | 2002-10-21 | 2004-05-13 | Sumitomo Bakelite Co Ltd | Micro-chip for measuring function of cell |
| TW563929U (en) * | 2002-12-24 | 2003-11-21 | Molex Inc | Press connection terminal |
| JP2004340867A (en) * | 2003-05-19 | 2004-12-02 | Nec Electronics Corp | Spring probe and ic socket |
| JP3981042B2 (en) * | 2003-06-09 | 2007-09-26 | アルプス電気株式会社 | Contact probe, probe socket, electrical characteristic measuring apparatus, and contact probe pressing method |
| KR100769891B1 (en) | 2007-01-25 | 2007-10-24 | 리노공업주식회사 | Contact probe and socket |
| CN101315411A (en) | 2007-05-31 | 2008-12-03 | 安捷伦科技有限公司 | System, method and apparatus for testing circuit combination |
| US8390308B2 (en) * | 2008-02-29 | 2013-03-05 | Research In Motion Limited | Testbed for testing electronic circuits and components |
| JP4834039B2 (en) | 2008-07-25 | 2011-12-07 | 日本電子材料株式会社 | Probe unit |
| CN202002950U (en) | 2011-03-08 | 2011-10-05 | 上海韬盛电子科技有限公司 | Spring probe |
| JP5702416B2 (en) * | 2012-07-11 | 2015-04-15 | 本田技研工業株式会社 | Current application device |
| US9674943B2 (en) | 2012-12-06 | 2017-06-06 | Intel Corporation | Actuation mechanisms for electrical interconnections |
-
2012
- 2012-12-06 US US13/707,032 patent/US9674943B2/en active Active
-
2013
- 2013-11-22 SG SG2013086624A patent/SG2013086624A/en unknown
- 2013-12-05 KR KR1020130150743A patent/KR101602023B1/en active IP Right Grant
- 2013-12-06 CN CN201310656348.1A patent/CN103855496B/en not_active Expired - Fee Related
-
2017
- 2017-06-05 US US15/614,182 patent/US20170273176A1/en not_active Abandoned
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101160532A (en) * | 2005-04-28 | 2008-04-09 | 日本发条株式会社 | Conductive contact holder and conductive contact unit |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101602023B1 (en) | 2016-03-17 |
| CN103855496A (en) | 2014-06-11 |
| US9674943B2 (en) | 2017-06-06 |
| SG2013086624A (en) | 2014-07-30 |
| KR20140073443A (en) | 2014-06-16 |
| US20170273176A1 (en) | 2017-09-21 |
| US20140158416A1 (en) | 2014-06-12 |
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Granted publication date: 20170426 Termination date: 20211206 |