CN202002950U - Spring probe - Google Patents
Spring probe Download PDFInfo
- Publication number
- CN202002950U CN202002950U CN2011200579321U CN201120057932U CN202002950U CN 202002950 U CN202002950 U CN 202002950U CN 2011200579321 U CN2011200579321 U CN 2011200579321U CN 201120057932 U CN201120057932 U CN 201120057932U CN 202002950 U CN202002950 U CN 202002950U
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- CN
- China
- Prior art keywords
- thimble
- cavity
- spring
- outer sleeve
- spring probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The utility model relates to a spring probe, in particular a spring probe for testing a finished integrated circuit. The spring probe comprises an upper thimble, a cavity, a spring, a lower thimble, an eccentric ball, an outer sleeve and an elastic graphite sealing strip, wherein the upper thimble is integrally molded with the cavity; the eccentric ball is arranged between the spring and the lower thimble; the elastic graphite sealing strip is coated at the periphery of the lower thimble and a crimped position of the cavity; the outer sleeve is coated on the elastic graphite sealing strip; and the outer sleeve is in tight fit with the cavity. The spring probe can work stably in a severe environment, the inside of the cavity is prevented from being influenced by external liquid or dust, and stable contact between the spring and the lower thimble serving as a movable thimble is ensured.
Description
Technical field
The utility model relates to spring probe, especially a kind ofly is used for the spring probe that the integrated circuit finished product test is used.
Background technology
The existing structure that is used for the spring probe that the integrated circuit finished product test uses is mainly by last thimble, thimble, cavity, spring are formed down.Wherein the structure of cavity is to be made of columnar metal sleeve, and the big end of upper and lower thimble places in the cavity two ends, and spring places the centre of cavity, and the inward at both ends crimping of cavity is with wrapping in the cavity than big end of upper and lower thimble.During use, by the upper and lower thimble of extruding in cavity, compression spring forms stable elastic force and contacts with electric.In addition, also have employing to go up thimble in the existing spring probe structure and be pressed together on cavity one end, following thimble is as the structure of moving needle movement; And adopting the structural design that goes up thimble and cavity one, following thimble is as the structure of moving needle movement.
All there is the not good situation of leakproofness under the above-mentioned existing spring probe between thimble and the cavity, in being in, under the more harsh environment of dust chip as water, then the electric contact stabilization of spring probe can't be guaranteed, the elastic force instability appears easily, abnormal conditions such as contact resistance instability.Especially at being used for the spring probe that the integrated circuit finished product test is used, after probe is carried out ultrasonic cleaning, after promptly utilizing alcohol to do the ultra sonic bath of media, liquid enters into cavity easily, influence spring, the motion of upper and lower thimble causes probe elastic force, contact resistance instability, and then the efficient of influence test.
Summary of the invention
The purpose of this utility model is for guaranteeing the steady operation of probe under harsh environment, avoid being subjected in the cavity influence of extraneous liquid or dust, guarantees spring and as stable contact the between the following thimble of moving pin.
Concrete technical scheme of the present utility model is:
A kind of spring probe comprises thimble, cavity, spring and following thimble, and described upward thimble and cavity are one-body molded, also comprise eccentric sphere, outer sleeve and elastic graphite band; Described eccentric sphere places between spring and the following thimble, guarantees the stable contact and the transmission of elastic force; The crimping position of thimble periphery and cavity under the elastic graphite band coats guarantees that thimble is movable down, and isolated again simultaneously liquid or dust enter in the cavity; Outer sleeve coats the elastic graphite band, and outer sleeve and cavity closely cooperate, and come off to prevent outer sleeve.
Spring probe of the present utility model can be used for the integrated circuit finished product test, can be under harsh environment steady operation, avoid being subjected in the cavity influence of extraneous liquid or dust, guarantee spring and as stable contact the between the following thimble of moving pin.
Description of drawings
Fig. 1 is the utility model probe structure synoptic diagram.
The last thimble of 1-; The 2-spring; The 3-eccentric sphere; The 4-outer sleeve; 5-elastic graphite band; Thimble under the 6-.
Embodiment
The utility model is described in further detail below in conjunction with the drawings and specific embodiments, but not as qualification of the present utility model.
Please referring to Fig. 1, a kind ofly be used for the spring probe structure that the integrated circuit finished product test is used.Among the figure, the last thimble 1 and the cavity of this probe are one, and this probe also comprises thimble 6, spring 2, eccentric sphere 3, outer sleeve 4 and elastic graphite band 5 down in addition.Eccentric sphere 3 places between spring 2 and the following thimble 6, and stable contact is provided.Elastic graphite band 5 encases down the crimping position of thimble 6 peripheries and cavity, guarantees that thimble 6 can move down, and isolated again simultaneously liquid or dust enter in the cavity.Encase elastic graphite band 5 with outer sleeve 4 then, outer sleeve 4 and cavity close-fitting, the gap can come off to prevent outer sleeve 4 about 0.02mm.
Spring probe of the present utility model can be used for the integrated circuit finished product test, can be under harsh environment steady operation, avoid being subjected in the cavity influence of extraneous liquid or dust, guarantee spring and as stable contact the between the following thimble of moving pin.
Claims (1)
1. a spring probe comprises thimble, cavity, spring and following thimble, and described upward thimble and cavity are one-body molded, it is characterized in that described spring probe comprises eccentric sphere, outer sleeve and elastic graphite band; Described eccentric sphere places between spring and the following thimble; The crimping position of thimble periphery and cavity under described elastic graphite band coats; Described outer sleeve coats the elastic graphite band, and outer sleeve and cavity closely cooperate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200579321U CN202002950U (en) | 2011-03-08 | 2011-03-08 | Spring probe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200579321U CN202002950U (en) | 2011-03-08 | 2011-03-08 | Spring probe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202002950U true CN202002950U (en) | 2011-10-05 |
Family
ID=44705687
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200579321U Expired - Fee Related CN202002950U (en) | 2011-03-08 | 2011-03-08 | Spring probe |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202002950U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103148874A (en) * | 2013-02-01 | 2013-06-12 | 三门峡锐鑫测控量仪有限公司 | Miniature pneumatic contact type measuring head |
| CN103752870A (en) * | 2013-12-23 | 2014-04-30 | 柳州市永信机械配件制造有限公司 | Conductive block of positioning head |
| CN103855496A (en) * | 2012-12-06 | 2014-06-11 | 英特尔公司 | Actuation mechanism for electrical interconnection |
| CN106569088A (en) * | 2016-09-13 | 2017-04-19 | 北京映翰通网络技术股份有限公司 | Power distribution network line fault indication and positioning device |
| CN106847720A (en) * | 2015-12-04 | 2017-06-13 | 瑞萨电子株式会社 | The manufacture method of semiconductor device |
| CN108254676A (en) * | 2018-03-26 | 2018-07-06 | 苏州联讯仪器有限公司 | A kind of high precision laser chip aging clamp |
| CN109498974A (en) * | 2019-01-18 | 2019-03-22 | 王敏 | Safety aid before a kind of chemotherapy |
-
2011
- 2011-03-08 CN CN2011200579321U patent/CN202002950U/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103855496A (en) * | 2012-12-06 | 2014-06-11 | 英特尔公司 | Actuation mechanism for electrical interconnection |
| US9674943B2 (en) | 2012-12-06 | 2017-06-06 | Intel Corporation | Actuation mechanisms for electrical interconnections |
| CN103148874A (en) * | 2013-02-01 | 2013-06-12 | 三门峡锐鑫测控量仪有限公司 | Miniature pneumatic contact type measuring head |
| CN103752870A (en) * | 2013-12-23 | 2014-04-30 | 柳州市永信机械配件制造有限公司 | Conductive block of positioning head |
| CN103752870B (en) * | 2013-12-23 | 2016-05-18 | 柳州市永信机械配件制造有限公司 | Positioning head conducting block |
| CN106847720A (en) * | 2015-12-04 | 2017-06-13 | 瑞萨电子株式会社 | The manufacture method of semiconductor device |
| CN106569088A (en) * | 2016-09-13 | 2017-04-19 | 北京映翰通网络技术股份有限公司 | Power distribution network line fault indication and positioning device |
| CN108254676A (en) * | 2018-03-26 | 2018-07-06 | 苏州联讯仪器有限公司 | A kind of high precision laser chip aging clamp |
| CN109498974A (en) * | 2019-01-18 | 2019-03-22 | 王敏 | Safety aid before a kind of chemotherapy |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111005 Termination date: 20200308 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |