CN103817461A - Resin-core soldering flux - Google Patents
Resin-core soldering flux Download PDFInfo
- Publication number
- CN103817461A CN103817461A CN201410096685.4A CN201410096685A CN103817461A CN 103817461 A CN103817461 A CN 103817461A CN 201410096685 A CN201410096685 A CN 201410096685A CN 103817461 A CN103817461 A CN 103817461A
- Authority
- CN
- China
- Prior art keywords
- resin
- welding
- core flux
- amine salt
- stabilizing agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
- B23K35/3603—Halide salts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Nonmetallic Welding Materials (AREA)
Abstract
The invention discloses resin-core soldering flux. The resin-core soldering flux comprises, by weight, 10%-15% of amine salt, 1.5%-3% of organic acid activating agents, 0.5%-2.5% of surface activity agents, 1.5%-2% of stabilizing agents, and 4.5%-6% of dispersing agents, and the allowance is hydrochloric acid solution. Through the method, the resin-core soldering flux is suitable for welding in various lead-free technologies, the welding quality and the welding efficiency of lead-free solder sticks in the manual welding technology are improved, and serious damages on human bodies do not exist.
Description
Technical field
The present invention relates to scaling powder, particularly relate to a kind of Resin-core flux.
Background technology
Welding is the traditional manual manufacturing industry of China, and all the time, the welding of product is requisite production process, especially traditional manufacture in production process, and welding is that quality is particularly important.
The welds types of production enterprise is varied, for example brazing connects, Plate Welding, soldering, stainless steel welding etc., but various welding all need scaling powder, the auxiliary material using when scaling powder is welding, the Main Function of scaling powder is the oxide of removing scolder and welded mother metal surface, makes metal surface reach necessary cleannes. the oxidation again on surface when it prevents from welding, reduces solder surface tension force, improving welding performance. the quality of scaling powder performance, directly has influence on the quality of electronic product.
Along with the development of unleaded electronics industry, be applicable to the also corresponding increase of consumption of the lead-free soldering wire of manual welding technique.But unleaded tin silk is with respect to there being slicker solder silk, its welding temperature raises, and solderability reduces.For adapted to leadless technique, improve welding performance, be necessary to develop the Resin-core flux of high activity, low corrosion and low-halogen-content.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of Resin-core flux, adapts to various lead-free process welding, has improved welding quality and the welding efficiency of the lead-free soldering wire of manual welding technique, human body be there is no to large injury simultaneously.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of Resin-core flux is provided, comprise following component: amine salt, organic acid for activating agent, surface-active, stabilizing agent, stabilizing agent and diffusant amine salt, surplus is hydrochloric acid solution, wherein said each component content is: amine salt 10wt%～15 wt%, organic acid for activating agent is 1.5 wt%～3 wt%, surface-active is 0.5 wt%～2.5 wt %, stabilizing agent is 1.5 wt %～2 wt %, diffusant 4.5 wt %～6 wt %.
In preferred embodiments of the present invention, described ammonium salt is one or both mixtures in dimethylamine hydrochloride, diethylamine hydrochloride and cyclohexylamine hydrochloride.
In preferred embodiments of the present invention, described organic acid for activating agent is septichen, SA, the one in pimelic acid, malic acid.
In preferred embodiments of the present invention, described surfactant is lecithin or amino acid pattern.
In preferred embodiments of the present invention, described stabilizing agent is lead salicylate.
In preferred embodiments of the present invention, described each component content is: amine salt 10wt%, and organic acid for activating agent is 3 wt%, surface-active 1.5 wt %, stabilizing agent is 1.5wt %, diffusant 4.5 wt %.
The invention has the beneficial effects as follows: the invention provides a kind of Resin-core flux, adapt to various lead-free process welding, improved welding quality and the welding efficiency of the lead-free soldering wire of manual welding technique, human body be there is no to large injury simultaneously.
The specific embodiment
To the technical scheme in the embodiment of the present invention be clearly and completely described below, obviously, described embodiment is only a part of embodiment of the present invention, rather than whole embodiment.Based on the embodiment in the present invention, those of ordinary skills, not making all other embodiment that obtain under creative work prerequisite, belong to the scope of protection of the invention.
The embodiment of the present invention comprises:
A kind of Resin-core flux, comprise following component: amine salt, organic acid for activating agent, surface-active, stabilizing agent, stabilizing agent and diffusant amine salt, surplus is hydrochloric acid solution, wherein said each component content is: amine salt 10wt%～15 wt%, organic acid for activating agent is 1.5 wt%～3 wt%, surface-active is 0.5 wt%～2.5 wt %, and stabilizing agent is 1.5 wt %～2 wt %, diffusant 4.5 wt %～6 wt %.
Further, described ammonium salt is one or both mixtures in dimethylamine hydrochloride, diethylamine hydrochloride and cyclohexylamine hydrochloride.
Further, described organic acid for activating agent is septichen, SA, the one in pimelic acid, malic acid.
Further, described surfactant is lecithin or amino acid pattern.
Further, described stabilizing agent is lead salicylate.
Further, described each component content is: amine salt 10wt%, and organic acid for activating agent is 3 wt%, surface-active 1.5 wt %, stabilizing agent is 1.5wt %, diffusant 4.5 wt %.
The invention has the beneficial effects as follows: the invention provides a kind of Resin-core flux, adapt to various lead-free process welding, improved welding quality and the welding efficiency of the lead-free soldering wire of manual welding technique, human body be there is no to large injury simultaneously.
The foregoing is only embodiments of the invention; not thereby limit the scope of the claims of the present invention; every equivalent structure or conversion of equivalent flow process that utilizes description of the present invention to do; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (6)
1. a Resin-core flux, it is characterized in that, comprise following component: amine salt, organic acid for activating agent, surface-active, stabilizing agent, stabilizing agent and diffusant amine salt, surplus is hydrochloric acid solution, wherein said each component content is: amine salt 10wt%～15 wt%, and organic acid for activating agent is 1.5 wt%～3 wt%, surface-active is 0.5 wt%～2.5 wt %, stabilizing agent is 1.5 wt %～2 wt %, diffusant 4.5 wt %～6 wt %.
2. Resin-core flux according to claim 1, is characterized in that, described ammonium salt is one or both mixtures in dimethylamine hydrochloride, diethylamine hydrochloride and cyclohexylamine hydrochloride.
3. Resin-core flux according to claim 1, is characterized in that, described organic acid for activating agent is septichen, SA, the one in pimelic acid, malic acid.
4. Resin-core flux according to claim 1, is characterized in that, described surfactant is lecithin or amino acid pattern.
5. Resin-core flux according to claim 1, is characterized in that, described stabilizing agent is lead salicylate.
6. Resin-core flux according to claim 1, is characterized in that, described each component content is: amine salt 10wt%, and organic acid for activating agent is 3 wt%, surface-active 1.5 wt %, stabilizing agent is 1.5wt %, diffusant 4.5 wt %.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410096685.4A CN103817461A (en) | 2014-03-17 | 2014-03-17 | Resin-core soldering flux |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410096685.4A CN103817461A (en) | 2014-03-17 | 2014-03-17 | Resin-core soldering flux |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103817461A true CN103817461A (en) | 2014-05-28 |
Family
ID=50752901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410096685.4A Pending CN103817461A (en) | 2014-03-17 | 2014-03-17 | Resin-core soldering flux |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103817461A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104607825A (en) * | 2015-01-28 | 2015-05-13 | 一远电子科技有限公司 | Oxidation-resisting flux for metal material welding |
| CN108188616A (en) * | 2017-12-30 | 2018-06-22 | 刘滨 | A kind of preparation method of environment-protective halogen-free scaling powder |
| CN108274161A (en) * | 2018-04-09 | 2018-07-13 | 苏州锐耐洁电子科技新材料有限公司 | A kind of scaling powder to the corrosion-free effect in surface |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1429143A (en) * | 2000-04-13 | 2003-07-09 | 弗赖斯金属有限公司d.b.a.阿尔发金属有限公司 | Soldering flux with cationic surfactant |
| CN101062536A (en) * | 2007-06-01 | 2007-10-31 | 中南大学 | Non-halide cleaning-free welding flux for leadless solder |
| CN101116931A (en) * | 2007-07-25 | 2008-02-06 | 东莞市特尔佳电子有限公司 | Scaling powder for sn96.5ag3cu0.5 alloy soldering tin paste |
| CN101733589A (en) * | 2010-01-27 | 2010-06-16 | 浙江一远电子科技有限公司 | Halogen-free and cleaning-free soldering flux for lead-free solder |
| CN101745760A (en) * | 2008-12-08 | 2010-06-23 | 厦门法拉电子股份有限公司 | Lead-free solder environmental-protection scaling powder used for soldering capacitor with film adhered on surface |
| KR101117884B1 (en) * | 2004-08-16 | 2012-03-07 | 하리마 카세이 가부시키가이샤 | Flux for soldering, soldering method, and printed curcuit board |
| CN102513733A (en) * | 2010-12-31 | 2012-06-27 | 广东中实金属有限公司 | Flux |
| CN102528200A (en) * | 2011-12-12 | 2012-07-04 | 肇庆理士电源技术有限公司 | Pretreatment method of copper insert of storage battery terminal |
| JP2013126671A (en) * | 2011-12-16 | 2013-06-27 | Tamura Seisakusho Co Ltd | Soldering flux |
| CN103350291A (en) * | 2013-06-27 | 2013-10-16 | 东莞市和阳电子科技有限公司 | Soldering flux |
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2014
- 2014-03-17 CN CN201410096685.4A patent/CN103817461A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1429143A (en) * | 2000-04-13 | 2003-07-09 | 弗赖斯金属有限公司d.b.a.阿尔发金属有限公司 | Soldering flux with cationic surfactant |
| KR101117884B1 (en) * | 2004-08-16 | 2012-03-07 | 하리마 카세이 가부시키가이샤 | Flux for soldering, soldering method, and printed curcuit board |
| CN101062536A (en) * | 2007-06-01 | 2007-10-31 | 中南大学 | Non-halide cleaning-free welding flux for leadless solder |
| CN101116931A (en) * | 2007-07-25 | 2008-02-06 | 东莞市特尔佳电子有限公司 | Scaling powder for sn96.5ag3cu0.5 alloy soldering tin paste |
| CN101745760A (en) * | 2008-12-08 | 2010-06-23 | 厦门法拉电子股份有限公司 | Lead-free solder environmental-protection scaling powder used for soldering capacitor with film adhered on surface |
| CN101733589A (en) * | 2010-01-27 | 2010-06-16 | 浙江一远电子科技有限公司 | Halogen-free and cleaning-free soldering flux for lead-free solder |
| CN102513733A (en) * | 2010-12-31 | 2012-06-27 | 广东中实金属有限公司 | Flux |
| CN102528200A (en) * | 2011-12-12 | 2012-07-04 | 肇庆理士电源技术有限公司 | Pretreatment method of copper insert of storage battery terminal |
| JP2013126671A (en) * | 2011-12-16 | 2013-06-27 | Tamura Seisakusho Co Ltd | Soldering flux |
| CN103350291A (en) * | 2013-06-27 | 2013-10-16 | 东莞市和阳电子科技有限公司 | Soldering flux |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104607825A (en) * | 2015-01-28 | 2015-05-13 | 一远电子科技有限公司 | Oxidation-resisting flux for metal material welding |
| CN104607825B (en) * | 2015-01-28 | 2016-10-05 | 一远电子科技有限公司 | A kind of antioxidation scaling powder for Metal Material Welding |
| CN108188616A (en) * | 2017-12-30 | 2018-06-22 | 刘滨 | A kind of preparation method of environment-protective halogen-free scaling powder |
| CN108274161A (en) * | 2018-04-09 | 2018-07-13 | 苏州锐耐洁电子科技新材料有限公司 | A kind of scaling powder to the corrosion-free effect in surface |
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Application publication date: 20140528 |