CN103796426A - Circuit module applying multi-layer chip capacitor and electronic equipment - Google Patents
Circuit module applying multi-layer chip capacitor and electronic equipment Download PDFInfo
- Publication number
- CN103796426A CN103796426A CN201210424405.9A CN201210424405A CN103796426A CN 103796426 A CN103796426 A CN 103796426A CN 201210424405 A CN201210424405 A CN 201210424405A CN 103796426 A CN103796426 A CN 103796426A
- Authority
- CN
- China
- Prior art keywords
- chip multilayer
- circuit module
- multilayer capacitor
- main circuit
- circuit substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention discloses a circuit module applying a multi-layer chip capacitor and electronic equipment. The circuit module includes a main circuit board equipped with at least one electronic component, and at least one multi-layer chip capacitor, and the circuit module is characterized in that the multi-layer chip capacitor is mounted on the main circuit board, and all dielectric layers forming the multi-layer chip capacitor are not parallel to the main circuit board. The circuit module generates relatively small noise in a using process, thereby enabling electronic equipment applying the circuit module to have relatively good performance.
Description
Technical field
The present invention relates to electronic circuit technology field, relate in particular a kind of circuit module and electronic equipment of applying chip multilayer capacitor.
Background technology
Although the development of electronic technology, the requirement of the miniaturization of people to electronic equipment and high capacity is more and more higher.And chip multilayer capacitor is because having the advantages that capacity is large, volume is little, be widely used in the electronic equipment such as mobile phone, palmtop PC.Common chip multilayer capacitor as: by multiple layer ceramic dielectric printing electrode size, the superimposed chip multilayer ceramic capacitor (MLCC, Multi-layer ceramiccapacitors) forming that burns altogether.
But be provided with chip multilayer capacitor built-up circuit electronic equipment in use, in built-up circuit, be easy to produce some interference noises, thereby affected the normal use of electronic equipment.When the terminal in internal circuit as utilized with chip multilayer capacitor is conversed or watches video, often there will be the noise producing due to internal circuit to affect speech quality, or disturb normal video sound to play.
Summary of the invention
In view of this, the invention provides a kind of circuit module and electronic equipment of applying chip multilayer capacitor, compared with the circuit module of existing application chip multilayer capacitor, the noise that circuit module of the present invention produced is in the course of the work low, thereby has improved the result of use of the electronic equipment of applying this circuit module.
For achieving the above object, the invention provides following technical scheme: a kind of circuit module of applying chip multilayer capacitor, this circuit module comprises: the main circuit substrate that at least one electronic component is installed, and at least one chip multilayer capacitor, described chip multilayer capacitor is installed on described main circuit substrate, and the each dielectric layer that forms described chip multilayer capacitor all with the non-parallel setting of described main circuit substrate.
Preferably, described chip multilayer capacitor is chip multilayer ceramic capacitor.
Preferably, described multilayer ceramic capacitor at least comprises ceramic dielectric layer and metallic dielectric layer, and described ceramic dielectric layer and metal level all with the non-parallel setting of described main circuit substrate.
Preferably, each dielectric layer of the described chip multilayer capacitor of described composition is all vertical with described main circuit substrate.
On the other hand, the present invention also provides a kind of electronic equipment, the circuit module of the built-in above-described application chip multilayer capacitor of this electronic equipment.
Preferably, described electronic equipment is mobile terminal.
Known via above-mentioned technical scheme, compared with prior art, the present invention openly provides a kind of circuit module of applying chip multilayer capacitor, this circuit module comprises the main circuit substrate that is provided with at least one electronic component, and be installed on the chip multilayer capacitor on this main circuit substrate, wherein, each dielectric layer of this chip multilayer capacitor all with the non-parallel setting of described main circuit substrate.Like this, in the time of the logical work of this circuit module, the alternating current being loaded on this chip multilayer capacitor makes it produce after active force to each dielectric layer direction, because each dielectric layer is not parallel with main circuit substrate, therefore can't directly act on this main circuit substrate perpendicular to the active force on each dielectric layer, thereby reduce the active force to main circuit substrate, avoid in vibration, producing resonance with main circuit substrate with the each dielectric layer of chip multilayer capacitor, and then the deformation quantity of main circuit substrate is reduced, reduce the noise that main circuit substrate surface produces, reduce the interference noise producing in the circuit module course of work.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only embodiments of the invention, for those of ordinary skills, do not paying under the prerequisite of creative work, other accompanying drawing can also be provided according to the accompanying drawing providing.
Fig. 1 shows the composition structural representation of an embodiment of a kind of circuit module of applying chip multilayer capacitor of the present invention;
Fig. 2 shows the composition structural representation of an embodiment of a kind of circuit module of applying chip multilayer capacitor of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, rather than whole embodiment.Based on the embodiment in the present invention, those of ordinary skills, not making the every other embodiment obtaining under creative work prerequisite, belong to the scope of protection of the invention.
The electronic equipment of the existing built-up circuit that chip multilayer capacitor is installed in use, is easy in built-up circuit produce some interference noises, thereby has affected the normal use of electronic equipment.Inventor finds after deliberation, in the existing circuit module that chip multilayer capacitor is installed, and generally parallel being mounted on this main circuit substrate all of chip multilayer capacitor, each dielectric layer of this chip multilayer capacitor is all parallel with described main circuit substrate.When in the time that circuit module is worked, on this circuit module, load alternating voltage, and after this chip multilayer capacitor has been loaded alternating current, this chip multilayer capacitor can be flexible to its stack direction, be on each dielectric layer of chip multilayer capacitor, to have the active force perpendicular to dielectric layer, make each dielectric layer along the direction up-down vibration perpendicular to dielectric layer.And because each dielectric layer of chip multilayer capacitor is all parallel with main circuit substrate, on each hypothallus on chip multilayer capacitor, also can produce certain active force to main circuit substrate at active force, make main circuit substrate generation deformation, and surface produces vibration, formation noise.Under normal conditions, on main circuit substrate, generally can be provided with tens to a hundreds of chip multilayer capacitor, like this in the time that circuit module is worked, all chip multilayer capacitors all can produce corresponding vibration, and the close direction of vibration frequency is identical, thereby produce resonance with main circuit substrate, the deformation quantity of main circuit substrate is increased, oscillation intensity increases, thereby produces larger noise.
In order to solve the existing noise problem producing in the circuit module of chip multilayer capacitor that is provided with, the embodiment of the invention discloses a kind of circuit module of applying chip multilayer capacitor, this circuit module comprises: the main circuit substrate that at least one electronic component is installed, and at least one chip multilayer capacitor, wherein, chip multilayer capacitor is installed on described main circuit substrate, and the each dielectric layer that forms this chip multilayer capacitor all with the non-parallel setting of described main circuit substrate.The noise that this circuit module in use produced is little, thereby is conducive to the normal use of the electronic equipment of applying this circuit module.
Below in conjunction with accompanying drawing, the circuit module of this application chip multilayer capacitor is described in detail, referring to Fig. 1, show the composition structural representation of an a kind of embodiment of circuit module who applies chip multilayer capacitor of the present invention, the circuit module of the present embodiment comprises: the main circuit substrate 1 that at least one electronic component is installed, wherein, this main circuit substrate can be for being printing board PCB plate.
On this main circuit substrate, be provided with at least one chip multilayer capacitor 2, in this Fig. 1 in order to be conveniently to demonstrate between a chip multilayer capacitor and this main circuit substrate relation is set.Wherein, each chip multilayer capacitor 2 be all mounted on this main circuit substrate and with the non-parallel setting of this main circuit substrate.That is to say, the each dielectric layer that is installed in the present embodiment the chip multilayer capacitor on this main circuit substrate is all not parallel to main circuit substrate, thereby this chip multilayer capacitor and main circuit substrate is presented be greater than 0 angle that is less than 180 degree between becoming.
This chip multilayer capacitor 2 comprises dielectric layer 21 and interior electrode 22 as seen from Figure 1, and between electrode 22, folder is across dielectric layer 21, and each dielectric layer is parallel to each other.
In the present embodiment in the time of the logical work of this circuit module, two ends at this chip multilayer capacitor load alternating voltage, alternating current on this chip multilayer capacitor makes it produce active force to each dielectric layer direction, and because each dielectric layer is not parallel with main circuit substrate, therefore can't directly act on this main circuit substrate perpendicular to the active force on each dielectric layer, reduce the active force to main circuit substrate, thereby the deformation quantity of main circuit substrate is reduced, also reduced the noise that main circuit substrate surface produces, the interference noise producing in the circuit module course of work is reduced.
In actual applications, the type of other electronic components that arrange except chip multilayer capacitor on main circuit substrate can need to be selected according to side circuit, and is assembled on main circuit substrate.The scene difference of application, the type of the electronic component on this circuit module also may have difference, but regardless of application scenarios, the chip multilayer capacitor in this circuit module but all the time with the non-parallel setting of main circuit substrate.
Wherein, in the present embodiment, this chip multilayer capacitor also can be selected as required, in this no limit.
Optionally, in order to adapt to the requirement to electronics miniaturization, large capacity and high reliability, the chip multilayer capacitor being applied on this circuit module can be for having the chip multilayer ceramic capacitor (MLCC, Multi-layer ceramic capacitors) of the plurality of advantages such as volume is little, specific volume is large, the life-span is long.This kind of chip multilayer ceramic capacitor is made up of outside metallic dielectric layer and inner ceramic dielectric layer, certainly between this ceramic dielectric layer, is also provided with metal electrode.
When apply this chip multilayer ceramic capacitor in this circuit module time, by this chip multilayer ceramic capacitor and the non-parallel setting of main circuit substrate, the metallic dielectric layer that makes this chip multilayer ceramic capacitor all with the non-parallel setting of this main circuit substrate.Certainly, angle alleged between this chip multilayer ceramic capacitor and main circuit substrate can be selected as required, and at least the angle between the two is greater than 0 degree and is less than 180 degree.
In order to make the noise that this circuit module produces in the course of the work be reduced to as much as possible minimum value, while chip multilayer capacitor being installed on this circuit module, can make the angle between this chip multilayer capacitor and main circuit substrate approach 90 degree, optionally, can make that this chip multilayer capacitor is vertical with this main circuit substrate to be arranged.
Referring to Fig. 2, show the another kind of set-up mode schematic diagram of this main circuit substrate and chip multilayer capacitor in the circuit module of applying chip multilayer capacitor in the present invention.In the present embodiment, this chip multilayer capacitor 2 is mounted on the main circuit substrate 1 of this circuit module, and all arrange vertical with this main circuit substrate of each dielectric layer of this chip multilayer capacitor.Dielectric layer 21 between any two interior electrodes 22 of chip multilayer capacitor is all perpendicular to the place plane of this main circuit substrate as seen from Figure 2.
In the present embodiment, this chip multilayer capacitor is mounted on this main circuit substrate, and all arrange vertical with main circuit substrate of each dielectric layer of this chip multilayer capacitor.When in this circuit module work.Apply with this chip multilayer capacitor on alternating voltage direction as shown in the thick direction of arrow in figure (being the alternating voltage in horizontal direction), each dielectric layer of this chip multilayer capacitor is under the effect of alternating current, the active force perpendicular to each dielectric layer producing is parallel to this main circuit substrate, the vibration in the horizontal direction of each dielectric layer is less to the active force of main circuit substrate, thereby reduce the resonance that the deformation of main circuit substrate and dielectric layer and main circuit substrate produce, thereby reduced the noise producing in the circuit module course of work.
In the present embodiment, this chip multilayer capacitor can be also chip multilayer ceramic capacitor MLCC, when this chip multilayer ceramic capacitor is set in circuit module, this chip multilayer ceramic capacitor can be mounted on the main circuit substrate of this circuit module, and by metallic dielectric layer in this multilayer ceramic capacitor and all arrange vertical with this main circuit substrate of ceramic dielectric layer, make this metallic dielectric layer all vertical with this main circuit substrate with ceramic dielectric layer.
It should be noted that, the circuit module of application chip multilayer capacitor of the present invention can be applied to the electronic equipment that chip multilayer capacitor need to be set arbitrarily.Corresponding, the present invention also provides a kind of electronic equipment, and this electronic equipment is built-in with as Fig. 1 or the circuit module of the application chip multilayer capacitor of embodiment as shown in Figure 2.It should be noted that, in this circuit arrangement, the quantity of the circuit module of set above-described application chip multilayer capacitor can be set as required.
In actual applications, the electronic equipment of the circuit module of built-in this application chip multilayer capacitor of the present invention can be multiple for comprising, optional, this electronic equipment can be mobile terminal, as mobile phone, pad etc.In the circuit module of mobile terminal, generally can be built-in with a large amount of chip multilayer capacitors, and can obviously reduce in the mobile terminal course of work by the circuit module that application chip multilayer capacitor of the present invention is set in mobile terminal, the noise that circuit module produces, thus the performance of mobile terminal device improved.The mobile phone of circuit module that is provided with this application chip multilayer capacitor of the present invention as utilized carry out by time, because the noise that in mobile phone, circuit module inside produces is less, can obviously improve user's call definition.
In this specification, each embodiment adopts the mode of going forward one by one to describe, and what each embodiment stressed is and the difference of other embodiment, between each embodiment identical similar part mutually referring to.
To the above-mentioned explanation of the disclosed embodiments, make professional and technical personnel in the field can realize or use the present invention.To be apparent for those skilled in the art to the multiple modification of these embodiment, General Principle as defined herein can, in the situation that not departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (6)
1. apply the circuit module of chip multilayer capacitor for one kind, this circuit module comprises: the main circuit substrate that at least one electronic component is installed, and at least one chip multilayer capacitor, it is characterized in that, described chip multilayer capacitor is installed on described main circuit substrate, and the each dielectric layer that forms described chip multilayer capacitor all with the non-parallel setting of described main circuit substrate.
2. circuit module according to claim 1, is characterized in that, described chip multilayer capacitor is chip multilayer ceramic capacitor.
3. master die according to claim 2, is characterized in that, described multilayer ceramic capacitor at least comprises ceramic dielectric layer and metallic dielectric layer, and described ceramic dielectric layer and metal level all with the non-parallel setting of described main circuit substrate.
4. according to the circuit module described in claims 1 to 3 any one, it is characterized in that, each dielectric layer of the described chip multilayer capacitor of described composition is all vertical with described main circuit substrate.
5. an electronic equipment, is characterized in that, described electronic equipment is built-in with the circuit module of the application chip multilayer capacitor described in claim 1 to 4 any one.
6. electronic equipment according to claim 5, is characterized in that, described electronic equipment is mobile terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210424405.9A CN103796426A (en) | 2012-10-30 | 2012-10-30 | Circuit module applying multi-layer chip capacitor and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210424405.9A CN103796426A (en) | 2012-10-30 | 2012-10-30 | Circuit module applying multi-layer chip capacitor and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103796426A true CN103796426A (en) | 2014-05-14 |
Family
ID=50671556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210424405.9A Pending CN103796426A (en) | 2012-10-30 | 2012-10-30 | Circuit module applying multi-layer chip capacitor and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103796426A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06251981A (en) * | 1993-02-26 | 1994-09-09 | Mitsubishi Materials Corp | Multilayer chip capacitor provided with discharge |
| JPH09260196A (en) * | 1996-03-26 | 1997-10-03 | Taiyo Yuden Co Ltd | Multilayer capacitor |
| CN1551260A (en) * | 2003-05-06 | 2004-12-01 | 马维尔国际贸易有限公司 | Ultra low inductance multi layer ceramic capacitor |
| JP2005252141A (en) * | 2004-03-08 | 2005-09-15 | Murata Mfg Co Ltd | Electronic component, and manufacturing method thereof |
| CN1832070A (en) * | 2005-03-07 | 2006-09-13 | 三星电机株式会社 | Embedded multilayer chip capacitor and printed circuit board having the same |
| US20090034155A1 (en) * | 2007-05-24 | 2009-02-05 | Daniel Devoe | Stacked multilayer capacitor |
| WO2011005378A1 (en) * | 2009-07-06 | 2011-01-13 | Illinois Tool Works Inc. | Surface mount polymer capacitor with thermal protective external electrodes |
-
2012
- 2012-10-30 CN CN201210424405.9A patent/CN103796426A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06251981A (en) * | 1993-02-26 | 1994-09-09 | Mitsubishi Materials Corp | Multilayer chip capacitor provided with discharge |
| JPH09260196A (en) * | 1996-03-26 | 1997-10-03 | Taiyo Yuden Co Ltd | Multilayer capacitor |
| CN1551260A (en) * | 2003-05-06 | 2004-12-01 | 马维尔国际贸易有限公司 | Ultra low inductance multi layer ceramic capacitor |
| JP2005252141A (en) * | 2004-03-08 | 2005-09-15 | Murata Mfg Co Ltd | Electronic component, and manufacturing method thereof |
| CN1832070A (en) * | 2005-03-07 | 2006-09-13 | 三星电机株式会社 | Embedded multilayer chip capacitor and printed circuit board having the same |
| US20090034155A1 (en) * | 2007-05-24 | 2009-02-05 | Daniel Devoe | Stacked multilayer capacitor |
| WO2011005378A1 (en) * | 2009-07-06 | 2011-01-13 | Illinois Tool Works Inc. | Surface mount polymer capacitor with thermal protective external electrodes |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9460854B2 (en) | Multilayer ceramic electronic component with interposer substrate having double-layered resin/plating terminals | |
| JP5804577B2 (en) | Multilayer ceramic capacitor, its mounting substrate and manufacturing method | |
| US8681475B2 (en) | Mounting structure of circuit board having multi-layered ceramic capacitor thereon | |
| US20150014038A1 (en) | Multilayer ceramic capacitor and mounting circuit board therefor | |
| JP2015204451A (en) | Multilayer ceramic capacitor and method of manufacturing the same and its mounting board | |
| JP2015095647A (en) | Multilayer ceramic electronic component, and mounting substrate of multilayer ceramic electronic component | |
| US9148955B2 (en) | Mounting structure of circuit board having multi-layered ceramic capacitor thereon | |
| US9648746B2 (en) | Composite electronic component and board having the same | |
| JP2015128084A (en) | Electronic component | |
| US10192685B2 (en) | Multilayer capacitor and board having the same mounted thereon | |
| US10192684B2 (en) | Multilayer capacitor and board having the same mounted thereon | |
| US20150014035A1 (en) | Multilayer ceramic capacitor and mounting circuit board therefor | |
| JP2014187058A (en) | Multilayer ceramic capacitor, mounting board for multilayer ceramic capacitor, and manufacturing method of multilayer ceramic capacitor | |
| CN104282434A (en) | Multilayer ceramic capacitor and mounting board therefor | |
| KR102122931B1 (en) | Multi-layered ceramic capacitor and board having the same mounted thereon | |
| KR20180073358A (en) | Multi-layered capacitor and board having the same mounted thereon | |
| CN104810152A (en) | Multi-layer ceramic electronic assembly and board provided thereon with multi-layer ceramic electronic assembly | |
| JP6806354B2 (en) | Capacitor components and mounting boards equipped with them | |
| US20160120027A1 (en) | Multilayer ceramic electronic component and board having the same | |
| KR101499719B1 (en) | Composite electronic component and board for mounting the same | |
| JP2015019045A (en) | Array type multilayer ceramic electronic component and mounting substrate thereof | |
| US20210358692A1 (en) | Ceramic electronic component | |
| US9390859B2 (en) | Multilayer ceramic capacitor and board with the same mounted thereon | |
| KR102500116B1 (en) | Composite electronic component | |
| JP2015015445A (en) | Multilayer ceramic capacitor, and mounting circuit board and manufacturing method of the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140514 |