CN103786911A - Wafer braiding device and method - Google Patents

Wafer braiding device and method Download PDF

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Publication number
CN103786911A
CN103786911A CN201210423536.5A CN201210423536A CN103786911A CN 103786911 A CN103786911 A CN 103786911A CN 201210423536 A CN201210423536 A CN 201210423536A CN 103786911 A CN103786911 A CN 103786911A
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wafer
hole
parts
belt
carrier band
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CN201210423536.5A
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CN103786911B (en
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不公告发明人
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XIAMEN HONGHAN ELECTRONIC TECHNOLOGY Co Ltd
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XIAMEN HONGHAN ELECTRONIC TECHNOLOGY Co Ltd
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Abstract

A wafer braiding device is used for selecting qualified wafers from a wafer pile to be braided through a coverage tape and a carrier tape. The device comprises a sorting unit and a braiding unit. The sorting unit is used for sorting out qualified wafers and transferring the qualified wafers to the braiding unit. The braiding unit is connected with the sorting unit and is used for braiding the qualified wafers. The invention further provides a wafer braiding method. By means of the wafer braiding device and method, wafer sorting and braiding can be coordinated effectively, the qualified wafers can be sorted out accurately, the carrier tape position can be determined and adjusted rapidly to hold the qualified wafers, and accordingly, braiding packaging is performed timely, the braiding speed is fastened, and the work efficiency is improved.

Description

Wafer belt-braiding device and wafer braid method
Technical field
The present invention relates to a kind of wafer processing unit (plant) and job operation, particularly a kind of automation integrated device and the using method thereof in conjunction with Wafer Sort and braid function.
Background technology
Wafer is the base stock of manufacturing integration circuit.Manufacturing wafer operation mainly comprises: first by element silicon purifying (99.999%) in addition, then these pure silicons are grown into silicon crystal bar, pass through afterwards photomechnical reproduction, polishing, section supervisor, polysilicon is melted to pull-out silicon single crystal rod, finally cut into very thin one by one wafer.
The preliminary wafer stack up having cut, be not wherein each wafer be certified products.Be necessary wherein qualified wafer to pick out, and a large amount of qualified wafer of picking out is arranged to encapsulation, the final wafer parcel that generates convenient transportation storage.Wafer current, especially naked crystalline substance, relevant select and encapsulation technology still immature, cannot effectively carry out associative operation.
Summary of the invention
Based on this, be necessary to provide a kind of high efficiency the especially naked crystalline substance of wafer to be carried out to the wafer belt-braiding device of sorting and braid operation.
Also be necessary to provide a kind of wafer braid method.
A kind of wafer belt-braiding device, for picking out qualified wafer and with cover strip and carrier band, it carried out to braid operation at wafer heap.Described wafer belt-braiding device comprises screening installation, braid equipment and controller.Described screening installation is used for picking out qualified wafer.Described controller is electrically connected respectively described screening installation and described braid equipment, transfers described qualified wafer to the braid equipment that is positioned at vacant state for controlling screening installation.Described braid equipment is for carrying out braid operation to described qualified wafer.
Disclosed wafer belt-braiding device and using method thereof can effective coordination Wafer Sorts and braid operation, accurately select qualified wafer, and judgement is adjusted carrier band position to place described qualified wafer rapidly, thereby carry out in time braid encapsulation, accelerate braid speed, work efficiency is provided.
[accompanying drawing explanation]
Fig. 1 is in the first embodiment of the present invention, the schematic perspective view one of wafer belt-braiding device.
Fig. 2 is the A place enlarged diagram in Fig. 1.
Fig. 3 is in the first embodiment of the present invention, the schematic perspective view two of wafer belt-braiding device.
Fig. 4 is the B place enlarged diagram in Fig. 3.
Fig. 5 is the C place enlarged diagram in Fig. 3.
Fig. 6 is in the first embodiment of the present invention, the principle of work block diagram of wafer belt-braiding device.
Fig. 7 is in the second embodiment of the present invention, the schematic perspective view of wafer belt-braiding device.
Fig. 8 is in the first embodiment of the present invention, the workflow diagram of wafer belt-braiding device.
Description of reference numerals:
Wafer belt-braiding device 100、100a Screening installation 10、10a
Push up brilliant parts 11、11a The first plummer 111、111a
Moving meter 112 First monitors parts 12
Charge coupling camera 121、211 Display unit 13
Input block 14 Keyboard 141
Mouse 142 Transfer member 15
Hold-down arm 151 Vacuum slot 152
Braid equipment 20、20a Second monitors parts 21
Carrier band parts 22、22a Carrier band dish 221
The second plummer 222 Pressing end 2221
The second suspended axle 223 Cover strip parts 23、23a
Cover strip dish 231 Delivery wheel 232
Pillar 233 The first suspended axle 234
Pressing parts 24 Temperature booster 241
Pressure head 242 Coiling parts 25、25a
Pedestal
30 Controller 40
Processing unit 41 Memory cell 42
Charging tray 901、901a Wafer heap 902
Surveying wafer 903 Qualified wafer 904
Cover strip 905、905a Carrier band 906、906a
Carry hole 907 Knock hole 908
Packaging belt 909、909a Moulding load plate 910
The first control signal S1 The second control signal S2
The 3rd control signal S3 The 4th control signal S4
[specific embodiment]
In conjunction with shown in Fig. 1 to Fig. 5, the wafer belt-braiding device 100 that preferred embodiment of the present invention discloses is piled 902 qualified wafer 904 for picking out wafer on charging tray 901, and qualified wafer 904 is carried out to braid operation to generate moulding load plate 910.Wafer belt-braiding device 100 comprises screening installation 10, braid equipment 20, pedestal 30 and controller 40.Pedestal 30 is accommodated controller 40, and carries screening installation 10 and braid equipment 20.Controller 40 is electrically connected with screening installation 10 and braid equipment 20, to control the running of screening installation 10 and braid equipment 20.When work, the every characteristic parameter at survey wafer 903 in screening installation 10 test wafer heaps 902, as length and width size, wavelength, luminous intensity, lighting angle and operating voltage etc., from wherein picking out qualified wafer 904.Controller 40 judges braid equipment 20 current states and adjusts current state is vacant state, then controls screening installation 10 and transfers qualified wafer 904 to the braid equipment 20 that is positioned at vacant state.Braid equipment 20 is connected with screening installation 10, with carrier band 906 and cover strip 905, qualified wafer 904 is carried out to braid operation.Wherein braid equipment 20 has two states, and one is glove state, and it two is vacant state.Wherein glove state refers to that the current location of carrier band 906 on braid equipment 20 placed wafer, and vacant state refers to that the current location of carrier band 906 on braid equipment 20 is rooms, does not place wafer.In the present embodiment, wafer refers to naked crystalline substance.
Screening installation 10 comprises the brilliant parts 11 in top, the first supervision parts 12, display unit 13, input block 14 and transfer member 15.Wherein, push up brilliant parts 11, first and monitor that parts 12, display unit 13, input block 14 and transfer member 15 are pedestal 30 and support.Please refer to Fig. 6, controller 40 is electrically connected each parts in screening installation 10, to control the running of screening installation 10 each parts.
Push up brilliant parts 11 for carrying wafer heap 902.The first supervision parts 12 are for monitoring the wafer heap 902 being positioned on the brilliant parts 11 in top, with the every characteristic parameter in survey wafer 903 reality in test wafer heap 902, abbreviation wafer actual parameter.Display unit 13 is Liquid Crystal Display (LCD), and it is for Presentation Function Option Box, in information such as survey wafer 903 images.Input block 14 is for inputting wafer canonical parameter or other operating orders of qualified wafer to controller 40.Controller 40 receives and stores the wafer canonical parameter that input block 14 is inputted, and obtains and analyze wafer actual parameter, thereby produces the first control signal S1.Transfer member 15 receives the first control signal S1, captures qualified wafer 904.
Push up brilliant parts 11 and comprise the first plummer 111 and moving meter 112.The first plummer 111 is arranged on moving meter 112.On the first plummer 111, charging tray 901 is removably set.Moving meter 112 is arranged on described pedestal 30, can vertically move up and down and can move along orthogonal two horizontal directions.First monitors that parts 12 comprise that charge coupling camera 121 is to take at the image of surveying wafer 903, and is corresponding wafer actual parameter by video conversion.Input block 14 comprises keyboard 141 and mouse 142, to input canonical parameter and other instructions.Controller 40 comprises processing unit 41 and memory cell 42.Memory cell 42 is for storage standards parameter.Processing unit 41 is for receiving wafer actual parameter, transfer the wafer canonical parameter that is positioned at memory cell 42, and contrasts wafer actual parameter and wafer canonical parameter, to judge whether wafer actual parameter meets the requirements.If wafer actual parameter meets the requirements, processing unit 41 produces the first control signal S1; If wafer actual parameter is undesirable, processing unit 41 produces nonconformity notification signal.The Liquid Crystal Display of described display unit 13 is presented at according to nonconformity notification signal the inferior-quality information of wafer 903 of surveying.Transfer member 15 comprises hold-down arm 151 and vacuum slot 152.Controller 40 drives vacuum slot 152 to draw qualified wafer 904 with the first control signal S1.
Braid equipment 20 comprises the second supervision parts 21, carrier band parts 22, cover strip parts 23, pressing parts 24 and coiling parts 25.Second monitors that parts 21, carrier band parts 22, cover strip parts 23, pressing parts 24 and coiling parts 25 are connected with controller 40 respectively.Carrier band parts 22 are for depositing carrier band 906.Carrier band 906 is 0.3mm ground paper band, and its surface is provided with the parallel through hole of two row, is respectively and carries hole 907 and knock hole 908.Carry the qualified wafer 904 that hole 907 captures for placing transfer member 16.Knock hole 908, for regulating the position of carrier band 906, carries in hole 907 to guarantee that qualified wafer 904 can accurately be positioned over.Cover strip parts 23 are arranged at the top of carrier band parts 22, on the second plummer 222, and are supported by carrier band parts 22.Pressing parts 24 and coiling parts 25 be arranged at one end of carrier band parts 22 and pressing parts 24 carrier band parts 22 with coil between parts 25.Coil parts 25 for drawing packaging belt 909 away from carrier band parts 22, and packaging belt 909 is coiled to operation to generate moulding load plate 910.Controller 40 is also for driving the second supervision parts 21, carrier band parts 22, cover strip parts 23, pressing parts 24 and coiling parts 25.
In the time that braid equipment 20 is positioned at glove state, wafer has been placed in carrying in hole 907 of the current location of carrier band 906; In the time that braid equipment 20 is positioned at vacant state, wafer is not placed in the hole 907 of carrying of the current location of carrier band 906.Second monitors that parts 21 comprise the image that carry hole 907 of charge coupling camera 211 with the current location of shooting carrier band 906, and is the corresponding hole actual parameter that carries by video conversion.The memory cell 42 of controller 40 also stores year hole canonical parameter of carrying hole 907 of not placing wafer; Processing unit 41 receives and carries hole actual parameter, transfers year hole canonical parameter that is positioned at memory cell 42, and contrasts year hole actual parameter and carry hole canonical parameter, to judge whether a year hole actual parameter meets the requirements.If it is undesirable to carry hole actual parameter, processing unit 41 produces the second control signal S2; Meet the requirements if carry hole actual parameter, processing unit 42 produces the 3rd control signal S3.Controller 40 is controlled braid equipment 20 with the second control signal S2 and is moved carrier band 906, thus change carrier band 906 current locations carry hole 907, to guarantee that the hole 907 of carrying that is positioned at current location do not place wafer.Controller 40 drives the hold-down arm 151 of screening installation 10 to rotate with the 3rd control signal S3, making to draw has the vacuum slot 152 of qualified wafer 904 to move to the position of carrying hole 907 corresponding to carrier band 906 current locations, and then makes vacuum slot 1652 discharge qualified wafer 904 and qualified wafer 904 is positioned over to carrying in hole 907 of current location.
Cover strip parts 23 also comprise pillar 233 and the first suspended axle 234.Pillar 233 is vertically arranged on carrier band parts 22.Cover strip dish 231 is fixedly arranged on described the first suspended axle 234.The first suspended axle 234 is extended and forms in the horizontal direction by the free end of pillar 233.Cover strip 905 is coiled on cover strip dish 231.Cover strip 905 is for having the film of stickiness after heating.In the middle of cover strip dish 231, be provided with through hole, and be set on the first suspended axle 234 via through hole, can rotate around the first suspended axle 234.Cover strip parts 23 also comprise three delivery wheels 232, and delivery wheel 232 is located at respectively on the cylinder of pillar 233.Cover strip 905 is by discharging on described cover strip dish 231, and drawn to pressing parts 24 by delivery wheel 232.Carrier band parts 22 also comprise the second suspended axle 223.The second suspended axle 223 is connected with the second plummer 222.Carrier band 906 is coiled on carrier band dish 221.In the middle of carrier band dish 221, be provided with through hole, and be set on the second suspended axle 223 via through hole, can rotate around the second suspended axle 223.Be laid on the second plummer 222 by the carrier band 906 discharging on carrier band dish 221, and draw to pressing parts 24.The second plummer 222 has pressing end 2221, and its pressing end 2221 is provided with pressing parts 24.Pressing parts 24 comprise temperature booster 241 and pressure head 242.Temperature booster 241 is arranged on the pressing end 2221 of the second plummer 222.Pressure head 242 tilts to extend downward by temperature booster 241 position that is close to the second plummer 222.The temperature setting of temperature booster 241 can be adjusted according to actual conditions, and in the present embodiment, the heating-up temperature of temperature booster 241 is room temperature to 170 ℃.
In the time of practical operation, the cover strip 905 discharging is subject to traction through temperature booster 241, via being sent to pressure head 242 belows after 241 heating; Simultaneously, the carrier band 906 discharging is subject to traction to be sent to and to be positioned at the pressure head 242 of its pressing end 2221 and the below of cover strip 905 by second plummer 222 one end, and carries the qualified wafer 904 of interior its absorption of placement in hole 907 by vacuum slot 162 at carrier band 906 in transport process.The pressure head 242 of pressing parts 24 is pressed together on the cover strip 905 after its below heating on the carrier band 906 that is provided with qualified wafer 904, thereby forms packaging belt 907.Described packaging belt 907 is subject to traction to be sent to coiling parts 25.
The 4th control signal S4 that coiling parts 25 can provide according to controller 40 coils operation to packaging belt 907.In the present embodiment, the 4th control signal S4 comprises the information such as braid speed, and braid speed is 1r/s.In other embodiments, the 4th control signal S4 can set other braid speed according to different situations.
As shown in Figure 7, its wafer belt-braiding device 100a that is another preferred embodiment of the present invention.The difference of wafer belt-braiding device 100a and last embodiment wafer belt-braiding device 100 is: wafer belt-braiding device 100a comprises screening installation 10a and braid equipment 20a; Wherein the brilliant parts 11a in the top of screening installation 10a comprises three the first plummer 111a, to hold three charging tray 901a simultaneously; Wherein braid equipment 20a comprises that two carrier band parts 22a are to hold two carrier band 906a, two cover strip parts 23a to hold two cover strip 905a and two coiling parts 25a to carry out the coiling operation of two packaging belt 909a simultaneously.Real work, in the time that all qualified wafer on a charging tray 901a in three charging tray 901a all completes point selection operation, push up brilliant parts 11a will rotation in order next charging tray 901a is adjusted to the position of point selection operation, and the charging tray 901a that completes point selection operation will be positioned at idle condition to change the operation of wafer.In addition,, in the time that wafer belt-braiding device 100a places the operation of qualified wafer one of in to two carrier band 906a, can carry out the state confirmation operation of carrying hole of the current location of another carrier band simultaneously.Because, the present embodiment adopts the first plummer of greater number and the carrier band parts of greater number, cover strip parts and coiling parts, therefore can speed up processing, thus improve work efficiency.
As shown in Figure 8, it is the using method of aforementioned wafer belt-braiding device 100.Wherein, this using method comprises following concrete steps.
Step 802, wafer belt-braiding device 100 arranges wafer canonical parameter and carries hole canonical parameter.
Step 804, wafer belt-braiding device 100 is taken at the image of surveying wafer 903, changes image into wafer actual parameter.
Step 806, wafer belt-braiding device 100 contrasts wafer actual parameter and wafer canonical parameter, to judge whether wafer actual parameter meets the requirements.If wafer actual parameter is undesirable, enter step 808; If wafer actual parameter meets the requirements, enter step 812.In the present embodiment, wafer actual parameter meets the requirements and refers to that wafer actual parameter equates with wafer canonical parameter.In other embodiments, wafer actual parameter meet the requirements can refer to wafer actual parameter and wafer canonical parameter difference in an acceptable number range, number range herein can be the aviation value of many experiments data, can be also empirical value in the industry.
Step 808, wafer belt-braiding device 100 is presented at the inferior-quality information of wafer 903 of surveying.
Step 810, wafer belt-braiding device 100 is changed and is being surveyed wafer 903, and returns to step 804.
Step 812, wafer belt-braiding device 100 produces the first control signal S1.
Step 814, wafer belt-braiding device 100 drives vacuum slot 152 to draw qualified wafer 904 with the first control signal S1.So far step, wafer belt-braiding device 100 sub-elects qualified wafer 904 from wafer heap.
Step 816, wafer belt-braiding device 100 is taken the image that carries hole 907 of carrier band current location, and conversion image is for carrying hole actual parameter.
Step 818,100 contrasts of wafer belt-braiding device are carried hole actual parameter and are carried hole canonical parameter, to judge whether carry hole actual parameter meets the requirements.If it is undesirable to carry hole actual parameter, enter step 820; Meet the requirements if carry hole actual parameter, enter step 824.In the present embodiment, carrying hole actual parameter meets the requirements and refers to carry hole actual parameter and equate with a year hole canonical parameter.In other embodiments, year hole actual parameter meets the requirements and can refer to that the difference of carrying hole actual parameter and year hole canonical parameter is in an acceptable number range, and number range herein can be the aviation value of many experiments data, can be also empirical value in the industry.
Step 820, wafer belt-braiding device 100 produces the second control signal S2.
Step 822, wafer belt-braiding device 100 is controlled braid equipment 20 with the second control signal S2 and is moved carrier band 906, thereby changes year hole 907 of carrier band 906 current locations, and returns to step 816.
Step 824, wafer belt-braiding device 100 produces the 3rd control signal S3.
Step 826, wafer belt-braiding device 100 drives the hold-down arm 151 of screening installation 10 to rotate with the 3rd control signal S3, making to draw has the vacuum slot 152 of qualified wafer 904 to move to the position of carrying hole 907 corresponding to carrier band 906 current locations, and then makes vacuum slot 152 discharge qualified wafer 904 and qualified wafer 904 is positioned over to carrying in hole 907 of current location.
Step 828, wafer belt-braiding device 100 is pressed together on cover strip 905 on the carrier band 906 that is provided with qualified wafer 904, to form packaging belt 909.
Step 830, wafer belt-braiding device 100 coils operation to packaging belt 909.
The above embodiment has only expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.

Claims (24)

1. a wafer belt-braiding device, for picking out qualified wafer and with cover strip and carrier band, it carried out to braid operation at wafer heap, it is characterized in that, described wafer belt-braiding device comprises screening installation, braid equipment and controller, described screening installation is used for picking out qualified wafer, described controller is electrically connected respectively described screening installation and described braid equipment, transfer described qualified wafer to the braid equipment that is positioned at vacant state for controlling screening installation, described braid equipment is for carrying out braid operation to described qualified wafer.
2. wafer belt-braiding device according to claim 1, is characterized in that, described controller is also for judging described braid equipment current state, and in the time that described braid equipment current state is glove state, to adjust described braid equipment be vacant state.
3. wafer belt-braiding device according to claim 1, is characterized in that, described wafer belt-braiding device also comprises that pedestal is to accommodate described controller and to carry described screening installation and described braid equipment.
4. wafer belt-braiding device according to claim 3, is characterized in that, described screening installation comprises the brilliant parts in top, and the brilliant parts in described top are arranged on pedestal, for carrying wafer heap.
5. wafer belt-braiding device according to claim 4, is characterized in that, the quantity of the brilliant parts in described top is at least one.
6. wafer belt-braiding device according to claim 4, it is characterized in that, described screening installation comprises the first supervision parts, and described first monitors that parts are arranged on described pedestal, for monitoring that the wafer heap being positioned on the brilliant parts in top is with the test wafer heap one wafer actual parameter at survey wafer.
7. wafer belt-braiding device according to claim 6, is characterized in that, described screening installation comprises display unit, and described display unit is for Presentation Function Option Box and surveying wafer state.
8. wafer belt-braiding device according to claim 7, is characterized in that, described screening installation comprises input block, and described input block is for inputting the wafer canonical parameter of qualified wafer.
9. wafer belt-braiding device according to claim 8, it is characterized in that, described controller is also for receiving the wafer canonical parameter of qualified wafer of described input block, and store described wafer canonical parameter, obtain and according to described wafer canonical parameter compare of analysis wafer actual parameter, produce the first control signal.
10. wafer belt-braiding device according to claim 9, is characterized in that, described screening installation comprises transfer member, and described transfer member receives the first control signal, captures described qualified wafer.
11. wafer belt-braiding devices according to claim 10, it is characterized in that, described braid equipment comprises cover strip parts, carrier band parts, coiling parts and pressing parts, wherein said cover strip parts are used for depositing described cover strip, described carrier band parts are used for depositing described carrier band, described pressing parts are for described cover strip being pressed together on described carrier band to generate packaging belt, and described coiling parts are for coil operation with generation moulding load plate to described packaging belt.
12. wafer belt-braiding devices according to claim 11, is characterized in that, the quantity of described cover strip parts, described carrier band parts, described coiling parts and described pressing parts is respectively at least one.
13. wafer belt-braiding devices according to claim 12, is characterized in that, described controller is electrically connected respectively described cover strip parts, described carrier band parts, described pressing parts and described coiling parts.
14. wafer belt-braiding devices according to claim 13, it is characterized in that, described carrier band has the hole of carrying to place described qualified wafer, described carrier band parts also comprise that the second supervision parts are to take the image that carries hole of described carrier band current location, and change image for carrying hole actual parameter, described controller stores year hole canonical parameter of carrying hole of not placing wafer, to carry hole actual parameter described in the compare of analysis of described year hole canonical parameter, and do not meet described second control signal that produces while carrying hole canonical parameter at described year hole actual parameter, in the time carrying hole canonical parameter described in described year hole actual parameter meets, produce the 3rd control signal.
15. wafer belt-braiding devices according to claim 14, is characterized in that, described controller is according to carrier band described in described the second control signal control braid equipment moving, thus year hole of change carrier band current location.
16. wafer belt-braiding devices according to claim 14, it is characterized in that, described controller drives the described transfer member of described screening installation to move to the position corresponding to described year hole of described carrier band current location according to described the 3rd control signal, and then makes described transfer member discharge described qualified wafer and described qualified wafer is positioned over to described carrying in hole.
17. 1 kinds of wafer braid methods, is characterized in that, described wafer braid method comprises:
Step 1, sub-elects qualified wafer from wafer heap;
Step 2, confirms that wafer is not placed in the hole of carrying of carrier band current location;
Step 3, transfers the position of described qualified wafer to described year hole of corresponding and described carrier band;
Step 4, is positioned over described carrying in hole by described qualified wafer.
18. wafer braid methods according to claim 17, is characterized in that, described step 2 further comprises:
Step 5, judges whether described year hole of described carrier band current location places wafer, if do not place wafer, enters step 3, if place wafer, enters step 6;
Step 6, moves described carrier band to change the hole of carrying of described carrier band current location, and returns to step 5.
19. wafer braid methods according to claim 18, is characterized in that, described step 1 further comprises:
Step 7, arranges wafer canonical parameter;
Step 8, takes at the image of surveying wafer, changes described image into wafer actual parameter;
Step 9, contrasts described wafer actual parameter and described wafer canonical parameter, to judge whether described wafer actual parameter meets the requirements; If wafer actual parameter is undesirable, enter step 10; If wafer actual parameter meets the requirements, enter step 12;
Step 10, shows described in the inferior-quality information of survey wafer;
Step 11, changes and is surveying wafer, and return to step 8;
Step 12, produces the first control signal;
Step 13, is subject to described the first control signal to drive to draw qualified wafer.
20. wafer braid methods according to claim 19, is characterized in that, described step 5 further comprises:
Step 14, arranges and carries hole canonical parameter;
Step 15, takes year hole image of carrier band current location, and changes image for carrying a hole actual parameter;
Step 16, contrast is carried hole actual parameter and is carried hole canonical parameter, to judge whether carry hole actual parameter meets the requirements; If it is undesirable to carry hole actual parameter, enter step 6; Meet the requirements if carry hole actual parameter, enter step 3.
21. wafer braid methods according to claim 19, is characterized in that, wafer actual parameter meets the requirements and refers to that wafer actual parameter equates with wafer canonical parameter.
22. wafer braid methods according to claim 19, is characterized in that, wafer actual parameter meet the requirements can refer to wafer actual parameter and wafer canonical parameter difference in an acceptable number range.
23. wafer braid methods according to claim 20, is characterized in that, a year hole actual parameter meets the requirements and refers to that year hole actual parameter equates with a year hole canonical parameter.
24. wafer braid methods according to claim 20, is characterized in that, year hole actual parameter meets the requirements and can refer to that the difference of carrying hole actual parameter and year hole canonical parameter is in an acceptable number range.
CN201210423536.5A 2012-10-30 2012-10-30 Wafer belt-braiding device and wafer braid method Active CN103786911B (en)

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CN115642098A (en) * 2022-09-14 2023-01-24 深圳源明杰科技股份有限公司 Chip mounting and positioning method, device and equipment and readable storage medium

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CN115642098B (en) * 2022-09-14 2023-12-26 深圳源明杰科技股份有限公司 Chip mounting and positioning method, device, equipment and readable storage medium

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