CN103756588B - For the Pressuresensitive Tape of microelectronic device - Google Patents

For the Pressuresensitive Tape of microelectronic device Download PDF

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Publication number
CN103756588B
CN103756588B CN201410036328.9A CN201410036328A CN103756588B CN 103756588 B CN103756588 B CN 103756588B CN 201410036328 A CN201410036328 A CN 201410036328A CN 103756588 B CN103756588 B CN 103756588B
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Prior art keywords
parts
kapton
graphite
degree
burned
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CN201410036328.9A
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CN103756588A (en
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金闯
杨晓明
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Taicang Sidike New Material Science and Technology Co Ltd
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Suzhou Sidike New Material Science and Technology Co Ltd
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Priority to CN201410036328.9A priority Critical patent/CN103756588B/en
Priority to CN201610116969.4A priority patent/CN106118518A/en
Priority to CN201610116966.0A priority patent/CN106433500A/en
Priority to CN201610116970.7A priority patent/CN106118519A/en
Priority to CN201610119322.7A priority patent/CN106393842B/en
Priority to CN201610116967.5A priority patent/CN106118517B/en
Priority to CN201610119265.2A priority patent/CN106118520B/en
Priority to CN201610116960.3A priority patent/CN106118516B/en
Application filed by Suzhou Sidike New Material Science and Technology Co Ltd filed Critical Suzhou Sidike New Material Science and Technology Co Ltd
Priority to CN201610119321.2A priority patent/CN106118521A/en
Publication of CN103756588A publication Critical patent/CN103756588A/en
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    • C04B35/522—Graphite
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    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
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    • B32B27/00—Layered products comprising a layer of synthetic resin
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
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Abstract

The present invention discloses a kind of Pressuresensitive Tape for microelectronic device, fits in heat generating components surface, and graphite linings is obtained by following processing method: the upper and lower surface of Kapton all applies graphite modified dose of one deck and obtains the Kapton after processing; Graphite modified dose is made up of the component of following weight part: pyromellitic acid anhydride 25 ~ 30 parts, benzophenone tetracarboxylic dianhydride 10 ~ 15 parts, diaminodiphenylmethane 20 ~ 28 parts, dimethyl formamide 20 ~ 25 parts, N-Methyl pyrrolidone 8 ~ 10 parts, ethylene glycol 1.5 ~ 2.5 parts, polydimethylsiloxane 2 ~ 3 parts; Kapton after process is warming up to 800 DEG C, after insulation, is warming up to 1200 DEG C thus the carbonized film of acquisition pre-burned; Rolling press is adopted to roll the carbonized film of the pre-burned of described step 4.While present invention achieves the homogeneity of adhesive tape heat conductivility, improve heat dispersion stability, the reliability of product, greatly reduce the cost of product.

Description

For the Pressuresensitive Tape of microelectronic device
Technical field
The present invention relates to a kind of Pressuresensitive Tape for microelectronic device, belong to heat radiation Filming Technology field.
Background technology
Along with the development of modern microelectronic technology high-speed, electronics (as notebook computer, mobile phone, panel computer etc.) becomes ultra-thin, light day by day, this structure makes electronic equipment internal power density significantly improve, and the heat produced in operation is not easily discharged, is easy to run-up and forms high temperature.On the other hand, high temperature can reduce the performance of electronics, reliability and work-ing life.Therefore, Current electronic industry proposes more and more higher requirement for the heat sink material as heat control system core component, is passed by heat rapidly in the urgent need to a kind of high-efficiency heat conduction, light material, ensures that electronics normally runs.
In prior art, Kapton is used for flexible PCB greatly, polyimide film sintered acquisition graphite heat radiation fin is adopted although have, thus be covered on thermal source, but be limited to the very different of the product quality and performances of Kapton, have influence on the performance of the two-sided pad pasting heat dispersion of heat radiation, there is following technical problem: dispel the heat uneven, easily there is adhesive tape local superheating, the heat dispersion instability, the reliability performance that improve product are poor, be unfavorable for product quality management control, affect the competitive power of product.
Summary of the invention
The object of the invention is to provide a kind of Pressuresensitive Tape for microelectronic device, this heat radiation pad pasting all improves heat conductivility with horizontal direction in the vertical direction, avoid adhesive tape local superheating, while achieving the homogeneity of adhesive tape heat conductivility, improve heat dispersion stability, the reliability of product, greatly reduce the cost of product.
For achieving the above object, the technical solution used in the present invention is: a kind of Pressuresensitive Tape for microelectronic device, described heat radiation attachment film is in heat generating components surface, described heat radiation pad pasting comprises graphite linings, is positioned at the heat-conducting glue adhesion coating on graphite linings surface and separated type material layer, and this separated type material layer fits in heat-conducting glue adhesion coating and the opposing surface of graphite linings; Described graphite linings is obtained by following processing method, and this processing method comprises the following steps:
Step one, Kapton is risen to 250 DEG C from room temperature, near room temperature after rising to 400 DEG C after insulation;
Step 2, the upper and lower surface of the Kapton through step one all apply graphite modified dose of one deck obtain process after Kapton, the viscosity of described graphite modified dose is 30000 ~ 48000CP;
Described graphite modified dose is made up of the component of following weight part:
Pyromellitic acid anhydride 25 ~ 30 parts,
Benzophenone tetracarboxylic dianhydride 10 ~ 15 parts,
Diaminodiphenylmethane 20 ~ 28 parts,
Dimethyl formamide 20 ~ 25 parts,
N-Methyl pyrrolidone 8 ~ 10 parts,
Ethylene glycol 1.5 ~ 2.5 parts,
Polydimethylsiloxane 2 ~ 3 parts;
Step 3, the Kapton after process is warming up to 800 DEG C, is being warming up to 1200 DEG C after insulation, cooling after insulation, thus is obtaining the carbonized film of pre-burned;
Step 4, employing rolling press roll the carbonized film of the pre-burned of described step 4;
Step 5, be warming up to 2400 DEG C, after insulation, be warming up to 2900 DEG C again, cooling after insulation, thus obtain the main graphite film fired;
Step 6, then the graphite film that the master of step 5 gained fires is carried out rolling thus obtain described graphite linings.
In technique scheme, further improved plan is as follows:
1, in such scheme, described graphite modified dose is made up of the component of following weight part:
Pyromellitic acid anhydride 26 ~ 28 parts,
Benzophenone tetracarboxylic dianhydride 12 ~ 14 parts,
Diaminodiphenylmethane 22 ~ 26 parts,
Dimethyl formamide 20 ~ 25 parts,
N-Methyl pyrrolidone 8 ~ 10 parts,
Ethylene glycol 1.8 ~ 2.5 parts,
Polydimethylsiloxane 2.5 ~ 3 parts.
2, in such scheme, described graphite linings is obtained by following processing method, and this processing method comprises the following steps:
Step one, Kapton is risen to 250 DEG C with 4 ~ 6 degree/min speed from room temperature, keep 0.9 ~ 1.1 hour, then with 2.5 ~ 3.5 degree/min, rise to 400 DEG C, keep near room temperature after 1 hour;
Step 2, the upper and lower surface of the Kapton through step one all apply graphite modified dose of one deck obtain process after Kapton;
Step 3, rise to 800 DEG C with the speed of 4 ~ 6 degree/min, keep 0.9 ~ 1.1 hour; Rise to 1200 DEG C with the speed of 9 ~ 11 degree/min again, preserve after 0.9 ~ 1.1 hour and cool, thus obtain the carbonized film of pre-burned;
Step 4, employing rolling press roll the carbonized film of the pre-burned of described step 4;
Step 5, rise to 2400 DEG C with the speed of 19 ~ 21 degree/min, keep 0.9 ~ 1.1 hour, then rise to 2900 DEG C with the speed of 19 ~ 21 degree/min, keep cooling after 1.8 ~ 2.2 hours, thus obtain the main graphite film fired;
The graphite film that step 6, the then master of step 5 gained are fired carries out rolling thus obtains described graphite linings (6).
Because technique scheme is used, the present invention compared with prior art has following advantages and effect:
1, the present invention is used for the Pressuresensitive Tape of microelectronic device, the Kapton that in its structure, graphite linings all applies graphite modified dose of one deck by upper and lower surface is prepared from, improve in the vertical direction with the heat conductivility of horizontal direction, avoid adhesive tape local superheating, achieve the homogeneity of adhesive tape heat conductivility; Secondly, its graphite modified dose of being positioned at Kapton surface is made up of benzophenone tetracarboxylic dianhydride 20 ~ 25 parts, pyromellitic acid anhydride 12 ~ 18 parts, diaminodiphenylmethane 20 ~ 28 parts, dimethyl formamide 20 ~ 25 parts, N-Methyl pyrrolidone 8 ~ 10 parts, ethylene glycol 1.5 ~ 2.5 parts, polydimethylsiloxane 2 ~ 3 parts, be coated on Kapton, be filled with the pin hole in heat-processed, improve degree of crystallinity simultaneously, also overcome thermal contraction excessive cause uneven, improve graphite linings two-way stretch performance.
2, the present invention is used for the Pressuresensitive Tape of microelectronic device, and its graphite modified dose of being positioned at Kapton surface is by benzophenone tetracarboxylic dianhydride 20 ~ 25 parts, pyromellitic acid anhydride 12 ~ 18 parts, diaminodiphenylmethane 20 ~ 28 parts, dimethyl formamide 20 ~ 25 parts, N-Methyl pyrrolidone 8 ~ 10 parts, ethylene glycol 1.5 ~ 2.5 parts
, polydimethylsiloxane 2 ~ 3 parts composition, adopt dimethyl formamide 20 ~ 25 parts, N-Methyl pyrrolidone 8 ~ 10 parts to reduce azeotropic point and level and smooth boiling point district, improve flatness and the snappiness of the finished product film forming; Secondly, Kapton surface has graphite modified dose, improve graphite linings and heat-conducting glue adhesion coating heat conductivility in two-sided pad pasting, and adopt rolling press to roll the carbonized film of described pre-burned, avoid the volumetric shrinkage in fold and greying sintering process, improve compactness and degree of crystallinity, further increase in the vertical direction with the heat conductivility of horizontal direction.
3, the present invention is used for the Pressuresensitive Tape of microelectronic device, after first Kapton being risen to 400 DEG C of imidizations, calendaring processes is increased again between the carbonized film of pre-burned and greying, and again roll after forming heat conduction graphite patch again, avoid the volumetric shrinkage in fold and greying sintering process, improve compactness and degree of crystallinity, further increase in the vertical direction with the heat conductivility of horizontal direction.
Accompanying drawing explanation
Accompanying drawing 1 is for the present invention is for the Pressuresensitive Tape structural representation of microelectronic device;
Accompanying drawing 2 is for the present invention is for the Pressuresensitive Tape application schematic diagram of microelectronic device.
In above accompanying drawing: 1, heat generating components; 2, graphite linings; 3, heat-conducting glue adhesion coating; 4, separated type material layer.
Embodiment
Below in conjunction with embodiment, the invention will be further described:
Embodiment: a kind of Pressuresensitive Tape for microelectronic device, described heat radiation attachment film is in heat generating components 1 surface, described heat radiation pad pasting comprises graphite linings 2, is positioned at heat-conducting glue adhesion coating 3 and the separated type material layer 4 on graphite linings 2 surface, and this separated type material layer 4 fits in heat-conducting glue adhesion coating 3 surface opposing with graphite linings 2; Described graphite linings 2 is obtained by following processing method, and this processing method comprises the following steps:
Step one, Kapton is risen to 250 DEG C with 4 ~ 6 degree/min speed from room temperature, keep 0.9 ~ 1.1 hour, then with 2.5 ~ 3.5 degree/min, rise to 400 DEG C, keep near room temperature after 1 hour;
Step 2, the upper and lower surface of the Kapton through step one all apply graphite modified dose of one deck obtain process after Kapton, described graphite modified dose is made up of the component of following weight part, as shown in table 1:
Table 1
Embodiment 1 Embodiment 2 Embodiment 3 Embodiment 4 Embodiment 5
Pyromellitic acid anhydride 28.5 25.5 28 30 26
Benzophenone tetracarboxylic dianhydride 12.5 12 13.5 14 10
Diaminodiphenylmethane 26 24 25 22 20
Dimethyl formamide 22 22.5 24 21 23
N-Methyl pyrrolidone 8.5 6 9 7 8
Ethylene glycol 1.5 1.8 2.2 1.6 2.5
Polydimethylsiloxane 2 2.5 2.2 2.8 3
Note: the viscosity of graphite modified dose of embodiment 1 is 32000CP, the viscosity of graphite modified dose of embodiment 2 is 35000CP, the viscosity of graphite modified dose of embodiment 3 is 38000CP, the viscosity of graphite modified dose of embodiment 4 is 42000CP, and the viscosity of graphite modified dose of embodiment 5 is 45000CP.
Step 3, rise to 800 DEG C with the speed of 4 ~ 6 degree/min, keep 0.9 ~ 1.1 hour; Rise to 1200 DEG C with the speed of 9 ~ 11 degree/min again, preserve after 0.9 ~ 1.1 hour and cool, thus obtain the carbonized film of pre-burned;
Step 4, employing rolling press roll the carbonized film of the pre-burned of described step 4;
Step 5, rise to 2400 DEG C with the speed of 19 ~ 21 degree/min, keep 0.9 ~ 1.1 hour, then rise to 2900 DEG C with the speed of 19 ~ 21 degree/min, keep cooling after 1.8 ~ 2.2 hours, thus obtain the main graphite film fired;
Step 6, then the graphite film that the master of step 5 gained fires is carried out rolling thus obtain described graphite linings 6.
When adopting the above-mentioned Pressuresensitive Tape for microelectronic device, the Kapton that in its structure, graphite linings all applies graphite modified dose of one deck by upper and lower surface is prepared from, improve in the vertical direction with the heat conductivility of horizontal direction, avoid adhesive tape local superheating, achieve the homogeneity of adhesive tape heat conductivility, secondly, its graphite modified dose of being positioned at Kapton surface is by benzophenone tetracarboxylic dianhydride 20 ~ 25 parts, pyromellitic acid anhydride 12 ~ 18 parts, diaminodiphenylmethane 20 ~ 28 parts, dimethyl formamide 20 ~ 25 parts, N-Methyl pyrrolidone 8 ~ 10 parts, ethylene glycol 1.5 ~ 2.5 parts, polydimethylsiloxane 2 ~ 3 parts composition, be coated on Kapton, be filled with the pin hole in heat-processed, improve degree of crystallinity simultaneously, also overcome thermal contraction excessive cause uneven, improve graphite linings two-way stretch performance, also reduce azeotropic point and level and smooth boiling point district, improve flatness and the snappiness of the finished product film forming, again, Kapton surface has graphite modified dose, improve graphite linings and heat-conducting glue adhesion coating heat conductivility in two-sided pad pasting, and after first Kapton being risen to 400 DEG C of imidizations, increase calendaring processes between the carbonized film of pre-burned and greying again, and again roll after forming heat conduction graphite patch again, avoid the volumetric shrinkage in fold and greying sintering process, improve compactness and degree of crystallinity, further increase in the vertical direction with the heat conductivility of horizontal direction.
Above-described embodiment, only for technical conceive of the present invention and feature are described, its object is to person skilled in the art can be understood content of the present invention and implement according to this, can not limit the scope of the invention with this.All equivalences done according to spirit of the present invention change or modify, and all should be encompassed within protection scope of the present invention.

Claims (2)

1. the Pressuresensitive Tape for microelectronic device, described Pressuresensitive Tape fits in heat generating components (1) surface, described Pressuresensitive Tape comprises graphite linings (2), is positioned at heat-conducting glue adhesion coating (3) and the separated type material layer (4) on graphite linings (2) surface, and this separated type material layer (4) fits in heat-conducting glue adhesion coating (3) surface opposing with graphite linings (2); It is characterized in that: described graphite linings (2) is obtained by following processing method, and this processing method comprises the following steps:
Step one, Kapton is risen to 250 DEG C from room temperature, after rising to 400 DEG C after insulation, be down to room temperature;
Step 2, the upper and lower surface of the Kapton through step one all apply graphite modified dose of one deck obtain process after Kapton, the viscosity of described graphite modified dose is 30000 ~ 48000cP;
Described graphite modified dose is made up of the component of following weight part:
Pyromellitic acid anhydride 25 ~ 30 parts,
Benzophenone tetracarboxylic dianhydride 10 ~ 15 parts,
Diaminodiphenylmethane 20 ~ 28 parts,
Dimethyl formamide 20 ~ 25 parts,
N-Methyl pyrrolidone 8 ~ 10 parts,
Ethylene glycol 1.5 ~ 2.5 parts,
Polydimethylsiloxane 2 ~ 3 parts;
Step 3, the Kapton after process is warming up to 800 DEG C, is being warming up to 1200 DEG C after insulation, cooling after insulation, thus is obtaining the carbonized film of pre-burned;
Step 4, employing rolling press roll the carbonized film of the pre-burned of described step 3;
Step 5, be warming up to 2400 DEG C, after insulation, be warming up to 2900 DEG C again, cooling after insulation, thus obtain the main graphite film fired;
Step 6, then the graphite film that the master of step 5 gained fires is carried out rolling thus obtain described graphite linings (2).
2. Pressuresensitive Tape according to claim 1, is characterized in that: described graphite linings (2) is obtained by following processing method, and this processing method comprises the following steps:
Step one, Kapton is risen to 250 DEG C with 4 ~ 6 degree/min speed from room temperature, keep 0.9 ~ 1.1 hour, then with 2.5 ~ 3.5 degree/min, rise to 400 DEG C, keep being down to room temperature after 1 hour;
Step 2, the upper and lower surface of the Kapton through step one all apply graphite modified dose of one deck obtain process after Kapton;
Step 3, rise to 800 DEG C with the speed of 4 ~ 6 degree/min, keep 0.9 ~ 1.1 hour; Rise to 1200 DEG C with the speed of 9 ~ 11 degree/min again, preserve after 0.9 ~ 1.1 hour and cool, thus obtain the carbonized film of pre-burned;
Step 4, employing rolling press roll the carbonized film of the pre-burned of described step 3;
Step 5, rise to 2400 DEG C with the speed of 19 ~ 21 degree/min, keep 0.9 ~ 1.1 hour, then rise to 2900 DEG C with the speed of 19 ~ 21 degree/min, keep cooling after 1.8 ~ 2.2 hours, thus obtain the main graphite film fired;
The graphite film that step 6, the then master of step 5 gained are fired carries out rolling thus obtains described graphite linings (2).
CN201410036328.9A 2014-01-26 2014-01-26 For the Pressuresensitive Tape of microelectronic device Active CN103756588B (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
CN201610116966.0A CN106433500A (en) 2014-01-26 2014-01-26 Pressure-sensitive adhesive tape for electronic products
CN201610116970.7A CN106118519A (en) 2014-01-26 2014-01-26 The pressure-sensitive pad pasting of microelectronic component
CN201610119322.7A CN106393842B (en) 2014-01-26 2014-01-26 Stretch-proof graphite dissipates pad pasting
CN201610116967.5A CN106118517B (en) 2014-01-26 2014-01-26 The thermally conductive pad pasting of high compactness
CN201410036328.9A CN103756588B (en) 2014-01-26 2014-01-26 For the Pressuresensitive Tape of microelectronic device
CN201610116960.3A CN106118516B (en) 2014-01-26 2014-01-26 Manufacturing process for high compactness heat dissipation pad pasting
CN201610116969.4A CN106118518A (en) 2014-01-26 2014-01-26 The preparation technology of smart mobile phone pressure sensitive adhesive tape
CN201610119321.2A CN106118521A (en) 2014-01-26 2014-01-26 Needleless pass height conductive graphite adhesive tape
CN201610119265.2A CN106118520B (en) 2014-01-26 2014-01-26 Manufacturing process for graphite glue band

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CN201610116966.0A Division CN106433500A (en) 2014-01-26 2014-01-26 Pressure-sensitive adhesive tape for electronic products
CN201610116967.5A Division CN106118517B (en) 2014-01-26 2014-01-26 The thermally conductive pad pasting of high compactness
CN201610119322.7A Division CN106393842B (en) 2014-01-26 2014-01-26 Stretch-proof graphite dissipates pad pasting
CN201610119265.2A Division CN106118520B (en) 2014-01-26 2014-01-26 Manufacturing process for graphite glue band
CN201610119321.2A Division CN106118521A (en) 2014-01-26 2014-01-26 Needleless pass height conductive graphite adhesive tape
CN201610116969.4A Division CN106118518A (en) 2014-01-26 2014-01-26 The preparation technology of smart mobile phone pressure sensitive adhesive tape
CN201610116970.7A Division CN106118519A (en) 2014-01-26 2014-01-26 The pressure-sensitive pad pasting of microelectronic component
CN201610116960.3A Division CN106118516B (en) 2014-01-26 2014-01-26 Manufacturing process for high compactness heat dissipation pad pasting

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CN201410036328.9A Active CN103756588B (en) 2014-01-26 2014-01-26 For the Pressuresensitive Tape of microelectronic device
CN201610116960.3A Active CN106118516B (en) 2014-01-26 2014-01-26 Manufacturing process for high compactness heat dissipation pad pasting
CN201610116970.7A Pending CN106118519A (en) 2014-01-26 2014-01-26 The pressure-sensitive pad pasting of microelectronic component
CN201610116967.5A Active CN106118517B (en) 2014-01-26 2014-01-26 The thermally conductive pad pasting of high compactness
CN201610116969.4A Pending CN106118518A (en) 2014-01-26 2014-01-26 The preparation technology of smart mobile phone pressure sensitive adhesive tape
CN201610119265.2A Active CN106118520B (en) 2014-01-26 2014-01-26 Manufacturing process for graphite glue band
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CN201610116967.5A Active CN106118517B (en) 2014-01-26 2014-01-26 The thermally conductive pad pasting of high compactness
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