CN103721913B - Coating method and coating device - Google Patents
Coating method and coating device Download PDFInfo
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- CN103721913B CN103721913B CN201410015555.3A CN201410015555A CN103721913B CN 103721913 B CN103721913 B CN 103721913B CN 201410015555 A CN201410015555 A CN 201410015555A CN 103721913 B CN103721913 B CN 103721913B
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Abstract
The invention provides a coating method and a coating device capable of shortening beats and economically and stably coating liquid material on a substrate. By adopting the coating method, a chuck part for holding a substrate is rotated, so that liquid material is diffused and coated on the surface of the substrate. The coating method comprises a loading process (S1), wherein a substrate is loaded on a chunk part positioned at a substrate loading position; a moving process (S3) for moving the chunk part with a loaded substrate to a rotating position for being subjected to rotation operation; and a rotating process (S4), wherein the chunk part is rotated at a rotating position. A dropping process (S2) is arranged between the loading process (S1) and a moving process (S3), wherein the liquid material is dropped on the surface of the chunk part.
Description
The divisional application that the application is the applying date is on July 27th, 2011, application number is 201110212716.4, denomination of invention is the application for a patent for invention of " coating method and applying device ".
Technical field
The present invention relates to coating method and applying device.
The application based on July 29th, 2010 in No. 2010-170475, the Patent of Japanese publication and on July 29th, 2010 at the Patent 2010-170476 CLAIM OF PRIORITY of Japanese publication, quote its content at this.
Background technology
In recent years, solar cell receives much concern in various uses.In the manufacturing process of substrate used for solar batteries, be included in the operation of the surface application diffusion material of semiconductor substrate.This applying device used for solar batteries is requiring economy and the device of high speed beat.
But, all the time, when manufacturing the semiconductor devices such as IC, as making wafer and keeping the chuck segment of wafer to rotate, with the applying device of centrifugal force at its surface application resist, there will be a known spin coater (for example, referring to patent documentation 1).Therefore, as the device for applying diffusion material on substrate used for solar batteries, consider to use above-mentioned spin coater.
Patent documentation 1 Japanese Unexamined Patent Publication 06-20935 publication
But, such as, when spin coater being directly applied to the coating of diffusion material, needing to expend the processing time, substrate used for solar batteries can not be manufactured economically, there is the low this problem of practicality.In addition, because substrate used for solar batteries is also thinner than wafer, therefore such as when above-mentioned spin coater is directly applied to the coating of diffusion material, the substrate used for solar batteries being held in chuck segment will let droop, and has this problem of deficient in stability thus.
Summary of the invention
The present invention develops in view of this problem, its object is to, there is provided a kind of and can shorten beat and can not only economy but also the stably coating method of applying liquid material and applying device on substrate, and provide a kind of and the square substrate thin like that to substrate used for solar batteries can apply the applying device of diffusion material well.
To achieve these goals, first method of the present invention (aspect) provide a kind of coating method, the method rotates by making the chuck segment maintaining substrate, and fluent material diffusion is coated on the surface of described substrate, it is characterized in that, comprising: the mounting operation described chuck segment being positioned at substrate-placing position being loaded to substrate; Under the state making described chuck segment rotate, drip the operation of dripping of diffusion material in surface to the described substrate be configured in the described chuck segment being positioned at described substrate-placing position, described diffusion material comprises the impurity element selected from the group be made up of boron, gallium, phosphorus, arsenic, antimony, zinc, copper, will be placed with the described chuck segment of described substrate from described substrate-placing position to the mobile process that the position of rotation carrying out spinning movement declines; Described chuck segment is made to carry out the rotational sequence rotated at described position of rotation.
According to the coating method of first method of the present invention, between mounting operation and mobile process, drip the surface to the substrate being placed in chuck segment diffusion material, therefore, it is possible to realize the shortening of the beat of working procedure of coating.
In addition, in the coating method of first method of the present invention, preferably, drip in operation described, the state carrying out to make described chuck segment rotating is carried out.
According to this structure, in advance at the surface diffusion coating diffusion material of substrate, can realize beat and shorten.
In addition, in the coating method of first method of the present invention, preferably, the speed setting of the described chuck segment of dripping described in operation is lower than the rotating speed of the described chuck segment of described rotational sequence.
According to this structure, in the scope of not overflowing from substrate, diffusion well diffusion material can be applied.
In addition, in the coating method of first method of the present invention, preferably, the speed setting of the described chuck segment of dripping described in operation is below 50rpm.
According to this structure, coating diffusion material can be spread in the mode of not overflowing from substrate, therefore, it is possible to shorten the time of the rotational sequence thrown away by diffusion material.
In addition, in the coating method of first method of the present invention, preferably, in described rotational sequence, anti-the dispersing that described chuck segment is preventing described diffusion material from dispersing rotates with in cup.
According to this structure, when rotational sequence, can reliably prevent diffusion material from dispersing towards periphery.
In addition, in the coating method of first method of the present invention, preferably, the spinning movement of the described chuck segment in described rotational sequence is the revolution of more than 4000rpm, and carries out within 5 seconds.
According to this structure, diffusion material reliably can be spread coating throughout whole of substrate.
In addition, in the coating method of first method of the present invention, preferably, make to retreat to the drip nozzle of described diffusion material of described substrate relative to described chuck segment.
According to this structure, owing to have employed the structure that nozzle is retreated relative to chuck segment, therefore nozzle can not hinder substrate to move into operation to chuck segment.
In addition, in the coating method of first method of the present invention, preferably, described nozzle advance and retreat direction and described substrate relative to described chuck segment to move into direction parallel.
According to this structure, the displacement of nozzle can be shortened, the shortening of the beat of working procedure of coating entirety can be realized.
In addition, in the coating method of first method of the present invention, preferably, by described substrate to while the moment that described chuck segment loads, make described nozzle opposed with described substrate.
According to this structure, due at substrate to while the moment that chuck segment loads, nozzle is opposed with substrate, because this eliminating stand-by period when nozzle moves to chuck segment.
In addition, in the coating method of first method of the present invention, preferably, in described rotational sequence, the backside rinse process that the back side of described substrate is cleaned is carried out.
According to this structure, while when rotational sequence, carry out backside rinse process, thus can prevent diffusion material rearwardly lateral bine prolong.Therefore, with compared with carrying out the situation of backside rinse after rotational sequence in addition, beat can be realized and shorten.
In addition, in the coating method of first method of the present invention, preferably, as described diffusion material, use viscosity at the material of below 20cp.
According to this structure, owing to using viscosity at the diffusion material of below 20cp, therefore can prevent diffusion material from spreading to the rear side of substrate in rotational sequence.Therefore, it is possible to omit the backside rinse process of cleaning the back side of substrate, the shortening of beat can be realized.
In addition, in the coating method of first method of the present invention, preferably, described substrate is substrate used for solar batteries.
If employing the present invention, then use spin coated just can apply such as diffusion material on substrate used for solar batteries, therefore, it is possible to provide substrate used for solar batteries economically.
First method of the present invention provides a kind of applying device, it rotates by making substrate, and apply diffusion material in the surface diffusion of described substrate, it is characterized in that, possess: nozzle, it to drip described diffusion material to described substrate, and described diffusion material comprises the impurity element selected from the group be made up of boron, gallium, phosphorus, arsenic, antimony, zinc, copper; Chuck segment, it is rotatable under the state maintaining described substrate, and carries out lifting action between the substrate-placing position and the position of rotation carrying out described rotation of the described substrate of mounting; Control part, it controls described nozzle, when to make this nozzle before described chuck segment starts to decline to described position of rotation, under the state making described chuck segment rotate, drip described diffusion material on surface to the described substrate be positioned in the described chuck segment being positioned at described substrate-placing position, and this control part controls described chuck segment rotates at described position of rotation.
According to the applying device of first method of the present invention, due to before starting in chuck segment to move to position of rotation when, drip diffusion material on surface to the substrate being placed in chuck segment, can shorten beat therefore, it is possible to provide a kind of and can carry out not only economy but also the device of the coating of stable diffusion material.
Second method of the present invention provides a kind of applying device, possesses: rotatable chuck segment under absorption maintains the state that flat shape is square substrate; Drip to the surface of the described substrate of rotation status the nozzle that drips of diffusion material; To the washer jet of the rear side supply cleaning fluid of described substrate, it is characterized in that, described chuck segment is formed as toroidal under the state of overlooking, and has the diameter of 40 ~ 70% of the bond length of described substrate.
According to the applying device of second method of the present invention, have the diameter of 40 ~ 70% of the bond length of substrate due to chuck segment, even therefore such as flat shape is square and that thickness is thin substrate, chuck segment also can well keep.Therefore, it is possible to apply diffusion material well on the substrate of chuck segment maintenance.
In addition, in the applying device of second method of the present invention, preferably, described washer jet, under the state of overlooking, is same heart shaped relative to described chuck segment, and is configured in the substantial middle between the outer rim of described chuck segment and the outer rim of described substrate.
According to this structure, due to the substantial middle configuration washer jet between the outer rim and the outer rim of substrate of chuck segment, therefore, it is possible to become the position of roughly concentric circles to supply cleaning fluid to the outer rim of the chuck segment at the back side relative to substrate.
In addition, in the applying device of second method of the present invention, preferably, described washer jet is configured within the outer edge 10mm of the minor face of described substrate.
Like this, because washer jet is configured within the outer edge 10mm of the minor face of described substrate, the outer edge at the back side of substrate therefore can be diffused into well from the cleaning fluid of washer jet supply.Thus, by preventing diffusion material spreading to substrate back, after the coating of diffusion material, not needing the so-called backside rinse process of carrying out in addition cleaning the back side of substrate, the beat of working procedure of coating can be shortened.
In addition, in the applying device of second method of the present invention, preferably, described substrate is that the shape of chamfering has been carried out in corner.In addition, preferred described substrate is substrate used for solar batteries.
The substrate that the shape of chamfering has been carried out in this corner is suitable as solar cell purposes.If employing the present invention, even then usually thinner than semiconductor wafer and the substrate used for solar batteries of deficient in stability, above-mentioned chuck segment also can stably keep, therefore, it is possible to applied well by diffusion material.
According to the present invention, can provide a kind of and can shorten beat and can not only economy but also stably apply coating method and the applying device of diffusion material on substrate, and a kind of square substrate thin like that to substrate used for solar batteries can be provided, apply the applying device of diffusion material well.
Accompanying drawing explanation
Fig. 1 (a), (b) are vertical view and the sectional view of the structure representing substrate board treatment.
Fig. 2 is the block scheme of the electrical structure representing substrate board treatment.
Fig. 3 is the figure of the major part structure representing applying device.
Fig. 4 is the figure of the major part structure representing spray nozzle part.
Fig. 5 is the figure of the flow process of the working procedure of coating of the diffusion material representing applying device.
Fig. 6 is the figure for being described the working procedure of coating of applying device.
Symbol description
W substrate
S1 loads operation
S2 drips operation
S3 mobile process
S4 rotational sequence
10 applying devices
20 chuck segment
22 cup portion (anti-dispersing uses cup)
100 substrate board treatments
200 diffusion materials
Embodiment
Below, with reference to accompanying drawing, one embodiment of the present invention is described.
Fig. 1 (a) is the vertical view of the substrate board treatment comprising applying device of the present invention, and Fig. 1 (b) is the sectional view that the A-A alignment of Fig. 1 (a) is looked.Fig. 2 is the block scheme of the electrical structure representing substrate board treatment 100.The substrate board treatment of present embodiment be for the substrate used for solar batteries forming solar cell is applied and drying for the device of the process of the diffusion material of diffusion impurity, substrate application device is for applying diffusion material and use substrate used for solar batteries (hereinafter referred to as substrate) being upper.
Below, when being described the structure of substrate board treatment 100, easy in order to what state, with XYZ coordinate system, the direction in figure is described.The length direction of substrate board treatment 100 and the throughput direction of substrate are expressed as X-direction.Direction orthogonal with X-direction (substrate throughput direction) when overlooking is expressed as Y-direction.Direction with the plane orthogonal comprising X-direction axle and Y-direction axle is expressed as Z-direction.X-direction, Y-direction and the Z-direction direction of arrow be set to respectively in figure is+direction, the direction contrary with the direction of arrow is-direction.
As shown in Fig. 1 (a), (b), substrate board treatment 100 possesses: for move into treated object and substrate W loading unit 1, be arranged at the downstream (+X-direction) of above-mentioned loading unit 1 applying device 10, be arranged at the downstream (+X-direction) of above-mentioned applying device 10 drying device 3, from these loading unit 1, substrate W is transported to the first conveying device 6 of drying device 3, the second conveying device 7 at the local conveying substrate W of drying device 3.
As shown in Figure 2, substrate board treatment 100 possesses control part 9, and the respective driving of this control part 9 pairs of loading unit 1, applying device 10, drying device 3, first conveying device 6 and the second conveying device 7 controls.
Drying device 3 is made up of three heating plates 3a, 3b, the 3c configured successively towards downstream (+X-direction).Each heating plate 3a, 3b, 3c by trisection, are formed with gap 51 each between heating plate 3a, 3b, 3c on the direction (Y-direction) orthogonal with the throughput direction of substrate.
Above-mentioned second conveying device 7 comprises: the laminal substrate supporting parts 52 can retreated between the rear side and surface of heating plate 3a, 3b, 3c via gap 51, the guide pole 53 led in X direction by aforesaid substrate support unit 52, to make the working cylinder unit 54 of substrate supporting parts 52 movement in X direction along above-mentioned guide pole 53.Drying device 3 is electrically connected with control part 9, and the driving of each heating plate 3a, 3b, 3c is controlled by control part 9.
Applying device 10 comprises: keep the chuck segment 20 of substrate W, the spray nozzle part 21 of diffusion material (fluent material) that the substrate W being held in chuck segment 20 is dripped, collecting rotate in the cup portion (anti-disperse with cup) 22 of chuck segment 20.The applying device 10 of present embodiment is so-called spin coater.Applying device 10 is electrically connected with control part 9, and the action of chuck segment 20 is controlled by control part 9.
First conveying device 6 comprises: the guide rail 60 that one end (-Y-direction) side along substrate board treatment 100 is arranged, along the movement of above-mentioned guide rail 60 multiple moving bodys 61, from above-mentioned each moving body 61, (+Z-direction) lifting is freely and multiple substrate supporting parts 62 of supporting substrates W upward.Substrate supporting parts 62 are provided with the multiple bearing claws 63 for supporting substrates W.First conveying device 6 is electrically connected with control part 9, and the driving of moving body 61 and substrate supporting parts 62 is controlled by control part 9.
In first conveying device 6, can the multiple moving body 61 of drive.These moving bodys 61 are located at the position of not interfering respectively when moving along guide rail 60.Thus, for the first conveying device 6, such as at the substrate supporting parts 62 being located at a moving body 61, the substrate W being coated with diffusion material 200 can be taken out of in applying device 10 and while being moved to the moment in drying device 3, another substrate W is moved in applying device 10 from loading unit 1 by the substrate supporting parts 62 being located at another moving body 61.Thus, substrate board treatment 100 shortens diffusion material 200 relative to the beat needed for the working procedure of coating of substrate W and drying process.
Second conveying device 7 is electrically connected with control part 9, and the driving of working cylinder unit 54 is controlled by control part 9.The elongation action of Z-direction of the second conveying device 7 by carrying out working cylinder unit 54 and carrying out, and the upper end of substrate supporting parts 52 is given prominence to from gap 51, the substrate W on heating plate 3a is made to increase thus, in this condition, substrate supporting parts 52 and working cylinder unit 54 are together moved to side, downstream along guide pole 53, then, working cylinder unit 54 is compressed, the upper end of substrate supporting parts 52 is declined from the upper surface of heating plate 3a, thus substrate W is transferred to the heating plate 3b in downstream.By repeating such action, successively substrate W can be transferred to the heating plate 3c in downstream.
Fig. 3 is the figure of the major part structure representing applying device 10, Fig. 3 (a) be the figure representing sectional side view, Fig. 3 (b) is the figure representing vertical view.In addition, in figure 3, the state being provided with substrate W in applying device 10 is illustrated.
As shown in Fig. 3 (a), chuck segment 20 can rotate to adsorb the state keeping substrate W, and relative to cup portion 22 liftable.Specifically, chuck segment 20 from the mounting position (substrate-placing position) of mounting substrate W between the position of rotation (position of rotation) carrying out spinning movement in cup portion 22 liftable.
Cup portion 22 is the devices for preventing the diffusion material dripping to substrate W from dispersing towards periphery, possesses Wafer Backside Cleaning nozzle (washer jet) 22a cleaned the rear side of substrate W.Wafer Backside Cleaning nozzle 22a is connected with not shown cleaning solution supplying source.This cleaning solution supplying source by pressurization, and makes cleaning fluid spray from Wafer Backside Cleaning nozzle 22a.
As shown in Fig. 3 (b), the chuck segment 20 of present embodiment is formed as toroidal under the state of overlooking.On the other hand, the substrate W that chuck segment 20 keeps is owing to being solar cell purposes, and therefore flat shape is square, and for having carried out the shape of chamfering in corner.
Chuck segment 20 has the diameter of 40 ~ 70% of the bond length of substrate W.And then preferably chuck segment 20 has the diameter of 60 ~ 70% of the bond length of substrate W.In present embodiment, the diameter of chuck segment 20 is roughly 2/3 of the bond length of such as substrate W.Like this, there is due to chuck segment 20 diameter of 40 ~ 70% of the bond length of substrate W, therefore as mentioned above can by corner chamfering.Due to corner chamfering, even so may produce the substrate W of shake when rotated, chuck segment 20 also can keep well.In addition, as substrate W, even if when adopting the thin substrate of thickness, chuck segment 20 also can reliably keep.
Then, the configuration relation of chuck segment 20 and Wafer Backside Cleaning nozzle 22a is described.As shown in Fig. 3 (b), Wafer Backside Cleaning nozzle 22a is configured in the substantial middle between the outer rim of chuck segment 20 and the outer rim of substrate W under the state of overlooking.According to this structure, the position supply cleaning fluid of roughly concentric circles can be become to the outer rim of the chuck segment 20 at the back side of the substrate W carrying out rotating with respect to chuck segment 20.It should be noted that, so-called substantial middle shows as and allows from central offset-10mm ~ about 10mm, is more preferably this skew for-5mm ~ 5mm.
But as described later, in the applying device 10 of present embodiment, while the moment of the diffusion material that drips to the surface of substrate W, the so-called backside rinse process of alcohol as cleaning fluid is sprayed at the back side of carrying out from Wafer Backside Cleaning nozzle 22a to substrate W.As the alcohol of this cleaning fluid, enumerating the carbon numbers such as methyl alcohol, ethanol, propyl alcohol, butanols, MMB and 3-methoxyl-n-butyl alcohol is the alcohol of 1 ~ 5.
Specifically, in the present embodiment, Wafer Backside Cleaning nozzle 22a distance is held in the distance D of the minor face outer edge of the substrate W of chuck segment 20 within 10mm.Within distance D is more preferably at 8mm, further preferred within 6mm.Thus, the cleaning fluid being supplied to the back side of substrate W from Wafer Backside Cleaning nozzle 22a can be diffused into the outer edge of substrate W well, by preventing diffusion material spreading to the back side of substrate W, thus do not need to carry out backside rinse process separately after diffusion material coating, shorten the beat of working procedure of coating.
Fig. 4 is the figure of the major part structure representing spray nozzle part 21.
As shown in Figure 4, spray nozzle part 21 has: the resettlement section 24 being formed with the nozzle 23 of the peristome 23a of the diffusion material that drips, collecting nozzle 23.As shown in Figure 4, resettlement section 24 has: the cap 24a be wholely set with nozzle 23, together form the main part 24b of the confined space of accommodating nozzle 23 with above-mentioned cap 24a.Like this, resettlement section 24, by with air-tight state collecting nozzle 23, can prevent peristome 23a dry.Cap 24a and nozzle 23 together move, and main part 24b can not move from the position of readiness of spray nozzle part 21.
Nozzle 23 is provided with travel mechanism 25, and under the effect of above-mentioned travel mechanism 25, nozzle 23 can be retreated relative to chuck segment 20.Thus, nozzle 23 can retreated relative to moving on parallel direction, direction (X-direction) of chuck segment 20 with substrate W.Thereby, it is possible to reduce the displacement of nozzle 23, the beat of working procedure of coating entirety can be shortened.
In addition, be provided with the not shown circulation flow path that diffusion material 200 is circulated to peristome 23a in the inside of nozzle 23, this circulation flow path is connected with not shown diffusion material supply source.This diffusion material supply source has such as not shown pump, by being released to peristome 23a by diffusion material by said pump, and diffusion material is dripped from peristome 23a.
At this, the diffusion material dripped to substrate W from nozzle 23 is described.
As the impurity element added in the diffusion material 200 used in the present embodiment, as IIIA race element, enumerate boron, gallium etc.; As VA race element, enumerate phosphorus, arsenic, antimony etc., as other element, enumerate zinc, copper etc.Above-mentioned impurity element can be added on film with the form of the organic acid such as inorganic salts, the acetic acid salt such as oxide, halogenide, nitrate, sulfate and be formed in constituent.Specifically, enumerate: P
2o
5, NH
4h
2pO
4, (RO)
3p, (RO)
2p (OH), (RO)
3pO, (RO)
2p
2o
3(OH)
3, (RO) P (OH)
2deng phosphide, B
2o
3, (RO)
3b, RB (OH)
2, R
2boride, the H such as B (OH)
3sbO
4, (RO)
3sb, SbX
3, SbOX, Sb
4o
5the antimonides such as X, H
3asO
3, H
2asO
4, (RO)
3as, (RO)
5as, (RO)
2as (OH), R
3the arsenides such as AsO, RAs=AsR, Zn (OR)
2, ZnX
2, Zn (NO
2)
2deng Zinc compounds, (RO)
3ga, RGa (OH), RGa (OH)
2, R
2ga (OC (CH
3)=CH-CO-(CH
3)) etc. gallium compound etc. (wherein, R represents halogen atom, alkyl, thiazolinyl or aryl, X represents halogen atom).In these compounds, preferably can use boron oxide, phosphorous oxide etc.
The diffusion material 200 of present embodiment, while diffusion, in order to form dielectric film, graduation film or diaphragm on substrate, also can comprise with by R
1 nsi (OR
2)
4-nat least one in the alkoxy silane represented is the hydrolytie polycondensation thing of initiation material.(in formula, R
1for hydrogen atom or any monovalent organic radical, R
2for any monovalent organic radical, n represents the integer of 1 ~ 3.)
At this, as any monovalent organic radical, can enumerate such as: alkyl, aryl, propenyl, glycidyl.Wherein, preferred alkyl and aryl.
The carbon number of alkyl is preferably 1 ~ 5, can enumerate methyl, ethyl, propyl group, butyl etc.In addition, alkyl both can be straight-chain, and can be also branched, hydrogen also can replaced by fluorine.As aryl, preferred carbon number is the aryl of 6 ~ 20, can enumerate such as phenyl, naphthyl etc.
I () is when n=1, enumerate: alkyltrialkoxysilaneand such as monomethyl trimethoxy silane, methltriethoxysilone, monomethyl tripropoxy silane, an ethyl trimethoxy silane, an ethyl triethoxysilane, an ethyl tripropoxy silane, a propyl trimethoxy silicane and a propyl-triethoxysilicane, phenyl trialkoxysilane etc. such as a phenyl ortho-siliformic acid and phenyltriethoxysilane.
(ii) when n=2, enumerate: the dialkyl group alkoxy silanes such as dimethyldimethoxysil,ne, dimethyldiethoxysilane, dimethyl dipropoxy silane, diethyldimethoxysilane, diethyldiethoxysilane, diethyl npropoxysilane, dipropyl methoxy silane and dipropyl Ethoxysilane, the diphenyl alkoxy silanes etc. such as diphenylmethyl TMOS and diphenyl Ethoxysilane.
(iii) when n=3, enumerate: the trialkyl alkoxy silane such as trimethylmethoxysilane, trimethylethoxysilane, trimethyl npropoxysilane, triethyl methoxy silane, triethyl-ethoxy-silicane alkane, triethyl npropoxysilane, tripropyl methoxy silane and tripropyl Ethoxysilane, the triphenyl alkoxy silanes etc. such as triphenylmethoxy silane, triphenyl Ethoxysilane.
Wherein, the monomethyl trialkoxy silanes such as monomethyl trimethoxy silane, methltriethoxysilone and monomethyl tripropoxy silane can preferably be used.
In the diffusion material 200 of present embodiment, in order to improve homogeneity and the screening characteristics of thickness and coating composition, preferably containing solvent.In this situation, as solvent, the organic solvent used at present can be used.Specifically, can enumerate: the monohydroxy alcohols such as methyl alcohol, ethanol, propyl alcohol, butanols, MMB and 3-methoxyl-n-butyl alcohol; The alkyl carboxylic acid esters such as methyl-3-methoxy propyl acid esters and ethyl-3-ethoxy-c acid esters; The polyvalent alcohols such as ethylene glycol, diethylene glycol and propylene glycol; The polyol derivatives such as glycol monoethyl ether, ethylene glycol monoethyl ether, ethylene glycol ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, dihydroxypropane single-ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate and propylene glycol methyl ether acetate; The fatty acid such as acetic acid and propionic acid; The ketone of acetone, MEK, 2-HEPTANONE and so on.These organic solvents both may be used alone, can also be used in combination.
Then, the action of substrate board treatment 100 is described.The present invention has feature in the coating method of diffusion material 200, therefore, is mainly described the working procedure of coating applying diffusion material on semiconductor substrate W that applying device 10 carries out.
Fig. 5 is the process flow diagram of the working procedure of coating representing the diffusion material that applying device 10 carries out.
The working procedure of coating of the diffusion material of applying device 10 comprises: to the chuck segment 20 being positioned at substrate-placing position load substrate W mounting operation S1, by the chuck segment 20 being placed with substrate W from substrate-placing position to the rotational sequence S4 carrying out the mobile process S3 of position of rotation movement of spinning movement in cup portion 22, chuck segment 20 rotates at position of rotation, in addition, between mounting operation S1 and mobile process S3, drip the operation S2 that drips of diffusion material on the surface had to the substrate W being placed in chuck segment 20.
Below, with reference to Fig. 6, working procedure of coating is described.
First, as shown in Fig. 6 (a), substrate board treatment 100 utilizes the first conveying device 6 the substrate W being moved to loading unit 1 to be transferred to applying device 10 (mounting operation S1).Now, chuck segment 20 rises to the mounting position loading the substrate W carried by substrate supporting parts 62.Now, substrate board treatment 100 moves into another substrate W in loading unit 1, for lower road working procedure of coating is prepared.
In the present embodiment, such as by substrate W to while the moment that chuck segment 20 loads, make spray nozzle part 21 opposed with substrate W.Like this, due to be placed in chuck segment 20 at substrate W moment while, make spray nozzle part 21 opposed with substrate W, because this eliminating stand-by period when spray nozzle part 21 moves to chuck segment 20.
Control part 9, to drip diffusion material 200 (drip operation S2) to the substrate W being placed in chuck segment 20 from the peristome 23a of nozzle 23 adsorb the mode drive chuck portion 20 of maintenance aforesaid substrate W when loading substrate W.
In the present embodiment, as shown in Fig. 6 (b), control part 9 controls in the mode making chuck segment 20 rotate when dripping diffusion material 200 from nozzle 23.Specifically, in the present embodiment, control part 9 makes chuck segment 20 rotate with the rotating speed of below 50rpm.Be more preferably below 45rpm, further preferred below 40rpm.Thereby, it is possible to make diffusion material 200 be diffused into not from the scope that the surface of substrate W is overflowed.
Then, as shown in Fig. 6 (c), control part 9 makes chuck segment 20 decline with the state be rotating, and moves (mobile process S3) in cup portion 22.Now, control part 9 makes nozzle 23 keep out of the way position of readiness from the position opposed with chuck segment 20.Nozzle 23 is housed at position of readiness and is abutted by cap 24a and main part 24b and in the resettlement section 24 that forms (reference Fig. 4).
As shown in Fig. 6 (d), chuck segment 20 is configured in cup portion 22 by control part 9, makes chuck segment 20 while entering cup portion 22, rotates (rotational sequence S4) with the revolution of more than 4000rpm and within 5 seconds.Different according to viscosity, rotate with more than 1500rpm.In this situation, be more preferably more than 2000rpm, further preferred more than 2500rpm.Thereby, it is possible to the surface of diffusion material 200 from substrate W is thrown away.
Chuck segment 20 preferably accelerated to the revolution of more than 4000rpm within 1.0 seconds from the revolution of such as below 50rpm, and when spinning movement stops, decelerating to revolution 0rpm from the revolution of more than 4000rpm within 0.5 second.Thereby, it is possible to diffusion well applies diffusion material 200 on substrate W.
Also can adopt following structure, that is, the mode of not overflowing from substrate W with diffusion material 200 accelerates to 4000rpm from the rotating speed of below 50rpm, lentamente while carry out mobile process S3.Accordingly, the transition from mobile process S3 to rotational sequence S4 can be carried out reposefully, the beat of working procedure of coating can be shortened.
In the present embodiment, while chuck segment 20 rotates, the backside rinse process of alcohol as cleaning fluid is sprayed at the back side of carrying out from Wafer Backside Cleaning nozzle 22a to substrate W.The injection of cleaning fluid was carried out from the rotation of chuck segment 20 within 3 seconds.As the alcohol of above-mentioned cleaning fluid, enumerating the carbon numbers such as methyl alcohol, ethanol, propyl alcohol, butanols, MMB and 3-methoxyl-n-butyl alcohol is the alcohol of 1 ~ 5.
According to the present embodiment, at the back side of substrate W, cleaning fluid is spread by the effect of the centrifugal force peripheral end to substrate W, can prevent diffusion material 200 from spreading rear side to substrate thus.Therefore, after rotational sequence, do not need to arrange the operation of cleaning the back side of substrate W.Therefore, it is possible to shorten the beat needed for process of applying device 10.
In addition, according to the present embodiment, Wafer Backside Cleaning nozzle 22a is as illustrated with reference to Fig. 3, and be configured within the outer edge 10mm of substrate W, the cleaning fluid being therefore supplied to the back side of substrate W can be diffused into the outer edge of substrate W well.Thus, prevent diffusion material 200 spreading to the back side of substrate W, after working procedure of coating, do not need to carry out backside rinse process separately.Therefore, it is possible to shorten the beat of working procedure of coating significantly.
After rotational sequence terminates, chuck segment 20 rises, and keeps out of the way in cup portion 22.Then, the substrate supporting parts 62 of control part 9 to the first conveying device 6 drive, and receive substrate W from chuck segment 20, are transported in drying device 3 by this substrate W.Then, drying is carried out to the diffusion material 200 on substrate W.
In present embodiment, after being taken out of from chuck segment 20 by the substrate W being coated with diffusion material 200, another substrate W is handed off to applying device 10 from loading unit 1 by control part 9.Now, control part 9 utilizes another substrate supporting parts 62 of the first conveying device 6 that substrate W is placed in chuck segment 20.And, move into the substrate W being coated with diffusion material 200 in drying device 3 during, in applying device 10, similarly diffusion material 200 is applied to substrate W.
Then, substrate W is moved in drying device 3 by control part 9.In drying device 3, heating plate 3a, 3b, 3c is used to carry out primary drying process every 10 seconds at 150 DEG C to one piece of substrate W.Based on this structure, substrate board treatment 100 can move into substrate W every 10 seconds in drying device 3, by being transported to successively in drying device 3 by the substrate taken out of from applying device 10 W, improves processing speed significantly.
Specifically, first the substrate W being coated with diffusion material 200 is placed on and is positioned on the heating plate 3a of most upstream by substrate board treatment 100.Heating plate 3a carries out drying in 10 seconds to substrate W at 150 DEG C.Thereafter, control part 9 makes working cylinder unit 54 compress, and the upper end of substrate supporting parts 52 is declined from the upper surface of heating plate 3a, thus substrate W is transferred to the heating plate 3b in downstream.Heating plate 3b carries out drying in 10 seconds to substrate W at 150 DEG C.Thereafter, control part 9 makes working cylinder unit 54 compress, and the upper end of substrate supporting parts 52 is declined from the upper surface of heating plate 3b, thus the dried substrate W that heating plate 3b realizes is transferred to the heating plate 3c in downstream.Heating plate 3c carries out drying in 10 seconds to substrate W at 150 DEG C.Thus, the drying process in 30 seconds can be implemented at 150 DEG C to substrate W.
In the present embodiment, substrate W is moved to heating plate 3b from heating plate 3a, and the substrate W taken out of from applying device 10 is placed on heating plate 3a by the substrate supporting parts 62 of the first conveying device 6.In addition, one piece of substrate W is moved to heating plate 3c from heating plate 3b, and another block substrate W is taken out of in substrate board treatment 100 from heating plate 3c by not shown output arm.
Like this, in the present embodiment, by sending between heating plate 3a ~ 3c successively by each substrate W, the drying process of diffusion material 200 is carried out.Thereby, it is possible to form diffusion barrier on the surface of substrate W.
As mentioned above, according to the present embodiment, chuck segment 20 due to applying device 10 has the diameter of 40 ~ 70% of the bond length of substrate W, therefore, for because of thinner than semiconductor wafer and corner has been carried out chamfering and has lacked maintenance time the substrate used for solar batteries of stability and substrate W, chuck segment 20 also can reliably keep.
In addition, according to the present embodiment, carry out dripping from nozzle 23 to substrate W the operation S2 that drips of diffusion material 200 between substrate W to be placed in mobile process S3 that the mounting operation S1 of chuck segment 20 and chuck segment 20 move in cup portion 22 by applying device 10, owing to being above-mentioned structure, so the shortening of beat diffusion material 200 being coated on the working procedure of coating of substrate W can be realized.In addition, in the moment of the operation S2 that dripped by control, the structure same with existing spin coater can be adopted as applying device 10.Therefore, it is possible to suppress the cost of substrate board treatment 100.
Above one embodiment of the present invention is illustrated, but the invention is not restricted to above-mentioned embodiment, can suitably change in the scope of purport not departing from invention.Such as, in above-mentioned embodiment, to while making chuck segment 20 rotate, the situation of the back side supply cleaning fluid of substrate W is illustrated, but the present invention is not limited thereto.Such as, also can, by the viscosity of the diffusion material 200 dripped from nozzle 23 to substrate W is set in below 20cp, prevent the diffusion material 200 dripping to substrate W when the rotation of chuck segment 20 from spreading to the back side of substrate W.Accordingly, because the viscosity of diffusion material 200 is low, and when the rotation of substrate W, the rear side of substrate can not be spread to, therefore not need to spray above-mentioned cleaning fluid.
Utilizability in industry
According to the present invention, can provide a kind of and shorten beat and can not only economy but also the stably coating method of applying liquid material and applying device on substrate, and can provide a kind of and can apply the applying device of diffusion material well by the square substrate thin like that to substrate used for solar batteries, therefore exceedingly useful in industry.
Claims (12)
1. a coating method, the method rotates by making the chuck segment maintaining substrate, and diffusion material diffusion is coated on the surface of described substrate, it is characterized in that, comprising:
The described chuck segment being positioned at substrate-placing position is loaded to the mounting operation of substrate;
Under the state making described chuck segment rotate, drip the operation of dripping of diffusion material in surface to the described substrate be configured in the described chuck segment being positioned at described substrate-placing position, described diffusion material comprises the impurity element selected from the group be made up of boron, gallium, phosphorus, arsenic, antimony, zinc, copper
To the described chuck segment of described substrate be placed with from described substrate-placing position to the mobile process that the position of rotation carrying out spinning movement declines;
Described chuck segment is made to carry out the rotational sequence rotated at described position of rotation.
2. coating method as claimed in claim 1, is characterized in that,
The speed setting of described described chuck segment of dripping in operation is lower than the rotating speed of the described chuck segment in described rotational sequence.
3. coating method as claimed in claim 2, is characterized in that,
The speed setting of described described chuck segment of dripping in operation is below 50rpm.
4. coating method as claimed in claim 2, is characterized in that,
In described rotational sequence, anti-the dispersing that described chuck segment is preventing described diffusion material from dispersing rotates with in cup.
5. coating method as claimed in claim 2, is characterized in that,
The spinning movement of the described chuck segment in described rotational sequence is the revolution of more than 4000rpm, and carries out within 5 seconds.
6. coating method as claimed in claim 1, is characterized in that,
Make to retreat to the drip nozzle of described diffusion material of described substrate relative to described chuck segment.
7. coating method as claimed in claim 6, is characterized in that,
The advance and retreat direction of described nozzle and described substrate relative to described chuck segment to move into direction parallel.
8. coating method as claimed in claim 6, is characterized in that,
By described substrate to while the moment that described chuck segment loads, make described nozzle opposed with described substrate.
9. coating method as claimed in claim 1, is characterized in that,
In described rotational sequence, carry out the backside rinse process that the back side of described substrate is cleaned.
10. coating method as claimed in claim 1, is characterized in that,
As described diffusion material, use viscosity at the material of below 20cp.
11. coating methods according to any one of claim 1 ~ 10, is characterized in that,
Described substrate is substrate used for solar batteries.
12. 1 kinds of applying devices, it rotates by making substrate, and applies diffusion material in the surface diffusion of described substrate, it is characterized in that possessing:
Nozzle, it to drip described diffusion material to described substrate, and described diffusion material comprises the impurity element selected from the group be made up of boron, gallium, phosphorus, arsenic, antimony, zinc, copper;
Chuck segment, it is rotatable under the state maintaining described substrate, and carries out lifting action between the substrate-placing position and the position of rotation carrying out described rotation of the described substrate of mounting;
Control part, it controls described nozzle, when to make this nozzle before described chuck segment starts to decline to described position of rotation, under the state making described chuck segment rotate, drip described diffusion material on surface to the described substrate be positioned in the described chuck segment being positioned at described substrate-placing position, and this control part controls described chuck segment rotates at described position of rotation.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010170475A JP5439310B2 (en) | 2010-07-29 | 2010-07-29 | Coating method and coating apparatus |
| JP2010170476A JP2012030160A (en) | 2010-07-29 | 2010-07-29 | Coating apparatus |
| JP2010-170475 | 2010-07-29 | ||
| JP2010-170476 | 2010-07-29 |
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| CN2011102127164A Division CN102343327A (en) | 2010-07-29 | 2011-07-27 | Coating method and coating device |
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| CN103721913A CN103721913A (en) | 2014-04-16 |
| CN103721913B true CN103721913B (en) | 2015-05-20 |
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| CN105289923A (en) * | 2014-05-30 | 2016-02-03 | 盛美半导体设备（上海）有限公司 | Wafer gumming machine and gumming method |
| CN108298521A (en) * | 2017-08-24 | 2018-07-20 | 东莞产权交易中心 | A kind of preparation facilities and its method of graphene perovskite nano thin-film |
| KR101928888B1 (en) * | 2018-06-25 | 2018-12-13 | 한국지질자원연구원 | Manufacturing apparatus for lithium adsorbent porous material and making method using thereof |
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| JPH0620935A (en) * | 1992-06-30 | 1994-01-28 | Nec Kansai Ltd | Resist coating device |
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| CN201030353Y (en) * | 2007-04-30 | 2008-03-05 | 沈阳芯源微电子设备有限公司 | Square sheet rotating gumming mechanism |
| CN101354534B (en) * | 2007-07-27 | 2011-07-06 | 中芯国际集成电路制造(上海)有限公司 | Method for coating photoresist and method for forming photolithography pattern |
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| JPH0620935A (en) * | 1992-06-30 | 1994-01-28 | Nec Kansai Ltd | Resist coating device |
| CN1467793A (en) * | 2002-06-10 | 2004-01-14 | 大日本屏影象制造株式会社 | Treating solution applying method |
| CN1885160A (en) * | 2005-06-24 | 2006-12-27 | 大日本网目版制造株式会社 | Substrate processing apparatus |
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| CN103721913A (en) | 2014-04-16 |
| CN102343327A (en) | 2012-02-08 |
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