CN103716980B - A kind of power module positive pole oxide-film printed base plate - Google Patents
A kind of power module positive pole oxide-film printed base plate Download PDFInfo
- Publication number
- CN103716980B CN103716980B CN201310745411.9A CN201310745411A CN103716980B CN 103716980 B CN103716980 B CN 103716980B CN 201310745411 A CN201310745411 A CN 201310745411A CN 103716980 B CN103716980 B CN 103716980B
- Authority
- CN
- China
- Prior art keywords
- heat sink
- power module
- film layer
- base plate
- positive pole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 13
- 238000003466 welding Methods 0.000 claims abstract description 11
- 230000000694 effects Effects 0.000 claims abstract description 9
- 238000009413 insulation Methods 0.000 claims abstract description 9
- 230000003647 oxidation Effects 0.000 claims abstract description 9
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 9
- 239000004020 conductor Substances 0.000 claims abstract description 8
- 238000003854 Surface Print Methods 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 230000001590 oxidative effect Effects 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000005516 engineering process Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 208000025599 Heat Stress disease Diseases 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Surface Heating Bodies (AREA)
Abstract
The invention discloses a kind of power module positive pole oxide-film printed base plate, including aluminum heat sink（1）, in the aluminum heat sink（1）Plate face up and down be equipped with the oxidation film layer of insulating effect（2）, and layer oxide film layer above（2）On be printed with insulation glue-line（3）, the insulation glue-line（3）Upper surface printing form DBC substrate circuits conductor paste（4）, the conductor paste（4）Upper welding chip, chip are connected with DBC substrate circuits.The present invention solves the problems, such as that heat sink flexural deformation and welding produce stomata, while simplifying production technology, facilitating processing and fabricating, reduction manufacturing cost, effectively ensure that the effect of radiating, substantially prolongs the service life of product.
Description
Technical field
The present invention relates to a kind of auto electric component, and specifically, more particularly to power module is printed with positive pole oxide-film
Substrate.
Background technology
General semiconductor chip is mounted on DBC substrates, and substrate is then welded on heat sink（Copper, aluminium）On make
Make.The product of the semi-conductor electricity source module produced at present be IGBT (Insulated Gate Bipolar Transistor),
Multiple chip module chemical conversion SPM such as FRD (Fast Recovery Diode), resistance chip, thermistor (thermistor)
(Smart Power Module), diode (led) module, IGBT module etc..
In order to make in the welding sequence required for product as described above, it may appear that it is many problem of.Wherein, heat sink
It is that caused thermal stress distributes in semiconductor chip for handle with DBC substrate welding sequences, enables the device of inside
Normal work.If caused heat can not distribute, internal components can be caused to damage, bad phenomenon occur.Generally as
MOSFET and IGBT etc. is used for the semi-conductor electricity source module for switching a large amount of power supplys, can produce substantial amounts of heat at work.This
A little heats can promote semi-conductor electricity source module excess load, cause device to make a mistake running, finally occur it is bad, and with device
Part durability degree declines, and makes the lost of life of product.
But according to the method described above, stomata will necessarily be produced when heat sink and DBC substrates weld, is caused under heat sinking function
Drop.In order to solve this problem, typically all use and welded under vacuum conditions, but the cost of equipment put into and maintenance
Expense is too high, and also need to be confirmed whether to weld with X-RAY it is intact, even and if detected with X-RAY, can not be complete
It is confirmed whether there is stomata, so generally product can be all put into water, and is confirmed whether to have stomata with ultrasonic wave, has so surveyed
Product cannot reuse, and can only be detected by way of stochastical sampling, so manufacturing cost can be caused to increase
Add.
In addition, when heat sink and the welding of DBC substrates, because of the principle expanded with heat and contract with cold, the plate benging that radiates may be caused, it is curved
The joint performance of quyi makes centre projection, can hinder to radiate after mounting.In order to solve problems, when heat sink is processed, bending
Position flexes certain radian process, but solve the problems, such as bent portion in this way, it is impossible to completely really
Protect product quality because welding after the elapsed time passage, the part bent originally may restore, so as to cause DBC bases
Plate departs from heat sink.
The content of the invention
The technical problems to be solved by the invention are that the plate benging that radiates can effectively be prevented by providing one kind, and ensure radiating effect
The power module of fruit positive pole oxide-film printed base plate.
Technical scheme is as follows：A kind of power module positive pole oxide-film printed base plate, including aluminum heat sink
（1）, in the aluminum heat sink（1）Plate face up and down be equipped with the oxidation film layer of insulating effect（2）, and one layer of oxidation above
Film layer（2）On be printed with insulation glue-line（3）, the insulation glue-line（3）Upper surface printing form DBC substrate circuits conductor paste
（4）, the conductor paste（4）Upper welding chip, chip are connected with DBC substrate circuits.
The present invention also simultaneously makes the circuit of DBC substrates when semiconductor module heat radiation plate is processed, and on the one hand produces work
Skill is simple, and processing and fabricating is easy, and production efficiency is high, and manufacturing cost is low；On the other hand, can effectively prevent from producing in welding process
Heat sink flexural deformation caused by heat stress, it both ensure that each several part was connected firmly, reliably, and will not loosen or depart from,
In turn ensure that the effect of radiating.Meanwhile the present invention will not produce stomata, avoid the heat dissipation characteristics caused by stomata and decline.This
Invention will be separated by oxidation film layer and insulating cement between heat sink and circuit substrate, is allowed to be not directly contacted with, is effectively avoided
The fatigue damage caused by heat fatigue, substantially prolongs the service life of product.
In order to facilitate processing and fabricating, the oxidation film layer（2）By aluminum heat sink（1）Surface using metal positive-pole aoxidize
Method is formed.
In order to reach good insulation effect, preferably, the oxidation film layer（2）Thickness be 50-100um.
Beneficial effect：The present invention solves the problems, such as that heat sink flexural deformation and welding produce stomata, and work is produced simplifying
Skill, facilitate processing and fabricating, reduce manufacturing cost while, effectively ensure that the effect of radiating, substantially prolongs the use of product
Life-span.
Brief description of the drawings
Fig. 1 is the structural representation of the present invention.
Embodiment
The invention will be further described with reference to the accompanying drawings and examples：
As shown in figure 1, aluminum heat sink 1 is flat structures, it has been equipped with absolutely in the plate face up and down of the aluminum heat sink 1
The oxidation film layer 2 of edge effect, the oxidation film layer 2 are formed by the surface of aluminum heat sink 1 using metal positive-pole oxidizing process, and are aoxidized
The thickness of film layer 2 is 50-100um.Insulation glue-line 3, the upper table of the insulation glue-line 3 are printed with layer oxide film layer 2 above
Face printing forms the conductor paste 4 of DBC substrate circuits, welding chip on the conductor paste 4, and chip is connected with DBC substrate circuits.
Claims (3)
1. a kind of power module positive pole oxide-film printed base plate, including aluminum heat sink (1), it is characterised in that：Aluminum radiates
Plate (1) is flat structures, and the oxidation film layer (2) of insulating effect has been equipped with the plate face up and down of the aluminum heat sink (1), and
Insulation glue-line (3) is printed with layer oxide film layer (2) above, the upper surface printing of the insulation glue-line (3) forms DBC substrates electricity
The conductor paste (4) on road, welding chip on the conductor paste (4), chip are connected with DBC substrate circuits.
2. the power module positive pole oxide-film printed base plate according to claims 1, it is characterised in that：The oxide-film
Layer (2) is formed by the surface of aluminum heat sink (1) using metal positive-pole oxidizing process.
3. the power module positive pole oxide-film printed base plate according to claims 1 or 2, it is characterised in that：The oxygen
The thickness for changing film layer (2) is 50-100um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310745411.9A CN103716980B (en) | 2013-12-30 | 2013-12-30 | A kind of power module positive pole oxide-film printed base plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310745411.9A CN103716980B (en) | 2013-12-30 | 2013-12-30 | A kind of power module positive pole oxide-film printed base plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103716980A CN103716980A (en) | 2014-04-09 |
| CN103716980B true CN103716980B (en) | 2017-12-05 |
Family
ID=50409408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310745411.9A Active CN103716980B (en) | 2013-12-30 | 2013-12-30 | A kind of power module positive pole oxide-film printed base plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103716980B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102016112602A1 (en) * | 2016-07-08 | 2018-01-11 | Danfoss Silicon Power Gmbh | Low-inductance power module design |
| CN109741859B (en) * | 2019-02-28 | 2020-10-16 | 业成科技（成都）有限公司 | Transparent conductive film substrate and manufacturing method thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4206915B2 (en) * | 2002-12-27 | 2009-01-14 | 三菱マテリアル株式会社 | Power module substrate |
| CN201084746Y (en) * | 2007-08-17 | 2008-07-09 | 广东昭信光电科技有限公司 | A low-cost high-power LED encapsulation structure |
| CN201601892U (en) * | 2009-12-09 | 2010-10-06 | 常州市超顺电子技术有限公司 | Circuit board directly prepared on aluminum base plate or aluminum base radiating plate |
| CN203661409U (en) * | 2013-12-30 | 2014-06-18 | 重庆博耐特实业（集团）有限公司 | Positive pole oxidation film printed substrate used for power supply module |
-
2013
- 2013-12-30 CN CN201310745411.9A patent/CN103716980B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN103716980A (en) | 2014-04-09 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20171107 Address after: 350200, 5, 1203, azure coast, Zhangzhou Port Street, Fuzhou, Fujian, Changle Applicant after: Chen Wen Address before: 401120 No. 16 Xiang Road, Yubei District Airport Industrial Center, Chongqing Applicant before: Chongqing Bonet Industrial (Group) Co., Ltd. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: 210098 Xikang Road, Drum Tower District, Nanjing, Jiangsu Province, No. 1 Patentee after: Chen Wen Address before: 350200 5 zhangchun street, Zhanggang District, Changle, Fuzhou, Fujian 1203 Patentee before: Chen Wen |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190326 Address after: 434000 No. 114 Jingzhou Middle Road, Jingzhou District, Jingzhou City, Hubei Province Patentee after: Ou Yongheng Address before: 210098 Xikang Road, Drum Tower District, Nanjing, Jiangsu Province, No. 1 Patentee before: Chen Wen |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190711 Address after: 226100 Fuxing Road, Yuet Lai Town, Haimen, Nantong, Jiangsu, 20 Patentee after: Nantong excellent art design Co., Ltd. Address before: 434000 No. 114 Jingzhou Middle Road, Jingzhou District, Jingzhou City, Hubei Province Patentee before: Ou Yongheng |