CN103716980A - Positive electrode oxidation film printing substrate used for power module - Google Patents
Positive electrode oxidation film printing substrate used for power module Download PDFInfo
- Publication number
- CN103716980A CN103716980A CN201310745411.9A CN201310745411A CN103716980A CN 103716980 A CN103716980 A CN 103716980A CN 201310745411 A CN201310745411 A CN 201310745411A CN 103716980 A CN103716980 A CN 103716980A
- Authority
- CN
- China
- Prior art keywords
- oxidation film
- power module
- positive electrode
- film layer
- heating panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 22
- 238000007254 oxidation reaction Methods 0.000 title claims abstract description 16
- 230000003647 oxidation Effects 0.000 title claims abstract description 14
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000003466 welding Methods 0.000 claims abstract description 11
- 230000000694 effects Effects 0.000 claims abstract description 9
- 239000004020 conductor Substances 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 7
- 238000010438 heat treatment Methods 0.000 claims description 20
- 238000009413 insulation Methods 0.000 claims description 7
- 238000003854 Surface Print Methods 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 230000001590 oxidative effect Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000005516 engineering process Methods 0.000 abstract description 4
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 239000011148 porous material Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 230000005855 radiation Effects 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Surface Heating Bodies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a positive electrode oxidation film printing substrate used for a power module. The substrate comprises an aluminum heat dissipating plate (1), wherein the upper plate face and the lower plate face of the aluminum heat dissipating plate (1) are respectively provided with an oxidization film layer (2) having the insulating effect, an insulating paste layer (3) is printed on the oxidization film layer (2) on the upper face, conductor paste (4) forming a DBC substrate circuit is printed on the upper surface of the insulating paste layer (3), a chip is welded to the conductor paste (4), and the chip is connected with the DBC substrate circuit. The positive electrode oxidation film printing substrate solves the problems that the heat dissipating plate bends and deforms, and air holes are generated in the welding process, the production technology is simplified, the substrate is convenient to machine and manufacture, the heat dissipating effect is effectively guaranteed while the manufacturing cost is lowered, and the service life of the positive electrode oxidation film printing substrate is greatly prolonged.
Description
Technical field
The present invention relates to a kind of auto electric member, specifically, particularly anodal oxide-film printed base plate for power module.
Background technology
General semiconductor chip is mounted on DBC substrate, then substrate is welded on heating panel (copper, aluminium) and is made.The product of the semi-conductor electricity source module of producing is at present IGBT (Insulated Gate Bipolar Transistor), FRD (Fast Recovery Diode), resistance chip, a plurality of chip modules such as thermistor (thermistor) change into SPM (Smart Power Module), diode (led) module, IGBT module etc.
In order to make in the needed welding sequence of product as above, there will be a lot of problems.Wherein, heating panel and DBC substrate welding sequence are for the thermal stress producing in semiconductor chip being distributed, inner device can normally being worked.If the heat producing can not distribute, can cause internal components to damage, there is bad phenomenon.General as MOSFET and IGBT etc. for switching the semi-conductor electricity source module of a large amount of power supplys, when work, can produce a large amount of heats.These heats can impel semi-conductor electricity source module excess load, cause the device running that makes a mistake, and finally occur badly, and along with device durability degree declines, make the lost of life of product.
But according to the method described above, when heating panel and the welding of DBC substrate, will inevitably produce pore, cause heat sinking function to decline.In order to address this problem, generally all adopt under vacuum state and weld, but the cost of equipment and the upkeep cost that drop into are too high, but also need to be confirmed whether to weld intact with X-RAY, even if detect with X-RAY, can not full confirmation whether there is pore, so conventionally all product can be put into water, and be confirmed whether pore with ultrasonic wave, the product of having surveyed so just can not re-use, and can only detect by the mode of stochastical sampling, so can cause manufacturing cost to increase.
In addition, when heating panel and the welding of DBC substrate, because of the principle of expanding with heat and contract with cold, may cause heating panel crooked, bending can make centre projection, after installation, can hinder heat radiation.In order to solve problems, at heating panel, add man-hour, in crooked position flexes certain radian, process, but solve by this way the problem of sweep, can not guarantee the quality of product completely, because the passing in elapsed time after welding, originally crooked part may be restored, thereby causes DBC substrate and heating panel to depart from.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of can effectively prevent that heating panel is crooked, and guarantees the anodal oxide-film printed base plate for power module of radiating effect.
Technical scheme of the present invention is as follows: anodal oxide-film printed base plate for a kind of power module, comprise aluminum heating panel (1), at the upper and lower plates face of described aluminum heating panel (1), be equipped with the oxidation film layer (2) of insulating effect, and on layer oxide film layer (2), be printed with insulation glue-line (3) above, the upper surface printing of this insulation glue-line (3) forms the conductor paste (4) of DBC substrate circuit, the upper welding chip of described conductor paste (4), chip is connected with DBC substrate circuit.
The present invention adds and man-hour the circuit of DBC substrate is also made simultaneously at semiconductor module heat radiation plate, and production technology is simple on the one hand, and processing and fabricating is easy, and production efficiency is high, low cost of manufacture; On the other hand, can effectively prevent from welding process, producing the heating panel flexural deformation that thermal stress causes, both guarantee that each several part was connected firmly, reliably, can not occur loosening or depart from, guarantee again the effect of heat radiation.Meanwhile, the present invention can not produce pore, has avoided the heat dissipation characteristics causing because of pore to decline.The present invention will separate between heating panel and circuit substrate by oxidation film layer and insulating cement, makes it directly not contact, and has effectively avoided the fatigue damage that causes because of thermal fatigue, has greatly extended the useful life of product.
In order to facilitate processing and fabricating, described oxidation film layer (2) adopts metal positive-pole oxidizing process to form by the surface of aluminum heating panel (1).
In order to reach good insulation effect, as preferably, the thickness of described oxidation film layer (2) is 50-100um.
Beneficial effect: the invention solves the problem that heating panel flexural deformation and welding produce pore, simplifying production technology, facilitate processing and fabricating, reduce manufacturing cost in, effectively guaranteed the effect of heat radiation, greatly extended the useful life of product.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Embodiment
Below in conjunction with drawings and Examples, the invention will be further described:
As shown in Figure 1, aluminum heating panel 1 is plain film structure, at the upper and lower plates face of described aluminum heating panel 1, be equipped with the oxidation film layer 2 of insulating effect, this oxidation film layer 2 adopts metal positive-pole oxidizing process to form by the surface of aluminum heating panel 1, and the thickness of oxidation film layer 2 is 50-100um.On layer oxide film layer 2, be printed with insulation glue-line 3 in the above, the upper surface printing of this insulation glue-line 3 forms the conductor paste 4 of DBC substrate circuit, welding chip on described conductor paste 4, and chip is connected with DBC substrate circuit.
Claims (3)
1. an anodal oxide-film printed base plate for power module, comprise aluminum heating panel (1), it is characterized in that: the oxidation film layer (2) that has been equipped with insulating effect at the upper and lower plates face of described aluminum heating panel (1), and on layer oxide film layer (2), be printed with insulation glue-line (3) above, the upper surface printing of this insulation glue-line (3) forms the conductor paste (4) of DBC substrate circuit, the upper welding chip of described conductor paste (4), chip is connected with DBC substrate circuit.
2. according to anodal oxide-film printed base plate for the power module described in claims 1, it is characterized in that: described oxidation film layer (2) adopts metal positive-pole oxidizing process to form by the surface of aluminum heating panel (1).
3. according to anodal oxide-film printed base plate for the power module described in claims 1 or 2, it is characterized in that: the thickness of described oxidation film layer (2) is 50-100um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310745411.9A CN103716980B (en) | 2013-12-30 | 2013-12-30 | A kind of power module positive pole oxide-film printed base plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310745411.9A CN103716980B (en) | 2013-12-30 | 2013-12-30 | A kind of power module positive pole oxide-film printed base plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103716980A true CN103716980A (en) | 2014-04-09 |
| CN103716980B CN103716980B (en) | 2017-12-05 |
Family
ID=50409408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310745411.9A Active CN103716980B (en) | 2013-12-30 | 2013-12-30 | A kind of power module positive pole oxide-film printed base plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103716980B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018007062A1 (en) * | 2016-07-08 | 2018-01-11 | Danfoss Silicon Power Gmbh | Low-inductance power module design |
| CN109741859A (en) * | 2019-02-28 | 2019-05-10 | 业成科技（成都）有限公司 | Transparent conductive film substrate and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040188828A1 (en) * | 2002-12-27 | 2004-09-30 | Mitsubishi Materials Corporation | Heat-conducting multilayer substrate and power module substrate |
| CN201084746Y (en) * | 2007-08-17 | 2008-07-09 | 广东昭信光电科技有限公司 | A low-cost high-power LED encapsulation structure |
| CN201601892U (en) * | 2009-12-09 | 2010-10-06 | 常州市超顺电子技术有限公司 | Circuit board directly prepared on aluminum base plate or aluminum base radiating plate |
| CN203661409U (en) * | 2013-12-30 | 2014-06-18 | 重庆博耐特实业（集团）有限公司 | Positive pole oxidation film printed substrate used for power supply module |
-
2013
- 2013-12-30 CN CN201310745411.9A patent/CN103716980B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040188828A1 (en) * | 2002-12-27 | 2004-09-30 | Mitsubishi Materials Corporation | Heat-conducting multilayer substrate and power module substrate |
| CN201084746Y (en) * | 2007-08-17 | 2008-07-09 | 广东昭信光电科技有限公司 | A low-cost high-power LED encapsulation structure |
| CN201601892U (en) * | 2009-12-09 | 2010-10-06 | 常州市超顺电子技术有限公司 | Circuit board directly prepared on aluminum base plate or aluminum base radiating plate |
| CN203661409U (en) * | 2013-12-30 | 2014-06-18 | 重庆博耐特实业（集团）有限公司 | Positive pole oxidation film printed substrate used for power supply module |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018007062A1 (en) * | 2016-07-08 | 2018-01-11 | Danfoss Silicon Power Gmbh | Low-inductance power module design |
| CN109741859A (en) * | 2019-02-28 | 2019-05-10 | 业成科技（成都）有限公司 | Transparent conductive film substrate and preparation method thereof |
| CN109741859B (en) * | 2019-02-28 | 2020-10-16 | 业成科技（成都）有限公司 | Transparent conductive film substrate and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103716980B (en) | 2017-12-05 |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| TA01 | Transfer of patent application right |
Effective date of registration: 20171107 Address after: 350200, 5, 1203, azure coast, Zhangzhou Port Street, Fuzhou, Fujian, Changle Applicant after: Chen Wen Address before: 401120 No. 16 Xiang Road, Yubei District Airport Industrial Center, Chongqing Applicant before: Chongqing Bonet Industrial (Group) Co., Ltd. |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder |
Address after: 210098 Xikang Road, Drum Tower District, Nanjing, Jiangsu Province, No. 1 Patentee after: Chen Wen Address before: 350200 5 zhangchun street, Zhanggang District, Changle, Fuzhou, Fujian 1203 Patentee before: Chen Wen |
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| CP02 | Change in the address of a patent holder | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190326 Address after: 434000 No. 114 Jingzhou Middle Road, Jingzhou District, Jingzhou City, Hubei Province Patentee after: Ou Yongheng Address before: 210098 Xikang Road, Drum Tower District, Nanjing, Jiangsu Province, No. 1 Patentee before: Chen Wen |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190711 Address after: 226100 Fuxing Road, Yuet Lai Town, Haimen, Nantong, Jiangsu, 20 Patentee after: Nantong excellent art design Co., Ltd. Address before: 434000 No. 114 Jingzhou Middle Road, Jingzhou District, Jingzhou City, Hubei Province Patentee before: Ou Yongheng |
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| TR01 | Transfer of patent right |