CN111489890B - Manufacturing method of patch power inductor - Google Patents
Manufacturing method of patch power inductor Download PDFInfo
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- CN111489890B CN111489890B CN201910078314.6A CN201910078314A CN111489890B CN 111489890 B CN111489890 B CN 111489890B CN 201910078314 A CN201910078314 A CN 201910078314A CN 111489890 B CN111489890 B CN 111489890B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
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Abstract
The invention relates to the field of inductors, which has the technical problems of high sintering process temperature, less selection of magnetic powder, large size, poor magnetic shielding property and the like in the field of manufacturing of the conventional inductors. Therefore, the invention provides a manufacturing method of a patch power inductor, which comprises the following steps: manufacturing a coil, manufacturing an upper substrate and a lower substrate, manufacturing a magnetic printing layer, placing the coil, placing the upper substrate, curing and cutting, arranging an upper electrode and electroplating. The magnetic powder material has multiple selectivity, and the manufactured chip inductor has the advantages of small size, good magnetic shielding property, high saturation characteristic, high efficiency, high-density packaging, high production efficiency and the like.
Description
Technical Field
The invention relates to the field of inductors, in particular to a manufacturing method of a patch power inductor combining a winding process and a multilayer printing technology.
Background
As electronic components are developed in a direction of miniaturization, low mounting thickness, low electromagnetic interference, and high efficiency, inductors inevitably meet such a trend. Therefore, there is a trend in the market to produce inductors with small size, low electromagnetic interference, high inductance, high saturation characteristics, and high efficiency. The chip power inductor is one of important products of electronic components, has the characteristics of high Q value, low impedance, capability of providing braid packaging and the like, and is widely applied to a switching power supply. The performance of the inductor directly affects the performance of the switching power supply, for example, miniaturization is beneficial to reducing the volume of the whole switching power supply; the low EMI ensures that electronic components cannot interfere with each other, and the higher-density packaging is realized; the high inductance value helps to reduce the ripple size of the switching power supply; the high saturation current can transmit more power; high efficiency can reduce its power consumption.
The patch power inductor mainly comprises three parts, namely a magnetic powder material, a conductive coil and a terminal electrode. The patch power inductors can be classified into three categories according to their manufacturing methods: wire wound chip inductors, integrally molded inductors, and multilayer chip inductors. The wire wound chip inductor is made by winding an enameled copper wire on a framework, wherein the framework is made of magnetic powder materials through high-density pressing and high-temperature sintering (higher than 600 ℃), the high-temperature sintering limits the selectivity of the powder materials, and the magnetic powder materials comprise ferrite powder materials (MnZn ferrite, NiZn ferrite, NiCuZn ferrite and the like) and part of alloy powder materials (Fe-Si-Cr, Fe-Si-Cr-Al and the like) with good high-temperature resistance. The ferrite powder has poor direct current superposition characteristics, which results in poor saturation characteristics of the wound chip inductor. The integrated inductor is formed by pressing an enameled coil and magnetic powder without a high-temperature sintering process, and the used magnetic powder comprises soft magnetic alloy powder (carbonyl Fe, Fe-Si-Cr, Fe-Si-Al and the like), amorphous powder (Fe-Si-B and the like), nanocrystalline powder (Fe-Si-B-Cu-Nb and the like) and the like. Therefore, compared with the wound chip inductor, the magnetic powder material of the integrally formed inductor is selected more, has the characteristics of higher saturation characteristic and higher efficiency, and is gradually replacing the wound chip inductor. However, the wire-wound inductor and the integrally formed inductor have great difficulty in developing the inductor in a smaller size direction due to the limitation of the manufacturing process. The multilayer chip inductor is an inductor made by adopting a multilayer printing technology, an internal conductive coil is conductor silver, and a high-temperature sintering process is also needed, so that the selection of magnetic powder materials is limited, and the multilayer chip inductor comprises ferrite powder and part of alloy powder with good high-temperature resistance, and also has the problems of poor inductance saturation characteristic and low efficiency.
Therefore, the development of a chip power inductor which does not need a high-temperature sintering process, has the advantages of multiple magnetic powder materials, small size, good magnetic shielding property, high saturation characteristic, high efficiency, high-density packaging and high production efficiency is a problem to be solved by the technical staff in the field.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides a manufacturing method of a patch power inductor, which comprises the following steps:
the first step is as follows: manufacturing a coil, winding the coil by a winding machine, and then bending and stripping paint on pin parts at two ends of the coil;
the second step is that: manufacturing an upper substrate and a lower substrate, adding organic matters into the powder, manufacturing the upper substrate and the lower substrate by a ball milling process and a tape casting method, wherein the thicknesses of the upper substrate and the lower substrate are both 80-300 mu m;
the third step: manufacturing a magnetic printing layer, adding an organic matter into the powder, preparing magnetic slurry through a rolling and grinding process, printing the magnetic slurry on the surface of the lower substrate manufactured in the second step, drying at 60-80 ℃, and repeating the printing step until the thickness of the printing layer reaches 350-450 mu m;
the fourth step: placing a coil, namely placing the coil manufactured in the first step in the middle of the magnetic printing layer manufactured in the third step;
the fifth step: placing an upper substrate, placing the upper substrate manufactured in the second step above the coil, and laminating the upper substrate and the coil into a whole through a laminating process;
and a sixth step: curing and cutting, namely curing the patch power inductor processed in the step at the temperature of 80-200 ℃, and then cutting the cured patch power inductor;
the seventh step: upper end electrodes, wherein connecting wire ends are manufactured at two ends of the chip power inductor processed in the step;
eighth step: and electroplating, namely plating a Ni layer and a Sn layer on the terminal electrode manufactured in the previous step.
The coil material in the step one is an enameled copper wire and consists of a conductor copper and an insulating varnish coating;
the bending treatment specifically includes: the bending angle of the pins at the two ends is 20-80 degrees;
the paint stripping treatment specifically comprises the following steps: and removing the insulating layer on the surface of the enameled copper wire by using a laser paint stripping machine.
The substrate in the second step and the magnetic slurry in the third step are as follows: at least one of carbonyl Fe powder, Fe-Si powder, Fe-Al powder, Fe-Cr powder, Fe-Si-Al powder, Fe-Si-Cr powder, Fe-Al-Cr powder, Fe-Ni-Mo powder, Fe-based amorphous powder and Fe-based nanocrystalline powder.
In the seventh step, the terminal electrode material is selected from low-temperature silver paste, and the silver firing temperature is 100-300 ℃;
and in the eighth step, the thickness of the Ni layer is more than 1 μm, and the thickness of the Sn layer is more than 5 μm.
The organic matter is one or more of the following components: silane coupling agent, epoxy resin and acrylic resin.
The invention has the beneficial effects that: the manufacturing method is characterized in that the winding process of the integrally formed inductor and the multilayer printing technology of the laminated chip inductor are combined, the manufactured chip inductor does not need to be subjected to a high-temperature sintering process, the magnetic powder material has high selectivity, and meanwhile, the chip inductor has the advantages of small size, good magnetic shielding property, high saturation characteristic, high efficiency, high-density packaging, high production efficiency and the like.
Drawings
Fig. 1 is a schematic perspective view of the present invention.
Fig. 2 is a schematic diagram of the coil structure of the present invention.
Fig. 3 is a schematic view of a coil structure after bending and stripping of paint.
Fig. 4 is a schematic cross-sectional structure view of the magnetic printing layer of the present invention.
Fig. 5 is a schematic perspective view of the silver-terminated structure of the present invention.
Wherein: 1-lower substrate, 2-coil, 3-magnetic printing layer, 4-upper substrate, 5-two-end pins, 6-two-end pins after bending and stripping paint, 7-base body and 8-end electrode.
Detailed Description
A manufacturing method of a patch power inductor comprises the following steps:
the first step is as follows: manufacturing a coil 2, winding the coil 2 through a winding machine, and then bending and stripping paint on the pins 5 at two ends of the coil 2;
the second step is that: manufacturing an upper substrate 4 and a lower substrate 1, adding organic matters into powder, manufacturing the upper substrate 4 and the lower substrate 1 through a ball milling process and a tape casting mode, wherein the thicknesses of the upper substrate 4 and the lower substrate 1 are both 80-300 mu m;
the third step: manufacturing a magnetic printing layer 3, adding organic matters into the powder, preparing magnetic slurry through a rolling and grinding process, printing the magnetic slurry on the surface of the lower substrate 1 manufactured in the second step, drying at 60-80 ℃, and repeating the printing step until the thickness of the printing layer reaches 350-450 mu m;
the fourth step: placing the coil 2, and placing the coil 2 manufactured in the first step in the middle of the magnetic printing layer 3 manufactured in the third step;
the fifth step: placing an upper substrate 4, placing the upper substrate 4 manufactured in the second step above the coil 2, and pressing the upper substrate 4 into a whole through a laminating process;
and a sixth step: curing and cutting, namely curing the patch power inductor processed in the step at the temperature of 80-200 ℃, and then cutting the cured patch power inductor;
the seventh step: an upper electrode 8, wherein connecting wire ends are manufactured at two ends of the chip power inductor processed in the step;
eighth step: and electroplating, namely plating a Ni layer and a Sn layer on the terminal electrode 8 which is manufactured in the previous step.
The coil material in the step one is an enameled copper wire and consists of a conductor copper and an insulating varnish coating;
the bending treatment specifically includes: the bending angle of the pins 5 at the two ends is 20-80 degrees;
the paint stripping treatment specifically comprises the following steps: and removing the insulating layer on the surface of the enameled copper wire by using a laser paint stripping machine.
The substrate in the second step and the magnetic slurry in the third step are as follows: at least one of carbonyl Fe powder, Fe-Si powder, Fe-Al powder, Fe-Cr powder, Fe-Si-Al powder, Fe-Si-Cr powder, Fe-Al-Cr powder, Fe-Ni-Mo powder, Fe-based amorphous powder and Fe-based nanocrystalline powder.
In the seventh step, the material of the terminal electrode 8 is selected from low-temperature silver paste, and the silver firing temperature is 100-300 ℃;
and in the eighth step, the thickness of the Ni layer is more than 1 μm, and the thickness of the Sn layer is more than 5 μm.
The product of the embodiment mainly consists of a coil 2, a base body 7 and a terminal electrode 8. The coil 2 is arranged in the base body 7, the coil pin 5 is connected with the terminal electrode 8, and the base body 7 comprises three parts, namely a lower substrate 1, a magnetic printing layer 3 and an upper substrate 4.
In this embodiment, the manufacturing method of the patch power inductor of the present invention is as follows: as shown in fig. 2, an enameled copper wire is wound into a coil 2 through a winding machine, the number of turns of the coil 2 is 5.5, then the pin 5 is bent through a bending machine, the contact area between the bent pin and the end electrode 8 is increased, paint stripping treatment is performed on the bent pin, good conductivity of the pin is ensured, and the bent paint stripping coil 2 is shown in fig. 3. Taking carbonyl Fe powder, Fe-Si-Cr powder and Fe-based amorphous powder in a certain mass ratio of 3:4:3, adding 0.2wt% of silane coupling agent, 1.5wt% of epoxy resin and 0.5wt% of acrylic resin into a solvent based on the powder, uniformly dissolving, and casting into a film belt by adopting a ball milling process and a casting process, wherein the film thickness is 300 mu m, and the film belt is used as an upper substrate 4 and a lower substrate 1; adding 0.2wt% of silane coupling agent and 1.5wt% of epoxy resin into a solvent according to the proportion of carbonyl Fe powder, Fe-Si-Cr powder and Fe-based amorphous powder, and preparing magnetic printing slurry by a three-roll milling process; printing the pattern shown in FIG. 4 on the surface of the lower substrate 1 by using the above magnetic printing paste, baking at 65 ℃ for 5 min, and printing for multiple times until the thickness reaches 350-450 μm, wherein the black part is the printing position (i.e. the position of the magnetic printing layer 3) and the white part is the non-printing position (i.e. the position of the coil 2) in FIG. 4; placing the coil 2 in the figure 3 at a white position in the figure 4, then placing the upper substrate 4 right above the coil 2, pressing the coil into a whole by a laminating process, baking the whole at 180 ℃ for 2 hours to improve the mechanical strength of the product, and cutting the product according to the designed size; the upper end electrode 8, the end electrode material is selected from low temperature silver paste, the silver firing condition is 150-; finally, electroplating treatment is carried out, wherein the thickness of the Ni layer is more than 1 μm, and the thickness of the Sn layer is more than 5 μm.
Claims (4)
1. A manufacturing method of a patch power inductor is characterized by comprising the following steps:
the first step is as follows: manufacturing a coil, winding the coil by a winding machine, and then bending and stripping paint on pin parts at two ends of the coil;
the second step is that: manufacturing an upper substrate and a lower substrate, adding organic matters into the powder, manufacturing the upper substrate and the lower substrate by a ball milling process and a tape casting method, wherein the thicknesses of the upper substrate and the lower substrate are both 80-300 mu m;
the third step: manufacturing a magnetic printing layer, adding an organic matter into the powder, preparing magnetic slurry through a rolling and grinding process, printing the magnetic slurry on the surface of the lower substrate manufactured in the second step, drying at 60-80 ℃, and repeating the printing step until the thickness of the printing layer reaches 350-450 mu m;
the fourth step: placing a coil, namely placing the coil manufactured in the first step in the middle of the magnetic printing layer manufactured in the third step;
the fifth step: placing an upper substrate, placing the upper substrate manufactured in the second step above the coil, and laminating the upper substrate and the coil into a whole through a laminating process;
and a sixth step: curing and cutting, namely curing the patch power inductor processed in the step at the temperature of 80-200 ℃, and then cutting the cured patch power inductor;
the seventh step: upper end electrodes, wherein connecting wire ends are manufactured at two ends of the chip power inductor processed in the step;
eighth step: electroplating, namely plating a Ni layer and a Sn layer on the terminal electrode manufactured in the previous step;
wherein, in the seventh step, the terminal electrode material is selected from low-temperature silver paste, and the silver firing temperature is 100-300 ℃;
and in the eighth step, the thickness of the Ni layer is more than 1 μm, and the thickness of the Sn layer is more than 5 μm.
2. The method of claim 1, wherein the method comprises: the coil material in the step one is an enameled copper wire and consists of a conductor copper and an insulating varnish coating;
the bending treatment specifically includes: the bending angle of the pins at the two ends is 20-80 degrees;
the paint stripping treatment specifically comprises the following steps: and removing the insulating layer on the surface of the enameled copper wire by using a laser paint stripping machine.
3. The method of claim 1, wherein the method comprises: the substrate in the second step and the magnetic slurry in the third step include: at least one of carbonyl Fe powder, Fe-Si powder, Fe-Al powder, Fe-Cr powder, Fe-Si-Al powder, Fe-Si-Cr powder, Fe-Al-Cr powder, Fe-Ni-Mo powder, Fe-based amorphous powder and Fe-based nanocrystalline powder.
4. The method of claim 1, wherein the organic material is one or more of the following: silane coupling agent, epoxy resin and acrylic resin.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910078314.6A CN111489890B (en) | 2019-01-28 | 2019-01-28 | Manufacturing method of patch power inductor |
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| CN201910078314.6A CN111489890B (en) | 2019-01-28 | 2019-01-28 | Manufacturing method of patch power inductor |
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| CN113963928B (en) * | 2021-11-30 | 2022-11-25 | 横店集团东磁股份有限公司 | Power inductor and preparation method thereof |
| CN114464439B (en) * | 2022-02-20 | 2024-05-17 | 广东创芯电子有限公司 | Shielded power patch inductor and forming method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000012332A (en) * | 1998-06-25 | 2000-01-14 | Tokin Corp | Laminated inductance element and its manufacture |
| JP2004095991A (en) * | 2002-09-03 | 2004-03-25 | Fdk Corp | Laminated inductor and its manufacturing method |
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| CN103387388B (en) * | 2012-05-07 | 2015-08-26 | 深圳振华富电子有限公司 | Ferrite Material, small-sized big current lamination sheet type wideband magnetic bead and its preparation method |
| CN104425121B (en) * | 2013-08-27 | 2017-11-21 | 三积瑞科技（苏州）有限公司 | Inlay the manufacture method of buried alloy inductance |
| CN105679529A (en) * | 2016-01-14 | 2016-06-15 | 深圳顺络电子股份有限公司 | Magnetic device and manufacturing method thereof |
| CN105551712B (en) * | 2016-03-11 | 2017-07-18 | 深圳市固电电子有限公司 | A kind of chip ceramic electrical sensor and preparation method thereof |
| CN205406223U (en) * | 2016-03-11 | 2016-07-27 | 深圳市固电电子有限公司 | Piece formula pottery inductor |
| CN107039732B (en) * | 2016-06-08 | 2022-08-19 | 深圳振华富电子有限公司 | Laminated sheet type power distribution module and manufacturing method thereof |
| CN106653356B (en) * | 2016-11-30 | 2018-10-16 | 广东风华邦科电子有限公司 | A kind of preparation method of Stacked magnetic bead |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000012332A (en) * | 1998-06-25 | 2000-01-14 | Tokin Corp | Laminated inductance element and its manufacture |
| JP2004095991A (en) * | 2002-09-03 | 2004-03-25 | Fdk Corp | Laminated inductor and its manufacturing method |
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