CN103712721A - 一种soi压力应变计及其制作方法 - Google Patents
一种soi压力应变计及其制作方法 Download PDFInfo
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- CN103712721A CN103712721A CN201310719756.7A CN201310719756A CN103712721A CN 103712721 A CN103712721 A CN 103712721A CN 201310719756 A CN201310719756 A CN 201310719756A CN 103712721 A CN103712721 A CN 103712721A
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Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105043606A (zh) * | 2015-07-10 | 2015-11-11 | 东南大学 | 一种电容式压力传感器及其制备方法 |
CN105091730A (zh) * | 2015-07-03 | 2015-11-25 | 新会康宇测控仪器仪表工程有限公司 | 一种dsoi应变计及其制作方法 |
CN105424236A (zh) * | 2015-11-19 | 2016-03-23 | 南京信息工程大学 | 一种多量程阵列式压力传感芯片及其检测方法 |
CN106197834A (zh) * | 2016-08-31 | 2016-12-07 | 洛阳卓为微电子技术有限公司 | 一种低漂移dsoi压力传感器 |
EP3156771A4 (en) * | 2014-06-13 | 2017-11-22 | Multidimension Technology Co., Ltd. | Sensor chip for multi-physical quantity measurement and preparation method therefor |
CN107462192A (zh) * | 2017-09-11 | 2017-12-12 | 重庆大学 | 一种基于soi和压电薄膜的声表面波高温应变传感器芯片及其制备方法 |
CN107607098A (zh) * | 2017-10-17 | 2018-01-19 | 西北工业大学 | 芯片级mems旋转调制陀螺制备方法 |
US10067597B2 (en) | 2016-01-29 | 2018-09-04 | Shanghai Tianma Micro-electronics Co., Ltd. | Array substrate and display panel |
US10234978B2 (en) | 2016-01-29 | 2019-03-19 | Shanghai Tianma Micro-electronics Co., Ltd. | Array substrate and display panel |
CN113728217A (zh) * | 2019-04-26 | 2021-11-30 | 长野计器株式会社 | 压力传感器 |
CN116202661A (zh) * | 2023-01-10 | 2023-06-02 | 苏州锐光科技有限公司 | 压力传感器及其制作方法 |
CN116242246A (zh) * | 2023-05-12 | 2023-06-09 | 广东润宇传感器股份有限公司 | 一种超薄型全边框耐高温的半导体应变计及其制备方法 |
RU2803024C1 (ru) * | 2022-12-29 | 2023-09-05 | Александр Александрович Цывин | Групповой способ изготовления упругих элементов тензорезисторных датчиков силы |
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CN101082525A (zh) * | 2007-07-06 | 2007-12-05 | 天津大学 | 一种新型压阻式压力传感器及其制备方法 |
WO2008043061A2 (en) * | 2006-10-05 | 2008-04-10 | Endevco Corporation | Highly sensitive piezoresistive element |
US20090078547A1 (en) * | 2007-09-21 | 2009-03-26 | Kurtz Anthony D | Pressure switch employing silicon on insulator (SOI) technology |
CN202710219U (zh) * | 2012-06-29 | 2013-01-30 | 慧石(上海)测控科技有限公司 | Soi压力传感芯片结构 |
CN102980692A (zh) * | 2012-11-19 | 2013-03-20 | 西安微纳传感器研究所有限公司 | 一种高温耐冲击压力传感器及其制备方法 |
CN203643063U (zh) * | 2013-12-23 | 2014-06-11 | 新会康宇测控仪器仪表工程有限公司 | 一种soi压力应变计 |
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2013
- 2013-12-23 CN CN201310719756.7A patent/CN103712721B/zh active Active
Patent Citations (6)
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WO2008043061A2 (en) * | 2006-10-05 | 2008-04-10 | Endevco Corporation | Highly sensitive piezoresistive element |
CN101082525A (zh) * | 2007-07-06 | 2007-12-05 | 天津大学 | 一种新型压阻式压力传感器及其制备方法 |
US20090078547A1 (en) * | 2007-09-21 | 2009-03-26 | Kurtz Anthony D | Pressure switch employing silicon on insulator (SOI) technology |
CN202710219U (zh) * | 2012-06-29 | 2013-01-30 | 慧石(上海)测控科技有限公司 | Soi压力传感芯片结构 |
CN102980692A (zh) * | 2012-11-19 | 2013-03-20 | 西安微纳传感器研究所有限公司 | 一种高温耐冲击压力传感器及其制备方法 |
CN203643063U (zh) * | 2013-12-23 | 2014-06-11 | 新会康宇测控仪器仪表工程有限公司 | 一种soi压力应变计 |
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10942048B2 (en) | 2014-06-13 | 2021-03-09 | MultiDimension Technology Co., Ltd. | Sensor chip used for multi-physical quantity measurement and preparation method thereof |
EP3156771A4 (en) * | 2014-06-13 | 2017-11-22 | Multidimension Technology Co., Ltd. | Sensor chip for multi-physical quantity measurement and preparation method therefor |
CN105091730A (zh) * | 2015-07-03 | 2015-11-25 | 新会康宇测控仪器仪表工程有限公司 | 一种dsoi应变计及其制作方法 |
CN105043606A (zh) * | 2015-07-10 | 2015-11-11 | 东南大学 | 一种电容式压力传感器及其制备方法 |
CN105424236A (zh) * | 2015-11-19 | 2016-03-23 | 南京信息工程大学 | 一种多量程阵列式压力传感芯片及其检测方法 |
US10234978B2 (en) | 2016-01-29 | 2019-03-19 | Shanghai Tianma Micro-electronics Co., Ltd. | Array substrate and display panel |
US10067597B2 (en) | 2016-01-29 | 2018-09-04 | Shanghai Tianma Micro-electronics Co., Ltd. | Array substrate and display panel |
CN106197834A (zh) * | 2016-08-31 | 2016-12-07 | 洛阳卓为微电子技术有限公司 | 一种低漂移dsoi压力传感器 |
CN107462192A (zh) * | 2017-09-11 | 2017-12-12 | 重庆大学 | 一种基于soi和压电薄膜的声表面波高温应变传感器芯片及其制备方法 |
CN107462192B (zh) * | 2017-09-11 | 2023-06-23 | 重庆大学 | 一种基于soi和压电薄膜的声表面波高温应变传感器芯片及其制备方法 |
CN107607098B (zh) * | 2017-10-17 | 2020-09-22 | 西北工业大学 | 芯片级mems旋转调制陀螺制备方法 |
CN107607098A (zh) * | 2017-10-17 | 2018-01-19 | 西北工业大学 | 芯片级mems旋转调制陀螺制备方法 |
CN113728217A (zh) * | 2019-04-26 | 2021-11-30 | 长野计器株式会社 | 压力传感器 |
CN113728217B (zh) * | 2019-04-26 | 2023-05-23 | 长野计器株式会社 | 压力传感器 |
RU2803024C1 (ru) * | 2022-12-29 | 2023-09-05 | Александр Александрович Цывин | Групповой способ изготовления упругих элементов тензорезисторных датчиков силы |
CN116202661A (zh) * | 2023-01-10 | 2023-06-02 | 苏州锐光科技有限公司 | 压力传感器及其制作方法 |
CN116202661B (zh) * | 2023-01-10 | 2023-09-29 | 苏州锐光科技有限公司 | 压力传感器及其制作方法 |
CN116242246A (zh) * | 2023-05-12 | 2023-06-09 | 广东润宇传感器股份有限公司 | 一种超薄型全边框耐高温的半导体应变计及其制备方法 |
CN116242246B (zh) * | 2023-05-12 | 2023-10-03 | 广东润宇传感器股份有限公司 | 一种超薄型全边框耐高温的半导体应变计及其制备方法 |
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Effective date of registration: 20230413 Address after: Room 01, Block 1, No. 18 Huichenghui Road, Xinhui District, Jiangmen City, Guangdong Province, 529100 Patentee after: GUANGDONG HEYU SENSOR CO.,LTD. Patentee after: SHANGHAI DANYU SENSOR TECHNOLOGY Co.,Ltd. Patentee after: Guangdong Runyu Sensor Co.,Ltd. Address before: 529100 main workshop of Guifeng hi tech Industrial Village, Ximen Road, Huicheng, Xinhui District, Jiangmen City, Guangdong Province Patentee before: GUANGDONG HEYU SENSOR CO.,LTD. Patentee before: SHANGHAI DANYU SENSOR TECHNOLOGY Co.,Ltd. |