CN103700653A - LED (Light-Emitting Diode) light source packaging structure - Google Patents
LED (Light-Emitting Diode) light source packaging structure Download PDFInfo
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- CN103700653A CN103700653A CN201310684275.7A CN201310684275A CN103700653A CN 103700653 A CN103700653 A CN 103700653A CN 201310684275 A CN201310684275 A CN 201310684275A CN 103700653 A CN103700653 A CN 103700653A
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Abstract
The invention relates to an LED (Light-Emitting Diode) light source packaging structure, which comprises an LED chip, a bottom plate and a cover plate. The LED chip is fixedly arranged on the bottom plate. The cover plate covers the bottom plate. A holding tank is formed after the cover plate and the bottom plate are closed and is used for holding the LED chip. Transparent colloids are arranged in the holding tank to cover the LED chip. The LED chip is in hot connection with the bottom plate. The bottom plate is integrally made of a transparent or semi-transparent heat conducting material by mixing with fluorescent powder. The cover plate is made of a transparent or semi-transparent material and fluorescent powder is arranged on the cover plate at a position corresponding to the LED chip. The LED light source packaging structure not only can realize large-angle light emission, but also has the advantage of high heat dissipating efficiency.
Description
Technical field
The present invention relates to LED light source field, particularly a kind of LED light source encapsulating structure.
Background technology
LED light source is the new light sources of environmental protection, be widely used in lighting field at present, current, on market, existing LED encapsulating structure has multiplely, and the packing forms of current 4 π LED light sources mainly contains: the one, and chip is arranged on transparency carrier and is directly encapsulated; The 2nd, chip is installed on transparency carrier, be then encapsulated in the transparent unit that scribbles phosphor powder layer.Existing 4 π LED light sources have separately transparent substrate, LED chip is encapsulated on substrate simultaneously and adopt apply phosphor powder layer form exist the hidden danger that fluorescent material comes off, poor reliability.Also there is at present the packing forms that adopts fluorescent material to mix with transparent resin, for example Granted publication day is on November 27th, 2013, Granted publication number has disclosed a kind of LED light source module of high light efficiency for the Chinese utility model patent of CN203309561U, comprise transparency carrier 1, on transparency carrier 1, be fixed with LED chip array, the outer whole parcel one deck potting resin 3 of LED chip array and transparency carrier, the LED light source module packaging technical that encapsulation forms is like this complicated, and exist the large heat-sinking capability of thermal resistance low, the problems such as resin is aging, thereby greatly affect and shortened the performance and used life of LED chip.
Summary of the invention
In view of this, be necessary to provide a kind of LED light source encapsulating structure of simple in structure, good reliability.
A kind of LED light source encapsulating structure, comprise LED chip, base plate and cover plate, described LED chip is fixed on this base plate, this cover plate covers on this base plate, this cover plate and this base plate cover rear formation accepting groove to accommodate described LED chip, in this accepting groove, be provided with coated this LED chip of transparent colloid, this LED chip and this base plate hot link, this base plate is made into integration by transparent or semitransparent Heat Conduction Material mixed fluorescent powder, this cover plate by transparent or semitransparent material, made and on it corresponding described LED chip be provided with fluorescent material.
Compared with prior art, these LED chips are located in the accepting groove that this cover plate and this base plate cover rear formation and are coated by transparent colloid, the light that these LED chips send can be simultaneously to this cover plate and the transmitting of this base plate, this cover plate and this base plate are made by transparent or semitransparent material, and the fluorescent material that light excites the two is dispersed and to realize 360 full angles luminous to surrounding simultaneously.Like this, because this LED chip direct heat is connected on this base plate, this base plate is provided with fluorescent material and is directly connected with the external world, makes this LED light source encapsulating structure not only can realize wide-angle luminous, and has advantages of that radiating efficiency is high.
Accompanying drawing explanation
Fig. 1 is the generalized section of LED light source encapsulating structure the first embodiment of the present invention.
Fig. 2 is the cutaway view along A-A line direction in Fig. 1.
Fig. 3 is the partial enlarged drawing of B part in Fig. 2.
Description of reference numerals:
10 LED chip 20 base plate 30 cover plates
40 accepting groove 50 transparent colloid 60 gold threads
70 conducting end 21 trapezoidal groove 31 light output grooves
Embodiment
Below in conjunction with accompanying drawing and embodiment, the present invention is described in further detail.
Fig. 1 is the structural representation of LED light source encapsulating structure the first embodiment of the present invention.Please refer to Fig. 1, this LED light source encapsulating structure comprises LED chip 10, base plate 20 and cover plate 30, and these LED chips 10 are fixed on this base plate 20, these LED chips 10 and these base plate 20 hot links.
Please refer to Fig. 1 to Fig. 3, this base plate 20 is made into integration by transparent or semitransparent Heat Conduction Material mixed fluorescent powder, and preferred, this base plate 20 has good chemical compatibility by fluorescent material and with fluorescent material and infiltrating transparent high heat conduction inorganic material is made.This base plate 20 is provided with trapezoidal groove 21(as shown in Figure 3), these LED chips 10 are fixed on the bottom of this trapezoidal groove 21, and the two side of this trapezoidal groove 21 is for ease of the curved wall structure of these LED chip 10 bright dippings.Comprise a plurality of LED chips 10, many gold threads 60 and two conducting end 70, these LED chips 10 are connected in series by gold thread 60, these conducting end 70 are connected electrically in respectively the both sides of this LED chip 10 by gold thread 60, these conducting end 70 lay respectively at the two ends of this base plate 20.This base plate 20 is semicylinder structure with this cover plate 30, and this base plate 20 covers rear formation column structure with cover plate 30.
Please refer to Fig. 1 to Fig. 3, this cover plate 30 covers on this base plate 20, passes through heat-conducting glue hot link between this cover plate 30 and this base plate 20.These cover plate 30 material therefors are identical with this base plate 20, this cover plate 30 by transparent or semitransparent material, made and on it corresponding described LED chip 10 be provided with fluorescent material.This cover plate 30 covers rear formation accepting groove 40 to accommodate these LED chips 10 with this base plate 20, is provided with coated this LED chip 10 of transparent colloid 50 in this accepting groove 40, and this transparent colloid 50 is made by highly heat-conductive material, this transparent colloid 50 and these cover plate 30 hot links.This cover plate 30 is provided with light output groove 31, and this light output groove 31 coordinates with this trapezoidal groove 21 and forms this accepting groove 40, this light output groove 31 be shaped as the deep-slotted chip breaker of being convenient to described LED chip 10 bright dippings.
In sum, these LED chips 10 are located in the accepting groove 40 that this cover plate 30 and this base plate 20 cover rear formation and are coated by transparent colloid 50, the light that these LED chips 10 send can be simultaneously to this cover plate and the transmitting of this base plate, this cover plate 30 is made by transparent or semitransparent material with this base plate 20, and the fluorescent material that light excites the two is dispersed and to realize 360 full angles luminous to surrounding.Like this, because these LED chip 10 direct heat are connected on this base plate 20, this base plate 20 is provided with fluorescent material and is directly connected with the external world, heat on LED chip 10 can directly diffuse to the external world by this base plate 20, it is luminous that this just makes this LED light source encapsulating structure not only can realize wide-angle, and have advantages of that radiating efficiency is high.In addition, this base plate 20 is provided with the trapezoidal groove 21 of curved wall and the light output groove 31 that this cover plate 30 is provided with arc, coordinates and forms this accepting groove 40, and the light that these LED chips 10 are sent is more even respectively.In addition, the heat part that these LED chips 10 produce directly distributes by this base plate 20 of hot linked high heat conduction with it, another part is delivered on this cover plate 30 by this transparent colloid 50 of high heat conduction and distributes, owing to utilizing this transparent colloid 50 to realize comprehensive heat radiation, make the heat radiation of this LED light source encapsulating structure better.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, any those skilled in the art are not within departing from this programme technical scope, and that utilize that the technology contents of above-mentioned exposure does a little change is the equal equivalent embodiment changing.In every case depart from technical solution of the present invention content, according to the technology of the present invention essence to any modification made for any of the above embodiments, be equal to replacement, improvement etc., within all should being included in the scope of protection of the invention.
Claims (8)
1. a LED light source encapsulating structure, comprise LED chip, base plate and cover plate, described LED chip is fixed on this base plate, it is characterized in that: this cover plate covers on this base plate, this cover plate and this base plate cover rear formation accepting groove to accommodate described LED chip, in this accepting groove, be provided with coated this LED chip of transparent colloid, this LED chip and this base plate hot link, this base plate is made into integration by transparent or semitransparent Heat Conduction Material mixed fluorescent powder, this cover plate by transparent or semitransparent material, made and on it corresponding described LED chip be provided with fluorescent material.
2. LED light source encapsulating structure according to claim 1, is characterized in that: this base plate has good chemical compatibility by fluorescent material and with fluorescent material and infiltrating transparent heat conduction inorganic material is made.
3. LED light source encapsulating structure according to claim 1, is characterized in that: this transparent colloid is made by Heat Conduction Material, this transparent colloid and this cover plate hot link.
4. LED light source encapsulating structure according to claim 1, is characterized in that: this base plate is provided with trapezoidal groove, and described LED chip is fixed on the bottom of this trapezoidal groove, and the two side of this trapezoidal groove is for ease of the curved wall structure of described LED chip bright dipping.
5. LED light source encapsulating structure according to claim 4, is characterized in that: this cover plate is provided with light output groove, and this light output groove coordinates with this trapezoidal groove and forms this accepting groove, this light output groove be shaped as the deep-slotted chip breaker of being convenient to described LED chip bright dipping.
6. according to the LED light source encapsulating structure described in any one in claim 1-5, it is characterized in that: this cover plate material therefor is identical with this base plate, between this cover plate and this base plate, pass through heat-conducting glue hot link.
7. LED light source encapsulating structure according to claim 6, is characterized in that: this base plate and this cover plate are semicylinder structure, and this base plate and cover plate cover rear formation column structure.
8. LED light source encapsulating structure according to claim 1, it is characterized in that: comprise a plurality of LED chips, many gold threads and two conducting end, described LED chip is connected in series by gold thread, described conducting end is connected electrically in respectively the both sides of this LED chip by gold thread, described conducting end lays respectively at the two ends of this base plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310684275.7A CN103700653B (en) | 2013-12-14 | 2013-12-14 | LED (Light-Emitting Diode) light source packaging structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310684275.7A CN103700653B (en) | 2013-12-14 | 2013-12-14 | LED (Light-Emitting Diode) light source packaging structure |
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| CN103700653A true CN103700653A (en) | 2014-04-02 |
| CN103700653B CN103700653B (en) | 2017-01-18 |
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| CN201310684275.7A Active CN103700653B (en) | 2013-12-14 | 2013-12-14 | LED (Light-Emitting Diode) light source packaging structure |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104300073A (en) * | 2014-11-04 | 2015-01-21 | 常州晶玺照明有限公司 | 360-degree complete cycle type LED lamp filament based on purple light chips |
| EP2942825A1 (en) * | 2014-05-08 | 2015-11-11 | Guan-Jie Luo | White light emitting diode, manufacturing method and packaging material thereof |
| WO2016109941A1 (en) * | 2015-01-06 | 2016-07-14 | 厦门星际电器有限公司 | Improved all-plastic led lamp |
| CN105895788A (en) * | 2014-05-08 | 2016-08-24 | 罗冠杰 | Sheet type white light emitting diode, method for preparing sheet type white light emitting diode and packaging adhesive material |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050206298A1 (en) * | 2004-03-22 | 2005-09-22 | Lee Hyeong R | Flat panel fluorescent lamp and fabricating method thereof |
| CN201126826Y (en) * | 2007-09-05 | 2008-10-01 | 昌鑫光电（东莞）有限公司 | Light emitting diode capable of bidirectional luminescence and heat radiation |
| CN202338805U (en) * | 2011-11-29 | 2012-07-18 | 苏州晶能科技有限公司 | LED (light-emitting diode) transparent light-emitting device capable of enhancing heat dissipation |
| CN102856475A (en) * | 2012-09-05 | 2013-01-02 | 苏州金科信汇光电科技有限公司 | Full-angle luminous LED (light-emitting diode) chip encapsulation structure |
| CN103035823A (en) * | 2012-12-18 | 2013-04-10 | 浙江中宙光电股份有限公司 | Fluorescent powder body capable of exciting light-emitting diode (LED) white light |
| CN103367622A (en) * | 2013-07-05 | 2013-10-23 | 江苏华英光宝科技股份有限公司 | Full-angle luminous LED (light emitting diode) support frame as well as LED lamp post comprising support frame and preparation method of LED lamp post |
| CN103398316A (en) * | 2013-08-27 | 2013-11-20 | 江苏华英光宝科技股份有限公司 | High-transparency ultrathin quartz crystal heat-radiation panel LED (Light Emitting Diode) light source |
| CN103441207A (en) * | 2013-08-30 | 2013-12-11 | 华南理工大学 | All-angle even-light-emitting high-power LED lamp bar with fluorescent powder and chips separated |
| CN103441205A (en) * | 2013-08-22 | 2013-12-11 | 厦门多彩光电子科技有限公司 | Light-emitting LED device with 360-degree light emitting function |
-
2013
- 2013-12-14 CN CN201310684275.7A patent/CN103700653B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050206298A1 (en) * | 2004-03-22 | 2005-09-22 | Lee Hyeong R | Flat panel fluorescent lamp and fabricating method thereof |
| CN201126826Y (en) * | 2007-09-05 | 2008-10-01 | 昌鑫光电（东莞）有限公司 | Light emitting diode capable of bidirectional luminescence and heat radiation |
| CN202338805U (en) * | 2011-11-29 | 2012-07-18 | 苏州晶能科技有限公司 | LED (light-emitting diode) transparent light-emitting device capable of enhancing heat dissipation |
| CN102856475A (en) * | 2012-09-05 | 2013-01-02 | 苏州金科信汇光电科技有限公司 | Full-angle luminous LED (light-emitting diode) chip encapsulation structure |
| CN103035823A (en) * | 2012-12-18 | 2013-04-10 | 浙江中宙光电股份有限公司 | Fluorescent powder body capable of exciting light-emitting diode (LED) white light |
| CN103367622A (en) * | 2013-07-05 | 2013-10-23 | 江苏华英光宝科技股份有限公司 | Full-angle luminous LED (light emitting diode) support frame as well as LED lamp post comprising support frame and preparation method of LED lamp post |
| CN103441205A (en) * | 2013-08-22 | 2013-12-11 | 厦门多彩光电子科技有限公司 | Light-emitting LED device with 360-degree light emitting function |
| CN103398316A (en) * | 2013-08-27 | 2013-11-20 | 江苏华英光宝科技股份有限公司 | High-transparency ultrathin quartz crystal heat-radiation panel LED (Light Emitting Diode) light source |
| CN103441207A (en) * | 2013-08-30 | 2013-12-11 | 华南理工大学 | All-angle even-light-emitting high-power LED lamp bar with fluorescent powder and chips separated |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2942825A1 (en) * | 2014-05-08 | 2015-11-11 | Guan-Jie Luo | White light emitting diode, manufacturing method and packaging material thereof |
| CN105895788A (en) * | 2014-05-08 | 2016-08-24 | 罗冠杰 | Sheet type white light emitting diode, method for preparing sheet type white light emitting diode and packaging adhesive material |
| CN104300073A (en) * | 2014-11-04 | 2015-01-21 | 常州晶玺照明有限公司 | 360-degree complete cycle type LED lamp filament based on purple light chips |
| WO2016109941A1 (en) * | 2015-01-06 | 2016-07-14 | 厦门星际电器有限公司 | Improved all-plastic led lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103700653B (en) | 2017-01-18 |
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Effective date of registration: 20170119 Address after: Xingtai Industrial Park Economic Development Zone, Changtai County, Fujian city of Zhangzhou province 363999 Patentee after: ZHANGZHOU LIDAXIN PHOTOELECTRON TECHNOLOGY CO., LTD. Address before: 363999 Xingda Road, Fujian city of Zhangzhou province Changtai Xingtai County Development Zone Patentee before: Leedarson Green Lighting Co., Ltd. |