CN103700635B - 一种带腔体的芯片封装结构及其封装方法 - Google Patents
一种带腔体的芯片封装结构及其封装方法 Download PDFInfo
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- CN103700635B CN103700635B CN201310727342.9A CN201310727342A CN103700635B CN 103700635 B CN103700635 B CN 103700635B CN 201310727342 A CN201310727342 A CN 201310727342A CN 103700635 B CN103700635 B CN 103700635B
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- chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310727342.9A CN103700635B (zh) | 2013-12-25 | 2013-12-25 | 一种带腔体的芯片封装结构及其封装方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201310727342.9A CN103700635B (zh) | 2013-12-25 | 2013-12-25 | 一种带腔体的芯片封装结构及其封装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103700635A CN103700635A (zh) | 2014-04-02 |
CN103700635B true CN103700635B (zh) | 2017-01-18 |
Family
ID=50362119
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201310727342.9A Active CN103700635B (zh) | 2013-12-25 | 2013-12-25 | 一种带腔体的芯片封装结构及其封装方法 |
Country Status (1)
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CN (1) | CN103700635B (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105281706B (zh) * | 2015-11-06 | 2018-05-25 | 江苏长电科技股份有限公司 | 一种声表面波滤波器封装结构及制造方法 |
CN107734216B (zh) * | 2016-08-12 | 2023-12-26 | 宁波舜宇光电信息有限公司 | 阵列摄像模组及其模塑感光组件和制造方法以及带有阵列摄像模组的电子设备 |
JP7025345B2 (ja) | 2016-03-28 | 2022-02-24 | ニンボー サニー オプテック カンパニー,リミテッド | カメラモジュールおよび成型された感光性アセンブリおよびその製造方法、および電子デバイス |
CN106449479A (zh) * | 2016-09-30 | 2017-02-22 | 山东盛品电子技术有限公司 | 用于芯片区域裸露封装的单元封装体模具及精准成型模具 |
CN109524372A (zh) * | 2018-12-29 | 2019-03-26 | 山东盛品电子技术有限公司 | 封装结构、解决传感器芯片封装后封装体内部应力的方法 |
CN110061069A (zh) * | 2019-04-30 | 2019-07-26 | 烟台艾睿光电科技有限公司 | 一种wlp器件封装产品 |
CN112309872A (zh) * | 2019-07-30 | 2021-02-02 | 苏州远创达科技有限公司 | 一种多芯片模块的封装工艺 |
CN110987280A (zh) * | 2019-12-02 | 2020-04-10 | 歌尔科技有限公司 | 防水防尘压力传感器及其加工方法 |
CN112694060A (zh) * | 2020-12-22 | 2021-04-23 | 青岛歌尔微电子研究院有限公司 | Mems封装结构及其封装方法 |
CN115190706A (zh) * | 2022-07-06 | 2022-10-14 | 连云港杰瑞电子有限公司 | 一种电子产品的双面封装结构 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1602555A (zh) * | 2001-04-10 | 2005-03-30 | 奥斯兰姆奥普托半导体有限责任公司 | 辐射元件的芯片引线架、辐射元件及其制造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20100080423A (ko) * | 2008-12-30 | 2010-07-08 | 삼성엘이디 주식회사 | 발광소자 패키지 및 그 제조방법 |
US8039862B2 (en) * | 2009-03-10 | 2011-10-18 | Nepes Led Corporation | White light emitting diode package having enhanced white lighting efficiency and method of making the same |
CN101764114A (zh) * | 2009-12-30 | 2010-06-30 | 上海凯虹电子有限公司 | 一种倒装式封装结构及其制作方法 |
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2013
- 2013-12-25 CN CN201310727342.9A patent/CN103700635B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1602555A (zh) * | 2001-04-10 | 2005-03-30 | 奥斯兰姆奥普托半导体有限责任公司 | 辐射元件的芯片引线架、辐射元件及其制造方法 |
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CN103700635A (zh) | 2014-04-02 |
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Address after: 100085 Beijing city Haidian District on the seven Street No. 1, building 2, room 710, Shanghai Patentee after: BEIJING WILL CREATE TECHNOLOGY Co.,Ltd. Address before: 100085 Beijing city Haidian District on the seven Street No. 1, building 2, room 710, Shanghai Patentee before: BEIJING BEETECH TECHNOLOGY CO.,LTD. |
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Effective date of registration: 20230619 Address after: 233010 6 # factory building in the intelligent display industrial park at the west side of H-2 Road, the south side of Xinghua Road, Changqing Township, Yuhui District, Bengbu Free Trade Pilot Zone, Bengbu City, Anhui Province Patentee after: Anhui Jingxin Sensor Technology Co.,Ltd. Address before: Room 710, Building 2, Huizhong, No.1 Shangdiqi Street, Haidian District, Beijing, 100085 Patentee before: BEIJING WILL CREATE TECHNOLOGY Co.,Ltd. |