CN103681607A - 半导体器件及其制作方法 - Google Patents
半导体器件及其制作方法 Download PDFInfo
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- CN103681607A CN103681607A CN201310142037.3A CN201310142037A CN103681607A CN 103681607 A CN103681607 A CN 103681607A CN 201310142037 A CN201310142037 A CN 201310142037A CN 103681607 A CN103681607 A CN 103681607A
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- semiconductor element
- conductive pole
- substrate
- semiconductor
- conductive
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Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Geometry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (15)
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US13/800,807 US9559039B2 (en) | 2012-09-17 | 2013-03-13 | Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package |
US13/800807 | 2013-03-13 |
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CN105321926A (zh) * | 2014-06-30 | 2016-02-10 | 恒劲科技股份有限公司 | 封装装置及其制作方法 |
CN106531636A (zh) * | 2015-09-09 | 2017-03-22 | 三星电子株式会社 | 制造半导体芯片封装件的方法和制造半导体封装件的方法 |
CN106935556A (zh) * | 2015-12-31 | 2017-07-07 | 三星电子株式会社 | 半导体封装件及其制造方法 |
CN107978566A (zh) * | 2016-10-21 | 2018-05-01 | 力成科技股份有限公司 | 堆叠封装结构的制造方法 |
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US9312193B2 (en) | 2012-11-09 | 2016-04-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Stress relief structures in package assemblies |
KR20140126598A (ko) * | 2013-04-23 | 2014-10-31 | 삼성전자주식회사 | 반도체 패키지 및 그 제조 방법 |
JP2015076465A (ja) * | 2013-10-08 | 2015-04-20 | イビデン株式会社 | プリント配線板、プリント配線板の製造方法、パッケージ−オン−パッケージ |
TWI550791B (zh) * | 2014-01-16 | 2016-09-21 | 矽品精密工業股份有限公司 | 半導體封裝件及其製法 |
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KR101563909B1 (ko) | 2014-08-19 | 2015-10-28 | 앰코 테크놀로지 코리아 주식회사 | 패키지 온 패키지 제조 방법 |
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US10181447B2 (en) | 2017-04-21 | 2019-01-15 | Invensas Corporation | 3D-interconnect |
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US11735570B2 (en) * | 2018-04-04 | 2023-08-22 | Intel Corporation | Fan out packaging pop mechanical attach method |
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CN107978566A (zh) * | 2016-10-21 | 2018-05-01 | 力成科技股份有限公司 | 堆叠封装结构的制造方法 |
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US20170098610A1 (en) | 2017-04-06 |
US9559039B2 (en) | 2017-01-31 |
SG10201601736QA (en) | 2016-04-28 |
TW201413845A (zh) | 2014-04-01 |
US10242948B2 (en) | 2019-03-26 |
SG2013051404A (en) | 2014-04-28 |
CN103681607B (zh) | 2019-01-18 |
TWI623048B (zh) | 2018-05-01 |
US20140077389A1 (en) | 2014-03-20 |
SG10201800267XA (en) | 2018-02-27 |
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