CN103681560B - A kind of grooving type IGBT module base plate and IGBT module - Google Patents
A kind of grooving type IGBT module base plate and IGBT module Download PDFInfo
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- CN103681560B CN103681560B CN201210361568.7A CN201210361568A CN103681560B CN 103681560 B CN103681560 B CN 103681560B CN 201210361568 A CN201210361568 A CN 201210361568A CN 103681560 B CN103681560 B CN 103681560B
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Abstract
A kind of grooving type IGBT module base plate, it is curved, the solder side surface of described grooving type IGBT module base plate is provided with at least two groovings that the solder side of base plate is divided into multiple block of cells, described grooving type IGBT module base plate is connected with some substrates in order to weld igbt chip, and what described grooving was located between grooving type IGBT module base plate solder side surface and described adjacent substrate is spaced the position that center line is corresponding.The present invention carries out channel design by the solder side surface at curved plate, with this, solder side grooving of base plate is divided into a few block of cells, it is arranged such, when module is installed, module base plate solder side is owing to the presence of grooving, in the mounted state, can reduce the stress of module base plate further, increase module base plate and effective contact area of radiator, improve module heat dissipating ability and reliability.
Description
Technical field
The present invention relates to technical field of semiconductors, particularly relate to a kind of grooving type IGBT module base plate.
Background technology
Insulated gate bipolar transistor (Insulated Gate Bipolar Transistor is called for short IGBT in full) tool
There are altofrequency, high voltage, big electric current, the performance characteristics that the most easily turns on and off, are the power electronics generally acknowledged in the world
The most representational product of technology third time revolution, had evolved to for the 6th generation so far, and commercialization had evolved to for the 5th generation.
IGBT module is mainly used in major loop inverter and all inverter circuits of converter, i.e.
In DC/AC conversion.The current novel power transistor with IGBT module as representative is high-frequency power electronic circuit and controls system
System core switching components and parts, be widely used in electric locomotive, high voltage power transmission and transforming, electric automobile, servo controller, UPS,
The field such as Switching Power Supply, power of chopping, market prospect is the best.
And IGBT module directly decides power electronics system as the core devices of power electronic system, its performance parameter
The Performance And Reliability of system.IGBT module base plate, as the main thoroughfare of inside modules chip cooling, is the main of IGBT module
One of assembly, heat dispersion and reliability on module have important impact, therefore, in IGBT module package fabrication process
In, the design to base plate constantly carries out new material, the research of new technique and application, with promote IGBT module heat dispersion and can
By property.
As shown in Figure 1 to Figure 3, in currently available technology, IGBT module base plate uses copper, aluminum, aluminium silicon carbide three kinds mostly
Material is made, and Structural Design of Bedplate uses plate base plate and curved plate design mostly.Curved plate and the plate end
Plate is compared, and under module installment state, increases effective contact area of module base plate and radiator, and reducing module base plate should
Power, can improve heat-sinking capability and the reliability of module.But comparatively speaking, under module installment state, module base plate still has
Stress exists, and this stress can affect heat-sinking capability and the reliability of module, optimizes Structural Design of Bedplate the most further, reduces peace
Dress state lower module base sheet stresses, it is ensured that the reliability of module, is one of the direction of IGBT module encapsulation technology development.
Therefore, for above-mentioned technical problem, it is necessary to provide one to have structure improved grooving type IGBT module base plate,
To overcome drawbacks described above.
Summary of the invention
In view of this, it is an object of the invention to provide a kind of grooving type IGBT module base plate, this grooving type IGBT module
Base plate can reduce module installment state lower shoe stress further, increases module base plate and effective contact area of radiator, carries
High module heat dissipating ability and reliability.
For achieving the above object, the present invention provides following technical scheme:
A kind of grooving type IGBT module base plate, it is curved, and the solder side surface of described grooving type IGBT module base plate sets
There are at least two groovings that the solder side of base plate is divided into multiple block of cells, described grooving type IGBT module base plate and some use
Connecting with the substrate of welding igbt chip, grooving type IGBT module base plate solder side surface and described adjacent base are located in described grooving
Position corresponding to center line, interval between plate.
Preferably, in above-mentioned grooving type IGBT module base plate, described grooving is crisscross arranged each other.
Preferably, in above-mentioned grooving type IGBT module base plate, the upper and lower surface phase of described grooving type IGBT module base plate
The most parallel.
A kind of IGBT module, if it includes curved plate, the stem substrate being welded on curved plate, is arranged on substrate
Igbt chip, the solder side surface of described curved plate is provided with and the solder side of curved plate is divided into multiple block of cells at least
Article two, grooving, the interval center line between grooving type IGBT module base plate solder side surface and described adjacent substrate is located in described grooving
Corresponding position.
Preferably, in above-mentioned IGBT module, described grooving is crisscross arranged each other.
Preferably, in above-mentioned IGBT module, the upper and lower surface of described curved plate is parallel to each other.
From technique scheme it can be seen that the grooving type IGBT module base plate of the embodiment of the present invention is by curved plate
Solder side surface carry out channel design, specifically dig along substrate interval center line on the solder side surface of existing curved plate
Groove, is divided into a few block of cells with this by the solder side grooving of base plate, is arranged such, module install time, module base plate solder side by
In with the presence of grooving, in the mounted state, having of the stress of module base plate, increase module base plate and radiator can be reduced further
Effect contact area, improves module heat dissipating ability and reliability.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
In having technology to describe, the required accompanying drawing used is briefly described, it should be apparent that, for the present invention in describing below
Accompanying drawing is only some embodiments of the present invention, for those of ordinary skill in the art, is not paying creative work
Under premise, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the partial schematic diagram of a kind of IGBT module with plate IGBT module base plate in prior art；
Fig. 2 is the partial schematic diagram of a kind of IGBT module with arc IGBT module base plate in prior art；
Fig. 3 is the structural representation of arc IGBT module base plate in Fig. 2；
Fig. 4 is the structural representation of grooving type IGBT module base plate of the present invention；
The position view of grooving when Fig. 5 is to have four pieces of substrates on grooving type IGBT module base plate of the present invention；
The position view of grooving when Fig. 6 is to have six pieces of substrates on grooving type IGBT module base plate of the present invention.
Detailed description of the invention
The invention discloses a kind of grooving type IGBT module base plate, this grooving type IGBT module base plate can reduce mould further
Block installment state lower shoe stress, increases module base plate and effective contact area of radiator, improves module heat dissipating ability and can
By property.
This grooving type IGBT module base plate, it is curved, and the solder side surface of described grooving type IGBT module base plate is provided with
The solder side of base plate is divided at least two groovings of multiple block of cells, described grooving type IGBT module base plate with some in order to
The substrate of welding igbt chip connects, and grooving type IGBT module base plate solder side surface and described adjacent substrate are located in described grooving
Between position corresponding to center line, interval.
Further, described grooving is crisscross arranged each other.
Further, the upper and lower surface of described grooving type IGBT module base plate is parallel to each other.
The invention also discloses a kind of IGBT module, if it include curved plate, the stem substrate being welded on curved plate,
The igbt chip being arranged on substrate, the solder side surface of described curved plate is provided with and is divided into many by the solder side of curved plate
At least two groovings of individual block of cells, grooving type IGBT module base plate solder side surface and described adjacent substrate are located in described grooving
Between position corresponding to center line, interval.
Further, described grooving is crisscross arranged each other.
Further, the upper and lower surface of described curved plate is parallel to each other.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out detailed retouching
State, it is clear that described embodiment is only a part of embodiment of the present invention rather than whole embodiments.Based on the present invention
In embodiment, the every other enforcement that those of ordinary skill in the art are obtained on the premise of not making creative work
Example, broadly falls into the scope of protection of the invention.
As shown in Figure 4, grooving type IGBT module base plate 10 disclosed by the invention is curved.At the bottom of described grooving type IGBT module
The solder side surface of plate 10 is provided with at least two groovings 20 that the solder side of base plate is divided into multiple block of cells.Described grooving type
IGBT module base plate 10 is connected with some substrates 30 in order to weld igbt chip, and grooving type IGBT module is located in described grooving 20
Position corresponding to center line 40, interval between base plate 10 solder side surface with described adjacent substrate 30.
Grooving type IGBT module base plate 10 structure designs, and concrete needs makes material, the area of base plate and thickness according to base plate
The difference of degree etc., is optimized the degree of depth, width and grooving 20 shape of grooving 20.Strong in order to ensure the due machinery of base plate
Degree, grooving 20 can not be the deepest.Because the distance between substrate 30 is limited, grooving 20 can not be wide.Choosing of grooving 20 shape, leads
Will be from the standpoint of stress uniformity.Suggestion uses " u "-shaped grooving, but concrete grooving 20 size need to consider and determines, at this
It is not specifically limited.
In conjunction with as shown in Figures 3 and 4, the present invention is unlike existing curved plate structure, at existing curved plate
Solder side surface carries out channel design, specifically carries out grooving, the end of by curved plate solder side surface along substrate interval center line
The solder side grooving of plate is divided into a few block of cells.So, when module is installed, module base plate solder side is owing to there being depositing of grooving 20
, in the mounted state, the stress of module base plate can be reduced further, increase module base plate and effective contact surface of radiator
Long-pending, improve module heat dissipating ability and reliability.
The curved plate structure that the grooving type IGBT module base plate 10 of present invention design is parallel to each other for upper and lower surface.
It can be seen that described two groovings 20 of the embodiment of the present invention are crisscross arranged each other.Certainly, at it
In his embodiment, it is not necessarily to the form being arranged to interlock.
IGBT module disclosed by the invention, if it includes curved plate, the stem substrate being welded on curved plate, is arranged at
Igbt chip on substrate.The solder side surface of described curved plate is provided with and the solder side of curved plate is divided into multiple community
At least two groovings of block.Described grooving is located between grooving type IGBT module base plate solder side surface and described adjacent substrate
The position that interval center line is corresponding.Described grooving is crisscross arranged each other.
Curved plate in the IGBT module of present invention design is the curved plate structure that upper and lower surface is parallel to each other.
As shown in Figures 5 and 6, Fig. 5 and Fig. 6 is the three-view diagram of the new base arrangement with substrate position signal.Fig. 5 shows
The position of grooving when having four pieces of substrates on base plate.Fig. 6 shows the position of grooving when having six pieces of substrates on base plate, for containing more
The base plate of many or less substrates, grooving position can be by that analogy.
In order to illustrate that grooving type IGBT module base plate 10 structure can reduce base sheet stresses under module installment state further,
Respectively to existing curved plate with dig grooved bottom board stress distribution under the conditions of equal mounting torque and emulate, during emulation
Use following structure:
Base plate is fastened this state on a heat sink by screw and sets up geometric model, use existing arcuate bottom
Plate structure (as shown in Figure 3), another side then uses grooving type base arrangement (as shown in Figure 4) that the present invention designs.
Use the distribution situation of as above geometric model emulation module installment state lower shoe stress, in identical simulated conditions
Under, base arrangement of the prior art with the stress distribution situation of the base arrangement of the present invention is:
The base arrangement of the prior art stress intensity in territory, substrate lands is between 95822～900630Pa；This
The base arrangement of the invention stress intensity in territory, substrate lands is between 121250～378280Pa.
Contrast finds, substrate weld, and the stress of the base arrangement of the present invention is less than base arrangement of the prior art
Stress, and the whole base arrangement stress distribution of the present invention is more uniform, the area of stress homogeneous area is bigger, therefore, it can
Illustrating under module installment state, the grooving type IGBT module bottom board structure of the present invention can reduce base sheet stresses further, makes
Module base plate is bigger with effective contact area of radiator, improves the heat-sinking capability of module, improves the reliability of module.
In sum, the grooving type IGBT module base plate 10 of the embodiment of the present invention is by the solder side surface of curved plate
Carry out grooving 20 to design, specifically carry out grooving on the solder side surface of existing curved plate along substrate interval center line, will with this
The solder side grooving of base plate is divided into a few block of cells, is arranged such, and when module is installed, module base plate solder side is owing to there being grooving 20
Existence, in the mounted state, the stress of module base plate can be reduced further, increase effectively contacting of module base plate and radiator
Area, improves module heat dissipating ability and reliability.
It is obvious to a person skilled in the art that the invention is not restricted to the details of above-mentioned one exemplary embodiment, Er Qie
In the case of the spirit or essential attributes of the present invention, it is possible to realize the present invention in other specific forms.Therefore, no matter
From the point of view of which point, all should regard embodiment as exemplary, and be nonrestrictive, the scope of the present invention is by appended power
Profit requires rather than described above limits, it is intended that all by fall in the implication of equivalency and scope of claim
Change is included in the present invention.Should not be considered as limiting involved claim by any reference in claim.
Although moreover, it will be appreciated that this specification is been described by according to embodiment, but the most each embodiment only wraps
Containing an independent technical scheme, this narrating mode of description is only that for clarity sake those skilled in the art should
Description can also be formed those skilled in the art through appropriately combined as an entirety, the technical scheme in each embodiment
May be appreciated other embodiments.
Claims (5)
1. a grooving type IGBT module base plate, it is curved, it is characterised in that: the welding of described grooving type IGBT module base plate
Surface, face is provided with at least two groovings that the solder side of base plate is divided into multiple block of cells, described grooving type IGBT module base plate
Being connected with some substrates in order to weld igbt chip, grooving type IGBT module base plate solder side surface and phase are located in described grooving
The position that interval center line between adjacent described substrate is corresponding, described grooving is crisscross arranged each other.
Grooving type IGBT module base plate the most according to claim 1, it is characterised in that: described grooving type IGBT module base plate
Upper and lower surface be parallel to each other.
3. an IGBT module, if it includes curved plate, the stem substrate being welded on curved plate, is arranged on substrate
Igbt chip, it is characterised in that: the solder side surface of described curved plate is provided with and is divided into multiple by the solder side of curved plate
At least two groovings of block of cells, described grooving be located at grooving type IGBT module base plate solder side surface and adjacent described substrate it
Between position corresponding to center line, interval.
IGBT module the most according to claim 3, it is characterised in that: described grooving is crisscross arranged each other.
IGBT module the most according to claim 3, it is characterised in that: the upper and lower surface of described curved plate is parallel to each other.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210361568.7A CN103681560B (en) | 2012-09-25 | 2012-09-25 | A kind of grooving type IGBT module base plate and IGBT module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210361568.7A CN103681560B (en) | 2012-09-25 | 2012-09-25 | A kind of grooving type IGBT module base plate and IGBT module |
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| CN103681560A CN103681560A (en) | 2014-03-26 |
| CN103681560B true CN103681560B (en) | 2016-12-21 |
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| CN106256519B (en) * | 2015-06-19 | 2019-09-24 | 上海和辉光电有限公司 | A kind of method of cutting substrate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101587867A (en) * | 2009-04-02 | 2009-11-25 | 嘉兴斯达微电子有限公司 | Substrate for insulated gate bipolar type transistor module |
| CN102169879A (en) * | 2011-01-30 | 2011-08-31 | 南通富士通微电子股份有限公司 | Highly integrated wafer fan-out packaging structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP5467933B2 (en) * | 2010-05-21 | 2014-04-09 | 株式会社東芝 | Semiconductor device |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101587867A (en) * | 2009-04-02 | 2009-11-25 | 嘉兴斯达微电子有限公司 | Substrate for insulated gate bipolar type transistor module |
| CN102169879A (en) * | 2011-01-30 | 2011-08-31 | 南通富士通微电子股份有限公司 | Highly integrated wafer fan-out packaging structure |
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Address after: 710016 No. 15 Wenjingbei Road, Jingkai District, Xi'an City, Shaanxi Province Patentee after: Xi'an Zhongche Yongji Electric Co. Ltd. Address before: 710016 No. 15 Wenjingbei Road, Jingkai District, Xi'an City, Shaanxi Province Patentee before: Xi'an Yongdian Electric Co., Ltd. |
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