CN103676066B - 镜头及其制造方法 - Google Patents
镜头及其制造方法 Download PDFInfo
- Publication number
- CN103676066B CN103676066B CN201310654080.8A CN201310654080A CN103676066B CN 103676066 B CN103676066 B CN 103676066B CN 201310654080 A CN201310654080 A CN 201310654080A CN 103676066 B CN103676066 B CN 103676066B
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- China
- Prior art keywords
- adhesive linkage
- glass wafer
- camera lens
- layer
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 title claims abstract description 30
- 239000000853 adhesive Substances 0.000 claims abstract description 52
- 230000001070 adhesive effect Effects 0.000 claims abstract description 52
- 239000011521 glass Substances 0.000 claims abstract description 43
- 238000004080 punching Methods 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims description 21
- 239000004642 Polyimide Substances 0.000 claims description 8
- 229920001721 polyimide Polymers 0.000 claims description 8
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 7
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- -1 polyethylene terephthalate Polymers 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000011218 segmentation Effects 0.000 claims description 3
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims 2
- 150000005690 diesters Chemical class 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 6
- 238000004026 adhesive bonding Methods 0.000 abstract description 3
- 239000003292 glue Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Lens Barrels (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201310654080.8A CN103676066B (zh) | 2013-12-06 | 2013-12-06 | 镜头及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201310654080.8A CN103676066B (zh) | 2013-12-06 | 2013-12-06 | 镜头及其制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103676066A CN103676066A (zh) | 2014-03-26 |
CN103676066B true CN103676066B (zh) | 2016-08-24 |
Family
ID=50314168
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201310654080.8A Active CN103676066B (zh) | 2013-12-06 | 2013-12-06 | 镜头及其制造方法 |
Country Status (1)
Country | Link |
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CN (1) | CN103676066B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105487147B (zh) * | 2016-01-25 | 2017-09-05 | 瑞声声学科技(苏州)有限公司 | 镜头及其切割方法 |
US20170219793A1 (en) * | 2016-01-28 | 2017-08-03 | AAC Technologies Pte. Ltd. | Sealed module with glue guiding features and method for making same |
CN106695263B (zh) * | 2017-01-23 | 2018-10-30 | 苏州五方光电材料有限公司 | 一种双摄工艺 |
CN111736259A (zh) * | 2020-07-24 | 2020-10-02 | 歌尔股份有限公司 | 波导镜片模组及其制作方法、ar设备 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2273289A1 (en) * | 2008-04-28 | 2011-01-12 | Konica Minolta Opto, Inc. | Method for producing wafer lens assembly and method for producing wafer lens |
CN102193116A (zh) * | 2010-03-10 | 2011-09-21 | 富士胶片株式会社 | 晶片透镜单元以及其制造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9132594B2 (en) * | 2008-11-04 | 2015-09-15 | Essilor International (Compagnie Générale d'Optique) | Bi-layer adhesive for lens lamination |
TW201024065A (en) * | 2008-12-18 | 2010-07-01 | E Pin Optical Industry Co Ltd | Array optical glass lens module and method of manufacturing the same |
CN101852908B (zh) * | 2009-03-30 | 2013-03-27 | 鸿富锦精密工业(深圳)有限公司 | 晶圆级镜头模组阵列 |
US20120257292A1 (en) * | 2011-04-08 | 2012-10-11 | Himax Technologies Limited | Wafer Level Lens Module and Method for Manufacturing the Wafer Level Lens Module |
-
2013
- 2013-12-06 CN CN201310654080.8A patent/CN103676066B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2273289A1 (en) * | 2008-04-28 | 2011-01-12 | Konica Minolta Opto, Inc. | Method for producing wafer lens assembly and method for producing wafer lens |
CN102193116A (zh) * | 2010-03-10 | 2011-09-21 | 富士胶片株式会社 | 晶片透镜单元以及其制造方法 |
Also Published As
Publication number | Publication date |
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CN103676066A (zh) | 2014-03-26 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C53 | Correction of patent of invention or patent application | ||
CB03 | Change of inventor or designer information |
Inventor after: JENS VIHELM JENSEN Inventor after: Chou Zhixiang Inventor after: Chen Huan Inventor after: Xie Jianwei Inventor before: JENS VIHELM JENSEN Inventor before: Chou Zhixiang Inventor before: Chen Huan |
|
COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: JENS VIHELM JENSEN CHOU ZHIXIANG CHEN HUAN TO: JENS VIHELM JENSEN CHOU ZHIXIANG CHEN HUAN XIE JIANWEI |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 215000 133 Weixin Road, Suzhou Industrial Park, Suzhou, Jiangsu Co-patentee after: AAC Acoustic Technologies (Shenzhen) Co., Ltd. Patentee after: Rui Sheng Optoelectronic Technology (Suzhou) Co., Ltd. Address before: 215000 133 Weixin Road, Suzhou Industrial Park, Suzhou, Jiangsu Co-patentee before: AAC Acoustic Technologies (Shenzhen) Co., Ltd. Patentee before: AAC Acoustic Technologies (Suzhou) Co., Ltd. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20200131 Address after: 215000, No. 133, Xin Lu, Suzhou Industrial Park, Suzhou, Jiangsu Patentee after: AAC TECHNOLOGIES Pte. Ltd. Address before: 215000, No. 133, Xin Lu, Suzhou Industrial Park, Suzhou, Jiangsu Co-patentee before: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) Co.,Ltd. Patentee before: AAC TECHNOLOGIES Pte. Ltd. |
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CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 215000, No. 133, Xin Lu, Suzhou Industrial Park, Suzhou, Jiangsu Patentee after: Chengrui optics (Suzhou) Co., Ltd Address before: 215000, No. 133, Xin Lu, Suzhou Industrial Park, Suzhou, Jiangsu Patentee before: Ruisheng Optoelectronic Technology (Suzhou) Co.,Ltd. |