CN103646928A - Connection structure and connection method of chip - Google Patents
Connection structure and connection method of chip Download PDFInfo
- Publication number
- CN103646928A CN103646928A CN201310617987.7A CN201310617987A CN103646928A CN 103646928 A CN103646928 A CN 103646928A CN 201310617987 A CN201310617987 A CN 201310617987A CN 103646928 A CN103646928 A CN 103646928A
- Authority
- CN
- China
- Prior art keywords
- chip
- binding
- circuit board
- lead
- connection structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a connection structure and a connection method of a chip. The connection structure comprises a circuit board (1), and a chip a (2) and a chip b (3) which are fixed on the circuit board (1). Lead-wire points are evenly arranged on electrode surfaces of the chip a (2) and the chip b (3). The connection structure is characterized in that: the lead-wire points between the chip a (2) and the chip b (3) are connected in a binding way via binding wires (4). With application of the aforementioned technical scheme, the corresponding lead-wire points between the chips are directly connected via the binding wires. Compared with an existing technology, processing step is simplified and the chips can be closely arranged between each other so that the connection structure is compact in structure, and area of the circuit board is reduced, cost is lowered and product yield rate is enhanced.
Description
Technical field
The present invention relates to electric connection technology field, more particularly, the present invention relates to a kind of syndeton and method of attachment of chip.
Background technology
The SMT mount technology of widely applying is at present that the pin of chip is welded on circuit board, in the test of encapsulation, there is the problems such as rosin joint, dry joint, solder skip, in routine use process, because the solder joint long term exposure on wiring board is subject to nature and human factor in air, affect, cause product easily to occur short circuit, the situation such as open circuit, even burn.
Existing kind of binding chip technology; that chip internal circuit is connected with circuit board package pin by binding line; and then cover with the organic material with special protection function is accurate; complete later stage encapsulation, the benefit of this mode is that manufactured goods stability wants high a lot of with respect to traditional SMT paster mode.If but a circuit board will connect a plurality of chips, be illustrated in figure 2 the chip connecting structure of prior art, chip a2 is connected with lead-in wire point corresponding on circuit board 1 respectively with the lead-in wire point on chip b3, between chip a2 and chip b3, by circuit board 1, transmits and be connected.The spacing distance of two chip chambers is large, need to connect two binding lines 4, and processing step is many, in each operation, makes mistakes and will cause the defective of product, and rate of finished products reduces, and feed consumption consuming time, and the cost of product is high.
Summary of the invention
The present invention will solve the problem existing in existing chip connecting structure, and a kind of compact conformation is provided, and cost is low, the chip connecting structure that rate of finished products is relatively high.
To achieve these goals, the technical scheme that the present invention takes is: the syndeton of this chip providing, comprise circuit board and be fixed on chip a and the chip b on described circuit board, on the electrode surface of described chip a and chip b, be equipped with lead-in wire point, it is characterized in that: between described chip a and chip b, by binding line, described lead-in wire point binding is connected.
For making technique scheme more perfect, the present invention also provides following further optimal technical scheme, to obtain satisfied practical function:
Described binding line and chip a and chip b cover organogel outward.
Described binding line is gold thread or aluminum steel.
In order to realize the goal of the invention identical with technique scheme, the present invention also provides the method for attachment of the above chip connecting structure, and this method of attachment comprises the following steps:
1), chip a and chip b are fixed on circuit board;
2), use binding machine that the upper corresponding lead-in wire point binding of chip a and chip b is connected;
3), after binding, the organogel of fusing is covered to binding line and chip a and chip b is outside;
4), baking-curing organogel.
The present invention adopts technique scheme, by between chip and chip directly by binding line by corresponding lead-in wire point connection, simplify compared with prior art processing step, chip and chip chamber can be near placing, compact conformation, the area that reduces circuit board, reduces costs, and has improved the rate of finished products of product; By adding adhesive curing, avoid chip wearing and tearing, prevent oxide etch, stable performance.
Accompanying drawing explanation
Below the expressed content of each width accompanying drawing of this specification and the mark in figure are briefly described:
Fig. 1 is existing chip connecting structure schematic diagram;
Fig. 2 is chip connecting structure schematic diagram of the present invention;
In figure, be labeled as:
1, circuit board, 2, chip a, 3, chip b, 4, binding line.
Embodiment
Contrast accompanying drawing below, the description by embodiment, is described in further detail the specific embodiment of the present invention.
In order to solve the problem existing in prior art chip connecting structure, the technical scheme that the present invention takes is: by binding line 4, chip a2 is connected with chip b3 binding.
As shown in Figure 1, for chip connecting structure of the present invention, chip a2 and chip b3 are fixed on circuit board 1, by binding machine wire feed termination by the lead terminal of one end pressure welding chip a2 electrode surface of binding line 4, form first key chalaza, then, shift to pressure welding on the position that another chip b3 is corresponding, complete the connection procedure of binding line 4.
Preferably, binding line 4 is gold thread or aluminum steel, and specification is 1.0mil or 2.0mil, and contact performance is good, and technique is relatively stable, and abnormal rate was is low.Binding line 4 and chip a2 and chip b3 cover organogel outward, avoid oxide etch, resistance to wear, and further improve the stability of product.
In order to realize the goal of the invention identical with technique scheme, the present invention also provides the method for attachment of the above chip connecting structure, and this method of attachment comprises the following steps:
1), chip a2 and chip b3 are fixed on circuit board 1;
2), use binding machine that the upper corresponding lead-in wire point binding of chip a2 and chip b3 is connected;
3), after binding, the organogel of high temperature melting is covered to binding line 4 and chip a2 and chip b3 is outside;
4), baking-curing organogel.
Chip is subject to the protection of organogel, is isolated from the outside, and avoids the generation of moist oxide etch situation; Meanwhile, organogel, by high temperature melt, covers process oven dry afterwards on chip, and seamless link between chip, prevents the physical abrasion of chip, and stability is higher.
By reference to the accompanying drawings the present invention is exemplarily described above; obviously specific implementation of the present invention is not subject to the restrictions described above; as long as adopted the improvement of the various unsubstantialities that method of the present invention design and technical scheme carry out or directly applied to other occasion, all within protection scope of the present invention.
Claims (4)
1. the syndeton of a chip, comprise circuit board (1) and be fixed on the chip a(2 on described circuit board (1)) and chip b(3), described chip a(2) and chip b(3) electrode surface on be equipped with lead-in wire point, it is characterized in that: described chip a(2) and chip b(3) between by binding line (4) by described lead-in wire point binding connection.
2. according to the syndeton of chip claimed in claim 1, it is characterized in that: described binding line (4) and chip a(2) and chip b(3) the outer organogel that covers.
3. according to the syndeton of chip claimed in claim 2, it is characterized in that: described binding line (4) is gold thread or aluminum steel.
4. a method of attachment for chip connecting structure as claimed in claim 1, is characterized in that: described method of attachment comprises the following steps:
1), by chip a(2) and chip b(3) be fixed on circuit board (1);
2), use binding machine by chip a(2) and chip b(3) upper corresponding lead-in wire point binds and be connected;
3), binding after, the organogel of fusing is covered to binding line (4) and chip a(2) and chip b(3) outside;
4), baking-curing organogel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310617987.7A CN103646928A (en) | 2013-11-27 | 2013-11-27 | Connection structure and connection method of chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310617987.7A CN103646928A (en) | 2013-11-27 | 2013-11-27 | Connection structure and connection method of chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103646928A true CN103646928A (en) | 2014-03-19 |
Family
ID=50252126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310617987.7A Pending CN103646928A (en) | 2013-11-27 | 2013-11-27 | Connection structure and connection method of chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103646928A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105611750A (en) * | 2015-12-21 | 2016-05-25 | 台州市日昌晶灯饰有限公司 | Fabrication technology of color light control circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7425759B1 (en) * | 2003-11-20 | 2008-09-16 | Bridge Semiconductor Corporation | Semiconductor chip assembly with bumped terminal and filler |
| WO2012055085A1 (en) * | 2010-10-26 | 2012-05-03 | 上海嘉塘电子有限公司 | Method for bonding wire between chips or between chip and metal frame |
| US20120208324A1 (en) * | 2011-02-14 | 2012-08-16 | Renesas Electronics Corporation | Manufacturing method of semiconductor device |
-
2013
- 2013-11-27 CN CN201310617987.7A patent/CN103646928A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7425759B1 (en) * | 2003-11-20 | 2008-09-16 | Bridge Semiconductor Corporation | Semiconductor chip assembly with bumped terminal and filler |
| WO2012055085A1 (en) * | 2010-10-26 | 2012-05-03 | 上海嘉塘电子有限公司 | Method for bonding wire between chips or between chip and metal frame |
| US20120208324A1 (en) * | 2011-02-14 | 2012-08-16 | Renesas Electronics Corporation | Manufacturing method of semiconductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105611750A (en) * | 2015-12-21 | 2016-05-25 | 台州市日昌晶灯饰有限公司 | Fabrication technology of color light control circuit board |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| ASS | Succession or assignment of patent right |
Owner name: WUHU ZHITONG AUTOMOBILE ELECTRONICS CO., LTD. Free format text: FORMER OWNER: WUHU TONGHE AUTO PIPELINE SYSTEM CO., LTD. Effective date: 20150611 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20150611 Address after: 8 A building, block 35, car electronics Pioneer Park, Hengshan Road, Wuhu economic and Technological Development Zone, Anhui 241009, China Applicant after: Wuhu causes the Electronics Co., Ltd. that is open to the traffic Address before: 241009 Hengshan Road economic and Technological Development Zone, Anhui, No. 26, Applicant before: Wuhu Tonhe Automobile Fluid System Co., Ltd. |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140319 |
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| RJ01 | Rejection of invention patent application after publication |