CN103642443A - Adhesive for sealing thick film circuit - Google Patents
Adhesive for sealing thick film circuit Download PDFInfo
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- CN103642443A CN103642443A CN201310643303.0A CN201310643303A CN103642443A CN 103642443 A CN103642443 A CN 103642443A CN 201310643303 A CN201310643303 A CN 201310643303A CN 103642443 A CN103642443 A CN 103642443A
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- parts
- film circuit
- thick film
- adhesive
- sealing
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Abstract
The invention provides an adhesive for sealing a thick film circuit. The adhesive is prepared from the following raw materials in parts by weight: 90-110 parts of epoxy resin, 9-15 parts of dibutyl phthalate, 8-15 parts of aluminum oxide, 5-10 parts of diethylenetriamine and 2-4 parts of ethanediamine. The adhesive for sealing the thick film circuit provided by the invention is friendly to the environment, and capable of enduring the temperature difference change within 15 DEG C per hour; as a result, the service life of the product can be effectively prolonged.
Description
Technical field
The present invention relates to circuit sealing compound goods field, relate in particular to thick film circuit sealing and stick with glue agent.
Background technology
Unicircuit is divided into thick film circuit, thin film circuit and semiconductor integrated circuit.The difference of thick film circuit and thin film circuit has 2 points: the difference of first thickness, and the thickness of thick film circuit is generally greater than 10 μ m, and the thickness of film is less than 10 μ m, mostly in being less than 1 μ m; It two is differences of manufacturing process, and thick film circuit generally adopts silk-screen printing technique, and state-of-the-art material substrate is used pottery as substrate, (more use alumina-ceramic), and what thin film circuit adopted is the processing methodes such as vacuum-evaporation, magnetron sputtering.The advantage of thick film circuit is dependable performance, and flexible design is invested littlely, and cost is low, is applied to that voltage is high, electric current is large, powerful occasion more.
The sealing of existing thick film circuit sticks with glue agent environment is had to certain pollution, and after solidifying work-ing life under the suddenly cold and hot of temperature, easily lost efficacy, be therefore necessary to propose a kind of difference variation to be stablized to environment amenable tackiness agent.
Summary of the invention
Object of the present invention provides thick film circuit sealing to stick with glue agent, reduces difference variation and thick film circuit is sealed to the life-span impact that sticks with glue agent.
The invention provides a kind of thick film circuit sealing and stick with glue agent, comprise the raw material of following quality proportioning: 90～110 parts of epoxy resin, 9～15 parts of dibutyl phthalates, 8～15 parts of aluminium sesquioxides, 5～10 parts of diethylenetriamines, 2～4 parts of quadrols.
It is environmentally friendly that thick film circuit sealing provided by the invention sticks with glue agent, and can stand interior 15 degrees Celsius of difference variation hourly, the life-span that can effectively improve product.
In some embodiments, thick film circuit sealing provided by the invention sticks with glue agent, comprises the raw material of following quality proportioning: 100 parts of epoxy resin, 12 parts of dibutyl phthalates, 12 parts of aluminium sesquioxides, 8 parts of diethylenetriamines, 3 parts of quadrols.Further parameters optimization, can be so that the present invention can stand interior 18 degrees Celsius of difference variation hourly, the life-span of further improving product.
In some embodiments, aluminium sesquioxide is selected from 150 object oversizes and 200 object undersizes.Further optimizing materials, can, so that the present invention can stand interior 25 degrees Celsius of difference variation hourly, increase substantially the life-span of product.
Embodiment
Embodiment 1:
The invention provides a kind of thick film circuit sealing and stick with glue agent, comprise following raw material: epoxy resin 90g, dibutyl phthalate 9g, aluminium sesquioxide 8g, diethylenetriamine 5g, quadrol 2g.Wherein, aluminium sesquioxide is selected from 150 object oversizes and 200 object undersizes.Insert and contain in glue device, stir in latter 20 minutes and use.
It is environmentally friendly that above-mentioned thick film circuit sealing sticks with glue agent, can stand interior 15 degrees Celsius of difference variation hourly.
Embodiment 2:
The invention provides a kind of thick film circuit sealing and stick with glue agent, comprise following raw material: epoxy resin 110g, dibutyl phthalate 15g, aluminium sesquioxide 15g, diethylenetriamine 10g, quadrol 4g.Wherein, aluminium sesquioxide is selected from 150 object oversizes and 200 object undersizes.Insert and contain in glue device, stir in latter 20 minutes and use.
It is environmentally friendly that above-mentioned thick film circuit sealing sticks with glue agent, can stand interior 16 degrees Celsius of difference variation hourly.
Embodiment 3:
The invention provides a kind of thick film circuit sealing and stick with glue agent, comprise following raw material: 100 parts of epoxy resin, 12 parts of dibutyl phthalates, 12 parts of aluminium sesquioxides, 8 parts of diethylenetriamines, 3 parts of quadrols.Wherein, aluminium sesquioxide is selected from 150 object oversizes and 200 object undersizes.Insert and contain in glue device, stir in latter 20 minutes and use.
It is environmentally friendly that above-mentioned thick film circuit sealing sticks with glue agent, can stand interior 25 degrees Celsius of difference variation hourly.
The above is only optimal way of the present invention; it should be pointed out that to those skilled in the art, without departing from the concept of the premise of the invention; can also make some similar distortion and improvement, within these also should be considered as protection scope of the present invention.
Claims (3)
1. thick film circuit sealing sticks with glue agent, it is characterized in that, comprises the raw material of following quality proportioning: 90～110 parts of epoxy resin, 9～15 parts of dibutyl phthalates, 8～15 parts of aluminium sesquioxides, 5～10 parts of diethylenetriamines, 2～4 parts of quadrols.
2. thick film circuit sealing according to claim 1 sticks with glue agent, it is characterized in that, comprises the raw material of following quality proportioning: 100 parts of epoxy resin, 12 parts of dibutyl phthalates, 12 parts of aluminium sesquioxides, 8 parts of diethylenetriamines, 3 parts of quadrols.
3. thick film circuit sealing according to claim 1 sticks with glue agent, it is characterized in that, described aluminium sesquioxide is selected from 150 object oversizes and 200 object undersizes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310643303.0A CN103642443A (en) | 2013-12-05 | 2013-12-05 | Adhesive for sealing thick film circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310643303.0A CN103642443A (en) | 2013-12-05 | 2013-12-05 | Adhesive for sealing thick film circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103642443A true CN103642443A (en) | 2014-03-19 |
Family
ID=50247733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310643303.0A Pending CN103642443A (en) | 2013-12-05 | 2013-12-05 | Adhesive for sealing thick film circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103642443A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105567143A (en) * | 2016-01-21 | 2016-05-11 | 广西大学 | Integrated circuit sealing adhesive |
| CN107325772A (en) * | 2017-07-12 | 2017-11-07 | 苏州润德新材料有限公司 | A kind of bonded adhesives for multi-wire saw |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57159866A (en) * | 1981-03-27 | 1982-10-02 | Kawasaki Steel Corp | Laminating adhesive between polyolefin and metal |
| CN101200573A (en) * | 2006-12-14 | 2008-06-18 | 上海化工研究院 | Halon-free intumescent fire-retardant epoxy resin compound |
| CN102277115A (en) * | 2011-06-20 | 2011-12-14 | 张凯 | High-temperature resistant adhesive |
| CN102286138A (en) * | 2011-07-01 | 2011-12-21 | 蓝星(北京)化工机械有限公司 | Heat-resistant epoxide resin composition for rapid pultrusion |
| CN102850981A (en) * | 2012-09-03 | 2013-01-02 | 南通市泓雨化工有限公司 | Epoxy resin adhesive |
| CN102898990A (en) * | 2012-09-25 | 2013-01-30 | 苏州汾湖电梯有限公司 | Epoxy adhesive for ceramic bonding |
-
2013
- 2013-12-05 CN CN201310643303.0A patent/CN103642443A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57159866A (en) * | 1981-03-27 | 1982-10-02 | Kawasaki Steel Corp | Laminating adhesive between polyolefin and metal |
| CN101200573A (en) * | 2006-12-14 | 2008-06-18 | 上海化工研究院 | Halon-free intumescent fire-retardant epoxy resin compound |
| CN102277115A (en) * | 2011-06-20 | 2011-12-14 | 张凯 | High-temperature resistant adhesive |
| CN102286138A (en) * | 2011-07-01 | 2011-12-21 | 蓝星(北京)化工机械有限公司 | Heat-resistant epoxide resin composition for rapid pultrusion |
| CN102850981A (en) * | 2012-09-03 | 2013-01-02 | 南通市泓雨化工有限公司 | Epoxy resin adhesive |
| CN102898990A (en) * | 2012-09-25 | 2013-01-30 | 苏州汾湖电梯有限公司 | Epoxy adhesive for ceramic bonding |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105567143A (en) * | 2016-01-21 | 2016-05-11 | 广西大学 | Integrated circuit sealing adhesive |
| CN107325772A (en) * | 2017-07-12 | 2017-11-07 | 苏州润德新材料有限公司 | A kind of bonded adhesives for multi-wire saw |
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Legal Events
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| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140319 |