CN203934231U - A kind of large thickness heat-conducting interface material of composition metal heat-conducting layer - Google Patents
A kind of large thickness heat-conducting interface material of composition metal heat-conducting layer Download PDFInfo
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- CN203934231U CN203934231U CN201420029115.9U CN201420029115U CN203934231U CN 203934231 U CN203934231 U CN 203934231U CN 201420029115 U CN201420029115 U CN 201420029115U CN 203934231 U CN203934231 U CN 203934231U
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Abstract
The utility model relates to Heat Conduction Material field.Especially a kind of a kind of novel large thickness heat conductive pad being applied in electronic product and communication apparatus.A large thickness heat-conducting interface material for composition metal heat-conducting layer, is characterized in that: described heat-conducting interface material consists of two-layer heat conductive pad and a metal level, and upper and lower two surfaces of described metal level are fitted with respectively heat conductive pad.The utility model can provide a kind of thickness at more than 2 millimeters and 2 millimeters Novel heat-conducting pads, and this heat conductive pad has advantages of that processing is simple, rate of finished products is high, cost significantly reduces, and can obviously improve heat conductivility simultaneously.
Description
Technical field
The present invention relates to Heat Conduction Material field.Especially a kind of a kind of novel large thickness heat conductive pad being applied in electronic product and communication apparatus.
Background technology
Heat-conducting interface material is a kind of generally for the material of IC encapsulation and electronic radiation also referred to as Heat Conduction Material, and the microvoid and the scraggly surface that while being mainly used in filling up two kinds of hard material contacts, produce, reduce thermal resistance, improves the heat dispersion of device.Along with contemporary electronic technology develops rapidly, degree of integration and the packaging density of electronic devices and components improve constantly, and when powerful use function is provided, have also caused the sharply increase of its work power consumption and caloric value.High temperature will produce injurious effects to the stability of electronic devices and components, reliability and life-span, such as the too high semi-conductive node of temperature entail dangers to, and the linkage interface of damage circuit increases the resistance of conductor and causes mechanical stress damage.Hot interface (contact-making surface) material has played very crucial effect in heat management.Between microelectronic material surface and radiator, have imperceptible rough space, if they are directly installed on together, the real contact area between them only has 10% of foot of radiator area, and all the other are air gap.Because air thermal conductivity only has 0.025W/ (m.K), be hot non-conductor, by causing, the contact heat resistance between electronic component and radiator is very large, has seriously hindered the conduction of heat, finally causes the usefulness of radiator low.Use has the thermal interfacial material of high-termal conductivity and fills full these gaps, get rid of air wherein, between electronic component and radiator, set up effective thermal conduction path, can significantly reduce contact heat resistance, the effect of radiator is brought into play fully, and guarantee that electronic device can work in suitable temperature range, guarantee the normal performance of electronic device performance.Thermal grease conduction is a kind of thermal interfacial material the earliest, and namely common heat conductive silica gel, was once widely used.But because of its operation, use large, the long-term shortcomings such as easily inefficacy of using of difficulty, oneself mainly contains following 3 large classes through progressively making way for other novel thermal interfacial material: (l) anvil knot solidifies heat-conducting glue (2) phase-change material (3) heat-conducting elastomer material.What be wherein most widely used is exactly heat conductive pad, is mainly because this material not only itself has good thermal conductivity, has good elasticity simultaneously, for other materials, is more easy to machine-shaping, and this heat conductive pad is used installation very convenient.But this heat conductive pad, when making the large thickness that surpasses 3 millimeters, not only due to the increase of materials thickness, significantly rises its cost, and its rate of finished products is also along with the increase of thickness starts to decline to a great extent.Therefore caused the price of the heat conductive pad of large thickness to rise rapidly.Above-mentioned technical problem, perplexs in the industry for a long time, but does not occur so far effective solution.
Summary of the invention
The object of this invention is to provide a kind of thickness at more than 2 millimeters and 2 millimeters Novel heat-conducting pads, this heat conductive pad has advantages of that processing is simple, rate of finished products is high, cost significantly reduces, and can obviously improve heat conductivility simultaneously.
Technical scheme of the present invention is achieved in that a kind of large thickness heat-conducting interface material of composition metal heat-conducting layer, it is characterized in that: described heat-conducting interface material consists of two-layer heat conductive pad and a metal level, described heat conductive pad and the thickness of metal level are at least 0.5 millimeter, and gross thickness is greater than 2 millimeters, upper and lower two surfaces of described metal level are fitted with respectively heat conductive pad, and described metal level is that aluminium sheet or copper coin form.
described metal level is smooth finish surface.
Described heat conductive pad surface label is covered with diaphragm.
Beneficial effect of the present invention is: the utility model, by adopting the structure that metallic plate is set in the middle of two-layer heat conductive pad, has obtained significant technical advantage in the following aspects respectively.One, makes production cost obtain significant decline.First by adopting the heat-conducting interface material of sandwich construction, because the price of aluminium sheet is starkly lower than heat conductive pad, therefore saved the heat conductive pad material of a large amount of costlinesses, make heat-conducting interface material cost obtain remarkable reduction.They are two years old, due to the use of composite construction, making the heat conductive pad that heat-conducting interface material is used is thinner common heat conductive pad, the high materials amount of production difficulty is large and large thickness heat-conducting interface material that rate of finished products is low, change into cleverly and use common heat conductive pad, therefore make the process costs of producing significantly decline.Its three, be greatly improved with traditional heat-conducting interface material phase specific thermal conductivity.The thermal conductivity of common conventional heat conductive pad only has 1.2 watts the highest to be no more than 5 watts, and the thermal conductivity of aluminium is 200 watts, copper is especially up to 300 watts, therefore adopt the heat-conducting interface material of sandwich construction, by original whole heat conductive pad structural changes, become low thickness heat conductive pad to add metal-layer structure, therefore make thermal conductivity obtain significantly improving.For example: 1.2 watts of heat conductive pads originally, to use its thermal conductivity after the utility model structure instead and reach more than 2 watts, increase rate approaches 70%.Its four, compare and significantly improve its installation capability with traditional heat-conducting interface material.Because material is very soft, easily there is the phenomenons such as gauffer bubble when therefore installing in tradition heat conductive pad, more serious in this phenomenon heat conductive pad that especially area is larger, this problem not only increases installation difficulty, is seriously even to cause equipment fault.And heat-conducting interface material in the utility model is due to the supporting role of middle part metal level, when carrying out heat-conducting interface material installation, still keep smooth, therefore significantly reduced the installation capability of heat-conducting interface material.
The technique effect that the utility model obtains is reported as following experiment test:
The utility model, by above-mentioned a series of technological improvements, provides a kind of low cost, high thermal conductivity and convenient a kind of Novel heat-conducting boundary material of installing in a word.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Embodiment
Below in conjunction with drawings and Examples, the invention will be further described.
The utility model is mainly for the technological improvement that in prior art, large thickness heat-conducting interface material existing problems are made, and is mainly can not to be in any more in order to improve large thickness heat-conducting interface material cost, and the problem such as rate of finished products is low, thermal conductivity is low, installation is inconvenient.As shown in Figure 1, the utility model is specifically related to a kind of large thickness heat-conducting interface material of composition metal heat-conducting layer, the technological improvement of carrying out is that heat-conducting interface material consists of sandwich construction, two-layer heat conductive pad 1 and a metal level 2, consist of, upper and lower two surfaces of described metal level 2 are fitted with respectively heat conductive pad 1.The laminating is here mainly to have utilized the glutinous viscosity of heat conductive pad 1 self to be fitted in the composite heat-conducting boundary material that metal level 2 surfaces form.Because the general thermal conductivity of heat-conducting interface material only has between 1.2 watts-5 watts, and the entire thermal resistance of the thermally-conductive interface of large thickness is apparently higher than thinner heat conductive pad, therefore causes the heat conductivility of heat-conducting interface material of large thickness lower.But the thermal conductivity of metallic aluminium is 200 watts, copper is up to 300 watts.Therefore in the utility model, adopt the heat-conducting interface material of this composite construction, cleverly the super-high heat-conductive ability of metal and the high thermal conductivity of thin heat conductive pad are combined as a whole, make the capacity of heat transmission of heat-conducting interface material of the present utility model improve nearly 70% under the condition that adopts identical Heat Conduction Material.
Heat-conducting interface material in the utility model is only suitable for using at thickness and surpasses in the large thickness heat-conducting interface material of 2 millimeters, and the raising of its thermal conductivity is along with thickness increase improves constantly.But consider the actual needs that use, the thickness of metal level 2 and heat conductive pad 1 is all not less than 0.5 millimeter, and the gross thickness large thickness heat-conducting interface material that is greater than 2 millimeters.These above-mentioned restrictions are mainly from the viewpoint of being used needs, cost and thermal conductivity two.Because if the thickness of the heat conductive pad of laminating is too thin, the thickness of its elastic layer is difficult to meet assembling demand, in addition thinner heat conductive pad cost is lower, if the composite heat-conducting boundary material in employing the utility model, cost advantage is also not obvious, the own thickness of heat conductive pad that is less than in addition 2 millimeters is little, even if therefore add metal level also very limited to the lifting of thermal conductivity.
Metal level in the utility model forms the main metal with thermal conductive resin that uses, preferred aluminium and copper, and other hot good conductors also can be used certainly.In order to improve the combination tightness degree between heat conductive pad 1 and metal level 2 in the utility model, described metal level 2 is smooth finish surface.Namely trend towards theoretically mirror effect.In composite heat-conducting boundary material in the utility model, be positioned at outside heat conductive pad 1 surface label and be covered with diaphragm 3.This is identical with the processing of common heat-conducting interface material.
Described above is only preferred embodiment of the present invention, and above-mentioned specific embodiment is not limitation of the present invention.In technological thought category of the present invention, can there is various distortion and modification, the retouching that all those of ordinary skill in the art make according to above description, revise or be equal to replacement, all belong to the scope that the present invention protects.
Claims (3)
1. the large thickness heat-conducting interface material of a composition metal heat-conducting layer, it is characterized in that: described heat-conducting interface material consists of two-layer heat conductive pad and a metal level, described heat conductive pad and the thickness of metal level are at least 0.5 millimeter, and gross thickness is greater than 2 millimeters, upper and lower two surfaces of described metal level are fitted with respectively heat conductive pad, and described metal level is that aluminium sheet or copper coin form.
2. the large thickness heat-conducting interface material of a kind of composition metal heat-conducting layer according to claim 1, is characterized in that: described metal level is smooth finish surface.
3. the large thickness heat-conducting interface material of a kind of composition metal heat-conducting layer according to claim 1, is characterized in that: described heat conductive pad surface label is covered with diaphragm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420029115.9U CN203934231U (en) | 2014-01-17 | 2014-01-17 | A kind of large thickness heat-conducting interface material of composition metal heat-conducting layer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420029115.9U CN203934231U (en) | 2014-01-17 | 2014-01-17 | A kind of large thickness heat-conducting interface material of composition metal heat-conducting layer |
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| CN203934231U true CN203934231U (en) | 2014-11-05 |
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| CN201420029115.9U Expired - Fee Related CN203934231U (en) | 2014-01-17 | 2014-01-17 | A kind of large thickness heat-conducting interface material of composition metal heat-conducting layer |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109936971A (en) * | 2019-04-18 | 2019-06-25 | 成都智明达电子股份有限公司 | It is a kind of for reducing the method for thermal contact resistance, structure and component heat dissipation equipment |
| CN112778562A (en) * | 2020-12-31 | 2021-05-11 | 深圳市奕韬科技有限公司 | Efficient heat-conducting interface material and preparation method and application thereof |
-
2014
- 2014-01-17 CN CN201420029115.9U patent/CN203934231U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109936971A (en) * | 2019-04-18 | 2019-06-25 | 成都智明达电子股份有限公司 | It is a kind of for reducing the method for thermal contact resistance, structure and component heat dissipation equipment |
| CN112778562A (en) * | 2020-12-31 | 2021-05-11 | 深圳市奕韬科技有限公司 | Efficient heat-conducting interface material and preparation method and application thereof |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141105 Termination date: 20160117 |
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| EXPY | Termination of patent right or utility model |