CN103635010A - Covering film with performances of heating conduction and electromagnetic shielding - Google Patents
Covering film with performances of heating conduction and electromagnetic shielding Download PDFInfo
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- CN103635010A CN103635010A CN201210308291.1A CN201210308291A CN103635010A CN 103635010 A CN103635010 A CN 103635010A CN 201210308291 A CN201210308291 A CN 201210308291A CN 103635010 A CN103635010 A CN 103635010A
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- layer
- coverlay
- heat conduction
- copper foil
- electromagnetic wave
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Abstract
Disclosed in the utility model is a covering film with performances of heating conduction and electromagnetic shielding. The covering film comprises a copper foil layer, an insulated polymer layer, an insulated film layer and an adhesion layer. The insulated film layer has two opposite sides; one side of the insulated film layer is coated with the insulated polymer layer; and the adhesion layer is formed at the other side of the insulated film layer. The copper foil layer is contacted to the insulated polymer layer that is clamped between the copper foil layer and the insulated film layer. According to the invention, the covering film has functions of high heat dissipation efficiency and electromagnetic interference resistance, wherein the functions can not be realized by non-metal solder resistance in the prior art; and the covering film also has the unique reflection light enhancing effect and can be applied to an illumination lamp of the LED photoelectric product, and the light brightness effect is enhanced. In addition, the covering film not only can be applied to a flexible circuit board but also can be used for replacing a traditional solder-resistant ink at a ridge circuit board.
Description
Technical field
The present invention relates to a kind of coverlay for printed circuit board (PCB), relate to specifically a kind of coverlay with heat conduction and electromagnetic wave shielding, and the application of this coverlay in printed circuit board (PCB) and LED photovoltaic.
Background technology
The coverlay that traditional printed circuit board (PCB) is used is generally to adopt nonmetallic polyimides or polyester film coating adhesion layer, by enclosing release liners after dry out solvent, makes, and the adhesive agent using is generally acrylic resin or epoxy is resin.Traditional coverlay is generally used on flexible circuit board, plays protection circuit and anti-welding function.
Traditional wiring board welding resistance mode is except with coverlay, and the mode the most generally adopting is to use welding resistance ink.No matter be coverlay or welding resistance ink, use in the process of wiring board, be all that optionally covering protection is lived circuit, and expose solder joint.
These two kinds of protected modes make its surface showing at finished product wiring board be all nonmetal; the general online road surfaces of this type nonmetallic materials does not possess good heat-sinking capability and anti-electromagnetic interference capability, does not possess the reflection enhanced shine that metal surface can possess yet.And select the circuit board of subsides thin-film against electromagnetic interference, be also after circuit board resistance welding layer completes, in the local surfaces of solder mask, paste one deck electromagnetic membrane.This type is also only confined to local anti-electromagnetic-radiation, and the numerous and diverse poor in timeliness of making technology, manufacturing cost is high, product heat dispersion is poor, does not possess good heat sinking function and reflection function, and efficiency low being unfavorable for is applied on product.
Therefore, need to overcome above shortcoming problem, research and develop a kind of flexible printed wiring board making technology of can simplifying and promote outside yield and have heat conduction and the polyfunctional coverlay of electromagnetic wave shielding and reflection enhanced shine effect.
Summary of the invention
In order to overcome above-mentioned defect, the invention provides a kind of coverlay with heat conduction and electromagnetic wave shielding, the coverlay that the present invention has heat conduction and electromagnetic wave shielding has good heat dispersion, and has good electromagnetic wave shielding, and LED illuminating lamp is had to reflection enhanced shine.
The present invention for the technical scheme that solves its technical problem and adopt is:
The invention discloses a kind of coverlay with heat conduction and electromagnetic wave shielding, comprise copper foil layer, insulating polymer layer, insulating film layer and adhesion layer, wherein, described insulating film layer has relative both sides, described insulating polymer layer is coated a side of described insulating film layer, described adhesion layer is formed at the opposite side of described insulating film layer, and described copper foil layer is affixed on described insulating polymer layer, and described insulating polymer layer is folded between described copper foil layer and described insulating film layer.
On the outer surface of described adhesion layer, be fitted with release liners.
Described copper foil layer is carrier copper foil.
Insulating polymer layer is polyimide layer or layer of polyethylene terephthalate, and thickness is 2～13 microns.
Described insulating polymer layer can be black, white or the color such as yellow.
Described insulating film layer is polyimide layer, layer of polyethylene terephthalate, polyaniline layer, Polyethylene Naphthalate layer, triacetyl glycerine layer or layer of polycarbonate, and thickness is 5～25 microns.
Described insulating film layer can be black, white or the color such as yellow.
Preferably, described insulating film layer is polyimide layer or layer of polyethylene terephthalate.
Described adhesion layer is the heat conduction adhesion layer consisting of the epoxy resin that is dispersed with heat radiation powder, and thickness is 15～50 microns.
Described adhesion layer can be black adhesion layer or white adhesion layer etc.
The invention also discloses a kind of printed circuit board (PCB), comprise the body layer that forms circuit, the surface coverage of described body layer has the above-mentioned coverlay with heat conduction and electromagnetic wave shielding.
The invention also discloses a kind of LED photovoltaic, there is above-mentioned printed circuit board (PCB), several LED are installed on described printed circuit board (PCB).
The invention has the beneficial effects as follows: the coverlay with heat conduction and electromagnetic wave shielding of the present invention comprises copper foil layer, insulating polymer layer, insulating film layer and adhesion layer, wherein, described insulating film layer has relative both sides, described insulating polymer layer is coated a side of described insulating film layer, described adhesion layer is formed at the opposite side of described insulating film layer, described copper foil layer is affixed on described insulating polymer layer, and described insulating polymer layer is folded between described copper foil layer and described insulating film layer, the function with radiating efficiency function and anti-electromagnetic interference that the nonmetal welding resistance of prior art of having solved coverlay of the present invention cannot realize, coverlay of the present invention also possesses and has unique reflection enhanced shine simultaneously, be applicable to being applied in the illuminating lamp of LED photovoltaic, there is the brightness of increasing effect, in addition, coverlay of the present invention not only can be used on flexible PCB, be applicable to too replace on rigid circuit board traditional welding resistance ink.
Accompanying drawing explanation
Fig. 1 is one of cross-sectional view of the present invention (not containing release liners);
Fig. 2 is two (containing release liners) of cross-sectional view of the present invention.
Embodiment
Below in conjunction with accompanying drawing, by specific embodiment, embodiments of the present invention are described, those of ordinary skills can understand advantage of the present invention and effect easily by content disclosed in the present specification.The present invention also can be implemented by other different modes, under not departing from disclosed category, can carry out different modifications and change.
Embodiment 1: a kind of coverlay with heat conduction and electromagnetic wave shielding, as shown in Figure 1, comprise copper foil layer 101, insulating polymer layer 102, insulating film layer 103 and adhesion layer 104, wherein, described insulating film layer 103 has relative both sides, described insulating polymer layer 102 is coated a side of described insulating film layer 103, described adhesion layer 104 is formed at the opposite side of described insulating film layer 103, described copper foil layer 101 is affixed on described insulating polymer layer 102, and described insulating polymer layer 102 is folded between described copper foil layer 101 and described insulating film layer 103.
As shown in Figure 2, the coverlay with heat conduction and electromagnetic wave shielding of the present invention also comprises the release liners 105 fitting on described adhesion layer outer surface.Described release liners, for keeping the viscosity of described adhesion layer, is beneficial to follow-up be bonded in circuit board or the use of other pressure programming.
Wherein, described copper foil layer 101 is carrier copper foil, at a side coating insulating polymer layer 102 of the copper foil layer 101 of carrier copper foil, after prebake conditions with described insulating film layer 103 laminatings; After toasting, obtain an one side copper clad laminate.Then, at the opposite side of the insulating film layer 103 of one side copper clad laminate, stick described adhesion layer 104, and the release liners 105 of fitting on described adhesion layer 104; This coverlay of rolling carries out after ripening at low temperature; Again the carrier layer of carrier copper foil is peeled off, completed the coverlay that this has heat conduction and electromagnetic wave shielding.
Described adhesion layer 104 is the epoxy resin layers that are dispersed with heat radiation powder.Because wherein contain heat radiation powder, so adhesion layer of the present invention 104 has the effect that improves radiating effect, and then make the coverlay with heat conduction and electromagnetic wave shielding of the present invention there is good heat radiation function.Described adhesion layer can be black adhesion layer or white adhesion layer etc.
Heat radiation powder is at least one in carborundum, boron nitride, aluminium oxide and aluminium nitride.By weight percentage, heat radiation powder accounts for 15～70% of adhesion layer solid content.
Adhesion layer of the present invention can make by following method: will be that the composition that resin, heat radiation powder blend together is coated with or is printed on a base material by epoxy, and after being dried, base material be peeled off, and obtain adhesion layer.
For the characteristic that maintains the coverlay with heat conduction and electromagnetic wave shielding of the present invention is to be applied to printed circuit board (PCB), and can effectively control cost, the present invention is 15～50 microns by the THICKNESS CONTROL of described adhesion layer, by the THICKNESS CONTROL of described insulating film layer, is 5～25 microns.The material of described insulating film layer is polyimides, polyethylene terephthalate (polyethylene terephthalate, PET), polyaniline (polyaniline, PAn), Polyethylene Naphthalate (Polyethylene Naphthalate, PEN), triacetyl glycerine (Triacetine, TAc) or Merlon (Polycarbonate, PC), preferably polyimides or polyethylene terephthalate.Described insulating film layer can be black adhesion layer or white adhesion layer etc.
Insulating polymer layer is polyimides (PI) layer or polyethylene terephthalate (PET) layer, and thickness is 2～13 microns.Described insulating polymer layer can be black, white or the color such as yellow.
Adhesion layer is carried out to heat conduction analysis test: with Hot Disk thermal conductivity coefficient instrument, carry out heat conduction analysis test, at transducer upper and lower surface, cover two adhesion layer samples, and at this two adhesion layers lateral surface respectively with the sandwiched adhesion layer of two steel plates and transducer, and by sensor measurement adhesion layer heat conductivility, using the test that adhesion layer sample of the present invention is done as experimental group, the heat conductivility of testing general coverlay with same method as a comparative example, is embedded in the coefficient of heat conduction result recording in table 1.
Table 1
Embodiment 2: the present embodiment discloses a kind of printed circuit board (PCB), comprise the body layer that forms circuit, and the surface coverage of described body layer has the coverlay with heat conduction and electromagnetic wave shielding of embodiment 1.
Embodiment 3: the present embodiment discloses a kind of LED photovoltaic, have the printed circuit board (PCB) of embodiment 2, and several LED are installed on described printed circuit board (PCB).
Above-described embodiment is only the illustrative principle of the invention and effect thereof, but not for limiting the present invention.The scope of the present invention, should be as listed in claims.
Claims (9)
1. a coverlay with heat conduction and electromagnetic wave shielding, it is characterized in that: comprise copper foil layer, insulating polymer layer, insulating film layer and adhesion layer, wherein, described insulating film layer has relative both sides, described insulating polymer layer is coated a side of described insulating film layer, described adhesion layer is formed at the opposite side of described insulating film layer, and described copper foil layer is affixed on described insulating polymer layer, and described insulating polymer layer is folded between described copper foil layer and described insulating film layer.
2. the coverlay with heat conduction and electromagnetic wave shielding as claimed in claim 1, is characterized in that: on the outer surface of described adhesion layer, be fitted with release liners.
3. the coverlay with heat conduction and electromagnetic wave shielding as claimed in claim 1, is characterized in that: described copper foil layer is carrier copper foil.
4. the coverlay with heat conduction and electromagnetic wave shielding as claimed in claim 1, it is characterized in that: insulating polymer layer is polyimide layer or layer of polyethylene terephthalate, and thickness is 2～13 microns.
5. the coverlay with heat conduction and electromagnetic wave shielding as claimed in claim 1, it is characterized in that: described insulating film layer is polyimide layer, layer of polyethylene terephthalate, polyaniline layer, Polyethylene Naphthalate layer, triacetyl glycerine layer or layer of polycarbonate, and thickness is 5～25 microns.
6. the coverlay with heat conduction and electromagnetic wave shielding as claimed in claim 5, is characterized in that: described insulating film layer is polyimide layer or layer of polyethylene terephthalate.
7. the coverlay with heat conduction and electromagnetic wave shielding as claimed in claim 1, is characterized in that: described adhesion layer is the heat conduction adhesion layer consisting of the epoxy resin that is dispersed with heat radiation powder, and thickness is 15～50 microns.
8. a printed circuit board (PCB), comprises the body layer that forms circuit, it is characterized in that: the surface coverage of described body layer is just like the coverlay with heat conduction and electromagnetic wave shielding described in any one in claim 1 to 7.
9. a LED photovoltaic, is characterized in that: have printed circuit board (PCB) as claimed in claim 8, several LED are installed on described printed circuit board (PCB).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210308291.1A CN103635010A (en) | 2012-08-28 | 2012-08-28 | Covering film with performances of heating conduction and electromagnetic shielding |
| TW101221997U TWM448880U (en) | 2012-08-28 | 2012-11-14 | Covering film and flexible printed circuit board having the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210308291.1A CN103635010A (en) | 2012-08-28 | 2012-08-28 | Covering film with performances of heating conduction and electromagnetic shielding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103635010A true CN103635010A (en) | 2014-03-12 |
Family
ID=48472345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210308291.1A Pending CN103635010A (en) | 2012-08-28 | 2012-08-28 | Covering film with performances of heating conduction and electromagnetic shielding |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103635010A (en) |
| TW (1) | TWM448880U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105226176A (en) * | 2015-08-25 | 2016-01-06 | 江苏华英光宝科技股份有限公司 | Cover brilliant high temperature resistant PI film printing opacity reelability filament and preparation method thereof |
| CN111050462A (en) * | 2019-11-29 | 2020-04-21 | 苏州市迪飞特电子有限公司 | Low-impedance flexible circuit board and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090038839A1 (en) * | 2005-05-13 | 2009-02-12 | Tatsuta System Electronics Co., Ltd | Shielding film, shielded printed circuit board, shielded flexible printed circuit board, method of manufacturing shielding film, and method of manufacturing shielded printed circuit board |
| CN202353923U (en) * | 2011-10-21 | 2012-07-25 | 松扬电子材料(昆山)有限公司 | Composite covering film |
| CN202773173U (en) * | 2012-08-28 | 2013-03-06 | 昆山雅森电子材料科技有限公司 | Cover film having advantages of thermal conductivity and electromagnetic shielding |
-
2012
- 2012-08-28 CN CN201210308291.1A patent/CN103635010A/en active Pending
- 2012-11-14 TW TW101221997U patent/TWM448880U/en not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090038839A1 (en) * | 2005-05-13 | 2009-02-12 | Tatsuta System Electronics Co., Ltd | Shielding film, shielded printed circuit board, shielded flexible printed circuit board, method of manufacturing shielding film, and method of manufacturing shielded printed circuit board |
| CN202353923U (en) * | 2011-10-21 | 2012-07-25 | 松扬电子材料(昆山)有限公司 | Composite covering film |
| CN202773173U (en) * | 2012-08-28 | 2013-03-06 | 昆山雅森电子材料科技有限公司 | Cover film having advantages of thermal conductivity and electromagnetic shielding |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105226176A (en) * | 2015-08-25 | 2016-01-06 | 江苏华英光宝科技股份有限公司 | Cover brilliant high temperature resistant PI film printing opacity reelability filament and preparation method thereof |
| CN111050462A (en) * | 2019-11-29 | 2020-04-21 | 苏州市迪飞特电子有限公司 | Low-impedance flexible circuit board and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM448880U (en) | 2013-03-11 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140312 |