CN113601926A - High-temperature-resistant heat dissipation covering film for 5G high-frequency circuit board - Google Patents
High-temperature-resistant heat dissipation covering film for 5G high-frequency circuit board Download PDFInfo
- Publication number
- CN113601926A CN113601926A CN202110767182.5A CN202110767182A CN113601926A CN 113601926 A CN113601926 A CN 113601926A CN 202110767182 A CN202110767182 A CN 202110767182A CN 113601926 A CN113601926 A CN 113601926A
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- temperature
- circuit board
- developing agent
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 70
- 239000010410 layer Substances 0.000 claims abstract description 145
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 78
- 239000013039 cover film Substances 0.000 claims abstract description 53
- 229920000642 polymer Polymers 0.000 claims abstract description 44
- 229920005989 resin Polymers 0.000 claims abstract description 44
- 239000011347 resin Substances 0.000 claims abstract description 44
- 239000012790 adhesive layer Substances 0.000 claims abstract description 29
- 239000000843 powder Substances 0.000 claims abstract description 28
- 239000003822 epoxy resin Substances 0.000 claims abstract description 25
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 25
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims abstract description 6
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052582 BN Inorganic materials 0.000 claims abstract description 6
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 6
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims abstract description 6
- 239000005011 phenolic resin Substances 0.000 claims abstract description 6
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 6
- 229920003192 poly(bis maleimide) Polymers 0.000 claims abstract description 6
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 6
- 239000010703 silicon Substances 0.000 claims abstract description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000010408 film Substances 0.000 claims description 47
- 239000007787 solid Substances 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 23
- -1 polyethylene terephthalate Polymers 0.000 claims description 11
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical group O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 229920001721 polyimide Polymers 0.000 claims description 7
- 239000004642 Polyimide Substances 0.000 claims description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 6
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 6
- 239000004408 titanium dioxide Substances 0.000 claims description 5
- 239000002041 carbon nanotube Substances 0.000 claims description 4
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 4
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims description 3
- 229920000767 polyaniline Polymers 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 8
- 230000003287 optical effect Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 16
- 239000000203 mixture Substances 0.000 description 11
- 238000012360 testing method Methods 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 238000002156 mixing Methods 0.000 description 5
- 238000005485 electric heating Methods 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000003556 assay Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012787 coverlay film Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/402—Coloured
- B32B2307/4026—Coloured within the layer by addition of a colorant, e.g. pigments, dyes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/416—Reflective
Abstract
The invention discloses a high-temperature-resistant heat dissipation cover film for a 5G high-frequency circuit board, which aims to solve the technical problems that the existing cover film does not have the performances of high temperature resistance and light reflection heat dissipation, cannot meet the basic requirements of high temperature resistance and heat dissipation of a 5G product, and cannot be applied to products with optical performance requirements. The cover film comprises a polymer layer, an adhesive layer for adhering the cover film to the circuit board, and an ink layer with the thickness of 5-50 μm, wherein the polymer layer is fixedly clamped between the ink layer and the adhesive layer, and the ink layer consists of epoxy resin, high-temperature-resistant resin, heat dissipation powder and a color developing agent; wherein the high-temperature resistant resin is at least one of phenolic resin, bismaleimide and organic silicon resin; the heat dissipation powder is at least one of silicon nitride, boron nitride and aluminum nitride. The cover film has the advantages of high temperature resistance and high heat dissipation efficiency by utilizing the high temperature resistant resin and the heat dissipation powder which are in the ink layer and improve the heat dissipation effect.
Description
Technical Field
The invention belongs to the field of printed circuit boards, and particularly relates to a high-temperature-resistant heat dissipation cover film for a 5G high-frequency circuit board.
Background
High-frequency high-speed printed wiring boards are indispensable materials in 5G electronic products, and with the growth of consumer electronic product demand, the demand for high-frequency printed wiring boards is increasing. Because the flexible printed circuit board has the characteristics of flexibility, three-dimensional wiring and the like, the flexible printed circuit board is widely applied to 5G antennas, high-frequency circuit substrates, Internet of things, communication base stations, automatic driving and smart homes, consumer electronics products, communication products, computers and peripheral equipment products thereof and the like under the development trend that the scientific and technological electronic products emphasize lightness, thinness, shortness and flexibility.
Generally, a flexible printed circuit board mainly comprises a copper-clad substrate (FCCL) and a Coverlay (CL), and a polyimide film coated with an epoxy adhesive and attached to a release film is generally used as the coverlay, but the coverlays do not have high temperature resistance and light reflection heat dissipation performance, so that the basic requirements of high temperature resistance and heat dissipation of a 5G product cannot be met, and the flexible printed circuit board cannot be applied to products with optical performance requirements; in addition, since the high-frequency high-speed flexible copper-clad substrate is more and more widely used, how to effectively dissipate heat of the copper-clad substrate through the high-temperature-resistant cover film to improve the service life of the whole system device has become a very important issue, and research and development are needed to break through.
Disclosure of Invention
(1) Technical problem to be solved
Aiming at the defects of the prior art, the invention aims to provide a high-temperature-resistant heat dissipation cover film for a 5G high-frequency circuit board, which aims to solve the technical problems that the existing cover film does not have the performances of high temperature resistance and light reflection heat dissipation, cannot meet the basic requirements of high temperature resistance and heat dissipation of a 5G product, and cannot be applied to products with optical performance requirements.
(2) Technical scheme
In order to solve the technical problems, the invention provides a high-temperature-resistant heat dissipation covering film for a 5G high-frequency circuit board, which comprises a polymer layer, an adhesive layer for adhering the covering film on the circuit board, and an ink layer with the thickness of 5-50 μm, wherein the polymer layer is fixedly clamped between the ink layer and the adhesive layer, and the ink layer consists of epoxy resin, high-temperature-resistant resin, heat dissipation powder and a color developing agent; the high-temperature-resistant resin is at least one of phenolic resin, bismaleimide and organic silicon resin, and accounts for 10-40% of the solid content of the ink layer in percentage by weight; the heat dissipation powder is at least one of silicon nitride, boron nitride and aluminum nitride, and accounts for 15-70% of the solid content of the ink layer in percentage by weight.
Through this technical scheme, because contain the heat-resisting resin that has the heat-resisting effect of improvement and the radiating powder who improves the radiating effect in the printing ink layer to make this cover membrane have high temperature resistant and the high advantage of radiating efficiency.
Preferably, the material of the polymer layer is at least one of polyimide, polyethylene terephthalate, polyaniline, polyethylene naphthalate, and polycarbonate.
Further, the material of the polymer layer is at least one of polyimide and polyethylene terephthalate.
Preferably, the developer is a white developer or a black developer. When the color developing agent used by the ink layer of the covering film is a white color developing agent, the covering film can have excellent reflectivity by mixing the white color developing agent with the resin; when the used colour-developing agent of the printing ink layer of this cover film is black colour-developing agent, mix through black colour-developing agent and resin, can make this cover film shield circuit pattern, prevent effectively that the circuit layout technique from leaking, can also prevent effectively simultaneously that the circuit from being oxidized by the light that sees through to promote life.
The pigment of the developer can be dye or toner, and the pigment can be organic or inorganic material.
Further, the white color developing agent is titanium dioxide, and accounts for 50-95% of the solid content of the epoxy resin in percentage by weight.
Further, the black color developing agent is at least one of carbon powder and carbon nano tubes, and accounts for 3-15% of the solid content of the epoxy resin in percentage by weight.
Preferably, the thickness of the polymer layer is 10-25 μm.
Preferably, the thickness of the adhesive layer is 15-35 μm.
By controlling the thickness of the polymer layer and the adhesive layer, the high-temperature-resistant and heat-dissipating characteristics of the cover film can be maintained to the maximum extent, so that the cover film can be applied to a 5G high-frequency printed circuit board, and the cost can be effectively controlled.
Preferably, the cover film further comprises a release film attached to the outer surface of the adhesive layer for maintaining the adhesiveness of the adhesive layer. The release film keeps the viscosity of the adhesive layer, so that the cover film is favorable for being subsequently adhered to a circuit board or used in other pressing processes.
(3) Advantageous effects
Compared with the prior art, the invention has the beneficial effects that:
the high-temperature-resistant heat dissipation covering film has the advantages of high temperature resistance and high heat dissipation efficiency by utilizing the high-temperature-resistant resin and the heat dissipation powder which are in the ink layer and have high temperature resistance and improve the heat dissipation effect. When the color developing agent used by the ink layer of the covering film is a white color developing agent, the covering film can have excellent reflectivity by mixing the white color developing agent with the resin; when the used colour-developing agent of the printing ink layer of this cover film is black colour-developing agent, mix through black colour-developing agent and resin, can make this cover film shield circuit pattern, prevent effectively that the circuit layout technique from leaking, can also prevent effectively simultaneously that the circuit from being oxidized by the light that sees through to promote life.
Detailed Description
In order to make the technical means, the original characteristics, the achieved purposes and the effects of the invention easily understood and obvious, the technical solutions in the embodiments of the present invention are clearly and completely described below to further illustrate the invention, and obviously, the described embodiments are only a part of the embodiments of the present invention, but not all the embodiments.
Example 1
The specific embodiment is a high-temperature-resistant heat dissipation covering film for a 5G high-frequency circuit board, the covering film comprises a polymer layer, an adhesion layer and an ink layer, the adhesion layer is used for adhering the covering film on the circuit board, the ink layer is 5-15 mu m thick, the polymer layer is fixedly clamped between the ink layer and the adhesion layer, and the ink layer is composed of epoxy resin, high-temperature-resistant resin, heat dissipation powder and color developing agent; the material of the polymer layer is polyimide, the thickness of the polymer layer is 10-15 mu m, the thickness of the adhesion layer is 30-35 mu m, and the polymer layer and the adhesion layer can be applied to a 5G high-frequency printed circuit board under the condition of maintaining the high-temperature-resistant and heat-dissipation characteristics of the cover film to the maximum extent by controlling the thicknesses of the polymer layer and the adhesion layer, and the cost can be effectively controlled; the high-temperature resistant resin is bismaleimide and organic silicon resin, and accounts for 10% of the solid content of the ink layer in percentage by weight; the heat dissipation powder is boron nitride and aluminum nitride, and accounts for 15% of the solid content of the ink layer in percentage by weight.
The color developing agent is white color developing agent, and the white color developing agent is titanium dioxide, and the white color developing agent accounts for 50% of the solid content of the epoxy resin in percentage by weight. When the color-developing agent used in the ink layer of the cover film is a white color-developing agent, the cover film can have excellent reflectance by mixing the white color-developing agent with the resin.
The ink layer of the high-temperature-resistant heat dissipation covering film is prepared by the following method: coating or printing a mixture consisting of epoxy resin, high-temperature-resistant resin, radiating powder and a color developing agent on a base material, and peeling the base material after drying to obtain the ink layer.
Example 2
The specific embodiment is a high-temperature-resistant heat dissipation covering film for a 5G high-frequency circuit board, the covering film comprises a polymer layer, an adhesive layer for adhering the covering film on the circuit board, and an ink layer with the thickness of 10-20 mu m, wherein the polymer layer is fixedly clamped between the ink layer and the adhesive layer, and the ink layer consists of epoxy resin, high-temperature-resistant resin, heat dissipation powder and a color developing agent; wherein, the material of the polymer layer is polyethylene terephthalate, the thickness of the polymer layer is 15-20 μm, the thickness of the adhesion layer is 25-30 μm, and the thickness of the polymer layer and the adhesion layer is controlled, so that the cover film can be applied to a 5G high-frequency printed circuit board under the condition of maintaining the high-temperature resistant and heat dissipation characteristics of the cover film to the maximum extent, and the cost can be effectively controlled; the high-temperature resistant resin is phenolic resin and organic silicon resin, and accounts for 20% of the solid content of the ink layer in percentage by weight; the heat dissipation powder is silicon nitride and aluminum nitride, and accounts for 30% of the solid content of the ink layer in percentage by weight.
The color developing agent is white color developing agent, and the white color developing agent is titanium dioxide, and the white color developing agent accounts for 60% of the solid content of the epoxy resin in percentage by weight. When the color-developing agent used in the ink layer of the cover film is a white color-developing agent, the cover film can have excellent reflectance by mixing the white color-developing agent with the resin.
The ink layer of the high-temperature-resistant heat dissipation covering film is prepared by the following method: coating or printing a mixture consisting of epoxy resin, high-temperature-resistant resin, radiating powder and a color developing agent on a base material, and peeling the base material after drying to obtain the ink layer.
In addition, the cover film also comprises a release film which is attached to the outer surface of the adhesive layer and used for keeping the adhesiveness of the adhesive layer; the release film keeps the viscosity of the adhesive layer, so that the cover film is favorable for being subsequently adhered to a circuit board or used in other pressing processes.
Example 3
The specific embodiment is a high-temperature-resistant heat dissipation covering film for a 5G high-frequency circuit board, the covering film comprises a polymer layer, an adhesive layer for adhering the covering film on the circuit board, and an ink layer with the thickness of 20-30 mu m, wherein the polymer layer is fixedly clamped between the ink layer and the adhesive layer, and the ink layer consists of epoxy resin, high-temperature-resistant resin, heat dissipation powder and a color developing agent; the material of the polymer layer is polyaniline, the thickness of the polymer layer is 20-25 mu m, the thickness of the adhesion layer is 20-25 mu m, and the thickness of the polymer layer and the adhesion layer is controlled, so that the cover film can be applied to a 5G high-frequency printed circuit board under the condition of maintaining the high-temperature-resistant and heat-dissipation characteristics of the cover film to the maximum extent, and the cost can be effectively controlled; the high-temperature resistant resin is phenolic resin and bismaleimide, and accounts for 30% of the solid content of the ink layer in percentage by weight; the heat dissipation powder is silicon nitride and boron nitride, and accounts for 45% of the solid content of the ink layer in percentage by weight.
The color developing agent is white color developing agent, and the white color developing agent is titanium dioxide, and the white color developing agent accounts for 95% of the solid content of the epoxy resin in percentage by weight. When the color-developing agent used in the ink layer of the cover film is a white color-developing agent, the cover film can have excellent reflectance by mixing the white color-developing agent with the resin.
The ink layer of the high-temperature-resistant heat dissipation covering film is prepared by the following method: coating or printing a mixture consisting of epoxy resin, high-temperature-resistant resin, radiating powder and a color developing agent on a base material, and peeling the base material after drying to obtain the ink layer.
In addition, the cover film also comprises a release film which is attached to the outer surface of the adhesive layer and used for keeping the adhesiveness of the adhesive layer; the release film keeps the viscosity of the adhesive layer, so that the cover film is favorable for being subsequently adhered to a circuit board or used in other pressing processes.
Example 4
The specific embodiment is a high-temperature-resistant heat dissipation covering film for a 5G high-frequency circuit board, the covering film comprises a polymer layer, an adhesive layer for adhering the covering film on the circuit board, and an ink layer with the thickness of 30-40 mu m, wherein the polymer layer is fixedly clamped between the ink layer and the adhesive layer, and the ink layer consists of epoxy resin, high-temperature-resistant resin, heat dissipation powder and a color developing agent; the material of the polymer layer is polyethylene naphthalate, the thickness of the polymer layer is 20-25 μm, the thickness of the adhesion layer is 15-20 μm, and the polymer layer and the adhesion layer are controlled to be applied to a 5G high-frequency printed circuit board under the condition that the high-temperature-resistant and heat-dissipation characteristics of the cover film are maintained to the maximum extent and the cost can be effectively controlled; the high-temperature resistant resin is organic silicon resin, and accounts for 40% of the solid content of the ink layer in percentage by weight; the heat dissipation powder is aluminum nitride, and accounts for 60% of the solid content of the ink layer in percentage by weight.
The color developing agent is a black color developing agent, the black color developing agent is carbon powder, and the black color developing agent accounts for 3% of the solid content of the epoxy resin in percentage by weight. When the used colour-developing agent of the printing ink layer of this cover film is black colour-developing agent, mix through black colour-developing agent and resin, can make this cover film shield circuit pattern, prevent effectively that the circuit layout technique from leaking, can also prevent effectively simultaneously that the circuit from being oxidized by the light that sees through to promote life.
The ink layer of the high-temperature-resistant heat dissipation covering film is prepared by the following method: coating or printing a mixture consisting of epoxy resin, high-temperature-resistant resin, radiating powder and a color developing agent on a base material, and peeling the base material after drying to obtain the ink layer.
Example 5
The specific embodiment is a high-temperature-resistant heat dissipation covering film for a 5G high-frequency circuit board, the covering film comprises a polymer layer, an adhesion layer for adhering the covering film on the circuit board, and an ink layer with the thickness of 35-45 mu m, wherein the polymer layer is fixedly clamped between the ink layer and the adhesion layer, and the ink layer consists of epoxy resin, high-temperature-resistant resin, heat dissipation powder and a color developing agent; the material of the polymer layer is polycarbonate, the thickness of the polymer layer is 15-20 microns, the thickness of the adhesion layer is 15-20 microns, and the thickness of the polymer layer and the thickness of the adhesion layer are controlled, so that the cover film can be applied to a 5G high-frequency printed circuit board under the condition that the high-temperature-resistant and heat-dissipation characteristics of the cover film are maintained to the greatest extent, and the cost can be effectively controlled; the high-temperature resistant resin is bismaleimide, and accounts for 25% of the solid content of the ink layer in percentage by weight; the heat dissipation powder is boron nitride, and accounts for 25% of the solid content of the ink layer in percentage by weight.
The color developing agent is a black color developing agent, the black color developing agent is a carbon nano tube, and the black color developing agent accounts for 15% of the solid content of the epoxy resin in percentage by weight. When the used colour-developing agent of the printing ink layer of this cover film is black colour-developing agent, mix through black colour-developing agent and resin, can make this cover film shield circuit pattern, prevent effectively that the circuit layout technique from leaking, can also prevent effectively simultaneously that the circuit from being oxidized by the light that sees through to promote life.
The ink layer of the high-temperature-resistant heat dissipation covering film is prepared by the following method: coating or printing a mixture consisting of epoxy resin, high-temperature-resistant resin, radiating powder and a color developing agent on a base material, and peeling the base material after drying to obtain the ink layer.
Example 6
The specific embodiment is a high-temperature-resistant heat dissipation covering film for a 5G high-frequency circuit board, the covering film comprises a polymer layer, an adhesive layer for adhering the covering film on the circuit board, and an ink layer with the thickness of 40-50 mu m, wherein the polymer layer is fixedly clamped between the ink layer and the adhesive layer, and the ink layer consists of epoxy resin, high-temperature-resistant resin, heat dissipation powder and a color developing agent; the material of the polymer layer is polyimide and polyethylene terephthalate, the thickness of the polymer layer is 10-15 μm, the thickness of the adhesion layer is 30-35 μm, and the polymer layer and the adhesion layer can be controlled to be applied to a 5G high-frequency printed circuit board under the condition that the high-temperature-resistant and heat-dissipation characteristics of the cover film are maintained to the greatest extent, and the cost can be effectively controlled; the high-temperature-resistant resin is phenolic resin, and accounts for 15% of the solid content of the ink layer in percentage by weight; the heat dissipation powder is silicon nitride, and accounts for 70% of the solid content of the ink layer in percentage by weight.
The color developing agent is a black color developing agent, the black color developing agent is carbon powder and carbon nano tubes, and the black color developing agent accounts for 10% of the solid content of the epoxy resin in percentage by weight. When the used colour-developing agent of the printing ink layer of this cover film is black colour-developing agent, mix through black colour-developing agent and resin, can make this cover film shield circuit pattern, prevent effectively that the circuit layout technique from leaking, can also prevent effectively simultaneously that the circuit from being oxidized by the light that sees through to promote life.
The ink layer of the high-temperature-resistant heat dissipation covering film is prepared by the following method: coating or printing a mixture consisting of epoxy resin, high-temperature-resistant resin, radiating powder and a color developing agent on a base material, and peeling the base material after drying to obtain the ink layer.
In addition, the cover film also comprises a release film which is attached to the outer surface of the adhesive layer and used for keeping the adhesiveness of the adhesive layer; the release film keeps the viscosity of the adhesive layer, so that the cover film is favorable for being subsequently adhered to a circuit board or used in other pressing processes.
Detection assay
The ink layers in the above 6 examples were subjected to heat resistance and thermal conductivity analysis tests, respectively: the heat resistance tester is used for testing the high temperature resistance, two electric heating plates are placed in a box body, a polytetrafluoroethylene layer is coated on the opposite surfaces of the two electric heating plates, the adhesion between a test sample and the electric heating plates can be effectively avoided by utilizing the anti-adhesion property of the polytetrafluoroethylene, the test sample of the ink layer in one embodiment is placed between the two electric heating plates, and the temperature control switch is used for adjusting the setting for testing; meanwhile, the heat resistance of a general coverlay film (i.e., comparative example) currently on the market was tested in the same manner, and the data obtained by the test was recorded in table 1 as a comparison.
The Hot Disk thermal conductivity meter is used for conducting thermal conductivity analysis and test, two ink layer samples are covered on the upper surface and the lower surface of a sensor, the ink layer and the sensor are clamped on the outer side surfaces of the two ink layers by two steel plates respectively, the thermal conductivity of the ink layers is measured by the sensor, test records of the ink layers prepared in the 6 embodiments are used as an experimental group, the thermal conductivity of common covering films on the market at present is tested by the same method to be used as a comparative example, and the measured thermal conductivity results are recorded in table 1.
TABLE 1 results of the experiments
As can be seen from the above table, the high temperature resistant heat dissipation cover film of the present technical solution indeed has higher heat resistance and heat dissipation effects than a general cover film; meanwhile, from the test data, the temperature resistance of the ink layer can reach about 280 ℃ or even above, and the heat conduction coefficient can also reach 2.0-3.0W/mK.
The high-temperature-resistant heat dissipation covering film has the advantages of high temperature resistance and high heat dissipation efficiency by utilizing the high-temperature-resistant resin and the heat dissipation powder which are in the ink layer and have high temperature resistance and improve the heat dissipation effect.
Having thus described the principal technical features and basic principles of the invention, and the advantages associated therewith, it will be apparent to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description is described in terms of various embodiments, not every embodiment includes only a single embodiment, and such descriptions are provided for clarity only, and those skilled in the art will recognize that the embodiments described herein can be combined as a whole to form other embodiments as would be understood by those skilled in the art.
Claims (9)
1. The high-temperature-resistant heat dissipation covering film for the 5G high-frequency circuit board is characterized by comprising a polymer layer, an adhesion layer and an ink layer, wherein the adhesion layer is used for adhering the covering film to the circuit board, the ink layer is 5-50 mu m thick, the polymer layer is fixedly clamped between the ink layer and the adhesion layer, and the ink layer is composed of epoxy resin, high-temperature-resistant resin, heat dissipation powder and a color developing agent; the high-temperature-resistant resin is at least one of phenolic resin, bismaleimide and organic silicon resin, and accounts for 10-40% of the solid content of the ink layer in percentage by weight; the heat dissipation powder is at least one of silicon nitride, boron nitride and aluminum nitride, and accounts for 15-70% of the solid content of the ink layer in percentage by weight.
2. The high-temperature-resistant heat dissipation cover film for the 5G high-frequency circuit board according to claim 1, wherein the material of the polymer layer is at least one of polyimide, polyethylene terephthalate, polyaniline, polyethylene naphthalate and polycarbonate.
3. The high-temperature-resistant heat dissipation cover film for the 5G high-frequency circuit board according to claim 2, wherein the material of the polymer layer is at least one of polyimide and polyethylene terephthalate.
4. The high-temperature-resistant heat dissipation cover film for the 5G high-frequency circuit board according to claim 1, wherein the color developing agent is a white color developing agent or a black color developing agent.
5. The high-temperature-resistant heat dissipation cover film for the 5G high-frequency circuit board according to claim 4, wherein the white color developing agent is titanium dioxide, and the white color developing agent accounts for 50-95% of the solid content of the epoxy resin in percentage by weight.
6. The high-temperature-resistant heat dissipation cover film for the 5G high-frequency circuit board according to claim 4, wherein the black color developing agent is at least one of carbon powder and carbon nanotubes, and the black color developing agent accounts for 3-15% of the solid content of the epoxy resin in percentage by weight.
7. The high-temperature-resistant heat dissipation covering film for a 5G high-frequency circuit board according to claim 1, wherein the thickness of the polymer layer is 10-25 μm.
8. The high-temperature-resistant heat dissipation cover film for a 5G high-frequency circuit board according to claim 1, wherein the thickness of the adhesive layer is 15-35 μm.
9. The high-temperature heat dissipation cover film for a 5G high-frequency circuit board according to claim 1, further comprising a release film attached to the outer surface of the adhesive layer for maintaining the adhesiveness of the adhesive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110767182.5A CN113601926A (en) | 2021-07-07 | 2021-07-07 | High-temperature-resistant heat dissipation covering film for 5G high-frequency circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110767182.5A CN113601926A (en) | 2021-07-07 | 2021-07-07 | High-temperature-resistant heat dissipation covering film for 5G high-frequency circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113601926A true CN113601926A (en) | 2021-11-05 |
Family
ID=78337402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110767182.5A Pending CN113601926A (en) | 2021-07-07 | 2021-07-07 | High-temperature-resistant heat dissipation covering film for 5G high-frequency circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113601926A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114466506A (en) * | 2022-01-13 | 2022-05-10 | 江西科昂电子新材料有限公司 | High-thermal-conductivity low-dielectric high-frequency covering film and preparation method thereof |
| TWI789149B (en) * | 2021-12-07 | 2023-01-01 | 大陸商河南烯力新材料科技有限公司 | Heat dissipation structure and electronic device |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101186796A (en) * | 2007-12-06 | 2008-05-28 | 上海交通大学 | Method for preparing epoxy resin adhesive |
| CN101717613A (en) * | 2009-12-07 | 2010-06-02 | 东华大学 | High-temperature resistant copper foil glue and preparation and application thereof |
| CN101851386A (en) * | 2009-04-01 | 2010-10-06 | 汉高（中国）投资有限公司 | Epoxy resin compound |
| CN102118916A (en) * | 2009-12-30 | 2011-07-06 | 昆山雅森电子材料科技有限公司 | Heat-conducting covering film |
| CN103320010A (en) * | 2013-06-05 | 2013-09-25 | 浙江华彩化工有限公司 | High-temperature-resistant powder paint |
| CN103619121A (en) * | 2013-11-26 | 2014-03-05 | 苏州城邦达力材料科技有限公司 | Laminating protective ink for circuit board |
| CN104293229A (en) * | 2014-10-21 | 2015-01-21 | 济南圣泉集团股份有限公司 | Conductive adhesive and preparation method thereof |
| CN112048085A (en) * | 2020-09-09 | 2020-12-08 | 深圳市知猪互联科技有限公司 | Preparation process of biodegradable resin-based composite material |
-
2021
- 2021-07-07 CN CN202110767182.5A patent/CN113601926A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101186796A (en) * | 2007-12-06 | 2008-05-28 | 上海交通大学 | Method for preparing epoxy resin adhesive |
| CN101851386A (en) * | 2009-04-01 | 2010-10-06 | 汉高（中国）投资有限公司 | Epoxy resin compound |
| CN101717613A (en) * | 2009-12-07 | 2010-06-02 | 东华大学 | High-temperature resistant copper foil glue and preparation and application thereof |
| CN102118916A (en) * | 2009-12-30 | 2011-07-06 | 昆山雅森电子材料科技有限公司 | Heat-conducting covering film |
| CN103320010A (en) * | 2013-06-05 | 2013-09-25 | 浙江华彩化工有限公司 | High-temperature-resistant powder paint |
| CN103619121A (en) * | 2013-11-26 | 2014-03-05 | 苏州城邦达力材料科技有限公司 | Laminating protective ink for circuit board |
| CN104293229A (en) * | 2014-10-21 | 2015-01-21 | 济南圣泉集团股份有限公司 | Conductive adhesive and preparation method thereof |
| CN112048085A (en) * | 2020-09-09 | 2020-12-08 | 深圳市知猪互联科技有限公司 | Preparation process of biodegradable resin-based composite material |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI789149B (en) * | 2021-12-07 | 2023-01-01 | 大陸商河南烯力新材料科技有限公司 | Heat dissipation structure and electronic device |
| CN114466506A (en) * | 2022-01-13 | 2022-05-10 | 江西科昂电子新材料有限公司 | High-thermal-conductivity low-dielectric high-frequency covering film and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102118916B (en) | Heat-conducting covering film | |
| CN113601926A (en) | High-temperature-resistant heat dissipation covering film for 5G high-frequency circuit board | |
| CN102143646B (en) | Stiffening plate for printed circuit board | |
| CN215073724U (en) | Matte electromagnetic interference shielding film with carrier film | |
| WO2021004177A1 (en) | Shielding film having multi-layered metal structure | |
| JP2010232252A (en) | Coverlay film having white reflection layer | |
| TW202033346A (en) | Electromagnetic interference shielding film having conductive fiber and the methods for preparing the same | |
| JP2021127438A (en) | Thermosetting resin composition, thermosetting adhesive, thermosetting resin film, and laminate, prepreg, and circuit board using thermosetting resin composition | |
| CN115558436A (en) | High-performance polyimide shielding film and preparation method thereof | |
| CN216391960U (en) | Electromagnetic interference shielding film | |
| TW202248008A (en) | Matte type electromagnetic interference shielding film and preparation method thereof | |
| CN111592760B (en) | Colored cover film composition, colored cover film and copper-clad plate assembly | |
| CN110511707A (en) | A kind of epoxy adhesive and apply and methods for using them | |
| CN102825861A (en) | Heat-conductive two-sided flexible copper clad laminate and manufacturing method thereof | |
| CN202773173U (en) | Cover film having advantages of thermal conductivity and electromagnetic shielding | |
| TW201844066A (en) | Coverlay film | |
| CN209210695U (en) | A kind of bond plies | |
| CN103547132A (en) | Electromagnetic interference shielding structure and flexible printed circuit board with same | |
| CN204733501U (en) | There is the fin of Electromagnetic Interference function of shielding | |
| TWM526265U (en) | Heat sink with electromagnetic wave shielding | |
| CN113613482A (en) | Electromagnetic wave shielding film suitable for grounding of extremely-small grounding hole, preparation method and application | |
| CN202679900U (en) | Structure for shielding electromagnetic interference and flexible printed circuit board provided with same | |
| CN103050616B (en) | Composition heat conducting copper foil base plate | |
| CN102020848A (en) | Polyamide acid composition and application thereof | |
| TWM448880U (en) | Covering film and flexible printed circuit board having the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20211105 |