CN103560128A - 光斑均匀的高光效大功率集成led - Google Patents
光斑均匀的高光效大功率集成led Download PDFInfo
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- CN103560128A CN103560128A CN201310544607.1A CN201310544607A CN103560128A CN 103560128 A CN103560128 A CN 103560128A CN 201310544607 A CN201310544607 A CN 201310544607A CN 103560128 A CN103560128 A CN 103560128A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
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Abstract
光斑均匀的高光效大功率集成LED,主要由支架、金线和若干晶片组成,晶片固定于支架上,晶片之间通过金线连接,两端晶片通过金线与支架的支架正极和支架负极连接,晶片按照S形结构均匀分布于支架表面,支架碗杯内填充荧光胶。本发明采用S型固晶焊线方式,将晶片均匀分布于支架表面,支架碗杯内填充荧光胶,以保证LED出光均匀、无光斑,荧光粉激发效率更高,亮度大大增加,因晶片分散排列,使其散热更好,品质可靠性提升。
Description
技术领域
本发明涉及照明灯具技术领域,具体涉及一种光斑均匀的高光效大功率集成LED。
背景技术
目前大功率集成LED主要结构是由:支架、晶片、金线、荧光粉(白光才有的)、AB胶组成,如图1所示,多个LED晶片(4)通过银胶固定于支架(1)上,所述LED晶片(4)相互通过金线(3)连接,两端LED晶片(4)通过金线(3)与支架(1)的支架正极5和支架负极6连接,其中支架(1)碗杯内设有硅胶充填在多个LED晶片(4)之间,并包裹住所述金线(3),这种结构的LED可防止LED集成光源内部部分金线或LED晶片损坏,解决了LED集成光源电路上的整串LED晶片不发光失效的现象,但是现有结构的大功率集LED根据不同串并联需求,将多个晶片(4)直线排列在支架上,造成晶片(4)过于集中,散热较差,荧光粉激发不均匀,不彻底,会产生光斑,光效比较低。
发明内容
本发明提供了一种光斑均匀的高光效大功率集成LED,以解决现有技术存在的散热较差,荧光粉激发不均匀彻底以及产生光斑的问题。
本发明主要由支架、金线和若干晶片组成,晶片固定于支架上,晶片之间通过金线连接,两端晶片通过金线与支架的支架正极和支架负极连接,解决其技术问题所采用的技术方案是晶片按照S形结构均匀分布于支架表面,支架碗杯内填充荧光胶。
与现有技术相比,本发明采用S型固晶焊线方式,将晶片均匀分布于支架表面,支架碗杯内填充荧光胶,以保证LED出光均匀、无光斑,荧光粉激发效率更高,亮度大大增加,因晶片分散排列,使其散热更好,品质可靠性提升。
附图说明
下面结合附图和实施例对本发明进一步说明。
图1是现有技术大功率LED的结构示意图;
图2是本发明大功率LED的结构示意图。
图中1支架、2荧光胶、3金线、4晶片、5支架正极、6支架负极。
具体实施方式
如图2所示,一种光斑均匀的高光效大功率集成LED,主要由支架1、金线3和若干晶片4组成,晶片4固定于支架1上,晶片4之间通过金线3连接,两端晶片4通过金线3与支架1的支架正极5和支架负极6连接,晶片4按照S形结构均匀分布于支架1表面,支架1碗杯内填充荧光胶2。
Claims (1)
1.一种光斑均匀的高光效大功率集成LED,主要由支架、金线和若干晶片组成,晶片固定于支架上,晶片之间通过金线连接,两端晶片通过金线与支架的支架正极和支架负极连接,其特征是晶片按照S形结构均匀分布于支架表面,支架碗杯内填充荧光胶。
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