CN103557464B - Can multiaspect mounted type paster LED bracket and LED, LED lamp - Google Patents
Can multiaspect mounted type paster LED bracket and LED, LED lamp Download PDFInfo
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- CN103557464B CN103557464B CN201310574415.5A CN201310574415A CN103557464B CN 103557464 B CN103557464 B CN 103557464B CN 201310574415 A CN201310574415 A CN 201310574415A CN 103557464 B CN103557464 B CN 103557464B
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Abstract
The present invention relates to LED technology field, refer in particular to a kind of can multiaspect mounted type paster LED bracket and apply the LED of this LED support, LED lamp.Can multiaspect mounted type paster LED bracket, it includes pedestal and is arranged on two electrodes of base bottom, having isolation part integrated with pedestal between two electrodes, two described electrodes are respectively provided with the lateral electrode and upper electrode extending along pedestal lateral wall and upper surface and being formed.Advantages of the present invention major embodiment is in the following areas: three faces of LED support are covered with electrode, can select the combination just pasted, anti-the mode of patch or side patch carries out LED as required；Electrode area expands, and is equivalent to area of dissipation and expands, and thermal resistance face is little, and the heat dispersion of LED is substantially improved；LED can concatenate assembling, and motility is high, significant for reducing the volume of whole LED product, making ultra-thin LED product etc..
Description
Technical field:
The present invention relates to LED technology field, refering in particular to one can multiaspect mounted type paster LED
Support and apply the LED of this LED support, LED lamp.
Background technology:
Existing LED, when assembling with wiring board, typically can only just paste mode, i.e. LED
Lamp is directly welded on the printed circuit of wiring board, this mode assemble after the height phase of product
When in the height superposition of the two, the highest, volume is relatively big, and this also becomes restriction LED
Product is towards the obstacle of frivolous trend development；And existing LED product is due to base material etc.
Reason shows poor in terms of heat radiation, and this also limits the development of great power LED.
It addition, what the LED of existing single cannot be directly connected to substantially, can only be by outside
, between LED, there is bigger gap and space in circuit or the series connection of gold thread welding manner,
In unit are or length, the number of LED is the most less, and the most multiple LED assemble
The volume of LED lamp is bigger.
Summary of the invention:
It is an object of the invention to overcome the weak point of existing product, it is provided that one can multiaspect
Mounted type paster LED bracket and apply the LED of this LED support, LED lamp.
The present invention realizes its purpose and the technical scheme is that one can multiaspect mounted type paster
LED support, it includes pedestal and is arranged on two electrodes of base bottom, between two electrodes
Having isolation part integrated with pedestal, two described electrodes are respectively provided with outside pedestal
Lateral electrode that sidewall and upper surface extend and formed and upper electrode.
The present invention also provides for a kind of LED, including LED support and LED chip, LED
Support includes pedestal and is arranged on two electrodes of base bottom, has and base between two electrodes
The integrated isolation part of seat, two electrodes of described LED support are respectively provided with outside pedestal
Lateral electrode that sidewall and upper surface extend and formed and upper electrode.
The present invention also provides for a kind of LED lamp, some LED concatenation form, each
LED includes that LED support and LED chip, each LED support include pedestal and setting
At two electrodes of base bottom, there is between two electrodes isolation part integrated with pedestal,
Two electrodes of described each LED support are respectively provided with and prolong along its pedestal lateral wall and upper surface
The lateral electrode stretched and formed and upper electrode, and the lateral electrode of adjacent LED contacts with each other shape
Become series connection.
The present invention also provides for another kind of LED lamp, including being printed with the wiring board of circuit, and institute
State wiring board and be provided with the recess of mounted LED lamp, described LED include LED support and
LED chip, LED support includes pedestal and is arranged on two electrodes of base bottom, two electricity
There is between pole isolation part integrated with pedestal, and two electrodes of LED support are respectively
There is the lateral electrode and upper electrode, described electricity extending along pedestal lateral wall and upper surface and being formed
Any one in the lower surface of pole or upper electrode or lateral electrode turns on described recess.
In above-mentioned LED lamp, the recess of described wiring board offers through hole.I.e. in the middle part of recess
Open-minded, periphery forms a step surface to support LED, and so, LED both can just be pasted
Mode install, it is also possible to the mode of anti-patch is installed, and when just pasting, luminescence is upward, sends out during anti-patch
Light down, thus gives user more more options.
The present invention also provides for another kind of LED lamp, and this LED lamp includes being printed on printing electricity
The light-transparent carrier on road and LED, described LED includes LED support and LED chip,
LED support includes pedestal and is arranged on two electrodes of base bottom, has between two electrodes
Isolation part integrated with pedestal, and two electrodes of LED support are respectively provided with along pedestal
Lateral electrode that lateral wall and upper surface extend and formed and upper electrode；Described LED flip-over type
It is mounted on the upper electrode on described light-transparent carrier surface, i.e. LED and the print on light-transparent carrier surface
Brush circuit connects.
Advantages of the present invention major embodiment is in the following areas:
Three faces of 1.LED support are covered with electrode, can select as required just to paste, counter paste
Or the mode of side patch carries out the attachment of LED；
2. the expanded surface area of electrode, is equivalent to area of dissipation and expands, and thermal resistance face is little, significantly carries
Rise the heat dispersion of LED, reduce the temperature of lamp, reduce light decay；And same size
LED support can be suitable for the assembling of more powerful LED chip, the most existing applicable single
The LED support of 0.2w, after expanding two electrode areas, applicable single 1w even 3w's
LED chip assembles；The raising of heat dispersion simultaneously is also beneficial to extend the use longevity of LED
Life；
3.LED lamp can concatenate assembling, and motility is high, and direct-connected weldering between the side of LED
Connecing, in unit length, the number of LED is more；
4. by the mounting means of recess or can be big by the way of using transparent carrier to do wiring board
Width reduces the whole height of LED lamp, thus LED circuit board is greatly decreased and is taken up space,
Significant for reducing the volume of whole LED product, making ultra-thin LED product etc..
Accompanying drawing illustrates:
Fig. 1 is the structural representation of LED support of the present invention；
Fig. 2 is the structural representation of LED of the present invention；
Fig. 3 is the structural representation of an embodiment of the present invention LED lamp；
Fig. 4 is the structural representation of another kind embodiment LED lamp of the present invention；
Fig. 5 is the structural representation of the third embodiment LED lamp of the present invention；
Fig. 6 is the structural representation of the 4th kind of embodiment LED lamp of the present invention；
Fig. 7 is the structural representation of the 5th kind of embodiment LED lamp of the present invention；
Fig. 8 is the structural representation of the 6th kind of embodiment LED lamp of the present invention.
Detailed description of the invention:
Below in conjunction with specific embodiments and the drawings, the present invention is further described.
As it is shown in figure 1, of the present invention can multiaspect mounted type paster LED bracket, its bag
Include pedestal 11 and be arranged on two electrodes 12 bottom pedestal 11, having between two electrodes 12
Isolation part 13 integrated with pedestal, two described electrodes 12 are respectively provided with along pedestal
Lateral electrode 121 that 11 lateral walls and upper surface extend and formed and upper electrode 122.I.e. two electricity
Pole 12 is covered each by the upper surface to described pedestal 11, side and region, lower surface,
LED support when attachment no matter electrode at upper surface, side and lower surface all can turn on,
This allows for LED and may select different mounting methods when attachment, thus produces difference
The various light fixture that structure, difference in functionality, applicable situation are different, more optional to consumer
LED lamp product；And electrode area expands, be equivalent to area of dissipation and expand, thermal resistance
Face is little, and the heat dispersion of LED and products thereof is substantially improved.
As in figure 2 it is shown, a kind of LED, including the LED support shown in Fig. 1 and LED
Chip 14, LED support includes pedestal 11 and is arranged on two electrodes 12 of base bottom,
There are between two electrodes isolation part 13 integrated with pedestal, two of described LED support
Electrode 12 is respectively provided with lateral electrode 121 He extending along pedestal lateral wall and upper surface and being formed
Upper electrode 122；Described LED chip 14 is mounted on a wherein electrode top, and by gold
Line connects with two electrodes 12 respectively.
Again as it is shown on figure 3, the present embodiment LED lamp is by the LED shown in some Fig. 2
Lamp 1 concatenation forms, and this compound mode has lateral electrode due to the sidepiece of LED 1, because of
This can directly contact and connect and form tandem type LED light fixture, the spacing between such lamp and lamp
The least, in unit length, the number of LED is the most, can make LED product volume
Littleization, is particularly well-suited to installing space little, and illumination concentration degree requires high occasion.
The most as shown in Figure 4, the present embodiment LED lamp includes the wiring board 2 being printed with circuit,
Described wiring board 2 is provided with the recess 21 of mounted LED lamp 1；Described LED 1 includes
LED support and LED chip 14, LED support includes pedestal 11 and is arranged on base bottom
Two electrodes 12, there is between two electrodes isolation part 13 integrated with pedestal, and
Two electrodes of LED support are respectively provided with and extend along pedestal lateral wall and upper surface and formed
In lateral electrode 121 and upper electrode 122, the lower surface of described electrode or upper electrode or lateral electrode
Any one turns on described recess.This figure embodiment such as it is the lower surface of electrode is with recessed
Position 21 conducting.The degree of depth of recess 21 can design according to specific needs, after LED 1 assembles
The two flush can be made, the most smooth, and whole LED lamp
Highly minimizing.Or as it is shown in figure 5, when wiring board 2 does not opens recess
Directly LED 1 is just being attached on wiring board 2.
Or, as shown in Figure 6, in the recess 21 of described wiring board 2, offer through hole 20.
I.e. open-minded in the middle part of recess 21, periphery forms a step surface to support LED, so, LED
Lamp 1 both can be installed in the way of just pasting, it is also possible to the mode of anti-patch is installed, luminous when just pasting
Upward, during anti-patch, luminescence is down, thus gives user more more options.Or, such as Fig. 7 institute
Showing, this LED lamp, in the case of wiring board 2 does not offers recess, directly offers through hole 20,
LED 1 is mounted in flip-over type on wiring board 2, and its luminescence is down through wiring board 2
Through hole 20 goes out light.And, back-sticked type attachment rising angle is less, and illumination is more concentrated.
Having as shown in Figure 8 again, in the present embodiment, LED lamp includes being printed on the saturating of printed circuit
Light carrier 3 and LED 1, described LED 1 includes LED support and LED chip
14, LED support includes pedestal 11 and is arranged on two electrodes 12 bottom pedestal 11, two
There are between electrode 12 isolation part 13 integrated with pedestal, and two of LED support
Electrode 12 is respectively provided with the lateral electrode 121 extending along pedestal 11 lateral wall and upper surface and being formed
With upper electrode 122；Described LED 1 flip-over type is mounted on described light-transparent carrier 3 surface,
The i.e. upper electrode 122 of LED connects with the printed circuit on light-transparent carrier 3 surface.This enforcement
Example LED is directly using transparent carrier 3 as wiring board direct back inversed attachment, thus
Eliminating the material such as light guide plate, aluminium base, the integral thickness of light fixture is less, large-area electricity
Pole heat conduction makes product heat dispersion secure.
The advantage of LED support of the present invention, LED and LED lamp is mainly reflected in following
Aspect:
Three faces of 1.LED support are covered with electrode, can select as required just to paste, counter paste
Or the mode of side patch carries out the combination of LED；
2. electrode area expands, and is equivalent to area of dissipation and expands, and thermal resistance face is little, is substantially improved
The heat dispersion of LED, reduces the temperature of lamp, reduces light decay；And the LED of same size
Support can be suitable for the assembling of more powerful LED chip, the most existing applicable single 0.2w
LED support, after expanding two electrode areas, applicable single the 0.8w even LED of 1w
Chip assembles；The raising of heat dispersion simultaneously is also beneficial to extend the service life of LED；
3.LED lamp can concatenate assembling, and motility is high, and can be direct-connected between the side of LED
Welding, in unit length, the number of LED is more；
4. by the mounting means of recess or can be big by the way of using transparent carrier to do wiring board
Width reduces the whole height of LED lamp, thus LED circuit board is greatly decreased and is taken up space,
Significant for reducing the volume of whole LED product, making ultra-thin LED product etc..
Claims (6)
1. one kind can multiaspect mounted type paster LED bracket, it includes pedestal and is arranged on two electrodes of base bottom, there is between two electrodes isolation part integrated with pedestal, it is characterized in that: be set to benchmark upward with the light direction of pedestal, two described electrodes are respectively provided with the lateral electrode and upper electrode extending along pedestal lateral wall and upper surface and being formed.
2. a LED, including LED support and LED chip, LED support includes pedestal and is arranged on two electrodes of base bottom, there is between two electrodes isolation part integrated with pedestal, it is characterized in that: be set to benchmark upward with the light direction of pedestal, two electrodes of described LED support are respectively provided with the lateral electrode and upper electrode extending along pedestal lateral wall and upper surface and being formed.
3. a LED lamp, formed by some LED concatenation, each LED includes LED support and LED chip, each LED support includes pedestal and is arranged on two electrodes of base bottom, there is between two electrodes isolation part integrated with pedestal, it is characterized in that: be set to benchmark upward with the light direction of pedestal, two electrodes of described each LED support are respectively provided with the lateral electrode and upper electrode extending along its pedestal lateral wall and upper surface and being formed, and the lateral electrode of adjacent LED contacts with each other and forms series connection.
4. a LED lamp, including the wiring board being printed with circuit, it is characterised in that: described wiring board is provided with the recess of mounted LED lamp；Described LED includes LED support and LED chip, LED support includes pedestal and is arranged on two electrodes of base bottom, there is between two electrodes isolation part integrated with pedestal, benchmark it is set to upward with the light direction of pedestal, and two electrodes of LED support be respectively provided with in the lateral electrode and upper electrode, the lower surface of described electrode or upper electrode or lateral electrode extended along pedestal lateral wall and upper surface and formed any one turn on described recess.
LED lamp the most according to claim 4, it is characterised in that: the recess of described wiring board offers through hole.
6. a LED lamp, it is characterized in that: this LED lamp includes being printed on light-transparent carrier and the LED of printed circuit, described LED includes LED support and LED chip, LED support includes pedestal and is arranged on two electrodes of base bottom, there is between two electrodes isolation part integrated with pedestal, it is set to benchmark upward with the light direction of pedestal, and two electrodes of LED support are respectively provided with the lateral electrode and upper electrode extending along pedestal lateral wall and upper surface and being formed；The printed circuit of upper electrode and light-transparent carrier surface that described LED flip-over type is mounted on described light-transparent carrier surface, i.e. LED connects.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310574415.5A CN103557464B (en) | 2013-11-15 | 2013-11-15 | Can multiaspect mounted type paster LED bracket and LED, LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310574415.5A CN103557464B (en) | 2013-11-15 | 2013-11-15 | Can multiaspect mounted type paster LED bracket and LED, LED lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103557464A CN103557464A (en) | 2014-02-05 |
| CN103557464B true CN103557464B (en) | 2016-08-24 |
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| CN201310574415.5A Active CN103557464B (en) | 2013-11-15 | 2013-11-15 | Can multiaspect mounted type paster LED bracket and LED, LED lamp |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109036168A (en) * | 2018-10-12 | 2018-12-18 | 广东德豪锐拓显示技术有限公司 | LED transparent display screen and its SMD lamp |
| CN111312884A (en) * | 2020-03-31 | 2020-06-19 | 苏州雷霆光电科技有限公司 | Light-emitting component |
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| CN201170529Y (en) * | 2008-02-20 | 2008-12-24 | 丽鸿科技股份有限公司 | LED module group |
| CN201173401Y (en) * | 2008-04-09 | 2008-12-31 | 陈雅惠 | Luminous body cascading package structure |
| WO2010022538A1 (en) * | 2008-08-26 | 2010-03-04 | Pan Dingguo | A led multi-chip bonding die and a light stripe holding the bonding die |
| CN102829369A (en) * | 2011-06-17 | 2012-12-19 | 展晶科技(深圳)有限公司 | Light-emitting diode light bar and manufacturing method thereof |
| CN103047574A (en) * | 2013-01-02 | 2013-04-17 | 马飞 | LED lamp structure |
| CN203549503U (en) * | 2013-11-15 | 2014-04-16 | 东莞市驰明电子科技有限公司 | Multi-surface-mounted type patch LED support, LEDs and LED lamp |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7262438B2 (en) * | 2005-03-08 | 2007-08-28 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | LED mounting having increased heat dissipation |
| TWI416771B (en) * | 2009-10-01 | 2013-11-21 | Everlight Electronics Co Ltd | Light emitting diode |
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201170529Y (en) * | 2008-02-20 | 2008-12-24 | 丽鸿科技股份有限公司 | LED module group |
| CN201173401Y (en) * | 2008-04-09 | 2008-12-31 | 陈雅惠 | Luminous body cascading package structure |
| WO2010022538A1 (en) * | 2008-08-26 | 2010-03-04 | Pan Dingguo | A led multi-chip bonding die and a light stripe holding the bonding die |
| CN102829369A (en) * | 2011-06-17 | 2012-12-19 | 展晶科技(深圳)有限公司 | Light-emitting diode light bar and manufacturing method thereof |
| CN103047574A (en) * | 2013-01-02 | 2013-04-17 | 马飞 | LED lamp structure |
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Effective date of registration: 20220728 Address after: 523000 No. 16, Jixi Road, Dongcheng Street, Dongguan City, Guangdong Province Patentee after: Dongguan Jufeng Electronic Material Co.,Ltd. Address before: 523000 No.9 Jidong Road, aoshitang Industrial Zone, Dongcheng District, Dongguan City, Guangdong Province Patentee before: DONGGUAN CHIMING ELECTRONICS TECHNOLOGY Co.,Ltd. |
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