CN103548430B - 电子部件安装方法、电子部件搭载装置以及电子部件安装*** - Google Patents
电子部件安装方法、电子部件搭载装置以及电子部件安装*** Download PDFInfo
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- CN103548430B CN103548430B CN201280025158.3A CN201280025158A CN103548430B CN 103548430 B CN103548430 B CN 103548430B CN 201280025158 A CN201280025158 A CN 201280025158A CN 103548430 B CN103548430 B CN 103548430B
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- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
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- H05K13/0465—Surface mounting by soldering
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- H05K3/3405—Edge mounted components, e.g. terminals
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- Y10T29/5313—Means to assemble electrical device
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Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (13)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2011124483 | 2011-06-02 | ||
JP2011-124483 | 2011-06-02 | ||
PCT/JP2012/003626 WO2012164957A1 (ja) | 2011-06-02 | 2012-06-01 | 電子部品実装方法、電子部品搭載装置および電子部品実装システム |
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CN103548430A CN103548430A (zh) | 2014-01-29 |
CN103548430B true CN103548430B (zh) | 2016-12-28 |
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CN201280025158.3A Expired - Fee Related CN103548430B (zh) | 2011-06-02 | 2012-06-01 | 电子部件安装方法、电子部件搭载装置以及电子部件安装*** |
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US (1) | US9609760B2 (zh) |
JP (1) | JP6260814B2 (zh) |
CN (1) | CN103548430B (zh) |
WO (1) | WO2012164957A1 (zh) |
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WO2012160817A1 (ja) * | 2011-05-26 | 2012-11-29 | パナソニック株式会社 | 電子部品実装方法、電子部品搭載装置および電子部品実装システム |
JP6177907B2 (ja) * | 2013-06-11 | 2017-08-09 | 富士機械製造株式会社 | 部品実装機 |
KR101575129B1 (ko) * | 2014-01-13 | 2015-12-08 | 피에스케이 주식회사 | 기판 이송 장치 및 방법, 그리고 기판 처리 장치 |
US10883356B2 (en) | 2014-04-17 | 2021-01-05 | Schlumberger Technology Corporation | Automated sliding drilling |
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JPWO2012164957A1 (ja) | 2015-02-23 |
US9609760B2 (en) | 2017-03-28 |
WO2012164957A1 (ja) | 2012-12-06 |
US20140096379A1 (en) | 2014-04-10 |
JP6260814B2 (ja) | 2018-01-17 |
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