CN102724808A - Printed circuit board (PCB) connecting structure and manufacturing method thereof - Google Patents
Printed circuit board (PCB) connecting structure and manufacturing method thereof Download PDFInfo
- Publication number
- CN102724808A CN102724808A CN2012102120808A CN201210212080A CN102724808A CN 102724808 A CN102724808 A CN 102724808A CN 2012102120808 A CN2012102120808 A CN 2012102120808A CN 201210212080 A CN201210212080 A CN 201210212080A CN 102724808 A CN102724808 A CN 102724808A
- Authority
- CN
- China
- Prior art keywords
- printed substrate
- printed
- spacer
- pcb1
- substrate pcb1
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
The invention discloses a printed circuit board (PCB) connecting structure and a manufacturing method thereof; the connecting structure comprises a PCB1, a PCB2, a division column and a fastener for connecting or communicating the two PCBs; a metallized through hole is arranged in the PCB1; metal pads are arranged close to the periphery of the metallized through hole in the upper and the lower surfaces of the PCB1, and a layer of soldering paste is printed on each metal pad; and the manufacturing method comprises the following steps that the PCBs are manufactured; the soldering paste is printed on a steel mesh; the division column is placed; welding is carried out; and the two PCBs are connected. According to the invention, because the structure between the PCBs and the connection of the division column is improved, the soldering paste is printed on the metal pads, a certain gap is left on the periphery of the division column and the metallized through hole, a reflux welding machine can replace a manual soldering iron for welding, the semi-automatic welding for the PCBs is realized, so that the production efficiency is improved, and the product quality is well guaranteed.
Description
Technical field
The invention belongs to electronic technology field, relate to a kind of connection structure of printed wiring board and preparation method thereof.
Background technology
In current electron trade; Printed substrate is almost ubiquitous; Little of electronic watch, calculator, general-purpose computer; Big to computer, communication electronic equipment, Aeronautics and Astronautics, military armament systems, as long as electronic devices and components such as integrated circuit are arranged, electric interconnection all will be used printed substrate between them.The production process of printed substrate is comparatively complicated, and the processing range that it relates to is wider, to connection structure of printed wiring board; Being connected between traditional printed substrate and the spacer mainly is to adopt direct welding manner; Spacer is inserted in the printed substrate, weld through manual flatiron, this connected mode production efficiency is low; And quality does not have guarantee; Because the production process of printed substrate is a kind of discrete streamline form, any one link goes wrong all can cause the consequence that stops production or scrap in a large number completely, and if printed substrate scrap just can't recycling.Therefore how to improve the production efficiency of printed substrate, quality is protected, the rate of reducing the number of rejects and seconds is an electron trade department problem demanding prompt solution.
Summary of the invention
The objective of the invention is to overcome the deficiency of prior art, a kind of connection structure of printed wiring board and preparation method thereof is provided, use the present invention can realize the semi-automatic welding to printed substrate, production efficiency is high, and product quality is secure.
For realizing above-mentioned purpose; The invention provides a kind of connection structure of printed wiring board; Comprise printed substrate PCB1, printed substrate PCB2, spacer and be used to connect or the securing member of two wiring boards of conducting; Be provided with the metallization via hole above the said printed substrate PCB1, be provided with metal pad by metallization via hole periphery, printing one deck solder(ing) paste on metal pad at printed substrate PCB1 upper and lower surfaces.
Be provided with the gap around the metallization via hole of said spacer insertion end and printed substrate PCB1, when being convenient to weld, make solder(ing) paste flow to gap location, cooling back spacer is able to firm the connection with printed substrate PCB1.
Be threaded installing hole in the said spacer, outer surface is zinc-plated.
The present invention also provides a kind of manufacture method of printed substrate, and this method comprises the steps:
A, making printed substrate PCB1, processing metal via hole on printed substrate PCB1, and at its surperficial metal plated pad;
B, steel mesh printed solder paste, printing one deck solder(ing) paste on the metal pad of printed substrate PCB1;
C, install to place spacer, the metal spacer of electroplating surfaces with tin is placed in the metallization via hole of said printed substrate PCB1 successively;
D, welding; Adopt reflow machine that metal spacer and printed substrate PCB1 are welded together; Under the reflow machine action of temperature, make solder(ing) paste flow to the gap location of spacer and printed substrate PCB1 metallization via hole, cooling back spacer just is able to firm the connection with printed substrate PCB1;
E, connect or conducting printed substrate PCB1 and printed substrate PCB2 with securing member.
Be provided with threaded mounting hole in the said step c spacer.
Leave the gap between said step c spacer and the metallization via hole.
Said step e is connected printed substrate PCB1 through screw with printed substrate PCB2, spacer can play the conducting effect of signal between the printed substrate as required.
Compared with prior art, the invention has the beneficial effects as follows: be used among the present invention to connect or the securing member of two wiring boards of conducting adopts screw, simple in structure, easy to operate; Architecture advances between the present invention connects through printed substrate and spacer; Printing one deck solder(ing) paste on metal pad; And leave certain interval at spacer and metallization via hole periphery, and can adopt reflow machine to replace manual flatiron welding, realize semi-automation welding to printed substrate; Thereby enhance productivity, and product quality obtains fine guarantee.
Description of drawings
Fig. 1 makes printed substrate structure sketch map for the present invention;
Fig. 2 is the A-A cutaway view of Fig. 1;
Fig. 3 is the F place zoomed-in view of Fig. 2;
Fig. 4 is a steel mesh printed solder paste structural representation of the present invention;
Fig. 5 is the B-B cutaway view of Fig. 4;
Fig. 6 is the G place zoomed-in view of Fig. 5;
Fig. 7 places the spacer structural representation for the present invention;
Fig. 8 is the C-C cutaway view of Fig. 7;
Fig. 9 is the H place zoomed-in view of Fig. 8;
Figure 10 is a printed substrate Welding Structure sketch map of the present invention;
Figure 11 is the D-D cutaway view of Figure 10;
Figure 12 is the J place zoomed-in view of Figure 11;
Figure 13 is the present invention's two wiring board syndeton sketch mapes;
Figure 14 is the E-E cutaway view of Figure 13;
Figure 15 is the K place zoomed-in view of Figure 14;
Figure 16 is an assembly exploded perspective view of the present invention.
Among the figure: the 1-via hole that metallizes, 2-metal pad, 3-solder(ing) paste, 4-spacer, 5-gap, 6-securing member.
Embodiment
Further describe technical scheme of the present invention below in conjunction with accompanying drawing, but require the scope of protection to be not limited to said.
Like Figure 13, Figure 14, shown in Figure 15; A kind of connection structure of printed wiring board of the present invention; Comprise printed substrate PCB1, printed substrate PCB2, spacer 4 and be used to connect or the securing member 6 of two wiring boards of conducting; Said printed substrate PCB1 is provided with metallization via hole 1, leans on the periphery of metallization via hole 1 to be provided with metal pad 2 at printed substrate PCB1 upper and lower surfaces, on metal pad 2, prints one deck solder(ing) paste 3.
Be provided with gap 5 around the metallization via hole 1 of said spacer 4 insertion ends and printed substrate PCB1, when being convenient to weld, make solder(ing) paste 3 flow to 5 places, gap, cooling back spacer 4 is able to firm the connection with printed substrate PCB1.
Be provided with threaded mounting hole in the said spacer 4, outer surface is zinc-plated.
Describedly be used to connect or the securing member 6 of two wiring boards of conducting adopts screws, simple in structure, easy to operate.
Extremely shown in Figure 16 like Fig. 1, the manufacture method of a kind of printed substrate of the present invention, this method comprises the steps:
A, make printed substrate PCB1, processing metal via hole 1 on printed substrate PCB1, and lower surface metal plated pad 2 above that;
B, steel mesh printed solder paste 3, printing one deck solder(ing) paste 3 on the metal pad 2 of printed substrate PCB1;
C, install to place spacer 4, the metal spacer 4 of electroplating surfaces with tin is placed in the metallization via hole 1 of printed substrate PCB1 successively;
D, welding; Adopt reflow machine that metal spacer 4 is welded together with printed substrate PCB1; Under the reflow machine action of temperature; Make solder(ing) paste 3 flow to 5 places, gap of spacer 4 and printed substrate PCB1 metallization via hole 1, cooling back spacer 4 just is able to firm the connection with printed substrate PCB1;
E, connect or conducting printed substrate PCB1 and printed substrate PCB2 with securing member 6.
Said step e is connected printed substrate PCB1 through screw with printed substrate PCB2, spacer 4 can play the conducting effect of signal between the printed substrate as required.
Claims (6)
1. connection structure of printed wiring board; Comprise printed substrate PCB1, printed substrate PCB2, spacer (4) and be used to connect or the securing member (6) of two wiring boards of conducting; It is characterized in that: said printed substrate PCB1 is provided with metallization via hole (1); Be provided with metal pad (2) at printed substrate PCB1 upper and lower surfaces by the periphery of metallization via hole (1), go up printing one deck solder(ing) paste (3) at metal pad (2).
2. a kind of connection structure of printed wiring board according to claim 1 is characterized in that: the metallization via hole (1) of said spacer (4) insertion end and printed substrate PCB1 is provided with gap (5) all around.
3. a kind of connection structure of printed wiring board according to claim 1 is characterized in that: said spacer is provided with threaded mounting hole in (4), and outer surface is zinc-plated.
4. a kind of connection structure of printed wiring board according to claim 1 is characterized in that: saidly be used to connect or the securing member (6) of two wiring boards of conducting is a screw.
5. printed wire board manufacturing method that adopts the described printed circuit board connecting structure of claim 1, this method comprises the steps:
A, make printed substrate PCB1, processing metal via hole (1) on printed substrate PCB1, and lower surface metal plated pad (2) above that;
B, steel mesh printed solder paste (3) are gone up printing one deck solder(ing) paste (3) at the metal pad (2) of printed substrate PCB1;
C, install to place spacer (4), the metal spacer (4) of electroplating surfaces with tin is placed in the metallization via hole (1) of printed substrate PCB1 successively;
D, welding; Adopt reflow machine that metal spacer (4) is welded together with printed substrate PCB1; Under the reflow machine action of temperature; Make solder(ing) paste (3) flow to spacer (4) and locate with the gap (5) of printed substrate PCB1 metallization via hole (1), cooling back spacer (4) just is able to firm the connection with printed substrate PCB1;
E, connect or conducting printed substrate PCB1 and printed substrate PCB2 with securing member (6).
6. printed wire board manufacturing method according to claim 5; It is characterized in that: said step e is connected printed substrate PCB1 through screw with printed substrate PCB2, spacer (4) can play the conducting effect of signal between the printed substrate as required.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102120808A CN102724808A (en) | 2012-06-26 | 2012-06-26 | Printed circuit board (PCB) connecting structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102120808A CN102724808A (en) | 2012-06-26 | 2012-06-26 | Printed circuit board (PCB) connecting structure and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102724808A true CN102724808A (en) | 2012-10-10 |
Family
ID=46950404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012102120808A Pending CN102724808A (en) | 2012-06-26 | 2012-06-26 | Printed circuit board (PCB) connecting structure and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102724808A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106842447A (en) * | 2017-03-31 | 2017-06-13 | 中航光电科技股份有限公司 | Active optical cable connector and active optical cable component, photoelectric conversion unit |
| CN111465182A (en) * | 2020-03-26 | 2020-07-28 | 重庆思睿创瓷电科技有限公司 | Filter assembling method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08204304A (en) * | 1995-01-30 | 1996-08-09 | Meidensha Corp | Printed board group |
| JPH08335760A (en) * | 1995-06-05 | 1996-12-17 | Mitsubishi Electric Corp | Printed board fixing structure |
| JP2001135382A (en) * | 1999-11-04 | 2001-05-18 | I-Pex Co Ltd | Electric connector for connecting parallel substrates |
| CN202713786U (en) * | 2012-06-26 | 2013-01-30 | 贵阳永青仪电科技有限公司 | Printed circuit board connection structure |
-
2012
- 2012-06-26 CN CN2012102120808A patent/CN102724808A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08204304A (en) * | 1995-01-30 | 1996-08-09 | Meidensha Corp | Printed board group |
| JPH08335760A (en) * | 1995-06-05 | 1996-12-17 | Mitsubishi Electric Corp | Printed board fixing structure |
| JP2001135382A (en) * | 1999-11-04 | 2001-05-18 | I-Pex Co Ltd | Electric connector for connecting parallel substrates |
| CN202713786U (en) * | 2012-06-26 | 2013-01-30 | 贵阳永青仪电科技有限公司 | Printed circuit board connection structure |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106842447A (en) * | 2017-03-31 | 2017-06-13 | 中航光电科技股份有限公司 | Active optical cable connector and active optical cable component, photoelectric conversion unit |
| CN106842447B (en) * | 2017-03-31 | 2019-06-11 | 中航光电科技股份有限公司 | Active optical cable connector and active optical cable component, photoelectric conversion unit |
| CN111465182A (en) * | 2020-03-26 | 2020-07-28 | 重庆思睿创瓷电科技有限公司 | Filter assembling method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202889786U (en) | PCB structure interconnected by surface mounting manner | |
| CN203086848U (en) | Connection structure for PCBs (Printed Circuit Boards) | |
| CN102724808A (en) | Printed circuit board (PCB) connecting structure and manufacturing method thereof | |
| CN110677988A (en) | Prevent circuit board in pad stifled hole | |
| CN202713786U (en) | Printed circuit board connection structure | |
| CN202335061U (en) | Semi-hole printed circuit board | |
| CN202488880U (en) | PCB (printed circuit board) capable of preventing hole from being plugged in tin soldering | |
| CN205430776U (en) | Circuit board combination | |
| CN211090145U (en) | Circuit board and electronic equipment | |
| CN111163583B (en) | Flexible printed circuit board | |
| CN107949160A (en) | A kind of hanging printed circuit board of the separated high heat conduction of thermoelectricity and its production method | |
| CN203912327U (en) | Heat-radiation polyimides circuit board with metallic holes and copper core | |
| CN204090290U (en) | There is the flexible circuit board of BGA pad | |
| CN210725493U (en) | Prevent circuit board in pad stifled hole | |
| CN203279346U (en) | False welding prevention single-sided circuit board | |
| CN203167427U (en) | Plated-through hole carbon film plate of paper base material | |
| CN102833958A (en) | EMI (Electromagnetic Interference) shielding method for circuit board lockhole and jig | |
| CN105491815A (en) | Reflow soldering template, template component, tin paste printing device and reflow soldering method | |
| CN203731074U (en) | Electronic weldment made of poor-welding materials | |
| CN202043385U (en) | Modified LED welding structure | |
| CN207625878U (en) | A kind of circuit board with novel metal half bore | |
| CN206879217U (en) | Mobile terminal and its circuit board assemblies | |
| CN219042077U (en) | Metal PCB grounding structure | |
| CN204810680U (en) | Novel electricity daughter board | |
| CN211427955U (en) | Terminal with common-mode filtering function |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20121010 |