CN103545989A - Motor unit - Google Patents

Motor unit Download PDF

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Publication number
CN103545989A
CN103545989A CN201310295684.8A CN201310295684A CN103545989A CN 103545989 A CN103545989 A CN 103545989A CN 201310295684 A CN201310295684 A CN 201310295684A CN 103545989 A CN103545989 A CN 103545989A
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CN
China
Prior art keywords
circuit substrate
motor
sidewall
main body
motor unit
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Granted
Application number
CN201310295684.8A
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Chinese (zh)
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CN103545989B (en
Inventor
中井基生
胁田恭之
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JTEKT Corp
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JTEKT Corp
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Publication of CN103545989A publication Critical patent/CN103545989A/en
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Publication of CN103545989B publication Critical patent/CN103545989B/en
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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K5/00—Casings; Enclosures; Supports
    • H02K5/04—Casings or enclosures characterised by the shape, form or construction thereof
    • H02K5/22—Auxiliary parts of casings not covered by groups H02K5/06-H02K5/20, e.g. shaped to form connection boxes or terminal boxes
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K5/00—Casings; Enclosures; Supports
    • H02K5/04—Casings or enclosures characterised by the shape, form or construction thereof
    • H02K5/22—Auxiliary parts of casings not covered by groups H02K5/06-H02K5/20, e.g. shaped to form connection boxes or terminal boxes
    • H02K5/225—Terminal boxes or connection arrangements
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/20—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for measuring, monitoring, testing, protecting or switching
    • H02K11/21—Devices for sensing speed or position, or actuated thereby
    • H02K11/225—Detecting coils
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/30—Structural association with control circuits or drive circuits
    • H02K11/33—Drive circuits, e.g. power electronics
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/30—Structural association with control circuits or drive circuits
    • H02K11/38—Control circuits or drive circuits associated with geared commutator motors of the worm-and-wheel type
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K7/00—Arrangements for handling mechanical energy structurally associated with dynamo-electric machines, e.g. structural association with mechanical driving motors or auxiliary dynamo-electric machines
    • H02K7/10—Structural association with clutches, brakes, gears, pulleys or mechanical starters
    • H02K7/116—Structural association with clutches, brakes, gears, pulleys or mechanical starters with gears

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Motor Or Generator Frames (AREA)
  • Connection Of Motors, Electrical Generators, Mechanical Devices, And The Like (AREA)

Abstract

A motor unit (1) includes an electric motor (1A) that has a motor bracket (60) that is fixed to an end portion of a motor housing (40) that houses a rotor (10) and a stator (20); a gear housing (110) fixed to the motor bracket (60); and a circuit board (70) that controls driving of the electric motor (1A). The circuit board (70) is wrapped on an outer face (113B) of a side wall (113) of the gear housing (110).

Description

Motor unit
Technical field
The present invention relates to have the motor unit of the circuit substrate that the driving of electro-motor is controlled.
Background technology
The motor unit of TOHKEMY 2007-288929 communique has motor shell, motor support and flat 1 circuit substrate.Motor shell is accommodated rotor and stator.Motor support is fixed on motor shell.Circuit substrate is installed on the diapire of motor support.Interarea at circuit substrate is provided with a plurality of circuit elements.
In said motor unit, whole circuit elements are installed on the interarea of circuit substrate.Therefore, be difficult to dwindle circuit substrate on in-plane.
Summary of the invention
The invention provides motor (the モ ー タ) unit that can dwindle the size that the footpath of circuit substrate makes progress.
Feature according to an embodiment of the invention, motor unit has: electro-motor, its have accommodate rotor and stator motor shell and above-mentioned rotor axially on be fixed on the motor support of the end of said motor housing; Above-mentioned, with respect to said motor bracket, be positioned at the substrate supporting parts of a side contrary with said motor housing on axially; The driving of above-mentioned electro-motor is controlled and is wound on the circuit substrate of the side of aforesaid substrate support unit.
Accompanying drawing explanation
By the description of the preferred embodiment of the present invention being carried out referring to accompanying drawing, the above-mentioned objects, features and advantages with other of the present invention must further to define.Wherein, identical Reference numeral represents identical key element of the present invention.
Fig. 1 is the cutaway view relevant to the motor unit of embodiments of the present invention, the cutaway view of the cross-section structure of the plane on meaning axially.
Fig. 2 A is the Z1A-Z1A cutaway view of Fig. 1, and Fig. 2 B is the Z1B-Z1B cutaway view of Fig. 1.
Fig. 3 is the expanded view relevant to the circuit substrate of execution mode, means the expanded view of the deployed configuration of the circuit substrate that has omitted resin cap part.
Fig. 4 is the cutaway view relevant to the control device of execution mode, is the Z3-Z3 cutaway view of Fig. 3.
Fig. 5 is the cutaway view relevant to the motor unit of other execution mode of the present invention, the cutaway view of a part for the cross-section structure of the plane on meaning axially.
Embodiment
Embodiments of the invention are described with reference to the accompanying drawings.
With reference to Fig. 1, the structure of the motor unit 1 of present embodiment is described.Motor unit 1 has electro-motor 1A, control device 1B and reductor 1C.Control device 1B is between electro-motor 1A and reductor 1C.Control device 1B controls the action of electro-motor 1A.Under the state that reductor 1C slows down in the rotary speed that makes the output shaft 11 of electro-motor 1A, to steering spindle 2, transmit the rotating torques of output shaft 11.
Electro-motor 1A has rotor 10, stator 20, busbar (バ ス バ ー) 30, motor shell 40, bearing 41 and 42, decomposer 50 and motor support 60.Control device 1B has circuit substrate 70 and gear housing 110.Reductor 1C has worm shaft 90, worm gear 100, gear housing 110, cover 130, tight split nut 131 and bearing 132 and 133.Gear housing 110 doubles as the inscape of control device 1B and the inscape of reductor 1C.In addition, gear housing 110 is equivalent to " substrate supporting parts ".
The direction of motor unit 1 is defined as follows.
(A) direction of the central shaft along rotor 10 (following, to be called " central shaft J ") is made as to " axially ZA ".In addition, will be made as " radially ZB " with the direction of axial ZA quadrature.In addition, the direction of rotor 10 rotations is made as to " circumferentially ZC ".
(B) will, on axial ZA, the direction of passing through be made as to " upper direction ZA1 " according to the order of electro-motor 1A, control device 1B and reductor 1C.In addition, will, on axial ZA, the direction of passing through according to the order of reductor 1C, control device 1B and electro-motor 1A be made as to " lower direction ZA2 ".
(C) on ZB radially, the direction that approaches central shaft J is made as " interior direction ZB1 ".In addition, on ZB radially, the direction away from central shaft J is made as " outer direction ZB2 ".
Rotor 10 has output shaft 11, rotor core 12 and permanent magnet 13.Rotor core 12 is output axle 11 and is pressed into.Permanent magnet 13 is fixed on the outer peripheral face of rotor core 12.Permanent magnet 13 circumferentially has 10 magnetic poles on ZC.
Stator 20 has stator core 21 and excitation division 22.Stator 20 is by supplying with from power supply (omitting diagram) magnetic field that electric current forms the revolving force that produces rotor 10.Stator core 21 is pressed into by the inner peripheral surface of motor shell 40.Excitation division 22 is wound on stator core 21 by electric wire and forms concentrated winding.Excitation division 22 has 4 U phase coils, 4 V phase coils and 4 W phase coils.
Busbar 30 has copper coin 31 and support unit 32.Busbar 30 is positioned at than the position of the more close upper direction ZA1 of stator core 21.Busbar 30 is electrically connected to stator 20 with circuit substrate 70.
Copper coin 31 has U phase copper coin 31U, V phase copper coin 31V and W phase copper coin 31W.At U phase copper coin 31U, be connected with the end winding of each U phase coil.At V phase copper coin 31V, be connected with the end winding of each V phase coil.At W phase copper coin 31W, be connected with the end winding of each W phase coil.The end upward direction ZA1 of each phase copper coin 31U, 31V, 31W extends, and is connected with circuit substrate 70.
Support unit 32 supporting copper coins 31.The bottom of support unit 32 is arranged on the outer peripheral portion of stator core 21.Support unit 32 has the copper coin supporting part 32A of the end of each phase copper coin of supporting 31U, 31V, 31W.Copper coin supporting part 32A contacts with the end of each phase copper coin 31U, 31V, 31W and upward direction ZA1 extends.Copper coin supporting part 32A and the end of each phase copper coin 31U, 31V, 31W are together inserted into the busbar through hole 62A of motor support 60.
Motor shell 40 has the lower direction ZA2 side of sealing, up to the drum of ZA1 side opening.Motor shell 40 is accommodated a part, stator 20, busbar 30 and the bearing 42 of rotor 10.Motor shell 40 is at bottom block bearing 42.
Decomposer 50 is positioned at than the more close upper direction ZA1 of busbar 30 and than the position of the more close direction ZB1 of busbar 30.Decomposer 50 is the corresponding voltage signal of position of rotation with rotor 10 to circuit substrate 70 outputs.Decomposer 50 has decomposer rotor 51, decomposer stator 52 and electric circuit connection member 53(with reference to Fig. 2 A).Decomposer 50 has the structure of variable reluctance-type resolver.
Decomposer rotor 51 is output axle 11 and is pressed into.The decomposer stator 52 device supporting part 63 that is decomposed is pressed into.Electric circuit connection member 53 has terminal board (omit diagram) and a plurality of splicing ear 53A(with reference to Fig. 2 A).Electric circuit connection member 53 is electrically connected to decomposer stator 52 with circuit substrate 70.Terminal board selfdecomposition device stator 52 is to radially ZB is outstanding.Splicing ear 53A extends from terminal board upward direction ZA1.
Motor support 60 have sidewall 61, diapire 62, decomposer supporting part 63, bearing support divide 64 and mounting portion 65(with reference to Fig. 2 A).Motor support 60 divides 64 block bearings 41 at bearing support.
Sidewall 61 is fixed on the upper end of motor shell 40.It is the inner peripheral surface of hexagonal configuration that sidewall 61 has when being roughly the outer peripheral face 61B of drum and overlooking.Sidewall 61 has planar section 61A in a part of outer peripheral face 61B.Planar section 61A with in the inner peripheral surface of sidewall 61 with the opposed partial parallel of planar section 61A (with reference to Fig. 2 A).
Diapire 62 closes motor shell 40 from upper direction ZA1 side seal.Diapire 62 has busbar through hole 62A, decomposer through hole 62B and the first telescoping part 62C.The first telescoping part 62C is positioned at than the position of busbar through hole 62A and the more close direction ZB1 of decomposer through hole 62B.The medial surface of the first telescoping part 62C has hexagonal configuration when overlooking.Decomposer supporting part 63 extends from diapire 62 downward direction ZA2.Bearing support divides 64 from wall 62 upward direction ZA1, to extend.
Worm shaft 90 rotates integratedly with output shaft 11.Worm shaft 90 and worm gear 100 engagements.Worm shaft 90 is fixed in link 120 in bottom.Worm shaft 90 links with output shaft 11 by link 120.
Worm gear 100 is fixed on steering spindle 2.Worm gear 100 is delivered to steering spindle 2 by the rotation of worm shaft 90.Gear housing 110 is formed by metal material.Gear housing 110 has axle accommodates part 111, takes turns and accommodate part 112 and sidewall 113.Gear housing 110 has cover 130, tight split nut 131 and bearing 132 and 133 and is installed in the structure that axle is accommodated part 111.
Axle is accommodated part 111 and is accommodated worm shaft 90.Axle is accommodated the part upper support bearing 132 of part 111 on lower direction ZA2, at upper end block bearing 133.Wheel is accommodated the part that part 112 is accommodated worm gear 100 and steering spindle 2.Sidewall 113 is positioned at the bottom of gear housing 110.It is the lateral surface 113B of hexagonal configuration that sidewall 113 has while looking up.Sidewall 113 has the second telescoping part 113A in bottom.The lateral surface of the second telescoping part 113A has hexagonal configuration when looking up.
Circuit substrate 70 is wound on the lateral surface 113B of sidewall 113.Circuit substrate 70 has hexagonal configuration (with reference to Fig. 2 B) when overlooking.Circuit substrate 70 has 71,3 busbar splicing ears 75 of circuit substrate main body and resin cap part 78.Busbar splicing ear 75 is arranged in circuit substrate main body 71.Resin cap part 78 covers circuit substrate main body 71 from the interarea 71A side of circuit substrate main body 71.
Cover 130 is fixed on the upper end that axle is accommodated part 111.Tight split nut 131 is installed on cover 130.Tight split nut 131 inhibition produce relaxing for the cover 130 of gear housing 110.
With reference to Fig. 1, Fig. 2 A and Fig. 2 B, the detailed structure of circuit substrate 70 and periphery thereof is described.As shown in Figure 1, the sidewall 113 of gear housing 110 is inserted into the sidewall 61 of motor support 60.That is, sidewall 113 is overlapping with sidewall 61 on ZB radially.Now, sidewall 113 is positioned at than the position of the more inner direction ZB1 side of outer peripheral face 61B of the sidewall 61 of the outer peripheral face 40A of motor shell 40 and motor support 60.In addition, circuit substrate 70 is overlapping and opposed with the medial surface of sidewall 61 with sidewall 61 on ZB radially.In addition, as shown in Figure 2 A, the second telescoping part 113A of gear housing 110 is embedded in the first telescoping part 62C of motor support 60.Sidewall 113 is fixed on sidewall 61(with reference to Fig. 2 B by 2 bolts 66).
As shown in Figure 2 B, circuit substrate 70 on ZB radially between sidewall 113 and sidewall 61.The lateral surface of resin cap part 78 contacts with the medial surface of sidewall 61.Circuit substrate 70 has the structure that the part corresponding with busbar splicing ear 75 do not covered by resin cap part 78.That is, circuit substrate 70 has the structure that busbar splicing ear 75 exposes to the outside of circuit substrate 70.
Each phase copper coin 31U, 31V, 31W and the copper coin supporting part 32A of busbar 30 by means of busbar through hole 62A(with reference to Fig. 2 A) and at radially between ZB of sidewall 61 and busbar splicing ear 75.Each phase copper coin 31U, 31V, 31W are opposed with each busbar splicing ear 75 on ZB radially.Each phase copper coin 31U, 31V, 31W and each busbar splicing ear 75 interfix by 3 bolts 79.Gear housing 110 and motor support 60 interfix by bolt 66 on 2 positions of circumferential ZC.In addition, the surface of bolt 79 is subjected to for realizing the coating of electric insulation.
With reference to Fig. 3 and Fig. 4, the detailed structure of circuit substrate 70 is described.The long side direction of the circuit substrate 70 that the arrow ZD1 by Fig. 3 is represented is made as " laterally ZD1 ".The short side direction of the circuit substrate 70 in addition, the arrow ZD2 by Fig. 3 being represented is made as " longitudinally ZD2 ".
As shown in Figure 3, circuit substrate 70 is except 71,3 busbar splicing ears 75 of circuit substrate main body and resin cap part 78(are with reference to Fig. 1), also there is 6 FETs as power component 72,76,1 aerial lug 77 of 74,1 decomposer connector of 73,3 control elements of 9 load bearing components and ceramic segment 80(with reference to Fig. 4).At circuit substrate 70, by 6 power components 72, form inverter circuit 70A, by control element 74 circuit elements such as grade, formed the control circuit 70B of the action of power ratio control element 72.Wherein, busbar splicing ear 75 is equivalent to " splicing ear ".
Circuit substrate main body 71 be take under the state launching as flat mode forms.As shown in Figure 4, circuit substrate main body 71 has interarea 71A, back side 71B, conductive pattern 71C, current-carrying part 71D, interlayer coupling part 71E, interarea metal bond part 71F and back metal bonding part 71G.Circuit substrate main body 71 forms as multilayer printed board, and this multilayer printed board carries out thermo-compressed and forms by being formed with the thermoplastic resin membrane of conductive pattern 71C under stacked state.Circuit substrate main body 71 have at interarea 71A busbar splicing ear 75, decomposer connector 76(are installed with reference to Fig. 3) and aerial lug 77(Fig. 3 with reference to) structure.Circuit substrate main body 71 is fixed on ceramic segment 80 on the back side 71B that is formed at the side contrary with interarea 71A.
Conductive pattern 71C is electrically connected to power component 72 circuit elements such as grade that are arranged on circuit substrate main body 71.Conductive pattern 71C is formed at each layer of circuit substrate main body 71.Current-carrying part 71D is positioned at the part corresponding with power component 72 in the inside of circuit substrate main body 71.Current-carrying part 71D is between power component 72 and back side 71B.
Interlayer coupling part 71E is formed by through hole and the electroconductive paste that is filled in through hole.Interlayer coupling part 71E is electrically connected to the conductive pattern 71C of each layer of circuit substrate main body 71 mutually.
Interarea metal bond part 71F is formed on the interarea 71A of circuit substrate main body 71.Interarea metal bond part 71F with the splicing ear 76A(of busbar splicing ear 75, decomposer connector 76 with reference to Fig. 2 A) and each control element 74 be electrically connected to.
Back metal bonding part 71G is formed on the back side 71B of circuit substrate main body 71.Back metal bonding part 71G is located at part corresponding with current-carrying part 71D and load bearing component 73 in circuit substrate main body 71.Back metal bonding part 71G contacts with load bearing component 73 with current-carrying part 71D.
Power component 72 is positioned at back side 71B side in the inside of circuit substrate main body 71.Power component 72 is electrically connected to current-carrying part 71D.Load bearing component 73 consists of metal material.Load bearing component 73 has cylindrical shape.Load bearing component 73 is positioned at each power component 72 around in the inside of circuit substrate main body 71.One end of load bearing component 73 is positioned at 71BCe end, the back side in the inside of circuit substrate main body 71, the other end is positioned at specific power element 72 and more leans on the position of interarea 71A side in the inside of circuit substrate main body 71.
Control element 74 is adjacent to the side of the interarea 71A with circuit substrate main body 71 and back side 71B quadrature.Control element 74 longitudinally ZD2 is arranged (with reference to Fig. 3).Control element 74 has film capacitor 74A, loop coil 74B and relay 74C(all with reference to Fig. 3).Film capacitor 74A, loop coil 74B and relay 74C are electrically connected to the interarea metal bond part 71F of circuit substrate main body 71 by wire-bonded.
Busbar splicing ear 75 is laterally being arranged in mode spaced apart on ZD1.Busbar splicing ear 75 is positioned at the interarea 71A side of circuit substrate main body 71.Busbar splicing ear 75 longitudinally ZD2 extends (with reference to Fig. 3).
Decomposer connector 76 has splicing ear 76A and connector shell 76B(all with reference to Fig. 2 A).Splicing ear 76A has the drum that the splicing ear 53A of the electric circuit connection member 53 of decomposer 50 is fitted.It is the rectangular shape on long limit that connector shell 76B has horizontal ZD1 when overlooking, and the box-formed shape of the connecting terminal 76A of collecting company (with reference to Fig. 2 A).
Aerial lug 77 interconnects external power source (omitting diagram) and circuit substrate main body 71.Aerial lug 77 is from the sidewall 61 outward direction ZB2 of motor support 60 side-prominent (with reference to Fig. 2 B).
Resin cap part 78 is formed by the resin material as electrical insulator.Resin cap part 78 covers part and the control element 74 beyond busbar splicing ear 75 on the interarea 71A of circuit substrate main body 71.Resin cap part 78 covers the circuit element (omitting diagram) of the interarea 71A that is arranged on circuit substrate main body 71.Resin cap part 78 suppress the circuit element (omit and illustrate) that engages with interarea metal bond part 71F by wire-bonded due to the variation of the temperature around circuit substrate 70 cause and interarea metal bond part 71F and circuit element between the conducting unsettled phenomenon that becomes.Resin cap part 78 suppresses by covering circuit substrate main body 71 phenomenon that dust and water droplet are attached to circuit substrate main body 71.
Ceramic segment 80 is formed by aluminium oxide.Ceramic segment 80 is formed in the film that the lateral surface 113B of the sidewall 113 of gear housing 110 forms.Ceramic segment 80 has current-carrying part 81 in the position corresponding with back metal bonding part 71G.Current-carrying part 81 contacts with back metal bonding part 71G and sidewall 113.
With reference to Fig. 1 and Fig. 4, the manufacture method of motor unit 1 is described.The manufacture method of motor unit 1 has fixedly operation of circuit substrate bending operation, resin forming operation, pottery formation operation, substrate bonding process and housing.
At circuit substrate bending operation, operating personnel bends to the circuit substrate (following, be called " moulding prebasal plate ") that has omitted resin cap part 78 along the shape of the lateral surface 113B of the sidewall 113 of gear housing 110.
In resin forming operation, operating personnel carries out resin forming to the interarea 71A side of the moulding prebasal plate of state crooked in circuit substrate bending operation, thereby forms resin cap part 78.
At pottery, form operation, operating personnel forms ceramic segment 80 at the lateral surface 113B of sidewall 113 by gas glue sedimentation (Aerosol Deposition method).In substrate bonding process, operating personnel is heated and pressurizes the sidewall 113 of circuit substrate 70 and gear housing 110 by heating in vacuum stamping machine.Thus, the current-carrying part 81 of back metal bonding part 71G and ceramic segment 80 is bonded with each other.That is, circuit substrate 70 is engaged in ceramic segment 80.
In the fixing operation of housing, operating personnel is pressed into worm shaft 90 to being fixed with the output shaft 11 of link 120 and the sidewall of gear housing 110 113 being inserted into the sidewall 61 of motor support 60.Now, it is chimeric with decomposer connector 76 that operating personnel makes the electric circuit connection member 53 of decomposer 50.Then, operating personnel fixes each phase copper coin 31U, 31V, 31W and each busbar splicing ear 75 by bolt 79, and by bolt 66, gear housing 110 is fixed on to motor support 60.Operating personnel is by so that the mode of the fastening torque of bolt 79 in predefined scope manages, thus manage between each phase copper coin 31U, 31V, 31W and each busbar splicing ear 75 engagement state.
With reference to Fig. 2 B, the effect of motor unit 1 is described.The lateral surface 113B of the sidewall 113 of gear housing 110 is positioned at than the position of the more close direction ZB1 of the inner peripheral surface of motor shell 40.Circuit substrate 70 is wound on the lateral surface 113B of sidewall 113 of gear housing 110.Now, circuit substrate 70 configures along axial ZA, and the thickness direction of circuit substrate main body 71 is with radially ZB is parallel.And at circuit substrate 70, circuit substrate main body 71 is radially realizing miniaturization on ZB because circuit substrate main body 71 is bent.Therefore, circuit substrate 70 is positioned at than the position of the more close direction ZB1 of the sidewall of motor support 60 61, and is positioned at than the position of the more close direction ZB1 of outer peripheral face 40A of motor shell 40.Thus, under the state being launched as shown in Figure 3 in circuit substrate main body 71, be parallel to the structure comparison that radially mode of ZB configures, the size decreases on the radially ZB of circuit substrate 70 with the interarea 71A and the back side 71B that are assumed to be with circuit substrate main body 71.Thus, motor support 60 is radially being realized miniaturization on ZB.
In addition, control device 1B has the first function and the second function.The first function refers to the function of the temperature rising that suppresses power component 72.The second function refers to the function that suppresses power component 72 to apply excessive load.
With reference to Fig. 4, the first function of control device 1B is described.When motor unit 1 drives, power component 72 heatings.The heat of power component 72 is via current-carrying part 71D and back metal bonding part 71G and transfer to the current-carrying part 81 of ceramic segment 80.The heat of transferring to current-carrying part 81 is transferred to the sidewall 113 of gear housing 110.Therefore, the heat of power component 72 is transferred to gear housing 110.Thus, the temperature that suppresses power component 72 rises.
With reference to Fig. 4, the second function of control device 1B is described.Load bearing component 73 is positioned at power component 72 peripheral part in the inside of circuit substrate main body 71.Therefore, in substrate bonding process, when by heating in vacuum stamping machine by circuit substrate 70 when ceramic segment 80 pressurizes, the power component 72 peripheral part carried parts 73 that load on that are applied in circuit substrate main body 71 bear.Thus, the load that suppresses to be added on circuit substrate main body 71 acts on the phenomenon of power component 72.
The motor unit 1 of present embodiment reaches following effect.
(1) motor unit 1 has the structure that circuit substrate 70 is wound on the sidewall 113 of gear housing 110.According to this structure, the structure that is fixed on the diapire 62 of motor support 60 with circuit substrate 70 is compared, and can realize the miniaturization on the radially ZB of circuit substrate 70.
(2) motor unit 1 has the first telescoping part 62C of motor support 60 and the mutual chimeric structure of the second telescoping part 113A of gear housing 110.According to this structure, motor support 60 is determined with the relative position relation of gear housing 110.In addition, the medial surface of the first telescoping part 62C has hexagonal configuration when overlooking, and the lateral surface of the second telescoping part 113A has hexagonal configuration when looking up, so the relative rotation of limiting gear housing 110 and motor support 60.
(3), at motor unit 1, each phase copper coin 31U, 31V, 31W and each busbar splicing ear 75 of busbar 30 interfix by bolt 79.According to this structure, compare the structure that each phase copper coin 31U, 31V, 31W and each busbar splicing ear 75 are only in contact with one another, each phase copper coin 31U, 31V, 31W raise with the reliability being electrically connected between each busbar splicing ear 75.In addition, by the fastening torque of management bolt 79, can manage the engagement state between each phase copper coin 31U, 31V, 31W and each busbar splicing ear 75.
(4) circuit substrate 70 has the resin cap part 78 of the part beyond the interarea 71A of circuit substrate main body 71 covers busbar splicing ear 75.According to this structure, suppress the phenomenon that outside dust and water droplet from circuit substrate 70 are attached to circuit substrate main body 71.Therefore, the reliability of circuit substrate 70 raises.
(5) circuit substrate 70 has the structure that load bearing component 73 is positioned at the surrounding of each power component 72.According to this structure, be suppressed at the phenomenon that the load that is applied to circuit substrate main body 71 in substrate bonding process is applied to power component 72.
(6) circuit substrate 70 has the structure that the current-carrying part 81 of ceramic segment 80 and the back metal bonding part 71G of circuit substrate main body 71 contact.According to this structure, the heat of power component 72 is transferred to current-carrying part 81 via back metal bonding part 71G.Therefore the temperature that, suppresses power component 72 rises.
(7), as the structure of the circuit substrate of motor unit, from the past known, there is a following structure (following, to be called " comparison circuit structure ").That is, comparison circuit structure has: be fixed on motor support, have the first circuit substrate of the writing board shape of power component 72; By control element 74 and the modular power module of aerial lug 77; And the second circuit substrate with the writing board shape of the circuit element that the action of power component 72 is controlled.Power module is positioned at than the position of the more close upper direction ZA1 side of the first circuit substrate.Second circuit substrate is positioned at than the position of the more close upper direction ZA1 of power module.Therefore, comparison circuit structure is axially reaching maximization on ZA.
On the other hand, circuit substrate 70 has the structure that power component 72, control element 74 and aerial lug 77 are installed in circuit substrate main body 71.That is, circuit substrate 70 is equivalent to the first circuit substrate in comparison circuit structure, power module and the integrated structure of second circuit substrate.Thus, circuit substrate 70 can be configured to comparison circuit structure and compare more miniaturization.
(8) circuit substrate 70 has the structure that control element 74 is adjacent with the periphery of circuit substrate main body 71.According to this structure, compare the size decreases on the thickness direction of circuit substrate 70 with the structure that control element 74 is installed on the interarea 71A of circuit substrate main body 71.
(9) motor unit 1 has the structure that control element 74 contacts with the sidewall 113 of gear housing 110.According to this structure, the heat of control element 74 is transferred to sidewall 113.Thus, the temperature of inhibitory control element 74 rises.
(10) motor unit 1 has the structure at gear housing 110 permanent circuit substrates 70.According to this structure, gear housing 110 is compared more separated with respect to stator 20 with motor support 60, so be not vulnerable to the hot impact of stator 20.In addition, the volume of the volumetric ratio motor support 60 of gear housing 110 is large.Therefore, the heat of power component 72 is easy to transfer to gear housing 110.Therefore the temperature that, suppresses power component 72 rises.
The present invention comprises execution mode different from the embodiment described above.Below, the variation as the above-mentioned execution mode of other execution mode of the present invention is shown.In addition, each following variation also can combine mutually.
The gear housing 110 of execution mode has the lateral surface 113B that is hexagonal sidewall 113 when looking up.On the other hand, can also to have when looking up be the lateral surface 113B of polygon beyond hexagon or circular sidewall 113 to the gear housing 110 of variation.The circuit substrate 70 of variation is along the shape of the lateral surface 113B of sidewall 113 and be wound onto sidewall 113.
The circuit substrate 70 of execution mode has resin cap part 78.On the other hand, the circuit substrate 70 of variation can also not have resin cap part 78.
The circuit substrate 70 of above-mentioned execution mode has the load bearing component 73 of cylindrical shape.On the other hand, the circuit substrate 70 of variation can also have the load bearing component 73 of the polygonal column shapes such as quadrangular prism shape.
The circuit substrate 70 of execution mode has the load bearing component 73 being made of metal.On the other hand, the circuit substrate 70 of variation can also have the load bearing component 73 being formed from a resin.
The circuit substrate 70 of execution mode has the structure that disposes load bearing component 73 in the surrounding of power component 72.On the other hand, the circuit substrate 70 of variation can also have the structure of the surrounding of the circuit element beyond the inside of circuit substrate main body 71 load bearing component 73 is disposed at power component 72.
The circuit substrate 70 of execution mode has the structure that is formed with current-carrying part 81 at ceramic segment 80.On the other hand, the circuit substrate 70 of variation can also have the structure of having omitted current-carrying part 81 from ceramic segment 80.
The circuit substrate 70 of execution mode has the control circuit of the action of inverter circuit based on power component 72 and power ratio control element 72.On the other hand, the circuit substrate 70 of variation can also have: first circuit substrate with the inverter circuit based on power component 72; With the second circuit substrate of control circuit with the action of power ratio control element 72.The first circuit substrate and second circuit substrate be independent formation respectively.The first circuit substrate is fixed on the lateral surface 113B of the sidewall 113 of gear housing 110.Second circuit substrate is fixed on parts different from the part that the first circuit substrate is installed in the lateral surface 113B of sidewall 113.
The circuit substrate 70 of execution mode engages with ceramic segment 80 on the whole in circuit substrate main body 71.On the other hand, the circuit substrate 70 of variation can also engage with ceramic segment 80 in the part of power component 72 that is equipped with circuit substrate main body 71.The part being equipped with beyond the part of power component 72 of circuit substrate main body 71 is for example fixed on the sidewall 113 of gear housing 110 by adhesive.
The circuit substrate 70 of execution mode has the ceramic segment 80 being formed by aluminium oxide.On the other hand, the circuit substrate 70 of variation can also have the ceramic segment 80 that at least 2 compounds in aluminium nitride, silicon nitride or aluminium oxide, aluminium nitride and silicon nitride form.
The circuit substrate 70 of execution mode has the ceramic segment 80 forming by gas glue sedimentation.On the other hand, the circuit substrate 70 of variation can also have by any one ceramic segment forming 80 in thermal spraying, chemical vapor deposition (CVD) and sputter.
The circuit substrate 70 of execution mode has ceramic segment 80.On the other hand, the circuit substrate 70 of variation can also not have ceramic segment 80.
The circuit substrate 70 of execution mode has the circuit substrate main body 71 that forms the stacked multilayer printed board forming of a plurality of thermoplastic resin membranes.On the other hand, the circuit substrate 70 of variation can also have the circuit substrate main body 71 of the printed base plate forming heat-curing resin as base material.The circuit substrate main body 71 of variation is configured to 4 base main body parts.Circuit substrate main body 71 is separately fixed at each face of lateral surface 113B of the sidewall 113 of gear housing 110.Adjacent base main body part for example interconnects by flexible base, board.
The motor unit 1 of execution mode has the first telescoping part 62C of motor support 60 and the second telescoping part 113A of gear housing 110.On the other hand, the motor unit 1 of variation can also not have the second telescoping part 113A and the first telescoping part 62C.
The motor unit 1 of execution mode has the structure each phase copper coin 31U, 31V, 31W and the busbar splicing ear 75 of busbar 30 being bonded with each other by bolt 79.On the other hand, the motor unit 1 of variation can also be bonded with each other each phase copper coin 31U, 31V, 31W and busbar splicing ear 75 by welding.
The motor unit 1 of execution mode, when looking up the sidewall 113 of gear housing 110, has the structure on a limit that each phase copper coin 31U, 31V, 31W and busbar splicing ear 75 are positioned at the lateral surface 113B of hexagon shape.On the other hand, the motor unit 1 of variation can also have the structure on a plurality of limits that each phase copper coin 31U, 31V, 31W and busbar splicing ear 75 are positioned at the lateral surface 113B of hexagonal configuration.
The motor unit 1 of execution mode has the formation that circuit substrate 70 is wound on the sidewall 113 of gear housing 110.On the other hand, as shown in Figure 5, it can also have the structure that circuit substrate 70 is wound on the lateral surface 141 of the substrate supporting parts 140 that are independent of gear housing 110 and form to the motor unit 1 of variation.The motor unit 1 of variation can also have the structure that substrate supporting parts 140 is fixed on to motor support 60, with this, replaces reductor 1C.The lateral surface 141 of substrate supporting parts 140 has hexagon when overlooking.
At the motor unit 1 of execution mode, the sidewall 113 of gear housing 110 is positioned at than the position of the more close direction ZB1 of outer peripheral face 61B of the sidewall 61 of the outer peripheral face 40A of motor shell 40 and motor support 60.On the other hand, motor unit 1 in variation, the sidewall 113 of gear housing 110 can be positioned at than the position of the more close direction ZB1 of outer peripheral face 61B of the sidewall of motor support 60 61, can also be positioned at than the position of the more close outer direction ZB2 side of outer peripheral face 40A of motor shell 40.At the motor unit 1 of variation, the medial surface of the sidewall 61 of motor support 60 is positioned at than the position of the more close outer direction ZB2 side of outer peripheral face 40A of motor shell 40.
The motor unit 1 of execution mode has the structure that gear housing 110 is fixed on motor support 60.On the other hand, the motor unit 1 of variation can also have the structure that gear housing 110 is fixed on motor shell 40.Particularly, motor shell 40 extends than the more close upper direction ZA1 of motor support 60.The medial surface of the lateral surface of gear housing 110 and motor shell 40 is chimeric.Gear housing 110 is fixed on motor shell 40 by 2 bolts 66.
In the motor unit 1 of above-mentioned variation, the sidewall 113 of gear housing 110 is positioned at than the position of the more close outer direction ZB2 of outer peripheral face 61B of the sidewall of motor support 60 61, can also be positioned at than the position of the more close direction ZB1 of outer peripheral face 40A of motor shell 40.

Claims (6)

1. a motor unit, wherein, possesses:
Electro-motor, its have accommodate rotor and stator motor shell and described rotor axially on be fixed on the motor support of the end of described motor shell;
Substrate supporting parts, it is positioned at a described motor shell contrary side with respect to described motor support described on axially; And
Circuit substrate, it controls the driving of described electro-motor, and is wound on the side of described substrate supporting parts.
2. motor unit according to claim 1, wherein,
Described substrate supporting parts have and are arranged in the sidewall near the position of direction than at least one party of the outer peripheral face of the outer peripheral face of described motor shell and described motor support,
Described circuit substrate is wound on the described sidewall of the support unit of described substrate.
3. motor unit according to claim 1 and 2, wherein,
Described motor support has the first telescoping part,
Described substrate supporting parts have the second telescoping part,
Described the first telescoping part and described the second telescoping part are mutually chimeric.
4. motor unit according to claim 1, wherein,
Described electro-motor has the busbar that described stator is electrically connected to described circuit substrate,
Described circuit substrate has the splicing ear being connected with the end of described busbar,
The end of described splicing ear and described busbar is fixed by bolt.
5. motor unit according to claim 4, wherein,
Described circuit substrate has the resin cap part that the resin material that the circuit substrate main body of described splicing ear is installed and passes through electric insulation covers described splicing ear part in addition outside described circuit substrate main body.
6. motor unit according to claim 1, wherein,
Described motor unit has the described circuit substrate as thermoplastic resin membrane's multilayer printed board.
CN201310295684.8A 2012-07-17 2013-07-15 Motor unit Expired - Fee Related CN103545989B (en)

Applications Claiming Priority (2)

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JP2012158756A JP6040602B2 (en) 2012-07-17 2012-07-17 Motor unit
JP2012-158756 2012-07-17

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CN103545989B CN103545989B (en) 2017-09-01

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US (1) US20140021833A1 (en)
EP (1) EP2688187A3 (en)
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Also Published As

Publication number Publication date
EP2688187A3 (en) 2015-10-28
CN103545989B (en) 2017-09-01
EP2688187A2 (en) 2014-01-22
JP2014023255A (en) 2014-02-03
US20140021833A1 (en) 2014-01-23
JP6040602B2 (en) 2016-12-07

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