CN103533493B - Silicon microphone and the encapsulating structure of application product thereof - Google Patents
Silicon microphone and the encapsulating structure of application product thereof Download PDFInfo
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- CN103533493B CN103533493B CN201310505115.1A CN201310505115A CN103533493B CN 103533493 B CN103533493 B CN 103533493B CN 201310505115 A CN201310505115 A CN 201310505115A CN 103533493 B CN103533493 B CN 103533493B
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- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 113
- 239000010703 silicon Substances 0.000 title claims abstract description 113
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 111
- 238000000576 coating method Methods 0.000 claims abstract description 31
- 239000011248 coating agent Substances 0.000 claims abstract description 28
- 238000009500 colour coating Methods 0.000 claims abstract description 17
- 230000005236 sound signal Effects 0.000 claims abstract description 9
- 229910000679 solder Inorganic materials 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims description 10
- 238000003032 molecular docking Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 32
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000005286 illumination Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 241000209140 Triticum Species 0.000 description 4
- 235000021307 Triticum Nutrition 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 241000222065 Lycoperdon Species 0.000 description 2
- 241000768494 Polymorphum Species 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000008033 biological extinction Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000012938 design process Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 150000003376 silicon Chemical class 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Abstract
The invention provides the encapsulating structure of a kind of silicon microphone and application product thereof, silicon microphone includes shell and wiring board, shell and wiring board constitute the outer enclosure structure of silicon microphone, in the PCB surface within encapsulating structure, MEMS chip is installed, and on encapsulating structure, it is provided with the acoustic aperture for receiving external sound signal, wherein, the exterior circumferential surface of acoustic aperture is provided with dark colour coating；Further, acoustic aperture is arranged on wiring board or shell；Coating in the exterior circumferential surface of setting acoustic aperture in the circuit board is to be arranged on the solder resist of PCB surface；Outer surface at wiring board is provided with the pad that the external circuit with silicon microphone electrically connects.The present invention only makes an uproar effect by being arranged around can realizing by the way of light-absorbing dark coating well dropping light in the acoustic aperture of silicon microphone outer surface, design is simple and is easily achieved, production cost and the size of product will not be increased, and the pickup effect of product will not be produced impact.
Description
Technical field
The present invention relates to electroacoustic transducer technical field, more specifically, relate to one and can have against sunshine
The silicon microphone of effect of making an uproar and the encapsulating structure of application product thereof.
Background technology
Along with progress and the development of technology of society, in recent years, along with the electronics such as mobile phone, notebook computer
Small product size constantly reduces, and people are more and more higher to the performance requirement of these portable electronic products, thus
The volume also requiring that matched electronic component constantly reduces, performance and concordance improve constantly.At this
Under kind of background, the microphone products field as one of the strength member of above-mentioned portable electronic products is also released
A lot of novel products, wherein to utilize semiconductor fabrication process technology and silicon microphone that batch realizes
For representative products.
For the operation principle of this silicon microphone product, United States Patent (USP) US6781231 has ratio
More detailed introduction.Such as the silicon microphone product profile that accompanying drawing 1 is a kind of routine, square including one
Wiring board 1 and square metal shell 2 constitute the outer enclosure of silicon microphone, on metal shell 2
It is provided with the acoustic aperture 21 for receiving external sound signal, on the wiring board 1 within encapsulation, pacifies respectively
Equipped with IC chip 3 and MEMS chip 4, wherein MEMS chip 4 is for utilizing MEMS(micro electronmechanical
System) technique making, extraneous acoustical signal can be transformed into the signal of telecommunication, the electricity of MEMS chip 4
IC chip 3 on pole and wiring board 1 electrically connects, and the signal of telecommunication that IC chip processed the most at last passes through
Multiple pads 11 that wiring board 1 outer surface is arranged are transferred to silicon microphone outside and are connected to external electrical
Road.As accompanying drawing 2 is demonstrated by structure chart when this silicon microphone is arranged on a kind of electronics applications, false
If it is arranged in mobile phone, in figure, 5 represent the shell of mobile phone, and phone housing 5 is provided with for receiving
The acoustic aperture 51 of external sound signal, silicon microphone is arranged on the main circuit board 7 of mobile phone by its pad 11,
Then silicon microphone acoustic aperture 21 and mobile phone acoustic aperture 51 are docked, therebetween by a flexible gum cover 6 even
Connecing, gum cover 6 is provided with the acoustic aperture 61 that can transmit acoustical signal, gum cover 6 can ensure that silicon microphone and
Air-tightness is kept, it is ensured that what acoustical signal can be airtight passes through mobile phone sound respectively from the external world between phone housing
Hole 51, gum cover acoustic aperture 61 and silicon microphone acoustic aperture 21 enter inside silicon microphone, silicon microphone realize sound-
After the conversion of the signal of telecommunication, the signal of telecommunication is transmitted by mobile phone main circuit board 7.
But, owing to the operation principle of silicon microphone require that its structure have to exist connection space outerpace
Acoustic aperture, this has resulted in extraneous light easily by mobile phone acoustic aperture 51, gum cover acoustic aperture 61 and silicon microphone
Acoustic aperture 21 is irradiated inside silicon microphone, and is irradiated in MEMS chip, and this can be to MEMS core
The work of sheet brings certain interference, is commonly called as " optical noise ".Further, in order to ensure the transmission of acoustical signal
And the needs of guarantee acoustical behavior, mobile phone acoustic aperture 51, gum cover acoustic aperture 61 and silicon microphone acoustic aperture 21 are all
That can not design is too small, otherwise can affect the pickup effect of silicon microphone.
Thus, it is desirable to a kind of simple in construction of design, and can be good at realizing fall light and make an uproar the silicon wheat of effect
Gram wind structure.
Summary of the invention
In view of the above problems, it is an object of the invention to provide a kind of simple in construction and can realize well
Fall light is made an uproar the silicon microphone of effect and the encapsulating structure of application product thereof.
According to an aspect of the invention, it is provided a kind of silicon microphone, including shell and wiring board, institute
State shell and the outer enclosure structure of wiring board composition silicon microphone, at the circuit within described encapsulating structure
Plate surface is provided with MEMS chip, and is provided with for receiving external sound on described encapsulating structure
The acoustic aperture of signal, wherein, is provided with dark colour coating in the exterior circumferential surface of described acoustic aperture；Further,
Described acoustic aperture is arranged on described wiring board or described shell；The acoustic aperture being arranged on described wiring board
Coating in exterior circumferential surface is to be arranged on the solder resist of described PCB surface；At described wiring board
Outer surface is provided with the pad that the external circuit with described silicon microphone electrically connects.
Furthermore it is preferred that technical scheme be, the color of described coating be black, navy blue, Dark grey,
Dark brown, blackish green, dark-brown or coffee color.
Furthermore, preferred technical scheme is, described acoustic aperture be aperture be 0.1～1.5mm aperture or
The multiple single small aperture of person is the aperture of 0.03～0.1mm.
According to a further aspect in the invention, it is provided that a kind of silicon microphone and the encapsulating structure of application product,
Wherein, described silicon microphone is the silicon microphone described in preceding solution；Outside described application product
The application product acoustic aperture corresponding with the acoustic aperture of described silicon microphone it is provided with on shell；And in described silicon wheat
It is additionally provided with in order to the described silicon microphone of airtight docking between acoustic aperture and the described application product acoustic aperture of gram wind
Acoustic aperture and the gum cover of described application product acoustic aperture, be provided with gum cover acoustic aperture in described gum cover.
Preferably, at described gum cover acoustic aperture and/or the acoustic aperture of described silicon microphone and/or described application product sound
The inwall in hole is provided with dark colour coating.
Preferably, described silicon microphone is arranged on shell and the master of described application product of described application product
Between wiring board, described silicon microphone is arranged on the main circuit board of described application product by pad.
Utilize the above-mentioned silicon microphone according to the present invention and the encapsulating structure with application product thereof, by silicon
In the acoustic aperture exterior circumferential of mike and the acoustic aperture inwall of encapsulating structure, dark colour coating is set, it is possible to inhale
Receive most of illumination that the external world enters, light line reflection repeatedly will not be formed outside silicon microphone acoustic aperture,
The extraneous illumination being seldom enters inside silicon microphone, thus well realizes noise reduction, and not
Influence whether the reception of acoustical signal.
In order to realize above-mentioned and relevant purpose, one or more aspects of the present invention include below will be in detail
The feature illustrating and being particularly pointed out in the claims.Description below and accompanying drawing are described in detail this
Some bright illustrative aspects.But, the principle that only can use the present invention of these aspects instruction
Some modes in various modes.Additionally, it is contemplated that include all these aspect and they etc.
Jljl.
Accompanying drawing explanation
By with reference to below in conjunction with the explanation of accompanying drawing and the content of claims, and along with to the present invention
Be more fully understood from, other purpose of the present invention and result will be more apparent and should be readily appreciated that.In the accompanying drawings:
Fig. 1 is the cross-sectional view of traditional silicon mike；
Fig. 2 is the application structure schematic diagram of traditional silicon mike；
Fig. 3 is the cross-sectional view of the embodiment of the present invention one；
Fig. 4 is the top view of the embodiment of the present invention one；
Fig. 5 is the application structure schematic diagram of the embodiment of the present invention one；
Fig. 6 is the cross-sectional view of the embodiment of the present invention two；
Fig. 7 is the top view of the embodiment of the present invention two；
Fig. 8 is the cross-sectional view of the embodiment of the present invention three；
Fig. 9 is the upward view of the embodiment of the present invention three；
Figure 10 is the application structure schematic diagram of the embodiment of the present invention three.
The most identical label indicates similar or corresponding feature or function.
Detailed description of the invention
Below with reference to accompanying drawing, the specific embodiment of the present invention is described in detail.
Embodiment one
Fig. 3 and Fig. 4 is cross-sectional view and the top view of the embodiment of the present invention one.Such as Fig. 3, Fig. 4
Shown in, in embodiment one, a square wiring board 1 and a square metal shell 2 constitute silicon wheat
The outer enclosure of gram wind, metal shell 2 is provided with the acoustic aperture 21 for receiving external sound signal,
On wiring board 1 within Feng Zhuan, it is separately installed with IC chip 3 and MEMS chip 4, wherein MEMS
Chip 4 is for utilizing MEMS(MEMS) technique making, extraneous acoustical signal can be changed
Becoming the signal of telecommunication, the IC chip 3 on the electrode of MEMS chip 4 and wiring board 1 electrically connects, and the most at last
Multiple pads 11 that the signal of telecommunication that IC chip processed is arranged by wiring board 1 outer surface are transferred to silicon wheat
Gram wind is outside and is connected with external circuit.Further, the present invention in order to realize reducing the effect made an uproar of light,
Dark colour coating 22 it is provided with in the exterior circumferential surface of acoustic aperture 21.
As preferred technical scheme, the color of coating 22 can select black, navy blue, Dark grey,
Dark brown, blackish green, dark-brown, coffee color or the color of other dark systems, in order to absorb from silicon
Most of illumination outside mike, from without making extraneous light become in the acoustic aperture external effect of silicon microphone
Light line reflection repeatedly, reduces the illumination entered within silicon microphone as far as possible, to realize the effect that fall light is made an uproar
Really.In the present embodiment one, preferred black is as the color of coating 22, can reach optimal effect.
In the production design process of silicon microphone, the size of acoustic aperture is also to affect silicon microphone acoustic efficiency
One of and the important indicator of anti-light effect of making an uproar.As preferred technical scheme, in the present embodiment one
Acoustic aperture 21 be an aperture be the aperture of 0.1-0.5mm, it is possible to acoustics pickup and fall light make an uproar aspect obtain
Balance, reaches preferably to drop light and makes an uproar effect and acoustic efficiency.
It addition, as preferred technical scheme, as shown in Figure 4, in the present embodiment one, coating 22 is
It is arranged on the annular coating around metal shell 2 surface, acoustic aperture 21.
Fig. 5 is the application structure schematic diagram that the silicon microphone of the present embodiment one is arranged in a kind of electronic product.
As it is shown in figure 5, after the silicon microphone shown in the present embodiment one is installed, it is assumed that it is arranged in mobile phone, then
In Fig. 5,5 represent the shell of mobile phone, phone housing 5 are provided with the acoustic aperture 21 with silicon microphone corresponding
, for receiving the mobile phone acoustic aperture 51 of external sound signal, silicon microphone is arranged on hands by its pad 11
On owner's wiring board 7, silicon microphone acoustic aperture 21 and mobile phone acoustic aperture 51 are docked, therebetween by one
Flexible gum cover 6 connects, and is provided with the gum cover acoustic aperture 61 that can transmit acoustical signal, gum cover 6 in gum cover 6
Airtight docking silicon microphone acoustic aperture 21 and mobile phone acoustic aperture 51, thereby may be ensured that silicon microphone and phone housing
Between keep air-tightness, it is ensured that acoustical signal can be airtight from the external world respectively by mobile phone acoustic aperture 51, glue
Set acoustic aperture 61 and silicon microphone acoustic aperture 21 enter inside silicon microphone, and silicon microphone realizes sound-electric signal
After conversion, the signal of telecommunication is transmitted by mobile phone main circuit board 7.When light irradiates into mobile phone acoustic aperture 51 He
After the space that gum cover acoustic aperture 61 is formed, major part is irradiated to the black around silicon microphone acoustic aperture 21
In coating 22, coating 22, will not be in mobile phone acoustic aperture 51 and gum cover acoustic aperture 61 by major part luminous absorption
Multiple reflections in the space formed, thus drastically reduce the area the light irradiated into silicon microphone acoustic aperture 21,
Eventually reduce optical noise.
This design of the present invention is only by being arranged around absorbing in the acoustic aperture of silicon microphone outer surface
The mode of the dark coating of light realizes well dropping light and makes an uproar effect, and design is simple and is easily achieved, no
Production cost and the size of product can be increased, and the pickup effect of product will not be produced impact.
Further, make an uproar the impact on mike to reduce light further, be preferable to carry out of the present invention
In mode, the inwall of gum cover acoustic aperture 61, silicon microphone acoustic aperture 21 and mobile phone acoustic aperture 51 is also provided with
There is the dark colour coating (not shown) being similar to above-mentioned coating 22, be used for absorbing extraneous entrance acoustic aperture
Light and reduce light reflection in acoustic aperture or refraction.For providing the gum cover sound of sound channel
Hole 61, silicon microphone acoustic aperture 21 and mobile phone acoustic aperture 51, can arrange deep on all of acoustic aperture inwall
Color coating, it is also possible to dark colour coating is set on the inwall of an one of which or two acoustic aperture.
Equally, the color of the dark colour coating being arranged on acoustic aperture inwall can select black, navy blue, deep
Lycoperdon polymorphum Vitt, dark brown, blackish green, dark-brown, coffee color or the color of other dark systems are the most permissible
Reach the black of optimal extinction effect.
Embodiment two
Fig. 6 and Fig. 7 is respectively cross-sectional view and the top view of the embodiment of the present invention two.As Fig. 6,
Shown in Fig. 7, in the present embodiment two, a square wiring board 1 and square metal shell 2 structure
Become the outer enclosure of silicon microphone, metal shell 2 is provided with the acoustic aperture for receiving external sound signal
21, on the wiring board 1 within encapsulation, it is separately installed with IC chip 3 and MEMS chip 4, wherein
MEMS chip 4 is for utilizing MEMS(MEMS) technique making, can be by extraneous sound letter
Number being transformed into the signal of telecommunication, the IC chip 3 on the electrode of MEMS chip 4 and wiring board 1 electrically connects, and
Multiple pads 11 that the signal of telecommunication that IC chip processed the most at last is arranged by wiring board 1 outer surface pass
It is passed to silicon microphone outside and is connected to external circuit.Further, the present invention is in order to realize reducing the effect that light is made an uproar
Really, the exterior circumferential surface of acoustic aperture 21 is provided with dark colour coating 22.
As preferred technical scheme, the color of coating 22 can select black, navy blue, Dark grey,
Dark brown, blackish green, dark-brown, coffee color or the color of other dark systems, in order to absorb from silicon
Most of illumination outside mike, from without making extraneous light become in the acoustic aperture external effect of silicon microphone
Light line reflection repeatedly, reduces the illumination entered within silicon microphone as far as possible, to realize the effect that fall light is made an uproar
Really.In the present embodiment one, preferred black is as the color of coating 22, can reach optimal effect.
In the production design process of silicon microphone, the size of acoustic aperture is also to affect silicon microphone acoustic efficiency
One of and the important indicator of anti-light effect of making an uproar.Unlike embodiment one, in the present embodiment two,
Acoustic aperture 21 is multiple aperture, and preferred single small aperture is 0.03-0.1mm, can reach preferably to drop
Light is made an uproar effect and acoustic efficiency, and compare to embodiment one only by the aperture structure that an aperture is bigger
The acoustic aperture become, the acoustic aperture that the aperture less by multiple single small apertures in the present embodiment two forms is permissible
Preferably realize dust-proof effect and wind resistance is made an uproar effect.
As preferred technical scheme, in the present embodiment two, coating 22 is for being arranged on acoustic aperture 21 place
Whole coatings in package surface.This design can preferably prevent light from irradiating inside silicon microphone.
Embodiment three
Fig. 8 and Fig. 9 is respectively cross-sectional view and the upward view of the embodiment of the present invention three.
As shown in Figure 8 and Figure 9, similar with previous embodiment, the silicon microphone of the present embodiment three is also
Outer enclosure is constituted, within encapsulation by a square wiring board 1 and a square metal shell 2
On wiring board 1, being separately installed with IC chip 3 and MEMS chip 4, wherein MEMS chip 4 is
Utilize MEMS(MEMS) technique making, extraneous acoustical signal can be transformed into the signal of telecommunication,
IC chip 3 on the electrode of MEMS chip 4 and wiring board 1 electrically connects, and the most at last at IC chip
Multiple pads 11 that the signal of telecommunication managed is arranged by wiring board 1 outer surface are transferred to outside silicon microphone
And it is connected to external circuit.
Unlike previous embodiment, in the present embodiment three, for receiving the sound of external sound signal
Hole 12 is arranged on wiring board 1, in order to realize reducing the effect that light is made an uproar, in the exterior circumferential of acoustic aperture 12
Dark colour coating 13 it is again provided with on surface.
Equally, the color of coating 13 can select black, navy blue, Dark grey, dark brown, blackish green,
Dark-brown, coffee color or the color of other dark systems, in order to absorb from the big portion outside silicon microphone
Light splitting photograph, from without making extraneous light become light line reflection repeatedly in the acoustic aperture external effect of silicon microphone,
Reduce the illumination entered within silicon microphone as far as possible, to realize the effect that fall light is made an uproar.At the present embodiment one
In preferably black as the color of coating 13, can reach optimal effect selection black, navy blue or
The color of other dark systems, in the present embodiment, preferred black, can reach best effect.
In the present embodiment three, acoustic aperture 13 is an aperture, and aperture is 0.1-0.5mm, can reach relatively
Good fall light is made an uproar effect and acoustic efficiency.
It addition, as it is shown in figure 9, in the present embodiment three, coating 13 is for being arranged on acoustic aperture 12 place envelope
Whole coatings on dress surface.This design can preferably prevent light from irradiating inside silicon microphone.
Further, coating 13 is the solder resist being arranged on wiring board 1 surface, and such coating 13 can be at wiring board 1
Manufacturing process in complete, technique is simple, and in circuit board manufacturing process, the making of solder resist
Journey is a necessary process, can't increase production cost.
Figure 10 is the application structure signal that the silicon microphone of the present embodiment three is arranged in a kind of electronic product
Figure.As shown in Figure 10, after the silicon microphone shown in the present embodiment three is installed, it is assumed that it is arranged in mobile phone,
In figure, 5 represent the shell of mobile phone, and phone housing 5 is provided with the mobile phone for receiving external sound signal
Acoustic aperture 51, silicon microphone is arranged on mobile phone main circuit board 7 by its pad 11, mobile phone main circuit board 7
Upper and mobile phone acoustic aperture 51 correspondence position is provided with main circuit board acoustic aperture 71, then main circuit board acoustic aperture 71
Docking with mobile phone acoustic aperture 51, connected by a flexible gum cover 6 therebetween, gum cover 6 is provided with permissible
The gum cover acoustic aperture 61 of transmission acoustical signal, gum cover 6 can ensure that and keeps between silicon microphone and phone housing
Air-tightness, it is ensured that acoustical signal can be airtight from the external world respectively by mobile phone acoustic aperture 51, gum cover acoustic aperture 61,
Main circuit board acoustic aperture 71 and silicon microphone acoustic aperture 12 enter inside silicon microphone, and silicon microphone realizes sound-electric
After the conversion of signal, the signal of telecommunication is transmitted by mobile phone main circuit board 7.
When light irradiates into mobile phone acoustic aperture 51, gum cover acoustic aperture 61 and main circuit board acoustic aperture 71 from outer handset
After the space formed, major part light is irradiated to the black coating 13 around silicon microphone acoustic aperture 12
On, coating 13, will not be at mobile phone acoustic aperture 51, gum cover acoustic aperture 61 and main line by major part luminous absorption
Multiple reflections in the space that plate acoustic aperture 71 is formed, thus drastically reduce the area and irradiate into silicon microphone acoustic aperture 12
Light, eventually reduce the optical noise impact on silicon microphone.
The present embodiment three equally can be by being simply provided around the acoustic aperture of silicon microphone outer surface dark painting
Layer absorbs light, the effect thus realization well fall light is made an uproar, and will not produce the pickup effect of product
Impact.
It addition, make an uproar the impact on mike to reduce light further, it is preferable to carry out of the present invention
In mode, equally at gum cover acoustic aperture 61, silicon microphone acoustic aperture 12, mobile phone acoustic aperture 51 and main circuit board
It is also equipped with being similar to the dark colour coating (not shown) of above-mentioned coating 22 on the inwall of acoustic aperture 71,
For absorbing the extraneous light entering acoustic aperture and reducing light reflection in acoustic aperture or refraction.For
The gum cover acoustic aperture 61 of sound channel, silicon microphone acoustic aperture 12, mobile phone acoustic aperture 51 and main circuit board are provided
Acoustic aperture 71, can arrange dark colour coating, it is also possible to an one of which on all of acoustic aperture inwall
Or dark colour coating is set on the inwall of two acoustic aperture.
Equally, the color of the dark colour coating being arranged on acoustic aperture inwall can select black, navy blue, deep
Lycoperdon polymorphum Vitt, dark brown, blackish green, dark-brown, coffee color or the color of other dark systems are the most permissible
Reach the black of optimal extinction effect.
In three embodiments enumerated above, all have employed square shell and wiring board, shell is
The metal groove form casing of one.It is true that shell and wiring board can also be other shapes, shell is also
Wiring board material, plastic material etc. can be used to make, and shell can also be a framework and a lid
Combine；Wiring board in this patent can be using preferred resin material as base material；Silicon microphone is installed
Application product can be mobile phone, it is also possible to be such as other electricity such as transmitter receiver, notebook computer, palm PC
Sub-product.In a word, the various choices of technology on the premise of not violating this novel silicon microphone design purport
Mode is all within the protection of this patent.In addition, it is necessary to explanation, suitable in view of MEMS chip
Adjusting the purport on the present invention not affect, the MEMS chip in pattern represents only with simple pattern.
Claims (9)
1. a silicon microphone, constitutes silicon microphone including shell and wiring board, described shell and wiring board
Outer enclosure structure, in the PCB surface within described encapsulating structure, MEMS chip is installed, and
And on described encapsulating structure, it is provided with the acoustic aperture for receiving external sound signal, it is characterised in that
The exterior circumferential surface of described acoustic aperture is provided with dark colour coating；Further,
Described acoustic aperture is arranged on described wiring board or described shell；
The acoustic aperture being arranged on described wiring board is arranged on described wiring board and installs described MEMS chip
Position corresponding；
Outer surface at described wiring board is provided with the weldering that the external circuit with described silicon microphone electrically connects
Dish.
2. silicon microphone as claimed in claim 1, it is characterised in that
The color of described coating be black, navy blue, Dark grey, dark brown, blackish green, dark-brown or
Person is coffee-like.
3. silicon microphone as claimed in claim 1, it is characterised in that
Described acoustic aperture be aperture be 0.1～1.5mm aperture or multiple single small aperture be
The aperture of 0.03～0.1mm.
4. silicon microphone as claimed in claim 1, it is characterised in that
Described shell is metal shell, and described acoustic aperture is arranged on the housing, and described coating is arranged on institute
State case surface.
5. silicon microphone as claimed in claim 1, it is characterised in that
The coating being arranged in the exterior circumferential surface of the acoustic aperture on described wiring board is for being arranged on described circuit
The solder resist on plate surface.
6. silicon microphone as claimed in claim 1, it is characterised in that
Described coating is to be arranged on the annular coating around described acoustic aperture or for being arranged on described acoustic aperture place
Whole coatings in package surface.
7. a silicon microphone and the encapsulating structure of application product, it is characterised in that
Described silicon microphone is the silicon microphone according to any one of claim 1～6；
The shell of described application product is provided with the application corresponding with the acoustic aperture of described silicon microphone produce
Product acoustic aperture；And
It is additionally provided with in order to airtight docking between the acoustic aperture and described application product acoustic aperture of described silicon microphone
The acoustic aperture of described silicon microphone and the gum cover of described application product acoustic aperture, be provided with gum cover sound in described gum cover
Hole.
8. encapsulating structure as claimed in claim 7, it is characterised in that
In described gum cover acoustic aperture and/or the acoustic aperture of described silicon microphone and/or described application product acoustic aperture
Wall is provided with dark colour coating.
9. encapsulating structure as claimed in claim 7, it is characterised in that
Described silicon microphone be arranged on the shell of described application product and described application product main circuit board it
Between, described silicon microphone is arranged on the main circuit board of described application product by pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310505115.1A CN103533493B (en) | 2010-09-03 | 2010-09-03 | Silicon microphone and the encapsulating structure of application product thereof |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102708717A CN102387454B (en) | 2010-09-03 | 2010-09-03 | Silicon microphone and packaging structure of product applying same |
| CN201310505115.1A CN103533493B (en) | 2010-09-03 | 2010-09-03 | Silicon microphone and the encapsulating structure of application product thereof |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102708717A Division CN102387454B (en) | 2010-09-03 | 2010-09-03 | Silicon microphone and packaging structure of product applying same |
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| Publication Number | Publication Date |
|---|---|
| CN103533493A CN103533493A (en) | 2014-01-22 |
| CN103533493B true CN103533493B (en) | 2016-09-14 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106412783B (en) * | 2016-11-23 | 2022-04-12 | 上海传英信息技术有限公司 | Microphone structure and mobile terminal |
| CN108074498B (en) * | 2017-12-27 | 2020-08-11 | 威创集团股份有限公司 | Display module, display device and manufacturing method |
| CN109769184B (en) * | 2019-01-16 | 2024-04-02 | 钰太芯微电子科技（上海）有限公司 | Packaging structure of microphone |
| CN111683332B (en) * | 2020-06-08 | 2021-11-09 | 荣成歌尔电子科技有限公司 | Optical noise test system, optical noise test method and storage medium |
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| JPH09200883A (en) * | 1996-01-12 | 1997-07-31 | Hitachi Media Electron:Kk | Infrared-ray cordless microphone system |
| US6781231B2 (en) * | 2002-09-10 | 2004-08-24 | Knowles Electronics Llc | Microelectromechanical system package with environmental and interference shield |
| US7095333B2 (en) * | 2003-09-18 | 2006-08-22 | Emerson Electric Company | Method and apparatus for enabling optical communication through low intensity indicators in an appliance that uses a vacuum fluorescent display |
| CN101808264A (en) * | 2010-02-10 | 2010-08-18 | 中国科学院半导体研究所 | Optical fiber laser microphone |
| CN102387454B (en) * | 2010-09-03 | 2013-11-20 | 歌尔声学股份有限公司 | Silicon microphone and packaging structure of product applying same |
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2010
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| CN103533493A (en) | 2014-01-22 |
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Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
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Effective date of registration: 20200608 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |