CN103533493A - Silicon microphone, and packaging structure of application product - Google Patents
Silicon microphone, and packaging structure of application product Download PDFInfo
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- CN103533493A CN103533493A CN201310505115.1A CN201310505115A CN103533493A CN 103533493 A CN103533493 A CN 103533493A CN 201310505115 A CN201310505115 A CN 201310505115A CN 103533493 A CN103533493 A CN 103533493A
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- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 114
- 239000010703 silicon Substances 0.000 title claims abstract description 114
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 112
- 238000004806 packaging method and process Methods 0.000 title abstract 6
- 238000000576 coating method Methods 0.000 claims abstract description 31
- 239000011248 coating agent Substances 0.000 claims abstract description 28
- 238000009500 colour coating Methods 0.000 claims abstract description 18
- 230000005236 sound signal Effects 0.000 claims abstract description 10
- 239000002184 metal Substances 0.000 claims description 10
- 238000003032 molecular docking Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 30
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000003466 welding Methods 0.000 abstract 2
- 238000005286 illumination Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000001678 irradiating effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000008033 biological extinction Effects 0.000 description 2
- 238000012938 design process Methods 0.000 description 2
- 230000001795 light effect Effects 0.000 description 2
- 150000003376 silicon Chemical class 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Abstract
The invention provides a silicon microphone, and a packaging structure of an application product. The silicon microphone comprises a housing and a circuit board, wherein the housing and the circuit board form the external packaging structure of the silicon microphone; an MEMS (Micro Electro Mechanical Systems) chip is mounted on the surface of the circuit board in the packaging structure; a sound hole used for receiving an outside sound signal is formed in the packaging structure; a dark color coating is arranged on the external periphery surface of the sound hole; the sound hole is formed in the circuit board or the housing; the coating arranged on the external periphery surface of the sound hole in the circuit board is a welding resist arranged on the surface of the circuit board; and welding discs electrically connected with an external circuit of the silicon microphone are arranged on the external surface of the circuit board. According to the silicon microphone and the packaging structure, a good light noise reduction effect is realized only in a manner that the dark color coating capable of absorbing light rays is arranged at the periphery of the sound hole in the external surface of the silicon microphone; the design is simple; realization is easy; the production cost and the size of the product cannot be increased; and a pickup effect of the product is not influenced.
Description
Technical field
The present invention relates to electroacoustic transducer technical field, more specifically, relate to and a kind ofly can there is the silicon microphone of the effect of making an uproar against sunshine and the encapsulating structure of application product thereof.
Background technology
Along with social progress and the development of technology, in recent years, along with the electronic product volumes such as mobile phone, notebook computer constantly reduce, people are also more and more higher to the performance requirement of these portable electronic products, thereby also require that the volume of supporting electronic component with it constantly reduces, performance and consistency improve constantly.Under this background, as the microphone products field of one of strength member of above-mentioned portable electronic products, also released a lot of novel products, the silicon microphone that utilizes semiconductor fabrication process technology and realize in batches of wherein take is representative products.
For the operation principle of this silicon microphone product, in US Patent No. 6781231, there is more detailed introduction.As the accompanying drawing 1 silicon microphone product profile that is a kind of routine, the outer enclosure that comprises a square wiring board 1 and square metal shell 2 formation silicon microphones, on metal shell 2, be provided with for receiving the sound hole 21 of external sound signal, on the inner wiring board 1 of encapsulation, be separately installed with IC chip 3 and MEMS chip 4, wherein MEMS chip 4 is for utilizing MEMS(MEMS (micro electro mechanical system)) technique making, extraneous voice signal can be transformed into the signal of telecommunication, IC chip 3 on the electrode of MEMS chip 4 and wiring board 1 is electrically connected to, and a plurality of pads 11 of the signal of telecommunication that IC chip was processed the most at last by wiring board 1 outer surface setting to be transferred to silicon microphone outside and be connected to external circuit.Structure chart when having showed this silicon microphone and be arranged on a kind of electronics applications as accompanying drawing 2, suppose that it is arranged in mobile phone, the shell of 5 expression mobile phones in figure, on phone housing 5, be provided with for receiving the sound hole 51 of external sound signal, silicon microphone is arranged on the main circuit board 7 of mobile phone by its pad 11, then silicon microphone sound hole 21 and 51 docking of mobile phone sound hole, between the two, by a flexible gum cover 6, connect, gum cover 6 is provided with the sound hole 61 that can transmit voice signal, gum cover 6 can guarantee to keep air-tightness between silicon microphone and phone housing, guarantee that voice signal can be airtight from the external world respectively by mobile phone sound hole 51, gum cover sound hole 61 and silicon microphone sound hole 21 enter silicon microphone inside, after silicon microphone is realized the conversion of sound-electric signal, the signal of telecommunication is transmitted by mobile phone main circuit board 7.
Yet, because having required its structure, the operation principle of silicon microphone must there is the sound hole that is communicated with space outerpace, this has just caused extraneous light easily by mobile phone sound hole 51, gum cover sound hole 61 and silicon microphone sound hole 21, to irradiate into silicon microphone inside, and be irradiated on MEMS chip, this can bring certain interference to the work of MEMS chip, is commonly called as " optical noise ".And in order to guarantee the transmission of voice signal and the needs that ensure acoustical behavior, it is too small that mobile phone sound hole 51, gum cover sound hole 61 and silicon microphone sound hole 21 all can not be designed, otherwise can affect the pickup effect of silicon microphone.
Thus, need to design a kind of simple in structurely, and can be good at realizing and fall the make an uproar silicon microphone structure of effect of light.
Summary of the invention
In view of the above problems, the object of this invention is to provide a kind of simple in structure and can realize well and fall light the make an uproar silicon microphone of effect and the encapsulating structure of application product thereof.
According to an aspect of the present invention, a kind of silicon microphone is provided, comprise shell and wiring board, described shell and wiring board form the outer enclosure structure of silicon microphone, PCB surface in described encapsulating structure inside is provided with MEMS chip, and on described encapsulating structure, be provided with for receiving the sound hole of external sound signal, wherein, in the exterior circumferential surface in described sound hole, be provided with dark colour coating; And described sound hole is arranged on described wiring board or described shell; The coating being arranged in the exterior circumferential surface in the sound hole on described wiring board is the solder resist that is arranged on described PCB surface; Outer surface at described wiring board is provided with the pad being electrically connected to the external circuit of described silicon microphone.
In addition, preferred technical scheme is, the color of described coating is black, navy blue, Dark grey, dark brown, blackish green, dark-brown or coffee color.
Moreover preferred technical scheme is, described sound hole is the aperture that the aperture aperture that is 0.1～1.5mm or a plurality of single small aperture are 0.03～0.1mm.
According to a further aspect in the invention, provide the encapsulating structure of a kind of silicon microphone and application product, wherein, described silicon microphone is the silicon microphone described in aforementioned techniques scheme; On the shell of described application product, be provided with the application product sound hole corresponding with the sound hole of described silicon microphone; And between the sound hole of described silicon microphone and described application product sound hole, be also provided with the gum cover in order to sound hole and the described application product sound hole of the described silicon microphone of airtight docking, in described gum cover, be provided with gum cover sound hole.
Preferably, in the sound hole of described gum cover sound hole and/or described silicon microphone and/or the inwall in described application product sound hole be provided with dark colour coating.
Preferably, described silicon microphone is arranged between the shell of described application product and the main circuit board of described application product, and described silicon microphone is arranged on the main circuit board of described application product by pad.
Utilize above-mentioned according to silicon microphone of the present invention and and the encapsulating structure of application product, on sound hole inwall by the sound hole exterior circumferential at silicon microphone and encapsulating structure, dark colour coating is set, can absorb most of illumination that the external world enters, can not form light reflection repeatedly in outside, silicon microphone sound hole, the extraneous illumination that is seldom enters silicon microphone inside, thereby well realize noise reduction, and can not have influence on the reception of voice signal.
In order to realize above-mentioned and relevant object, one or more aspects of the present invention comprise below by the feature that describes in detail and particularly point out in the claims.Explanation below and accompanying drawing describe some illustrative aspects of the present invention in detail.Yet, the indication of these aspects be only some modes that can use in the variety of way of principle of the present invention.In addition, the present invention is intended to comprise all these aspects and their equivalent.
Accompanying drawing explanation
By reference to the content below in conjunction with the description of the drawings and claims, and along with understanding more comprehensively of the present invention, other object of the present invention and result will be understood and easy to understand more.In the accompanying drawings:
Fig. 1 is the cross-sectional view of traditional silicon microphone;
Fig. 2 is the application structure schematic diagram of traditional silicon microphone;
Fig. 3 is the cross-sectional view of the embodiment of the present invention one;
Fig. 4 is the vertical view of the embodiment of the present invention one;
Fig. 5 is the application structure schematic diagram of the embodiment of the present invention one;
Fig. 6 is the cross-sectional view of the embodiment of the present invention two;
Fig. 7 is the vertical view of the embodiment of the present invention two;
Fig. 8 is the cross-sectional view of the embodiment of the present invention three;
Fig. 9 is the upward view of the embodiment of the present invention three;
Figure 10 is the application structure schematic diagram of the embodiment of the present invention three.
In institute's drawings attached, identical label is indicated similar or corresponding feature or function.
Embodiment
Below with reference to accompanying drawing, specific embodiments of the invention are described in detail.
Embodiment mono-
Fig. 3 and Fig. 4 are cross-sectional view and the vertical views of the embodiment of the present invention one.As Fig. 3, shown in Fig. 4, in embodiment mono-, the outer enclosure of a square wiring board 1 and square metal shell 2 formation silicon microphones, on metal shell 2, be provided with for receiving the sound hole 21 of external sound signal, on the inner wiring board 1 of encapsulation, be separately installed with IC chip 3 and MEMS chip 4, wherein MEMS chip 4 is for utilizing MEMS(MEMS (micro electro mechanical system)) technique making, extraneous voice signal can be transformed into the signal of telecommunication, IC chip 3 on the electrode of MEMS chip 4 and wiring board 1 is electrically connected to, and a plurality of pads 11 of the signal of telecommunication that IC chip was processed the most at last by wiring board 1 outer surface setting to be transferred to silicon microphone outside and be connected with external circuit.And the present invention reduces in order to realize the effect that light is made an uproar, and is provided with dark colour coating 22 in the exterior circumferential surface in sound hole 21.
As preferred technical scheme, the color of coating 22 can be selected the color of black, navy blue, Dark grey, dark brown, blackish green, dark-brown, coffee color or other dark systems, in order to absorb the most of illumination from silicon microphone outside, thereby can not make extraneous light become light reflection repeatedly in the sound hole of silicon microphone external effect, reduce as far as possible the illumination that enters silicon microphone inside, to realize, fall the effect that light is made an uproar.In the present embodiment one, preferably black, as the color of coating 22, can reach best effect.
In the Production design process of silicon microphone, the size in sound hole is also to affect silicon microphone acoustic efficiency and anti-light one of the important indicator of effect of making an uproar.As preferred technical scheme, the sound hole 21 in the present embodiment one is an aperture that aperture is 0.1-0.5mm, can and fall light in acoustics pickup and average out aspect making an uproar, and reaches and falls preferably light make an uproar effect and acoustic efficiency.
In addition, as preferred technical scheme, as shown in Figure 4, in the present embodiment one, coating 22 is for being arranged on metal shell 2 surfaces, sound hole 21 annular coating around.
Fig. 5 is that the silicon microphone of the present embodiment one is arranged on the application structure schematic diagram in a kind of electronic product.As shown in Figure 5, after silicon microphone shown in the present embodiment one is installed, suppose that it is arranged in mobile phone, 5 shells that represent mobile phones in Fig. 5, on phone housing 5, be provided with corresponding with the sound hole 21 of silicon microphone, for receiving the mobile phone sound hole 51 of external sound signal, silicon microphone is arranged on mobile phone main circuit board 7 by its pad 11, silicon microphone sound hole 21 and 51 docking of mobile phone sound hole, between the two, by a flexible gum cover 6, connect, in gum cover 6, be provided with the gum cover sound hole 61 that can transmit voice signal, the airtight docking silicon microphone sound of gum cover 6 hole 21 and mobile phone sound hole 51, thereby can guarantee to keep air-tightness between silicon microphone and phone housing, guarantee that voice signal can be airtight from the external world respectively by mobile phone sound hole 51, gum cover sound hole 61 and silicon microphone sound hole 21 enter silicon microphone inside, after silicon microphone is realized the conversion of sound-electric signal, the signal of telecommunication is transmitted by mobile phone main circuit board 7.When light irradiates after the space of mobile phone sound hole 51 and 61 formation of gum cover sound hole, major part is irradiated on the black coating 22 around of silicon microphone sound hole 21, coating 22 absorbs most of illumination, multiple reflections in the space that can not form in mobile phone sound hole 51 and gum cover sound hole 61, thereby significantly reduced the light irradiating into silicon microphone sound hole 21, finally reduced optical noise.
This design of the present invention only by the sound hole at silicon microphone outer surface around arrange can light-absorbing dark coating mode realize and well fall the light effect of making an uproar, simplicity of design and be easy to realize, can not increase production cost and the size of product, and can not exert an influence to the pickup effect of product.
And, in order further to reduce the impact that light is made an uproar on microphone, in a preferred embodiment of the present invention, on the inwall in gum cover sound hole 61, silicon microphone sound hole 21 and mobile phone sound hole 51, be also provided with the dark colour coating (not shown) that is similar to above-mentioned coating 22, for absorbing the external world, enter the light of tone-entering hole and reduce reflection or the refraction of light in sound hole.For gum cover sound hole 61, silicon microphone sound hole 21 and mobile phone sound hole 51 that sound channel is provided, can on all sound hole inwalls, dark colour coating be set, also can be only dark colour coating be set on the inwall in one or two sound holes therein.
Equally, the color that is arranged on the dark colour coating of sound hole inwall can be selected the color of black, navy blue, Dark grey, dark brown, blackish green, dark-brown, coffee color or other dark systems, preferably can reach the black of best extinction effect.
Embodiment bis-
Fig. 6 and Fig. 7 are respectively cross-sectional view and the vertical view of the embodiment of the present invention two.As Fig. 6, shown in Fig. 7, in the present embodiment two, the outer enclosure of a square wiring board 1 and square metal shell 2 formation silicon microphones, on metal shell 2, be provided with for receiving the sound hole 21 of external sound signal, on the inner wiring board 1 of encapsulation, be separately installed with IC chip 3 and MEMS chip 4, wherein MEMS chip 4 is for utilizing MEMS(MEMS (micro electro mechanical system)) technique making, extraneous voice signal can be transformed into the signal of telecommunication, IC chip 3 on the electrode of MEMS chip 4 and wiring board 1 is electrically connected to, and a plurality of pads 11 of the signal of telecommunication that IC chip was processed the most at last by wiring board 1 outer surface setting to be transferred to silicon microphone outside and be connected to external circuit.And the present invention reduces in order to realize the effect that light is made an uproar, and is provided with dark colour coating 22 in the exterior circumferential surface in sound hole 21.
As preferred technical scheme, the color of coating 22 can be selected the color of black, navy blue, Dark grey, dark brown, blackish green, dark-brown, coffee color or other dark systems, in order to absorb the most of illumination from silicon microphone outside, thereby can not make extraneous light become light reflection repeatedly in the sound hole of silicon microphone external effect, reduce as far as possible the illumination that enters silicon microphone inside, to realize, fall the effect that light is made an uproar.In the present embodiment one, preferably black, as the color of coating 22, can reach best effect.
In the Production design process of silicon microphone, the size in sound hole is also to affect silicon microphone acoustic efficiency and anti-light one of the important indicator of effect of making an uproar.Different from embodiment mono-is, in the present embodiment two, sound hole 21 is a plurality of apertures, preferred single small aperture is 0.03-0.1mm, can reach and fall preferably light make an uproar effect and acoustic efficiency, and compare to the sound hole only consisting of a larger aperture in aperture of embodiment mono-, dust-proof effect and the wind resistance effect of making an uproar can be better realized in the sound hole being comprised of the less aperture of a plurality of single small apertures in the present embodiment two.
As preferred technical scheme, in the present embodiment two, coating 22 is for being arranged on the whole coatings in the 21 place package surface of sound hole.This design can better prevent that light from irradiating into silicon microphone inside.
Embodiment tri-
Fig. 8 and Fig. 9 are respectively cross-sectional view and the upward view of the embodiment of the present invention three.
As shown in Figure 8 and Figure 9, similar with previous embodiment, the silicon microphone of the present embodiment three is also to form outer enclosure by a square wiring board 1 and a square metal shell 2, on the inner wiring board 1 of encapsulation, be separately installed with IC chip 3 and MEMS chip 4, wherein MEMS chip 4 is for utilizing MEMS(MEMS (micro electro mechanical system)) technique making, extraneous voice signal can be transformed into the signal of telecommunication, IC chip 3 on the electrode of MEMS chip 4 and wiring board 1 is electrically connected to, and a plurality of pads 11 of the signal of telecommunication that IC chip was processed the most at last by wiring board 1 outer surface setting to be transferred to silicon microphone outside and be connected to external circuit.
Different from previous embodiment, in the present embodiment three, for receiving the sound hole 12 of external sound signal, be arranged on wiring board 1, in order to realize, reduce the effect that light is made an uproar, in the exterior circumferential surface in sound hole 12, be provided with equally dark colour coating 13.
Equally, the color of coating 13 can be selected the color of black, navy blue, Dark grey, dark brown, blackish green, dark-brown, coffee color or other dark systems, in order to absorb the most of illumination from silicon microphone outside, thereby can not make extraneous light become light reflection repeatedly in the sound hole of silicon microphone external effect, reduce as far as possible the illumination that enters silicon microphone inside, to realize, fall the effect that light is made an uproar.In the present embodiment one, preferably black, as the color of coating 13, can reach best effect selection black, navy blue or other dark colors that is, in the present embodiment, preferred black, can reach best effect.
In the present embodiment three, sound hole 13 is an aperture, and aperture is 0.1-0.5mm, can reach and fall preferably light make an uproar effect and acoustic efficiency.
In addition, as shown in Figure 9, in the present embodiment three, coating 13 is for being arranged on the whole coatings in the 12 place package surface of sound hole.This design can better prevent that light from irradiating into silicon microphone inside.And coating 13 is for being arranged on the solder resist on wiring board 1 surface, coating 13 can complete in the manufacturing process of wiring board 1 like this, technique is simple, and in circuit board manufacturing process, the manufacturing process of solder resist is a necessary process, can't increase production cost.
Figure 10 is that the silicon microphone of the present embodiment three is arranged on the application structure schematic diagram in a kind of electronic product.As shown in figure 10, after silicon microphone shown in the present embodiment three is installed, suppose that it is arranged in mobile phone, the shell of 5 expression mobile phones in figure, on phone housing 5, be provided with for receiving the mobile phone sound hole 51 of external sound signal, silicon microphone is arranged on mobile phone main circuit board 7 by its pad 11, on mobile phone the main circuit board 7 and position of mobile phone sound hole 51 correspondences is provided with main circuit board sound hole 71, then main circuit board sound hole 71 and 51 docking of mobile phone sound hole, between the two, by a flexible gum cover 6, connect, gum cover 6 is provided with the gum cover sound hole 61 that can transmit voice signal, gum cover 6 can guarantee to keep air-tightness between silicon microphone and phone housing, guarantee that voice signal can be airtight from the external world respectively by mobile phone sound hole 51, gum cover sound hole 61, main circuit board sound hole 71 and silicon microphone sound hole 12 enter silicon microphone inside, after silicon microphone is realized the conversion of sound-electric signal, the signal of telecommunication is transmitted by mobile phone main circuit board 7.
When light irradiates the space forming into mobile phone sound hole 51, gum cover sound hole 61 and main circuit board sound hole 71 from outer handset after, major part light is irradiated on the black coating 13 around of silicon microphone sound hole 12, coating 13 absorbs most of illumination, multiple reflections in the space that can not form in mobile phone sound hole 51, gum cover sound hole 61 and main circuit board sound hole 71, thereby significantly reduced the light irradiating into silicon microphone sound hole 12, finally reduced the impact of optical noise on silicon microphone.
The present embodiment three equally can be by being simply arranged on silicon microphone outer surface sound hole around dark coating absorb light, thereby realize, well fall the light effect of making an uproar, and can not exert an influence to the pickup effect of product.
In addition, in order further to reduce the impact that light is made an uproar on microphone, in a preferred embodiment of the present invention, on the inwall in gum cover sound hole 61, silicon microphone sound hole 12, mobile phone sound hole 51 and main circuit board sound hole 71, be also provided with the dark colour coating (not shown) that is similar to above-mentioned coating 22 equally, for absorbing the external world, enter the light of tone-entering hole and reduce reflection or the refraction of light in sound hole.For gum cover sound hole 61, silicon microphone sound hole 12, mobile phone sound hole 51 and main circuit board sound hole 71 that sound channel is provided, can on all sound hole inwalls, dark colour coating be set, also can be only dark colour coating be set on the inwall in one or two sound holes therein.
Equally, the color that is arranged on the dark colour coating of sound hole inwall can be selected the color of black, navy blue, Dark grey, dark brown, blackish green, dark-brown, coffee color or other dark systems, preferably can reach the black of best extinction effect.
In above three cited embodiment, all adopted square shell and wiring board, shell is the metal groove form casing of one.In fact, shell and wiring board can be also other shapes, and shell also can adopt wiring board material, plastic material etc. to make, and shell can be also that a framework and a cover combination form; Wiring board in this patent can preferred resin material as base material; The application product that silicon microphone is installed can be mobile phone, can be also as other electronic products such as intercom, notebook computer, palmtop PCs.In a word, the various choice of technology modes under the prerequisite of not violating this novel silicon microphone design purport are all within the protection of this patent.In addition, it should be noted that, in view of the suitable adjustment of MEMS chip is on not impact of purport of the present invention, the MEMS chip in pattern only adopts simple pattern to represent.
Claims (8)
1. a silicon microphone, comprise shell and wiring board, described shell and wiring board form the outer enclosure structure of silicon microphone, PCB surface in described encapsulating structure inside is provided with MEMS chip, and on described encapsulating structure, be provided with for receiving the sound hole of external sound signal, it is characterized in that
In the exterior circumferential surface in described sound hole, be provided with dark colour coating; And,
Described sound hole is arranged on described wiring board or described shell;
The coating being arranged in the exterior circumferential surface in the sound hole on described wiring board is the solder resist that is arranged on described PCB surface;
Outer surface at described wiring board is provided with the pad being electrically connected to the external circuit of described silicon microphone.
2. silicon microphone as claimed in claim 1, is characterized in that,
The color of described coating is black, navy blue, Dark grey, dark brown, blackish green, dark-brown or coffee color.
3. silicon microphone as claimed in claim 1, is characterized in that,
Described sound hole is the aperture that the aperture aperture that is 0.1～1.5mm or a plurality of single small aperture are 0.03～0.1mm.
4. silicon microphone as claimed in claim 1, is characterized in that,
Described shell is metal shell, and described sound hole is arranged on described shell, and described coating is arranged on described case surface.
5. silicon microphone as claimed in claim 1, is characterized in that,
The sound hole being arranged on described wiring board is arranged on position corresponding with described MEMS chip position is installed on described wiring board.Silicon microphone as claimed in claim 1, is characterized in that,
Described coating is to be arranged on annular coating around of described sound hole or for being arranged on the whole coatings in the package surface of place, described sound hole.
6. an encapsulating structure for silicon microphone and application product, is characterized in that,
Described silicon microphone is the silicon microphone described in any one in claim 1～5;
On the shell of described application product, be provided with the application product sound hole corresponding with the sound hole of described silicon microphone; And
Between the sound hole of described silicon microphone and described application product sound hole, be also provided with the gum cover in order to sound hole and the described application product sound hole of the described silicon microphone of airtight docking, in described gum cover, be provided with gum cover sound hole.
7. encapsulating structure as claimed in claim 6, is characterized in that,
In the sound hole of described gum cover sound hole and/or described silicon microphone and/or the inwall in described application product sound hole be provided with dark colour coating.
8. encapsulating structure as claimed in claim 6, is characterized in that,
Described silicon microphone is arranged between the shell of described application product and the main circuit board of described application product, and described silicon microphone is arranged on the main circuit board of described application product by pad.
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| CN106412783A (en) * | 2016-11-23 | 2017-02-15 | 上海传英信息技术有限公司 | Microphone structure and mobile terminal |
| CN108074498A (en) * | 2017-12-27 | 2018-05-25 | 威创集团股份有限公司 | Display module, display device and manufacturing method |
| CN109769184A (en) * | 2019-01-16 | 2019-05-17 | 钰太芯微电子科技（上海）有限公司 | A kind of encapsulating structure of microphone |
| CN111683332A (en) * | 2020-06-08 | 2020-09-18 | 荣成歌尔电子科技有限公司 | Optical noise test system, optical noise test method and storage medium |
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| CN106412783B (en) * | 2016-11-23 | 2022-04-12 | 上海传英信息技术有限公司 | Microphone structure and mobile terminal |
| CN108074498A (en) * | 2017-12-27 | 2018-05-25 | 威创集团股份有限公司 | Display module, display device and manufacturing method |
| CN109769184A (en) * | 2019-01-16 | 2019-05-17 | 钰太芯微电子科技（上海）有限公司 | A kind of encapsulating structure of microphone |
| CN109769184B (en) * | 2019-01-16 | 2024-04-02 | 钰太芯微电子科技（上海）有限公司 | Packaging structure of microphone |
| CN111683332A (en) * | 2020-06-08 | 2020-09-18 | 荣成歌尔电子科技有限公司 | Optical noise test system, optical noise test method and storage medium |
| CN111683332B (en) * | 2020-06-08 | 2021-11-09 | 荣成歌尔电子科技有限公司 | Optical noise test system, optical noise test method and storage medium |
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|---|---|
| CN103533493B (en) | 2016-09-14 |
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Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
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Effective date of registration: 20200608 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |