CN103521926B - A kind of silicon-based film solar cells laser grooving and scribing equipment - Google Patents
A kind of silicon-based film solar cells laser grooving and scribing equipment Download PDFInfo
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- CN103521926B CN103521926B CN201310444349.XA CN201310444349A CN103521926B CN 103521926 B CN103521926 B CN 103521926B CN 201310444349 A CN201310444349 A CN 201310444349A CN 103521926 B CN103521926 B CN 103521926B
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 21
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 21
- 239000010703 silicon Substances 0.000 title claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 51
- 230000003287 optical effect Effects 0.000 claims abstract description 41
- 239000000428 dust Substances 0.000 claims description 62
- 238000010926 purge Methods 0.000 claims description 27
- 239000011521 glass Substances 0.000 claims description 16
- 238000001914 filtration Methods 0.000 claims description 15
- 230000001681 protective effect Effects 0.000 claims description 9
- 238000007664 blowing Methods 0.000 claims description 6
- 239000011148 porous material Substances 0.000 claims description 6
- 230000000740 bleeding effect Effects 0.000 claims description 4
- 239000004801 Chlorinated PVC Substances 0.000 claims description 3
- 229920000457 chlorinated polyvinyl chloride Polymers 0.000 claims description 3
- PGLTVOMIXTUURA-UHFFFAOYSA-N iodoacetamide Chemical compound NC(=O)CI PGLTVOMIXTUURA-UHFFFAOYSA-N 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims description 2
- 238000013461 design Methods 0.000 abstract description 4
- 239000007789 gas Substances 0.000 description 39
- 239000010408 film Substances 0.000 description 21
- 238000000034 method Methods 0.000 description 18
- 239000002245 particle Substances 0.000 description 18
- 230000010287 polarization Effects 0.000 description 10
- 238000005453 pelletization Methods 0.000 description 8
- 239000010409 thin film Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000013519 translation Methods 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000013081 microcrystal Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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- 239000007921 spray Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The present invention relates to a kind of silicon-based film solar cells laser grooving and scribing equipment, belong to solar cell device technical field.The technical problem of cost and delineation complex figure can not be taken into account for solving existing laser grooving and scribing equipment simultaneously, design a kind of silicon-based film solar cells laser grooving and scribing equipment, comprise rack-mount optical system, substrate workbench, optical system is primarily of laser instrument, beam expanding lens, focus lamp is formed, the output of laser instrument is equipped with beam expanding lens, optical system also comprises order and is arranged on spectroscope between beam expanding lens and focus lamp and galvanometer, the laser that laser instrument is launched enters spectroscope through beam expanding lens and is divided into reverberation and refract light, this reverberation and refract light enter corresponding galvanometer respectively and form parallel laser beam with condenser, delineation rete.The present invention not only can delineate the battery that large scale has complex figure, can also reduce laser instrument usage quantity, effectively reduce equipment cost, enhance productivity.
Description
Technical field
The present invention relates to a kind of silicon-based film solar cells laser grooving and scribing equipment, belong to solar cell device technical field.
Background technology
Laser grooving and scribing equipment is requisite key equipment during silicon-based film solar cells manufactures, it is for forming the interconnective structure of the sub-battery of inner more piece to post-depositional film by laser scoring, its principle is that the physical process such as fuel factor, thermal stress utilizing laser beam and rete to interact to produce makes the rete of radiation areas remove by the laser beam focus of particular energy and pulse frequency on the rete needing delineation.The typical processes of silicon-based film solar cells needs three laser grooving and scribing operations, i.e. electrodes conduct rete (being called that P1 delineates), laser grooving and scribing opto-electronic conversion silica-base film layer (being called that P2 delineates) and back electrode film (being called that P3 delineates) before laser grooving and scribing, after three delineations, substrate effective coverage is divided into the inside battery cascaded structure with one fixed width of specific quantity.
Laser grooving and scribing equipment mainly comprises optical system and control system thereof, and wherein optical system is core.At present, the thin-film solar cells light splitting flight optical system that mainly contains in the industry and vibration mirror scanning optical system, light splitting flight system is mainly used in delineation large scale hull cell, as Chinese Patent Application No. 200920106830.7 " thin-film solar cells chalker ", and vibration mirror scanning optical system is mainly used in delineating undersized complex figure.As Chinese patent 200810236766.4 " a kind of for thin-film solar cells engraved film and the new equipment got ready ", by optical element (as spectroscope), laser is divided into two equal bundle or four bundles of energy approximation, each beamlet conducts to different laser heads by light path, act on the substrate rete that need process after laser head line focus, in scoring process, high speed back and forth movement is done in laser head combination, and substrate keeps motionless, delineation speed is fast, number of lasers is few, but ruling span is determined by laser head spacing, to disposablely before delineation adjust, immutable in scoring process, cause the complex figure cannot delineated spacing and not wait, the diversified requirement of thin-film solar cells product can not be met, and due to spectroscope divide multiple laser not quite identical, need to carry out angle correct by polariscope, and these corrections all can not adjust in real time, score line is easily caused to occur error, then the electrical property of battery is affected.Vibration mirror scanning optical system stability is high, the figure of the complexity of any spacing can be realized, and laser head utilization rate is close to 100%, but due to the restriction by depth of focus after laser beam line focus, effective working region of single laser head is limited, required number of lasers is more, equipment and maintenance cost high.
The function of the dust arrester in laser grooving and scribing equipment effectively collects by the rete of laser ablation, particle, on the one hand avoids dust, particle on the impact of cleaning shop cleanliness factor, reduces its negative effect to battery core board electrical property on the other hand.As Chinese patent 201220015196.8 " dust arrester for thin-film solar cells laser grooving ", dedusting terminal and suction nozzle are installed directly over laser action position and glass substrate, suction nozzle is connected to exhausting system through flexible duct, in the process of laser film-engraving, the blower fan in dust pelletizing system with specific pumping speed is started working, negative pressure is produced at pipe interior, by below suction nozzle, that glass substrate superjacent air space sucks dust pelletizing system containing the air of membrane-coating granules, dust through flexible duct is inner, after dedusting, tail gas is expelled to factory's business exhaust system after filtration.This type of dust arrester is effective for non-crystalline silicon unijunction thin-film solar cells P2/P3 delineation, but delineate for amorphous/crystallite overlapping thin film solar battery P2/P3, its dust removing effects is not good enough, reason is: first, amorphous/microcrystalline film solar battery obsorbing layer thickness is generally more than 1.3 μm, its thickness is far longer than non-crystalline silicon single junction cell absorber thickness (general <500nm), increase due to thickness causes producing more dust and particle in the process of P2/P3 laser grooving and scribing, and dedusting difficulty is strengthened; Second, microcrystal silicon rete density is lower than amorphous silicon film layer, porosity is high and crystal grain is columnar growth, the particle causing producing in scoring process, the particle diameter of dust are less than normal, once drop on face, be difficult to be removed, the difficulty of dedusting is strengthened, and general dust pelletizing system can not meet the requirement of technique.Result according to on-the-spot test shows, remain in particle on substrate and dust, particle more than 90% and dust can be removed by gas flow purging, most of dust, the particle residue Electrostatic Absorption of reason not and between substrate layer at substrate surface is described, and is only that gravitate falls back on face.
Summary of the invention
The present invention solves the technical problem that existing laser grooving and scribing equipment can not take into account cost and delineation complex figure simultaneously, overcomes conventional laser scoring apparatus simultaneously and produce some particles compared with path grain in work runs, affect the problems such as solar cell electrical property.
In order to realize above task, a kind of silicon-based film solar cells laser grooving and scribing equipment of novel concept ground design of the present invention, comprise rack-mount optical system, substrate workbench, optical system is primarily of laser instrument, beam expanding lens, focus lamp is formed, the output of laser instrument is equipped with beam expanding lens, optical system also comprises order and is arranged on spectroscope between beam expanding lens and focus lamp and galvanometer, the laser that laser instrument is launched enters spectroscope through beam expanding lens and is divided into reverberation and refract light, this reverberation and refract light enter corresponding galvanometer respectively and form parallel laser beam with condenser, rete is delineated by collimated laser beam.
Before galvanometer on reverberation or the refract light direction of propagation, speculum is housed.Galvanometer comprises the X-axis galvanometer and Z axis galvanometer that are freely rotated by Electric Machine Control, and between Z axis galvanometer and spectroscope, light-baffling device is housed, and is blocked by laser by light-baffling device when not needing to delineate corresponding groove.
Be provided with speculum before light-baffling device, laser direction can be changed as required.
Focus lamp is F-θ focus lamp
,the port of this focus lamp has protective glass, in case contamination by dust focus lamp in scoring process.
Optical system has two covers at least, and often overlap in optical system and have two galvanometers at least, multiple laser is delineated substrate simultaneously, effectively improves laser grooving and scribing efficiency.
In work runs, some compared with path grain particles are produced in order to remove laser grooving and scribing equipment, the laser grooving and scribing equipment of the present invention's design also comprises dust arrester, this dust arrester is rack-mount, be positioned at above optical system, dust arrester is primarily of dust excluding hood, dust-filtering mechanism and bleed blower fan and auxiliary blowing mechanism composition.Auxiliary blowing mechanism comprises the purge gas source, filtering unit, solenoid electric valve, gas pressure control unit, gas pipeline and the gas purging unit that connect successively, and gas pipeline is communicated to gas purging unit.Dust excluding hood is the cavity of del and trapezoidal superposition shape, is trapezoidally positioned at del lower end, and the uncovered shape in bottom, has semicircle in uncovered inner side, connects dust filtering device successively and blower fan of bleeding on del top.Gas purging unit is hollow circular tube, and multiple internal diameter that it distributes is the pore of 1 ~ 1.5mm, and the end of this pore is conical reamer.The hollow circular tube of gas purging unit is stainless steel tube or chlorinated polyvinyl chloride pipe.Gas purging unit is two, lay respectively at the bottom of dust excluding hood uncovered two outside, the pore on hollow circular tube is towards the inner side of dust excluding hood lower end.
Good effect of the present invention:
1. laser grooving and scribing equipment is to the first light splitting rear polarizer of laser, the laser after light splitting is carried out polarization, not only can delineate the battery of large-sized complex figure, can also reduce laser instrument usage quantity, effectively reduce equipment cost, enhance productivity.Breach the restriction that tradition has the laser grooving and scribing equipment of light splitting flight optical system or polarization scans optical system.
2. the laser grooving and scribing equipment of the present invention's design can also precise calibration in real time, ensures that score line height unanimously, improves the quality of products, need the defect of rectification building-out after overcoming the light splitting of existing laser grooving and scribing equipment light splitting flight optical system.
3. the dust arrester of laser grooving and scribing equipment is provided with auxiliary blowing mechanism, can carry out better again purging to the particle compared with path grain stayed after laser grooving and scribing on face and dust, make battery core board can not reduce electrical property because of these particles residual and dust.
The present invention can also be provided with light beam guiding tube on the path of laser process, and light beam is conducted in airtight space, avoids the sense optical element in optical system not to be subject to external environment influence, reduces maintenance frequency.
Accompanying drawing explanation
Fig. 1: the structural representation of silicon-based film solar cells laser grooving and scribing equipment of the present invention.
Fig. 2: the schematic diagram of embodiment one.
Fig. 3: the schematic diagram of embodiment two.
Fig. 4: the schematic diagram of embodiment three.
Fig. 5: the schematic diagram of embodiment four.
Fig. 6: the schematic diagram of embodiment five.
The partial cutaway schematic of laser grooving and scribing equipment in Fig. 7: Fig. 6.
Fig. 8: the gas hole structural representation of the gas purging unit 19 of dust arrester in laser grooving and scribing equipment.
In Fig. 1 to Fig. 8: 1, laser instrument, 2, beam expanding lens, 3, spectroscope, 4, Z axis galvanometer, 5, X-axis galvanometer, 6, focus lamp, 7, protective glass, 8, speculum, 9, light-baffling device, 10, Z axis rotary electric machine, 11, X-axis rotary electric machine, 12, support, 13, laser system fixed head, 14, galvanometer cover, 15, substrate workbench, 16, dust shield support, 17, dust shield, 18, substrate, 19, gas purging unit, 20, gas pipeline, 21, gas pressure control unit, 22, solenoid electric valve, 23, filtering unit, 24, purge gas source, 25, exhaust tube, 26, dust filtering device, 27, to bleed blower fan.
Detailed description of the invention
Embodiment one
See Fig. 1 and Fig. 2, the laser grooving and scribing equipment of the present embodiment comprises laser instrument 1, beam expanding lens 2, spectroscope 3, Z axis galvanometer 4, X-axis galvanometer 5, focus lamp 6, protective glass 7, the beam of laser that laser instrument 1 sends is divided into the refract light of X axis and the reverberation of Y-axis by spectroscope 3 after beam expanding lens 2, refract light after Z axis galvanometer 4 polarization again through X-axis galvanometer 5, make laser upwards again line focus mirror 6 arrive substrate film surface, delineate, and another restraints reverberation after another Z axis galvanometer 4 polarization again through X-axis galvanometer 5 simultaneously, make laser upwards again line focus mirror 6 arrive substrate film surface, delineate, realize two bundle laser by a laser instrument to delineate simultaneously.
During work, substrate 18 is placed on substrate workbench 15, and upward, laser optical system is collaborative work under the control of the computer for face.
When delineating X axis score line (perpendicular to laser head orientation) in the course of work, controlling Z axis rotary electric machine 10 by computer drives Z axis galvanometer 4 to turn to the stopping of certain initial position along Z axis, X-axis rotary electric machine 11 drives X-axis galvanometer 5 to deflect into the original position of first group of score line along X-axis, the both sides living substrate 18 by manipulator clamping are carried out X-axis and are seesawed (perpendicular to laser head orientation), complete first group of six X axis score line, after first group of X axis score line completes, substrate 18 stop motion, then X-axis rotary electric machine 11 drives X-axis galvanometer 5 to deflect into the original position of second group of score line along X-axis, then the both sides that manipulator clamping lives substrate 18 start next stroke, complete second group of six X axis score line, the like, until realize the delineation of various spacing, complete the processing of the X axis score line to substrate 18.
When delineating Y-axis score line (being parallel to the direction of laser head arrangement) in the course of work, manipulator clamping lives the both sides of substrate 18 by the coordinate position of glass sliding to the first Y-axis score line, substrate position remains unchanged, controlling Z axis rotary electric machine 10 by computer drives Z axis galvanometer 4 and X-axis rotary electric machine 11 to drive X-axis galvanometer 5 to deflect to initial position, and then drive the speed of X-axis galvanometer 5 according to certain from initial position in the angular range of definition continuous by computer controlled built in X-axis rotary electric machine 11, quick rotation, make laser beam translation on Y-axis direction, complete the delineation of Y-axis direction score line in each laser head scored area, X-axis galvanometer 5 gets back to initial position, three cover laser optical systems work simultaneously, a Y-axis score line is spliced into about 6 Y-axis direction score line of 6 laser head complete independentlies, after completing a Y-axis score line delineation, the manipulator clamping both sides of living substrate 18 by glass sliding to the coordinate position of next horizontal score line, repeat said process and complete next Y-axis score line, the like, until complete the last item Y-axis score line, so far, complete the delineation processing of substrate 18.
Embodiment two
See Fig. 1 and Fig. 2, the laser grooving and scribing equipment of the present embodiment comprises laser instrument 1, beam expanding lens 2, spectroscope 3, Z axis galvanometer 4, X-axis galvanometer 5, focus lamp 6, protective glass 7, between Z axis galvanometer 4 and spectroscope, light-baffling device 9 is also housed, the beam of laser that laser instrument 1 sends is divided into the refract light of X axis and the reverberation of Y-axis by spectroscope 3 after beam expanding lens 2, refract light after Z axis galvanometer 4 polarization again through X-axis galvanometer 5, make laser upwards again line focus mirror 6 arrive substrate film surface, delineate, and another restraints reverberation after another Z axis galvanometer 4 polarization again through X-axis galvanometer 5 simultaneously, make laser upwards again line focus mirror 6 arrive substrate film surface, delineate, realize two bundle laser by a laser instrument to delineate simultaneously.Laser is blocked by light-baffling device when not needing to delineate corresponding groove.
When delineating Y-axis score line (being parallel to the direction of laser head arrangement) in the course of work, manipulator clamping lives the both sides of substrate 18 by the coordinate position of glass sliding to the first Y-axis score line, substrate position remains unchanged, controlling Z axis rotary electric machine 10 by computer drives Z axis galvanometer 4 and X-axis rotary electric machine 11 to drive X-axis galvanometer 5 to deflect to initial position, and then drive the speed of X-axis galvanometer 5 according to certain from initial position in the angular range of definition continuous by computer controlled built in X-axis rotary electric machine 11, quick rotation, make laser beam translation on Y-axis direction, complete the delineation of Y-axis direction score line in each laser head scored area, light-baffling device 9 is closed (not bright dipping) afterwards, X-axis galvanometer 5 gets back to initial position, three cover laser optical systems work simultaneously, a Y-axis score line is spliced into about 6 Y-axis direction score line of 6 laser head complete independentlies, after completing a Y-axis score line delineation, the manipulator clamping both sides of living substrate 18 by glass sliding to the coordinate position of next horizontal score line, in each laser optics module, light-baffling device 9 is opened, light beam is passed through, repeat said process and complete next Y-axis score line, the like, until complete the last item Y-axis score line, so far, complete the delineation processing of substrate 18.
Embodiment three
See Fig. 1 and Fig. 4, the laser grooving and scribing equipment of the present embodiment comprises laser instrument 1, beam expanding lens 2, spectroscope 3, Z axis galvanometer 4, X-axis galvanometer 5, focus lamp 6, protective glass 7 and speculum 8, the beam of laser that laser instrument 1 sends is divided into the refract light of X axis and the reverberation of Y-axis by spectroscope 3 after beam expanding lens 2, refract light after Z axis galvanometer 4 polarization again through X-axis galvanometer 5, make laser upwards again line focus mirror 6 arrive substrate film surface, delineate, and another restraints reverberation again after light path is reflected into the X axis consistent with refract light by a speculum 8 simultaneously, reverberation after another Z axis galvanometer 4 polarization again through X-axis galvanometer 5, make laser upwards again line focus mirror 6 arrive substrate film surface, delineate, realize two bundle laser by a laser instrument to delineate simultaneously.
Also can be that refract light is first reflected into the Y-axis light path consistent with reverberation by speculum 8, two-beam road is reflected into the light path of X axis more respectively by speculum 8, by light-dividing device 9 again after Z axis galvanometer 4 polarization again through X-axis galvanometer 5, make laser upwards again line focus mirror 6 arrive substrate film surface, delineate.
During work, substrate 18 is placed on substrate workbench 15, and upward, laser optical system is collaborative work under the control of the computer for face.
Embodiment four
See Fig. 1 and Fig. 5, the optical system of the laser grooving and scribing equipment of the present embodiment comprises laser instrument 1, beam expanding lens 2, spectroscope 3, Z axis galvanometer 4, X-axis galvanometer 5, focus lamp 6, protective glass 7, speculum 8 and light-baffling device 9, the beam of laser that laser instrument 1 sends is divided into the refract light of X axis and the reverberation of Y-axis by spectroscope 3 after beam expanding lens 2, refract light is first reflected into the Y-axis light path consistent with reverberation by speculum 8, two-beam road is reflected into the light path of X axis more respectively by speculum 8, by light-dividing device 9 again after Z axis galvanometer 4 polarization again through X-axis galvanometer 5, make laser upwards again line focus mirror 6 arrive substrate film surface, delineate.
During work, substrate 18 is placed on substrate workbench 15, is positioned in the middle of dust arrester and optical system, and upward, laser optical system is collaborative work under the control of the computer for face.
The running of laser grooving and scribing equipment, with embodiment 2, does not repeat them here.
Embodiment five
See Fig. 6-Fig. 8, the laser grooving and scribing equipment of the present embodiment comprises three cover optical systems, three cover optical system Y-axis are arranged on the laser system fixed head 13 of support 12 side by side, galvanometer cover 14 has six, respectively by focus lamp 6, X-axis galvanometer 5 and X-axis rotary electric machine 11 cover on inside, focus lamp 6 is F-θ focus lamp, protective glass 7 reaches galvanometer cover 14 upper end, galvanometer cover 14 is fixed on laser system fixed head 13, substrate workbench 15 is also arranged on support 12, and above laser grooving and scribing optical system, leave delineation gap, and laser grooving and scribing equipment is equipped with dust arrester.
During work, substrate 18 is placed on substrate workbench 15, be positioned in the middle of dust arrester and optical system device, face upward, three cover laser optical systems are relatively independent, collaborative work under the control of the computer, and laser scribing process is with embodiment 1, do not repeat them here, below stress dust arrester and the operation principle thereof of laser grooving and scribing equipment vendor:
Dust arrester is arranged on above optical system, the middle part of the dust shield 17 in dust arrester is just to the protective glass 10 above focus lamp 9, dust shield 17 is fixedly mounted on the dust shield support 15 of the both sides on support, dust shield 17 top is connected with exhaust tube 25, exhaust tube 25 is connected with blower fan 27 of bleeding through dust filtering device 26, in dust shield 17 bottom, dual-side is fixed with gas purging unit 19 respectively, gas purging unit 19 is connected with purge gas source 24 through filtering unit 23 after solenoid electric valve 22 through gas pressure control unit 21 successively by gas pipeline 20 again, wherein, purge gas source 24 is oil-free compressed air or nitrogen, filtering unit 25 is made up of two parts, particle in single filter system main filtration gas, cascade filtration the system hydrone in charcoal absorption gas and oil molecule, gas pressure control unit 21 is controlled by manual ball valve, gas pressure is controlled at 6bar, control the solenoid electric valve 22 that gas imports/cuts off, its control signal is+24V direct current signal, this triggering signal is controlled by machine control system, gas is divided into two-way gas pipeline 20 by a road by three-way connection by gas, be connected respectively on two gas purging unit 19 being fixed on Nozzle for dust suction, after gases at high pressure pass into the hollow pipeline be made up of CPVC of gas purging unit 19, under differential pressure action inside and outside pipeline, diameter from solid matter on hollow pipeline is spray in 1.5mm aperture by gas, form linear air-flow faster, airflow function is on the face of substrate 18, the angle in airflow direction and substrate normal direction about 15 ~ 30 °, dust on face, particle again blown off under the perturbation action of outer gas stream substrate 18 surface, then dust pelletizing system is sucked by the Nozzle for dust suction of top inner.
The specific operation process of dust arrester: substrate 18 is by after the clamping of location, the blower fan 27 of bleeding of dust pelletizing system starts to start, apparatus control system (CNC or motion control card) controls solenoid electric valve 22 and opens, make gas pass into gas purging unit 19 and form linear air-flow, afterwards, each subsystem of apparatus control system control both optical system starts scribing process, in scoring process, when laser beam acts on the rete of glass substrate 18, removed film material forms a large amount of small sized particles and dust, major part particle and dust are sucked by dust pelletizing system in the process leaving rete, collecting by filtration gets up, fraction particle and dust are not inhaled into dust pelletizing system in time, again fall back under gravity on substrate face, at the purging of the air-flow of auxiliary blowing mechanism, under perturbation action, by gas flow purging to substrate 18 rete on dust, particle will leave the surface of substrate 18 again, then discharge after being inhaled into dust pelletizing system and collect.
Claims (11)
1. a silicon-based film solar cells laser grooving and scribing equipment, comprise rack-mount optical system, substrate workbench, optical system is primarily of laser instrument, beam expanding lens, focus lamp is formed, the output of laser instrument is equipped with beam expanding lens, it is characterized in that described optical system also comprises order and is arranged on spectroscope between beam expanding lens and focus lamp and galvanometer, the laser that laser instrument is launched enters spectroscope through beam expanding lens and is divided into reverberation and refract light, this reverberation and refract light all enter corresponding galvanometer and form parallel laser beam with focus lamp, rete is delineated by collimated laser beam, described support is also equipped with dust arrester, this dust arrester is positioned at above optical system, dust arrester is primarily of dust excluding hood, dust-filtering mechanism and bleed blower fan and auxiliary blowing mechanism composition.
2. silicon-based film solar cells laser grooving and scribing equipment according to claim 1, is characterized in that, before the galvanometer on described reverberation or the refract light direction of propagation, speculum is housed.
3. silicon-based film solar cells laser grooving and scribing equipment according to claim 1 and 2, is characterized in that described galvanometer comprises the X-axis galvanometer and Z axis galvanometer freely rotated by Electric Machine Control, and between Z axis galvanometer and spectroscope, light-baffling device is housed.
4. silicon-based film solar cells laser grooving and scribing equipment according to claim 3, is characterized in that being provided with speculum before described light-baffling device.
5. silicon-based film solar cells laser grooving and scribing equipment according to claim 1 and 2, is characterized in that described focus lamp is F-θ focus lamp
,the port of this focus lamp has protective glass.
6. silicon-based film solar cells laser grooving and scribing equipment according to claim 1, is characterized in that described optical system has two covers at least, often overlaps in optical system and has two galvanometers at least.
7.
silicon-based film solar cells laser grooving and scribing equipment according to claim 6, it is characterized in that described auxiliary blowing mechanism comprises purge gas source, filtering unit, solenoid electric valve, gas pressure control unit, gas pipeline and the gas purging unit connected successively, gas pipeline is communicated to gas purging unit.
8.
silicon-based film solar cells laser grooving and scribing equipment according to claim 6, it is characterized in that described dust excluding hood is the cavity of del and trapezoidal superposition shape, trapezoidally be positioned at del lower end, the uncovered shape in bottom, there is semicircle in uncovered inner side, connect dust-filtering mechanism successively on del top and blower fan of bleeding.
9.
silicon-based film solar cells laser grooving and scribing equipment according to claim 7, is characterized in that described gas purging unit is hollow circular tube, and it distributes multiple pore, and the end of pore is conical reamer.
10.
silicon-based film solar cells laser grooving and scribing equipment according to claim 9, is characterized in that the hollow circular tube of described gas purging unit is stainless steel tube or chlorinated polyvinyl chloride pipe.
11.
silicon-based film solar cells laser grooving and scribing equipment according to claim 7, it is characterized in that the bottom of described dust excluding hood uncovered two outside be equipped with gas purging unit, the pore on the hollow circular tube of this gas purging unit is towards the inner side of dust excluding hood lower end.
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| JP2016039200A (en) * | 2014-08-06 | 2016-03-22 | セイコーエプソン株式会社 | Solar battery, electronic apparatus and method of manufacturing solar battery |
| CN104908108B (en) * | 2015-06-08 | 2017-05-31 | 航成（天津）科技有限公司 | It is a kind of for applying film material and it is adjustable draw it is intermembranous away from laser scribing film device |
| US9882071B2 (en) * | 2016-07-01 | 2018-01-30 | Sunpower Corporation | Laser techniques for foil-based metallization of solar cells |
| CN106735873B (en) * | 2017-01-09 | 2018-11-16 | 中电科天之星激光技术（上海）有限公司 | A kind of transparent plastic engraving device |
| CN107344267A (en) * | 2017-07-17 | 2017-11-14 | 中山瑞科新能源有限公司 | A kind of solar panel laser scribing device |
| CN108031992A (en) * | 2017-12-29 | 2018-05-15 | 苏州德龙激光股份有限公司 | The ultrafast systems of processing of LTCC and its method |
| CN113634903B (en) * | 2021-06-30 | 2023-03-14 | 中钞印制技术研究院有限公司 | Laser platemaking equipment and platemaking system |
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