CN103517574B

CN103517574B - Bearing fixture and the manufacture method of Rigid Flex

Info

Publication number: CN103517574B
Application number: CN201210212081.2A
Authority: CN
Inventors: 黄昱中
Original assignee: Fukui Precision Component Shenzhen Co Ltd; Zhending Technology Co Ltd
Current assignee: Peng Ding Polytron Technologies Inc; Avary Holding Shenzhen Co Ltd
Priority date: 2012-06-26
Filing date: 2012-06-26
Publication date: 2016-08-10
Anticipated expiration: 2032-06-26
Also published as: CN103517574A

Abstract

A kind of bearing fixture is used for carrying soft or hard superimposed sheet, and described soft or hard superimposed sheet is positioned inductive thermal riveter.This bearing fixture is provided with the multiple platform positioning needle the most multiple tools hole, location with inductive thermal riveter and multiple first overlapping location hole the most multiple carrying positioning needles of this soft or hard superimposed sheet and multiple penetrates groove.Each platform positioning needle is arranged in hole, corresponding tool location.Each carrying positioning needle is arranged in corresponding first hole, overlapping location.The plurality of groove that penetrates coordinates with multiple heating coil one_to_one corresponding of described inductive thermal riveter, so that each heating coil acts on described soft or hard superimposed sheet and rivets the edge of described soft or hard superimposed sheet.The invention still further relates to the manufacture method of a kind of Rigid Flex.

Description

Bearing fixture and the manufacture method of Rigid Flex

Technical field

The present invention relates to the manufacturing technology of circuit board, particularly relate to a kind of bearing fixture for carrying the soft or hard superimposed sheet making Rigid Flex and the method using this bearing fixture to make Rigid Flex.

Background technology

Rigid Flex (Rigid-Flexible Printed Circuit Board, R-F PCB) refers to comprise one or more rigid region and the printed circuit board of one or more flex region, and it has hardboard (Rigid Printed concurrently Circuit Board, RPCB, hard circuit board) durability and soft board (Flexible Printed Circuit Board, FPCB, flexible circuit board) flexibility, thus there is the features such as frivolous compact and resistance to severe applied environment, be particularly suitable for the application in terms of the precise electronics such as portable type electronic product, medical electronics product, military equipment.Thus, Rigid Flex has been carried out widely studied by the most numerous research worker, such as, Ganasan, et al. J.R. it is published in IEEE Transactions on Electronics Packaging Manufacturing in January, 2000, volume:23, Issue: The document Chip of 1, page:28-31 on chip (COC) and chip on board (COB) assembly on flex rigid printed circuit The package technique of Rigid Flex is inquired into by assemblies.

In the manufacturing process of Rigid Flex, especially before pressing rigid substrate and flexible base plate, typically require and by riveted process, rigid substrate edge and the riveting of flexible base plate edge are integrated, so that rigid substrate and flexible base plate are positioned, thus prevent in follow-up bonding processes, rigid substrate moves relative to flexible base plate.The riveting method commonly used is integrated for using rivet driver to be riveted in flexible base plate edge and rigid substrate edge, i.e. rigid substrate and flexible base plate riveting is integrated by rivet.But, in the method, during rivet is embedded flexible base plate and rigid substrate, some rivets bits can be produced.Those rivet bits can cause the internal layer circuit short circuit in the Soft Bonding plate after pressing, thus reduces the making yield of Rigid Flex.

Therefore, it is necessary to provide a kind of bearing fixture effectively flexible base plate and rigid substrate positioned and use the manufacture method of Rigid Flex of this bearing fixture, to improve the making yield of Rigid Flex.

Summary of the invention

Below by a kind of bearing fixture and the method using this bearing fixture to make Rigid Flex being described with embodiment, to improve the making yield of Rigid Flex.

A kind of bearing fixture, is provided with the soft or hard superimposed sheet in multiple first hole, overlapping location, and is positioned on inductive thermal riveter by described soft or hard superimposed sheet for carrying.Described inductive thermal riveter includes a carrying platform and multiple heating coil being located at carrying platform opposite sides.Described carrying platform is provided with multiple platform positioning needle.Described bearing fixture has relative first surface and second surface.Described bearing fixture offers the hole, multiple tools location running through described first surface and second surface.Hole, multiple described tools location coordinates with multiple platform positioning needle one_to_one corresponding, is arranged in hole, a tool location for each platform positioning needle.The opposite sides edge of the first surface of described bearing fixture is provided with multiple first carrying positioning needle.Each first carrying positioning needle all extends to the direction away from described second surface from described first surface.Multiple first carrying positioning needles coordinate with multiple first hole, overlapping location one_to_one corresponding, are arranged in hole, one first overlapping location for each first carrying positioning needle.The opposite sides edge of described bearing fixture all offers and runs through first surface and the multiple of second surface penetrate groove.The plurality of groove that penetrates coordinates with the plurality of heating coil one_to_one corresponding, so that each heating coil acts on described soft or hard superimposed sheet and rivets the edge of described soft or hard superimposed sheet.

The manufacture method of a kind of Rigid Flex, including step: providing inductive thermal riveter, described inductive thermal riveter includes a carrying platform and multiple heating coil, and described carrying platform is provided with multiple platform positioning needle；Above-mentioned bearing fixture is provided；nullBy at least one rigid substrate、At least one film and multiple flexible base plate position and are superimposed on one soft or hard superimposed sheet of formation on described bearing fixture，The plurality of flexible base plate constitutes at least one flexible base plate group，Each flexible base plate group all includes the multiple flexible base plates being arranged side by side，Each flexible base plate all includes the soft board product unit at multiple interval and around the soft board scrap portion being connected to around the plurality of soft board product unit，Described rigid substrate is corresponding with described flexible base plate group，Described rigid substrate includes the hardboard product unit at multiple interval and around the hardboard scrap portion being connected to around multiple described hardboard product unit，Each hardboard product unit is all corresponding with a described soft board product unit，Described film is corresponding with described rigid substrate，Described film includes the film product unit at multiple interval and around the film scrap portion being connected to around the plurality of film product unit，Each film product unit is all corresponding with a described hardboard product unit，In described soft or hard superimposed sheet，At least one film described is between at least one rigid substrate described and at least one flexible base plate group described，Described soft or hard superimposed sheet offers multiple first hole, overlapping location，Each first overlapping location Kong Jun runs through soft board scrap portion、Hardboard scrap portion and film scrap portion，Each first carrying positioning needle of described bearing fixture is arranged in hole, one first overlapping location；Described bearing fixture is positioned the described carrying platform of described inductive thermal riveter, the each platform positioning needle making carrying platform is arranged in the hole, tool location of a bearing fixture, and it is passed through electric current in multiple heating coils, so that part film scrap portion corresponding with heating coil in soft or hard superimposed sheet softens the adjacent rigid scrap portion of bonding and soft scrap portion, thus form a soft or hard riveting substrate；Described in pressing, soft or hard riveting substrate is so that film product unit softens bond adjacent hardboard product unit and soft board product unit, thus obtains soft or hard solderless substrate；Remove in soft or hard solderless substrate and be bonded in soft board scrap portion together, hardboard scrap portion and film scrap portion, thus obtain multiple Rigid Flex being separated from each other.

First the manufacture method of the Rigid Flex using above-mentioned tool of the technical program has the advantage that, flexible base plate and rigid substrate are positioned exactly on carrying platform by bearing fixture；Secondly, rigid substrate and flexible base plate are all positioned on described bearing fixture by the multiple first carrying positioning needles on bearing fixture, are possible to prevent flexible base plate to move relative to rigid substrate, improve the pressing quality in follow-up bonding processes and pressing efficiency；Furthermore, the make efficiency of Rigid Flex can be not only increased with the multiple Rigid Flex of one-shot forming, also improves the utilization rate of rigid substrate；Finally, the heat riveting that flexible base plate and rigid substrate are produced by eddy current is integrated, and does not have rivet bits and produces, such that it is able to improve the making yield of Rigid Flex.

Accompanying drawing explanation

Fig. 1 provide for the technical program embodiment with inductive thermal riveter with the use of and for carrying the bearing fixture schematic diagram of flexible base plate.

The flexible base plate group that Fig. 2 provides for the technical program embodiment, two rigid substrates and the schematic diagram of two films.

The schematic diagram flexible base plate in Fig. 2, rigid substrate and film being superimposed on the bearing fixture shown in Fig. 1 that Fig. 3 provides for the technical program embodiment, described flexible base plate, rigid substrate and film are overlapped into a soft or hard superimposed sheet.

Fig. 4 is the schematic diagram after the carrying platform that the bearing fixture carrying flexible base plate group, rigid substrate and film in Fig. 3 is placed in the inductive thermal riveter shown in Fig. 1.

The schematic diagram of the soft or hard riveting substrate after the pressing that Fig. 5 provides for the technical program embodiment.

Fig. 6 is the schematic diagram of rigid second region for forming with the rigid substrate on the soft or hard solderless substrate that formed after the soft or hard riveting substrate in first instrument cutting pressing Fig. 5 and the border of rigid first shaping area.

Fig. 7 for the technical program embodiment provide with the rigid product unit border on the soft or hard solderless substrate shown in the second instrument cutting drawing 6, make the schematic diagram that multiple second region for forming of hardboard scrap portion, soft board scrap portion, film scrap portion and rigid substrate come off.

Main element symbol description

Bearing fixture	100
		Inductive thermal riveter	200
Soft or hard superimposed sheet	300
		Carrying platform	21
Heating coil	23
		Platform positioning needle	211
Flexible base plate group	30
		Flexible base plate	31
Fill substrate	33
		First conductive layer	301
Second conductive layer	302
		First insulating barrier	303
Soft board product unit	311
		Soft board scrap portion	313
Soft board the first shaping area	3111
		Soft board the second shaping area	3113
First hole, overlapping location	3131、3594、3731、305
		Second hole, overlapping location	331、3595、3733、307
Heat conducting element	3133、333、357
		First surface	100a
Second surface	100b
		Hole, tool location	101
Penetrate groove	103
		Protuberance	102
First carrying positioning needle	105
		Second carrying positioning needle	107
Rigid substrate	35
		Film	37
Second insulating barrier	353
		3rd conductive layer	351
Hardboard product unit	358
		Hardboard scrap portion	359
Hardboard the first shaping area	3581
		Hardboard the second shaping area	3583
Film product unit	371
		Film scrap portion	373
Film the first shaping area	3711
		Film opening	3713
Soft or hard riveting substrate	400
		Border	501、505
Hardboard cutting mouth	503
		Soft or hard solderless substrate	500
Rigid Flex	600

Following detailed description of the invention will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.

Detailed description of the invention

Below in conjunction with drawings and Examples, the manufacture method of the bearing substrate providing the technical program and the Rigid Flex using this bearing substrate is described in further detail.

Seeing also Fig. 1 to Fig. 4, the bearing fixture 100 that the technical program provides is for coordinating with inductive thermal riveter 200.Bearing fixture 100 is for one soft or hard superimposed sheet 300 of carrying, and is positioned on described inductive thermal riveter 200 by described soft or hard superimposed sheet 300.The substrate in combination that described soft or hard superimposed sheet 300 refers to flexible base plate and rigid substrate is superimposed together and is not bonded as one.

Described bearing fixture 100 is generally rectangular plate body, and it has relative first surface 100a and second surface 100b.Described bearing fixture 100 offers the hole 101, four tool location running through described first surface 100a and second surface 100b.Hole 101, described four tools location is arranged, for described bearing fixture 100 is positioned described inductive thermal riveter 200 along the marginating compartment of bearing fixture 100.The opposite sides edge that described bearing fixture 100 alongst extends respectively offers three and penetrates groove 103.Each groove 103 that penetrates all runs through described first surface 100a and second surface 100b, and each opposite sides penetrating groove 103 is each formed with a protuberance 102, thus is respectively formed four protuberances 102 at the opposite sides edge of described bearing fixture 100.In present embodiment, hole 101, described four tools location is respectively close to four limits of described bearing fixture 100, and in hole 101, described four tools location, hole 101, two tool location is respectively arranged on two protuberances 102.

The opposite sides edge that described bearing fixture 100 alongst extends also is respectively provided with four first carrying positioning needles 105.Four first carrying positioning needles 105 are for being positioned described soft or hard superimposed sheet 300 for described bearing fixture 100.Four first carrying positioning needles 105 are arranged at four protuberances 102, and each first carrying positioning needle 105 all extends to the direction away from described second surface 100b from described first surface 100a.Preferably, in present embodiment, each first carrying positioning needle 105 is located on a protuberance 102.Certainly, a protuberance 102 is also provided with two, hole 101, three or more tools location.Certainly, a protuberance 102 is also provided with two, three or more first carrying positioning needles 105.Bearing fixture 100 is additionally provided with two relative second and carries positioning needle 107.Said two second carries the positioning needle 107 two sides alongst extended respectively close to bearing fixture 100.Each second carrying positioning needle 107 is respectively positioned between four first carrying positioning needles 105 of bearing fixture 100 side, and each second carrying positioning needle 107 all extends to the direction away from described second surface 100b from described first surface 100a.

Described inductive thermal riveter 200 is for riveting the edge of described soft or hard superimposed sheet 300, and it includes a carrying platform 21, six heating coil 23 and high-frequency ac power (not shown).Described carrying platform 21 is generally rectangular shaped plate body, is used for carrying described bearing fixture 100.Described carrying platform 21 is provided with four platforms positioning needle 211.Described four platforms positioning needle 211 is respectively close to four limits of described carrying platform 21, and coordinate with hole 101, described four tools location one_to_one corresponding, so that each platform positioning needle 211 is through hole 101, a corresponding tool location, thus described bearing fixture 100 is positioned on described carrying platform 21.The opposite sides edge of described carrying platform 21 all offers three accepting grooves 210.It is corresponding that each accepting groove 210 penetrates groove 103 with one, and the orthographic projection that each accepting groove 210 is on described bearing fixture 100 falls into and penetrates accordingly in groove 103.Each heating coil 23 is all electrical connected with described high-frequency ac power, alternating magnetic field is produced at described high-frequency ac power in the case of powering, and the orthographic projection that each heating coil 23 is on described carrying platform 21 falls in corresponding accepting groove 210, so that the most magnetic lines of force in alternating magnetic field produced by each heating coil 23 are distributed in the surface of corresponding accepting groove 210, and arrive soft or hard superimposed sheet 300 through penetrating groove 103 accordingly relatively easily.In present embodiment, each heating coil 23 is contained in an accepting groove 210.Certainly, the top of carrying platform 21 can also be all located at by described six heating coils 23, as long as the orthographic projection that each heating coil 23 is on described carrying platform 21 can fall in corresponding accepting groove 210, now, the most magnetic lines of force in alternating magnetic field produced by each heating coil 23 are distributed in the surface of corresponding accepting groove 210.Certainly, described six heating coils 23 can also have the top that carrying platform 21 is located at by part heating coil, as long as the orthographic projection that each heating coil 23 is on described carrying platform 21 each falls within corresponding accepting groove 210.Certainly, the quantity of heating coil 23 can also be two, three, four, five, seven or more, should set according to actual needs.

Described soft or hard superimposed sheet 300 includes at least one flexible base plate group 30, at least one rigid substrate 35 and at least one film 37.Flexible base plate group 30 includes multiple flexible base plate 31.In the present embodiment, the both sides of the edge that rigid substrate 35 extends along its length are respectively provided with six heat conducting elements 357.Described six heat conducting elements 357 heat coil 23 one_to_one corresponding with six respectively.The sensing in the alternating magnetic field that the heating coil 23 corresponding at it produces of each heat conducting element 357 forms eddy current, to form heat.Corresponding with a heat conducting element 357 just because of each heating coil 23, and each heating coil 23 to penetrate groove 103 with one corresponding, therefore, each heating coil 23 can act on a corresponding heat conducting element 357 by a corresponding groove 103 that penetrates, so that heat conducting element 357 senses formation eddy current in the alternating magnetic field that described heating coil 23 produces and produces heat.In the present embodiment, flexible base plate group 30 includes the flexible base plate 31 that two side by side parallel are arranged, and also sets up a filling substrate 33 between two flexible base plates 31.Flexible base plate 31, fill that substrate 33 is adjacent is arranged side by side, flexible base plate 31, filling the justified margin of the length direction of edge and the rigid substrate 35 of the width of substrate 33, each flexible base plate 31 is respectively arranged with the justified margin at the edge of a length direction and the length direction of rigid substrate 35.It is to say, the length of flexible base plate 31 is less than 1/2nd of the length of rigid substrate 35 equal to the width of rigid substrate 35, the width of flexible base plate 31.

The upper and lower surface of flexible base plate 31 is respectively provided with a heat conducting element 3133 along the both sides of the edge that its width extends, and fills substrate 33 and is respectively provided with a heat conducting element 333 along the both sides of the edge that its width extends.Each heat conducting element 3133,333 is each penetrates groove 103 with one, to heat coil 23 corresponding.So that heat conducting element 3133,333 senses formation eddy current in the alternating magnetic field that described heating coil 23 produces and produces heat.So, part film 37 can be made to soften bonding flexible base plate group 30 and rigid substrate 35, thus rivet the edge of described soft or hard superimposed sheet 300.

The opposite sides of described soft or hard superimposed sheet 300 is equipped with hole 305, four first overlapping location.Each first overlapping hole 305, location and one first carrying positioning needle 105 corresponding matching, be arranged in corresponding first hole 305, overlapping location for each first carrying positioning needle 105, thus described soft or hard superimposed sheet 300 be positioned described bearing fixture 100.The opposite sides of described soft or hard superimposed sheet 300 is additionally provided with and two second carrying positioning needles 107 hole 307, two second overlapping location one to one, is arranged in corresponding second hole 307, overlapping location for each second carrying positioning needle 107.Certainly, it will be understood by those skilled in the art that the quantity in hole 101, the location of tool in described bearing fixture 100 does not limits, it is also possible to be two, three, five or more, should set according to the quantity of described platform positioning needle 211.The distributing position in hole 101, multiple described tools location does not limits, can also be distributed in the edge on the opposite sides limit that described bearing fixture 100 alongst extends, the edge along the other opposite sides limit that width extends of described bearing fixture 100 can also not have tool to position hole 101.The line in hole 101, multiple described tools location can the shape such as triangular in shape, pentagon, circle.Additionally, described bearing fixture 100 penetrates the quantity of groove 103 and offers position and do not limit, penetrate the quantity of groove 103 can also be two, three, four, five or more, should set according to the quantity of described heating coil 23, penetrate groove 103 arrange position also with heating coil 23 corresponding.Furthermore, the first carrying quantity of positioning needle 105 and offer position and do not limit in described bearing fixture 100, the quantity of the first carrying positioning needle 105 can also be two, three, five or more, should set according to actual needs.That is, according to the described first overlapping location quantity in hole 305 and offer position and set.The second carrying quantity of positioning needle 107 and offer position and do not limit.

First the bearing fixture 100 of the technical program has the advantage that, the hole 101, multiple tools location of bearing fixture 100 coordinates with multiple platform positioning needle 211 one_to_one corresponding, multiple first carrying positioning needles 105 of bearing fixture 100 coordinate with multiple first hole 3131, overlapping location one_to_one corresponding, can be positioned exactly to carrying platform 21 by soft or hard superimposed sheet 300；Secondly, the multiple of bearing fixture 100 penetrate groove 103 and multiple heating coil 23 one_to_one corresponding, accelerate magnetic field produced by heating coil 23 and arrive the speed of soft or hard superimposed sheet 300, improve eddy current in heat conducting element 357 and produce the efficiency of heat, and then improve the efficiency of riveting；Finally, the structure of bearing fixture 100 is relatively simple, easily makes, and cost is relatively low.

The manufacture method of the Rigid Flex that the technical program provides comprises the following steps:

Step one, refers to 2, it is provided that multiple flexible base plates 31, at least one rigid substrate 35 and the film 37 that at least one is corresponding with described rigid substrate 35.

Specifically, the present embodiment only illustrates as a example by providing 31, two rigid substrates 35 of two flexible base plates and two films 37.

Each flexible base plate 31 is rectangular two-sided plate, and it includes first conductive layer the 301, second conductive layer 302 and the first insulating barrier 303 between the first conductive layer 301 and the second conductive layer 302.In the present embodiment, described first conductive layer 301 and the second conductive layer 302 all have been formed with conductive pattern (not shown).

Each flexible base plate 31 is respectively provided with two soft board product units 311 with spacing and around the soft board scrap portion 313 being connected to around two soft board product units 311.The opposite sides edge of each flexible base plate 31 is equipped with at least one heat conducting element 3133.Each heat conducting element 3133 is corresponding with a heating coil 23, and in the alternating magnetic field that the heating coil 23 corresponding at it produces, sensing forms eddy current, to form heat.Described heat conducting element 3133 can be used the method as the conductive pattern making the first conductive layer 301 to be formed, such as, can be made by the method for selective etch the first conductive layer 301 while making the conductive pattern of the first conductive layer 301.In order to produce more heat, it is preferable that in present embodiment, the upper and lower surface of described soft board scrap portion 313 is equipped with heat conducting element 3133 along the both sides of the edge that its width extends, and each heat conducting element 3133 is copper mesh.Certainly, each heat conducting element 3133 can also be copper billet.

The structure of each soft board product unit 311 does not limits, and it includes at least one soft board first shaping area 3111 and at least one soft board the second shaping area 3113 being connected.In the present embodiment, the quantity of described soft board the first shaping area 3111 is two, and the quantity of soft board the second shaping area 3113 is one, and described soft board the first shaping area 3111, soft board the second shaping area 3113 are rectangle and are distributed with conductive pattern.Soft board the second shaping area 3113 is connected between two soft board the first shaping areas 3111, and boundary length L of soft board the second shaping area 3113 and soft board the first shaping area 3111 is less than or equal to length B of soft board the first shaping area 3111.

Described soft board scrap portion 313 is not distributed conductive pattern, and its both sides are provided with the hole 3131, two first overlapping location running through described flexible base plate 31.Each first overlapping hole 3131, location and one first carrying positioning needle 105 corresponding matching, it is arranged in the first hole 3131, overlapping location of correspondence for corresponding first carrying positioning needle 105, thus described flexible base plate 31 is positioned described bearing fixture 100, and then described flexible base plate 31 can be positioned described carrying platform 21.Certainly, the quantity in the first hole 3131, overlapping location of each flexible base plate 31 can also be three, four or more, should be as desired to set.Said two flexible base plate 31 is arranged side by side and is set parallel to each other, thus constitutes a flexible base plate group 30.Being appreciated that in other embodiments, each flexible base plate group 30 can include the plural flexible base plate 31 being arranged side by side.In flexible base plate group 30, two adjacent flexible base plates 31 have spacing.Preferably, in order to improve two flexible base plates 31 be superimposed on a rigid substrate 35 side by side time, the flatness of the plane residing for two flexible base plates 31, thus improve the pressing efficiency in follow-up bonding processes and pressing quality, in present embodiment, also provide for a filling substrate 33, when said two flexible base plate 31 overlaps side by side with a rigid substrate 35, to fill the space between said two flexible base plate 31.The thickness of described filling substrate 33 is equal to the thickness of described flexible base plate 31；The length of described filling substrate 33 is equal to the length of described flexible base plate 31；Described filling substrate 33 width is equal to the distance between said two flexible base plate 31.Described filling substrate 33 is further opened with running through the hole 331, two second overlapping location of described filling substrate 33, for being positioned between adjacent two flexible base plate 31 by described filling substrate 33.Just because of having filling substrate 33 between two flexible base plates 31 adjacent in present embodiment, described filling substrate 33 is further opened with hole 331, two second overlapping location, for two second carrying positioning needle 107 corresponding matching with bearing fixture 100, it is arranged in hole 331, a corresponding second overlapping location for each second carrying positioning needle 107.

In order to produce more heat, it is preferable that in present embodiment, the both sides of the edge of the upper and lower surface of described filling substrate 33 are provided with heat conducting element 333, and described heat conducting element 333 is copper mesh.Each heat conducting element 333 is corresponding with a heating coil 23, and in the alternating magnetic field that the heating coil 23 corresponding at it produces, sensing forms eddy current and produces heat.Material and the structure of described filling substrate 33 do not limit, can make by processing, cut the useless plate produced in production process, it is also possible to obtained by additive method, such as, described filling substrate 33 can be prepared by following steps: first, cuts out the double-sided copper-clad rigid substrate of reservation shape；Secondly, use method for selective etching that the layers of copper of described double-sided copper-clad rigid substrate both sides is all manufactured formation heat conducting element 333.So, obtained filling substrate 33 and be rigid substrate.It will be understood by those skilled in the art that described filling substrate 33 can also be for the flexible base plate being made up of double-sided copper-clad flexible base plate.Those skilled in the art it is also understood that, the quantity of described filling substrate 33 can also be two, three or more, determine according to the quantity of flexible base plate 31, as long as being provided with at least one between the most adjacent two flexible base plates 31 to fill substrate 33, and the thickness of described filling substrate 33 being identical with the thickness of flexible base plate 31.

It should be noted that, in the present embodiment, in order to improve the pressing efficiency in follow-up bonding processes and pressing quality, filling substrate 33 is used to fill the space between adjacent two flexible base plate 31, to improve the flatness of the plane residing for adjacent two flexible base plate 31.Certainly, it will be understood by those skilled in the art that filling substrate 33 is not essential features.Even if filling substrate 33 to omit not, i.e. there is space between said two flexible base plate 31, it is also possible to described soft or hard superimposed sheet 300 is carried out follow-up process for pressing.

Each rigid substrate 35 all includes the 3rd conductive layer the 351, second insulating barrier 353 and six heat conducting elements 357.Described 3rd conductive layer 351 is positioned at the side of described second insulating barrier 353, and described six heat conducting elements 357 are respectively positioned on the opposite side of described second insulating barrier 353.Each heat conducting element 357 is corresponding with a heating coil 23, and in the alternating magnetic field that the heating coil 23 corresponding at it produces, sensing forms eddy current and produces heat.Described 3rd conductive layer 351 can form conductive pattern, it is also possible to not yet forms conductive pattern, and until making conductive pattern again after flexible base plate 31 pressing.In present embodiment, described 3rd conductive layer 351 does not forms conductive pattern, and the side with six heat conducting elements 357 of described second insulating barrier 353 only has described six heat conducting elements 357, does not have conductive pattern, that is, described rigid substrate 35 is the single sided board not forming conductive pattern.It will be appreciated by those skilled in the art that, when described 3rd conductive layer 351 has formed conductive pattern, and the surface with six heat conducting elements 357 of described second insulating barrier 353 only has described six heat conducting elements 357, when not having conductive pattern, rigid substrate 35 for formed conductive pattern single sided board.Those skilled in the art it is also understood that, when the surface with six heat conducting elements 357 of described second insulating barrier 353 is except there being described six heat conducting elements 357, when also having conductive pattern, if described 3rd conductive layer 351 has formed conductive pattern, then, rigid substrate 35 is the dual platen that bilateral all has been formed with conductive pattern.

The structure of rigid substrate 35 is corresponding with the structure of two flexible base plates 31.That is, each rigid substrate 35 the most correspondingly has four hardboard product units 358 with spacing and around being connected to the hardboard scrap portion 359 of four hardboard product units 358, and the structure of each hardboard product unit 358 is corresponding with the structure of a soft board product unit 311.

Each hardboard product unit 358 all includes at least one hardboard first shaping area 3581 and at least one hardboard the second shaping area 3583 being connected.At least one hardboard first shaping area 3581 described is corresponding with at least one soft board first shaping area 3111 described.At least one hardboard second shaping area 3583 described is corresponding with at least one soft board second shaping area 3113 described.In present embodiment, each hardboard product unit 358 all includes two hardboard the first shaping areas 3581 and hardboard second shaping area 3583 being connected between two hardboard the first shaping areas 3581.And, the shape of hardboard the first shaping area 3581 of each hardboard product unit 358, size and the shape of soft board the first shaping area 3111 of corresponding soft board product unit 311, size are identical, and the shape of hardboard the second shaping area 3583 of each hardboard product unit 358, size and the shape of soft board the second shaping area 3113 of corresponding soft board product unit 311, size are identical.

Hardboard scrap portion 359 has eight first overlapping holes 3594, location and hole 3595, two second overlapping location.Hole 3594, eight first overlapping location coordinates with eight first carrying positioning needle 105 one_to_one corresponding, is arranged in hole 3131, a corresponding first overlapping location behind hole 3594, a corresponding first overlapping location for each first carrying positioning needle 105.Hole 3595, two second overlapping location coordinates with two second carrying positioning needle 107 one_to_one corresponding, is arranged in hole 331, a corresponding second overlapping location behind hole 3595, a corresponding second overlapping location for each second carrying positioning needle 107.

Described rigid substrate 35 can be prepared by following steps: first, it is provided that a double-sided copper-clad rigid substrate；Secondly, on described double-sided copper-clad rigid substrate, form at least two first by laser drilling process or depthkeeping machine bore process and overlap hole 3594, location and hole 3595, at least two the second overlapping location；Finally, use method for selective etching the layers of copper of described double-sided copper-clad rigid substrate side to be made and form six heat conducting elements 357.So, can acquire described rigid substrate 35, the layers of copper of described double-sided copper-clad rigid substrate opposite side is the 3rd conductive layer 351 not forming conductive pattern.Preferably, in present embodiment, the heat conducting element 357 formed is copper mesh.It will be understood by those skilled in the art that if described 3rd conductive layer 351 has been formed with conductive pattern, then can use selective etch or semi-additive process that the layers of copper of described double-sided copper-clad rigid substrate opposite side is made the 3rd conductive layer 351 with conductive pattern.

The structure of film 37 is corresponding with the structure of described rigid substrate 35.That is, each film 37 the most correspondingly has four film product units 371 with spacing and around being connected to the film scrap portion 373 of four film product units 371, and the structure of each film product unit 371 is corresponding with a hardboard product unit 358.

Each film product unit 371 all includes at least one film first shaping area 3711 and at least one film opening 3713 being connected with described film the first shaping area 3711.Each film product unit 371 all includes at least one film first shaping area 3711 corresponding with at least one hardboard first shaping area 3581 described and at least one film opening 3713 corresponding with at least one hardboard second shaping area 3583 described.In present embodiment, each film product unit 371 all includes two film the first shaping areas 3711 and a film opening 3713 being connected between two film the first shaping areas 3711.And, the shape of film the first shaping area 3711 of each film product unit 371, size and the shape of hardboard the first shaping area 3581 of corresponding hardboard product unit 358, size are identical, and the shape of film opening 3713 of each film product unit 371, size and the shape of corresponding hardboard product unit 358 hardboard the second shaping area 3583, size are identical.

Film scrap portion 373 offers eight first overlapping holes 3731, location and hole 3733, two second overlapping location.Hole 3731, eight first overlapping location coordinates with eight first carrying positioning needle 105 one_to_one corresponding, is arranged in hole 3731, a corresponding first overlapping location behind hole 3594, a corresponding first overlapping location for each first carrying positioning needle 105.Hole 3733, two second overlapping location coordinates with two second carrying positioning needle 107 one_to_one corresponding, is arranged in hole 3733, a corresponding second overlapping location behind hole 3595, a corresponding second overlapping location for each second carrying positioning needle 107.

Hardboard the first shaping area 3581, film the first shaping area 3711, soft board the first shaping area 3111 will constitute the rigid region of Rigid Flex 600 after subsequent treatment, hardboard the second shaping area 3583, film opening 3713 and soft board the second shaping area 3113 will constitute the flexible region of Rigid Flex 600 after subsequent treatment, thus, 311, film product unit 371 of a soft board product unit and a hardboard product unit 358 may together form a Rigid Flex 600 including a flexible region and two rigid regions.

Certainly, hardboard the first shaping area 3581, film the first shaping area 3711, the shape of soft board the first shaping area 3111 and hardboard the second shaping area 3583, film opening 3713, the shape of soft board the second shaping area 3113 is except being in addition to rectangle as shown in this embodiment, it can also be square, trapezoidal, circular, oval, triangle, L-shaped or other arbitrary shape, only need hardboard the first shaping area 3581, film the first shaping area 3711, the shape of soft board the first shaping area 3111 is identical with the shape of the rigid region of the Rigid Flex of design, hardboard the second shaping area 3583, film opening 3713, the shape of soft board the second shaping area 3113 is identical with the shape of the flexible region of the Rigid Flex of design.nullHardboard the first shaping area 3581、Film the first shaping area 3711、The quantity of soft board the first shaping area 3111 and hardboard the second shaping area 3583、Film opening 3713、The quantity of soft board the second shaping area 3113 except as shown in this embodiment be respectively in addition to two each and every one and one，Hardboard the first shaping area 3581、Film the first shaping area 3711、The quantity of soft board the first shaping area 3111 can also be one、Three or more than three，Hardboard the second shaping area 3583、Film opening 3713、The quantity of soft board the second shaping area 3113 can also be two or more，Only need hardboard the first shaping area 3581、Film the first shaping area 3711、The quantity of soft board the first shaping area 3111 is identical with the quantity of the rigid region of the Rigid Flex of design、Hardboard the second shaping area 3583、Film opening 3713、The quantity of soft board the second shaping area 3113 is identical with the quantity of the flexible region of the Rigid Flex of design.

It will be understood by those skilled in the art that each flexible base plate 31 can also be for single sided board or multi-layer sheet, depending on the conductive layer quantity of the flexible region between two rigid substrates adjacent on the Rigid Flex of design.Those skilled in the art it is also understood that, rigid substrate 35 can also be for forming dual platen or the multi-layer sheet of conductive pattern, the quantity of rigid substrate 35 can also be one, three or more than three, depending on the conductive layer quantity of rigid region on the Rigid Flex of design and the conductive layer quantity of flexible base plate.Described film 37 quantity can also be one, three or more than three, depending on the quantity of rigid substrate on the Rigid Flex of design and the quantity with flexible base plate.

Those skilled in the art it is also understood that, if not filling substrate 33 between adjacent two flexible base plates 31, and on rigid substrate 35 and film 37, the most all there is no the second hole 3595,3777, overlapping location, then, bearing fixture 100 is without being provided with the second carrying positioning needle 107.Certainly, if not setting the second hole 331, overlapping location on the filling substrate 33 between adjacent two flexible base plates 31, and on rigid substrate 35 and film 37, the most all there is no the second hole 3595,3777, overlapping location, then, bearing fixture 100 is without being provided with the second carrying positioning needle 107.

nullStep 2，Refer to Fig. 2 and Fig. 3，By at least one rigid substrate 35 described、At least one film 37 and multiple flexible base plate 31 position and are superimposed on described bearing fixture 100，To form a soft or hard superimposed sheet 300，Multiple flexible base plates 31 constitute at least one flexible base plate group 30，Each flexible base plate group 30 all includes the multiple flexible base plates 31 being arranged side by side，And make at least one film 37 described between at least one rigid substrate 35 described and at least one flexible base plate group 30 described，And soft board first shaping area 3111 of described flexible base plate group 30 and soft board the second shaping area 3113 correspond respectively to film the first shaping area 3711 and the film opening 3713 of the film 37 adjacent with corresponding described flexible base plate group 30，Hardboard first shaping area 3581 of described rigid substrate 35 and hardboard the second shaping area 3583 correspond respectively to film the first shaping area 3711 and the film opening 3713 of the film 37 adjacent with corresponding described rigid substrate 35.That is, in soft or hard superimposed sheet 300, film the first shaping area 3711 is between adjacent soft board the first shaping area 3111 and hardboard the first shaping area 3581, and film opening 3713 is between adjacent soft board the second shaping area 3113 and hardboard the second shaping area 3583.

It should be noted that, when forming a soft or hard superimposed sheet 300, multiple described first hole, overlapping location 3594 of described rigid substrate 35 positions hole 3731 one_to_one corresponding with multiple described first overlapping of film 37, multiple described first hole, overlapping location 3731 of described film 37 positions hole 3131 one_to_one corresponding with multiple described first overlapping of flexible base plate group 30, thus forms multiple first hole 305, overlapping location on described soft or hard superimposed sheet 300.First hole 305, overlapping location of each soft or hard superimposed sheet 300 all includes the first overlapping hole 3731, location of the first 3594, two films 37 in overlapping hole, location of two rigid substrates 35 and the first hole 3131, overlapping location of a flexible base plate 31, and hardboard scrap portion 359, film scrap portion 373 and soft board scrap portion 313 are all run through in each first hole 305, overlapping location.Multiple first holes 305, overlapping location coordinate with multiple first carrying positioning needle 105 one_to_one corresponding, and during so that soft or hard superimposed sheet 300 is superimposed on bearing fixture 100, each first carrying positioning needle 105 is arranged in hole 305, one first overlapping location.Multiple described second hole, overlapping location 3595 of described rigid substrate 35 positions hole 3733 one_to_one corresponding with multiple described second overlapping of film 37, the second hole 331, overlapping location one_to_one corresponding is stated with filling the multiple of substrate 33 in multiple described second hole, overlapping location 3733 of described film 37, thus constitute multiple second hole 307, overlapping location on described soft or hard superimposed sheet 300, and each second hole 307, overlapping location is respectively positioned between multiple first hole 305, overlapping location.Filling substrate 33, hardboard scrap portion 359 and film scrap portion 373 are all run through in second hole 307, overlapping location of each soft or hard superimposed sheet 300.Multiple second holes 307, overlapping location coordinate with multiple second carrying positioning needle 107 one_to_one corresponding, and during so that soft or hard superimposed sheet 300 is superimposed on bearing fixture 100, each second carrying positioning needle 107 is arranged in hole 307, one second overlapping location.

It will be appreciated by those skilled in the art that, if not filling substrate 33 between adjacent two flexible base plates 31, and on rigid substrate 35 and film 37, the most all do not offer the second hole 3595,3777, overlapping location, then, bearing fixture 100 is without arranging the second carrying positioning needle 107, and soft or hard superimposed sheet 300 does not has the second hole 307, overlapping location yet.Certainly, if not setting the second hole 331, overlapping location on the filling substrate 33 between adjacent two flexible base plates 31, and on rigid substrate 35 and film 37, the most all do not offer the second hole 3595,3777, overlapping location, then, bearing fixture 100 is without arranging the second carrying positioning needle 107, and soft or hard superimposed sheet 300 does not has the second hole 307, overlapping location yet.

Specifically, in present embodiment, see also Fig. 2 and Fig. 3,35, filling substrate of two rigid substrates, 37, two flexible base plates 31 of 33, two films are positioned and are superimposed on described bearing fixture 100, to form a soft or hard superimposed sheet 300 being carried on described bearing fixture 100, two flexible base plates 31 constitute a flexible base plate group 30, and described flexible base plate group 30 includes two flexible base plates 31 being arranged side by side.Soft board first shaping area 3111 of described flexible base plate group 30 and soft board the second shaping area 3113 correspond respectively to film the first shaping area 3711 and the film opening 3713 of the film 37 adjacent with described flexible base plate group 30.Described filling substrate 33 is located between adjacent two flexible base plate 31, to fill the space between adjacent two flexible base plate 31.nullHardboard first shaping area 3581 of described rigid substrate 35 and hardboard the second shaping area 3583 correspond respectively to film the first shaping area 3711 and the film opening 3713 of the film 37 adjacent with corresponding described rigid substrate 35，So that two rigid substrates 35、Two films 37 and flexible base plate group 30 location are superimposed on described bearing fixture 100 and through processing (such as pressing further、Make circuit、Anti-welding、Cuttings etc. process) after，Hardboard first shaping area 3581 of rigid substrate 35、Film first shaping area 3711 of film 37 and soft board first shaping area 3111 of flexible base plate group 30 constitute the rigid region of Rigid Flex 600 together，And make hardboard second shaping area 3583 of rigid substrate 35、The flexible region of Rigid Flex 600 is may make up after further treatment after the film opening 3713 of film 37 and location, soft board the second shaping area 3113 overlapping of flexible base plate group 30.

Certainly, the number of described flexible base plate group 30 can also be two, and three or more, depending on the conductive layer quantity of flexible region on the Rigid Flex of design.Certainly, described flexible base plate group 30 can include three, four or more flexible base plate 31, the quantity of the soft board product unit 311 included by each flexible base plate 31 can also be one, three, four or more, should set according to the number of Rigid Flex 600 to be obtained.Correspondingly, the number filling substrate 33 can also be two, three or more, as long as there being at least one to fill substrate 33 between the most adjacent two flexible base plates 31.

Rigid substrate 35 and flexible base plate group 30 are positioned and are superimposed on described bearing fixture 100, during to form a soft or hard superimposed sheet 300, rigid substrate 35 should be made to be positioned at flexible base plate group 30 one or both sides, thus after overlapping and rivet flexible base plate group 30 and rigid substrate 35, available rigid substrate 35 is positioned at outermost soft or hard riveting substrate, in order to the follow-up rigid substrate 35 riveted soft or hard on substrate is for further processing.Such as, when providing a rigid substrate and multiple flexible base plate group, first this rigid substrate can be superimposed on described bearing fixture, the most multiple flexible base plate groups are superimposed on described rigid substrate successively, or first all of multiple flexible base plate groups are superimposed on described bearing fixture successively, more described rigid substrate are superimposed in these all of multiple flexible base plate groups；When providing multiple rigid substrates and a flexible base plate group, first the plurality of rigid substrate can be superimposed on described bearing fixture, the most again this flexible base plate group is superimposed on the plurality of rigid substrate, or first at least one rigid substrate is superimposed on described tool, the most again this flexible base plate group is superimposed on this at least one rigid substrate, finally remaining rigid substrate is superimposed in this flexible base plate group successively；When providing multiple rigid substrates and multiple flexible base plate group, first multiple rigid substrates can be superimposed on described bearing fixture, the most the plurality of flexible base plate group is superimposed on the plurality of rigid substrate successively, or first at least one rigid substrate is superimposed on described bearing fixture, the most the plurality of flexible base plate group is superimposed on this at least one rigid substrate successively, finally remaining rigid substrate is superimposed in the plurality of flexible base plate group successively.It is of course also possible to after multiple flexible base plate groups being arranged in order are pressed into a flexible substrate, then rigid substrate is superimposed on flexible substrate one or both sides.

Step 3, see also Fig. 1 and 4, the bearing fixture 100 carrying soft or hard superimposed sheet 300 is placed on described carrying platform 21, the four platforms positioning needle 211 making described carrying platform 21 is each passed through the hole 101, four tool location of described bearing fixture 100, thus a heating coil 23, penetrates groove 103, and is on the same straight line being perpendicular to described carrying platform 21 near 357, heat conducting element 3133 of heat conducting element and the heat conducting element 357 away from bearing fixture 100 of bearing fixture 100.

Step 4, refers to Fig. 5, opens the high-frequency ac power of described inductive thermal riveter 200, to power each heating coil 23.The heating coil 23 being connected with alternating current produces an alternating magnetic field, and alternating magnetic field senses formation eddy current in the heat conducting element 357 corresponding with described heating coil 23 and heat conducting element 3133 and produces heat.Heat on neighbouring heat conducting element 357 and heat conducting element 3133 will be located between neighbouring heat conducting element 357 and heat conducting element 3133 and corresponding with corresponding heat conducting element 357 part film scrap portion 373 and softens, with adjacent hardboard scrap portion 359 and the soft board scrap portion 313 of boning, thus be integrated the edge riveted of soft or hard superimposed sheet 300 to form a soft or hard riveting substrate 400, i.e., rigid substrate 35, film 37 and flexible base plate group 30 scrap portion riveted are integrated, to form a soft or hard riveting substrate 400.

Step 5, refers to Fig. 6, soft or hard riveting substrate 400 described in pressing, so that film product unit 371 softens and the hardboard product unit 358 that bonds adjacent and soft board product unit 311, thus obtains soft or hard solderless substrate 500.In present embodiment, after soft or hard riveting substrate 400 described in hot-press arrangement pressing, first conductive layer the 301, second conductive layer 302 of flexible base plate 31 constitutes the internal electrically conductive layer of soft or hard riveting substrate 400, and the 3rd conductive layer 351 of two rigid substrates 35 constitutes the outer conductive layers of soft or hard riveting substrate 400.

Owing to the 3rd conductive layer 351 of rigid substrate 35 not yet forms conductive pattern, therefore, after riveting substrate 400 pressing of described soft or hard, also need to carry out a step that the 3rd conductive layer 351 is formed conductive pattern.General; image transfer method can be first passed through make on the 3rd conductive layer 351, to form the photoresist layer with conductive pattern shape; the 3rd conductive layer 351 etching off will do not protected by photoresist layer by laser-etching process or chemical method for etching again, so that the 3rd conductive layer 351 is formed with conductive pattern.

Step 6, see also Fig. 5 and Fig. 6, with the border 501 of hardboard the second shaping area 3583 on the first instrument cutting soft or hard solderless substrate 500 with hardboard the first shaping area 3581, thus the boundary of hardboard second shaping area 3583 of the rigid substrate 35 on soft or hard solderless substrate 500 and hardboard the first shaping area 3581 forms hardboard cutting mouth 503.

With first instrument cutting hardboard the second shaping area 3583 and the method on the border 501 of hardboard the first shaping area 3581 can as cut, milling cutter blind drag for, punching pin stamping-out etc., it is only necessary to form hardboard cutting mouth 503 and do not damage multiple soft boards second shaping area 3113 of two flexible base plates 31.

Step 7, see also Fig. 6 and Fig. 7, the method using the border 505 of hardboard product unit 358 along soft or hard solderless substrate 500 to cut soft or hard solderless substrate 500 is removed in soft or hard solderless substrate 500 and is bonded in soft board scrap portion 313 together, hardboard scrap portion 359, film scrap portion 373, thus obtain eight product units being separated from each other, each product unit includes film product unit 371, hardboard product unit 358 and the soft board product unit 311 being bonded together, that is, eight Rigid Flexs being separated from each other 600 are obtained.

It should be noted that, owing to adjacent rigid substrate 35 is corresponding with film 37, adjacent film 37 is corresponding with flexible base plate group 30, therefore, the border of the hardboard product unit 358 of rigid substrate 35, the overlapping margins of the soft board product unit 311 on the border of the film product unit 371 of film 37 and flexible base plate group 30, therefore, when along soft or hard solderless substrate 500, soft or hard solderless substrate 500 is cut on the border 505 of hardboard product unit 358, as long as controlling the depth of cut the most removable soft or hard solderless substrate 500 of cutter is bonded in soft board scrap portion 313 together, hardboard scrap portion 359, film scrap portion 373 and multiple hardboard the second shaping area 3583.

In present embodiment, milling cutter or other border 505 being easy to cut cutter hardboard product unit 358 along soft or hard solderless substrate 500 of rigid base material is used to cut soft or hard solderless substrate 500, soft board scrap portion 313, hardboard scrap portion 359, film scrap portion 373 and multiple hardboard the second shaping area 3583 being bonded in soft or hard solderless substrate 500 together is cut come off simultaneously, thus obtains multiple Rigid Flex 600 being separated from each other.

Those skilled in the art it is also understood that, the quantity of the flexible base plate 31 in flexible base plate group 30 can also be one, three or more than three, the quantity of the soft board product unit 311 of each flexible base plate 31 in flexible base plate group 30 can also be one, three or more than three, determines according to the quantity of the Rigid Flex that need to design.The quantity of the film product unit 371 of the quantity of the hardboard product unit 358 of one described rigid substrate 35 and a described film 37 can also be one, nine or more than nine, as long as its quantity is equal to the product of the quantity of flexible base plate 31 being in same flexible base plate group 30 with the quantity of the soft board product unit 311 of the flexible base plate 31 being in same flexible base plate group 30.That is, if one or more hardboard product units 358 of described rigid substrate 35 and one or more soft board product unit 311 one_to_one corresponding being in same flexible base plate group 30, one or more film product unit 371 of described film 37 and one or more soft board product unit 311 one_to_one corresponding being in same flexible base plate group 30, such that it is able to form multiple soft or hard including 358, film product unit 371 of a hardboard product unit and a soft board product unit 311 to combine monomer.

nullCan be drawn from above，When the manufacture method of the Rigid Flex using the technical program to provide makes MN Rigid Flex, (M is the natural number more than or equal to 2，N is the natural number more than or equal to 1) time，As long as the quantity of the flexible base plate of described flexible base plate group is M，The quantity of the soft board product unit on each flexible base plate is N number of，The quantity of the film product unit in the quantity of the hardboard product unit on each rigid substrate and each film is all identical (i.e. with the quantity of the soft board product unit of described flexible base plate group，The quantity of the film product unit in the quantity of the hardboard product unit on described rigid substrate and described film is MN)，And the shape of a hardboard product unit and a soft board product unit shape one_to_one corresponding，The shape of one film product unit and the shape one_to_one corresponding of a soft board product unit，Again through overlapping、Riveted、Pressing、Cutting step，MN Rigid Flex can be obtained.

First the manufacture method of the Rigid Flex of the technical program has the advantage that, flexible base plate and rigid substrate are positioned on carrying platform by bearing fixture more accurately；Secondly, the multiple first carrying positioning needles on bearing fixture sequentially pass through hardboard hole, location and hole, overlapping location, are possible to prevent flexible base plate to move relative to rigid substrate, improve the pressing quality in follow-up bonding processes and pressing efficiency；Then, with the first instrument and the flexible region of the second instrument molding Rigid Flex and rigid region, thus the flexible region of Rigid Flex and rigid region can be made to be respectively provided with preferable molding effect, not produce burr and deformation；Furthermore, the make efficiency of Rigid Flex can be not only increased with the multiple Rigid Flex of one-shot forming, also improves the utilization rate of rigid substrate；Finally, the heat riveting that flexible base plate and rigid substrate are produced by eddy current is integrated, and does not have rivet bits and produces, such that it is able to improve the making yield of Rigid Flex.

It is understood that for the person of ordinary skill of the art, can conceive according to the technology of the present invention and make other various corresponding changes and deformation, and all these change all should belong to the protection domain of the claims in the present invention with deformation.

Claims

null1. a bearing fixture，The soft or hard superimposed sheet in multiple first hole, overlapping location it is provided with for carrying，And described soft or hard superimposed sheet is positioned on inductive thermal riveter，Described inductive thermal riveter includes a carrying platform and multiple heating coil being located at carrying platform opposite sides，Described carrying platform is provided with multiple platform positioning needle，Described bearing fixture has relative first surface and second surface，Described bearing fixture offers the hole, multiple tools location running through described first surface and second surface，Hole, multiple described tools location coordinates with multiple platform positioning needle one_to_one corresponding，It is arranged in hole, a tool location for each platform positioning needle，The opposite sides edge of the first surface of described bearing fixture is provided with multiple first carrying positioning needle，Each first carrying positioning needle all extends to the direction away from described second surface from described first surface，Multiple first carrying positioning needles coordinate with multiple first hole, overlapping location one_to_one corresponding，It is arranged in hole, one first overlapping location for each first carrying positioning needle，The opposite sides edge of described bearing fixture all offers and runs through first surface and the multiple of second surface penetrate groove，The plurality of groove that penetrates coordinates with the plurality of heating coil one_to_one corresponding，So that each heating coil acts on described soft or hard superimposed sheet and rivets the edge of described soft or hard superimposed sheet.
2. bearing fixture as claimed in claim 1, it is characterized in that, described Rigid Flex is provided with multiple second hole, overlapping location, described bearing fixture also includes multiple second overlapping positioning needle, each second overlapping positioning needle is respectively positioned between multiple first overlapping positioning needle, the plurality of second overlapping positioning needle coordinates with multiple second hole, overlapping location one_to_one corresponding, so that each second overlapping positioning needle is arranged in hole, one second overlapping location.
3. bearing fixture as claimed in claim 1, it is characterized in that, the opposite sides penetrating groove described in each is each formed with a protuberance, thus it is respectively formed multiple protuberance at the opposite sides edge of described bearing fixture, the plurality of first carrying positioning needle is arranged at the plurality of protuberance, and in hole, the plurality of tool location, at least partly hole, tool location is arranged at the plurality of protuberance.
4. bearing fixture as claimed in claim 3, it is characterised in that each protuberance is equipped with a described first carrying positioning needle.
5. bearing fixture as claimed in claim 3, it is characterised in that hole, the plurality of described tool location is arranged along the marginating compartment of bearing fixture.
6. a manufacture method for Rigid Flex, including step:

Thering is provided inductive thermal riveter, described inductive thermal riveter includes a carrying platform and multiple heating coil, and described carrying platform is provided with multiple platform positioning needle；

Bearing fixture as claimed in claim 1 is provided；

nullBy at least one rigid substrate、At least one film and multiple flexible base plate position and are superimposed on one soft or hard superimposed sheet of formation on described bearing fixture，The plurality of flexible base plate constitutes at least one flexible base plate group，Each flexible base plate group all includes the multiple flexible base plates being arranged side by side，Each flexible base plate all includes the soft board product unit at multiple interval and around the soft board scrap portion being connected to around the plurality of soft board product unit，Described rigid substrate is corresponding with described flexible base plate group，Described rigid substrate includes the hardboard product unit at multiple interval and around the hardboard scrap portion being connected to around multiple described hardboard product unit，Each hardboard product unit is all corresponding with a described soft board product unit，Described film is corresponding with described rigid substrate，Described film includes the film product unit at multiple interval and around the film scrap portion being connected to around the plurality of film product unit，Each film product unit is all corresponding with a described hardboard product unit，In described soft or hard superimposed sheet，At least one film described is between at least one rigid substrate described and at least one flexible base plate group described，Described soft or hard superimposed sheet offers multiple first hole, overlapping location，Each first overlapping location Kong Jun runs through soft board scrap portion、Hardboard scrap portion and film scrap portion，Each first carrying positioning needle of described bearing fixture is arranged in hole, one first overlapping location；

Described bearing fixture is positioned the described carrying platform of described inductive thermal riveter, the each platform positioning needle making described carrying platform is arranged in the hole, a tool location of described bearing fixture, and it is passed through electric current in multiple heating coils, so that part film scrap portion corresponding with heating coil in described soft or hard superimposed sheet softens the adjacent rigid scrap portion of bonding and soft scrap portion, thus form a soft or hard riveting substrate；

Described in pressing, soft or hard riveting substrate is so that film product unit softens bond adjacent hardboard product unit and soft board product unit, thus obtains soft or hard solderless substrate；

Remove in soft or hard solderless substrate and be bonded in soft board scrap portion together, hardboard scrap portion and film scrap portion, thus obtain multiple Rigid Flex being separated from each other.
7. the manufacture method of Rigid Flex as claimed in claim 6, it is characterized in that, the opposite sides edge of described soft or hard superimposed sheet is additionally provided with multiple heat conducting element, the plurality of heat conducting element penetrates groove with the plurality of, the plurality of heating coil one_to_one corresponding coordinates, so that each heating coil acts on a corresponding heat conducting element by a corresponding groove that penetrates, so that heat conducting element senses formation eddy current in the electromagnetic field that described heating coil produces and produces heat, and then rivet the edge of described soft or hard superimposed sheet.
8. the manufacture method of Rigid Flex as claimed in claim 7, it is characterized in that, in described soft or hard superimposed sheet, the opposite sides edge of each flexible base plate is provided with at least one copper mesh and is each provided with multiple copper mesh as heat conducting element as heat conducting element, the opposite sides edge of each rigid substrate.
9. the manufacture method of Rigid Flex as claimed in claim 6, it is characterized in that, when at least one rigid substrate, at least one film and multiple flexible base plate are positioned and are superimposed on one soft or hard superimposed sheet of formation on described bearing fixture, also arranging a filling substrate between the most adjacent two flexible base plates of at least one flexible base plate group described, the thickness of described filling substrate is identical with the thickness of flexible base plate.
10. the manufacture method of Rigid Flex as claimed in claim 9, it is characterized in that, described Rigid Flex is further opened with multiple second hole, overlapping location, each second overlapping location Kong Jun runs through filling substrate, hardboard scrap portion and film scrap portion, described bearing fixture also includes multiple second overlapping positioning needle, each second overlapping positioning needle is respectively positioned between multiple first overlapping positioning needle, multiple second overlapping positioning needles coordinate with multiple second hole, overlapping location one_to_one corresponding, during so that soft or hard superimposed sheet is superimposed on bearing fixture, each second overlapping positioning needle is arranged in hole, one second overlapping location.
The manufacture method of 11. Rigid Flexs as claimed in claim 9, it is characterized in that, in described soft or hard superimposed sheet, the opposite sides edge of each flexible base plate is provided with at least one copper mesh as heat conducting element, the opposite sides edge of each rigid substrate is each provided with multiple copper mesh and is provided with at least one copper mesh as heat conducting element as heat conducting element, the opposite sides edge of described filling substrate.
nullThe manufacture method of 12. Rigid Flexs as claimed in claim 6，It is characterized in that，Each soft board product unit all includes at least one soft board first shaping area and at least one soft board second shaping area being connected，Each hardboard product unit all includes at least one hardboard first shaping area and at least one hardboard second shaping area being connected，At least one hardboard first shaping area described is corresponding with at least one soft board first shaping area described，At least one hardboard second shaping area described is corresponding with at least one soft board second shaping area described，Each film product unit all includes at least one film first shaping area corresponding with at least one hardboard second shaping area described and at least one film opening corresponding with at least one hardboard second shaping area described，In soft or hard superimposed sheet，Film the first shaping area is between adjacent soft board the first shaping area and hardboard the first shaping area，Film opening is between adjacent soft board the second shaping area and hardboard the second shaping area；After pressing obtains soft or hard solderless substrate, also include cutting hardboard the first shaping area and the border of hardboard the second shaping area in soft or hard solderless substrate, to form the step of hardboard cutting mouth in rigid substrate；Hardboard product unit along soft or hard solderless substrate is used to remove soft board scrap portion, hardboard scrap portion and film scrap portion together with being bonded in soft or hard solderless substrate with the method for the cutting soft or hard solderless substrate that has a common boundary of hardboard scrap portion.
The manufacture method of 13. Rigid Flexs as claimed in claim 6, it is characterized in that, when overlapping a rigid substrate with multiple flexible base plate group, multiple flexible base plate groups are arranged in order, and this rigid substrate is superimposed on the side of the plurality of flexible base plate being arranged in order.
The manufacture method of 14. Rigid Flexs as claimed in claim 6, it is characterized in that, when overlapping multiple rigid substrate with multiple flexible base plate group, multiple flexible base plate groups are arranged in order, and multiple rigid substrates are superimposed on both sides or the side of the plurality of flexible base plate group being arranged in order.
The manufacture method of 15. Rigid Flexs as described in claim 13 or 14, it is characterized in that, after multiple flexible base plate groups are arranged in order, first multiple flexible base plate groups being arranged in order are overlapped into a flexible substrate, then rigid substrate is superimposed on flexible substrate one or both sides.
The manufacture method of 16. Rigid Flexs as claimed in claim 6, it is characterised in that when overlapping multiple rigid substrate and a flexible base plate group, is superimposed on this flexible base plate group between the plurality of rigid substrate or the plurality of rigid substrate side.
The manufacture method of 17. Rigid Flexs as claimed in claim 6, it is characterized in that, described flexible base plate is to have formed the single sided board of conductive pattern, dual platen or multi-layer sheet, and described rigid substrate is not form the single sided board of conductive pattern, form the single sided board of conductive pattern, form the dual platen of conductive pattern or formed the multi-layer sheet of conductive pattern.