CN103503140A - 绝缘体上硅芯片上的独立电压控制的硅区域 - Google Patents
绝缘体上硅芯片上的独立电压控制的硅区域 Download PDFInfo
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- CN103503140A CN103503140A CN201280019453.8A CN201280019453A CN103503140A CN 103503140 A CN103503140 A CN 103503140A CN 201280019453 A CN201280019453 A CN 201280019453A CN 103503140 A CN103503140 A CN 103503140A
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- Prior art keywords
- silicon area
- independent voltage
- semiconductor chip
- injection region
- silicon
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 62
- 239000010703 silicon Substances 0.000 title claims abstract description 62
- 239000012212 insulator Substances 0.000 title description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 57
- 239000004065 semiconductor Substances 0.000 claims abstract description 28
- 238000002955 isolation Methods 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 238000002347 injection Methods 0.000 claims description 30
- 239000007924 injection Substances 0.000 claims description 30
- 239000004020 conductor Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 7
- 229910052796 boron Inorganic materials 0.000 claims description 7
- 239000003990 capacitor Substances 0.000 abstract description 28
- 230000005669 field effect Effects 0.000 abstract description 7
- 239000007943 implant Substances 0.000 abstract 2
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000005684 electric field Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 210000000746 body region Anatomy 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
- H01L21/26513—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors of electrically active species
- H01L21/2652—Through-implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
- H01L21/76267—Vertical isolation by silicon implanted buried insulating layers, e.g. oxide layers, i.e. SIMOX techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
- H01L21/7627—Vertical isolation by full isolation by porous oxide silicon, i.e. FIPOS techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
- H01L21/76283—Lateral isolation by refilling of trenches with dielectric material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/107—Substrate region of field-effect devices
- H01L29/1075—Substrate region of field-effect devices of field-effect transistors
- H01L29/1079—Substrate region of field-effect devices of field-effect transistors with insulated gate
- H01L29/1087—Substrate region of field-effect devices of field-effect transistors with insulated gate characterised by the contact structure of the substrate region, e.g. for controlling or preventing bipolar effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/37—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor being at least partially in a trench in the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- High Energy & Nuclear Physics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Ceramic Engineering (AREA)
- Element Separation (AREA)
- Semiconductor Memories (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
Description
Claims (7)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/091,275 US8816470B2 (en) | 2011-04-21 | 2011-04-21 | Independently voltage controlled volume of silicon on a silicon on insulator chip |
US13/091,275 | 2011-04-21 | ||
PCT/US2012/028987 WO2012145097A2 (en) | 2011-04-21 | 2012-03-14 | Independently voltage controlled volume of silicon on a silicon on insulator chip |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103503140A true CN103503140A (zh) | 2014-01-08 |
CN103503140B CN103503140B (zh) | 2016-05-18 |
Family
ID=47020650
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201280019453.8A Expired - Fee Related CN103503140B (zh) | 2011-04-21 | 2012-03-14 | 绝缘体上硅芯片上的独立电压控制的硅区域 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8816470B2 (zh) |
CN (1) | CN103503140B (zh) |
DE (1) | DE112012001195B4 (zh) |
GB (1) | GB2502480B (zh) |
WO (1) | WO2012145097A2 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105489609A (zh) * | 2014-10-03 | 2016-04-13 | 瑞萨电子株式会社 | 半导体器件 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9716036B2 (en) | 2015-06-08 | 2017-07-25 | Globalfoundries Inc. | Electronic device including moat power metallization in trench |
TWI681502B (zh) * | 2015-09-21 | 2020-01-01 | 美商格羅方德半導體公司 | 接觸soi基板 |
FR3057393A1 (fr) * | 2016-10-11 | 2018-04-13 | Stmicroelectronics (Rousset) Sas | Circuit integre avec condensateur de decouplage dans une structure de type triple caisson |
US9929148B1 (en) * | 2017-02-22 | 2018-03-27 | Globalfoundries Inc. | Semiconductor device including buried capacitive structures and a method of forming the same |
FR3070534A1 (fr) | 2017-08-28 | 2019-03-01 | Stmicroelectronics (Rousset) Sas | Procede de fabrication d'elements capacitifs dans des tranchees |
FR3070535A1 (fr) | 2017-08-28 | 2019-03-01 | Stmicroelectronics (Crolles 2) Sas | Circuit integre avec element capacitif a structure verticale, et son procede de fabrication |
US11621222B2 (en) | 2018-01-09 | 2023-04-04 | Stmicroelectronics (Rousset) Sas | Integrated filler capacitor cell device and corresponding manufacturing method |
FR3076660B1 (fr) | 2018-01-09 | 2020-02-07 | Stmicroelectronics (Rousset) Sas | Dispositif integre de cellule capacitive de remplissage et procede de fabrication correspondant |
US11004785B2 (en) | 2019-08-21 | 2021-05-11 | Stmicroelectronics (Rousset) Sas | Co-integrated vertically structured capacitive element and fabrication process |
US11183452B1 (en) * | 2020-08-12 | 2021-11-23 | Infineon Technologies Austria Ag | Transfering informations across a high voltage gap using capacitive coupling with DTI integrated in silicon technology |
Citations (3)
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US20010026990A1 (en) * | 2000-01-05 | 2001-10-04 | International Business Machines Corporation | Method and semiconductor structure for implementing dual plane body contacts for silicon-on-insulator (SOI) transistors |
US20030094654A1 (en) * | 2001-11-21 | 2003-05-22 | International Business Machines Corporation | Method and semiconductor structure for implementing buried dual rail power distribution and integrated decoupling capacitance for silicon on insulator (SOI) devices |
US20040248363A1 (en) * | 2003-06-09 | 2004-12-09 | International Business Machines Corporation | Soi trench capacitor cell incorporating a low-leakage floating body array transistor |
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US6330648B1 (en) | 1996-05-28 | 2001-12-11 | Mark L. Wambach | Computer memory with anti-virus and anti-overwrite protection apparatus |
US6260172B1 (en) | 1997-09-05 | 2001-07-10 | Nippon Steel Corporation | Semiconductor device with logic rewriting and security protection function |
US6087690A (en) | 1998-10-13 | 2000-07-11 | Worldwide Semiconductor Manufacturing Corporation | Single polysilicon DRAM cell with current gain |
JP3437132B2 (ja) | 1999-09-14 | 2003-08-18 | シャープ株式会社 | 半導体装置 |
JP3526446B2 (ja) | 2000-06-09 | 2004-05-17 | 株式会社東芝 | フューズプログラム回路 |
US6429477B1 (en) | 2000-10-31 | 2002-08-06 | International Business Machines Corporation | Shared body and diffusion contact structure and method for fabricating same |
US6498057B1 (en) * | 2002-03-07 | 2002-12-24 | International Business Machines Corporation | Method for implementing SOI transistor source connections using buried dual rail distribution |
JP2003296680A (ja) | 2002-03-29 | 2003-10-17 | Hitachi Ltd | データ処理装置 |
US7129142B2 (en) * | 2002-06-11 | 2006-10-31 | Advanced Micro Devices, Inc. | Method of forming doped regions in the bulk substrate of an SOI substrate to control the operational characteristics of transistors formed thereabove, and an integrated circuit device comprising same |
US7825488B2 (en) * | 2006-05-31 | 2010-11-02 | Advanced Analogic Technologies, Inc. | Isolation structures for integrated circuits and modular methods of forming the same |
JP4497874B2 (ja) | 2002-12-13 | 2010-07-07 | 株式会社ルネサステクノロジ | 半導体集積回路及びicカード |
US6821857B1 (en) | 2003-06-10 | 2004-11-23 | International Business Machines Corporation | High on-current device for high performance embedded DRAM (eDRAM) and method of forming the same |
JP3781740B2 (ja) | 2003-07-07 | 2006-05-31 | 沖電気工業株式会社 | 半導体集積回路、半導体装置および半導体装置の製造方法 |
JP4221274B2 (ja) | 2003-10-31 | 2009-02-12 | 株式会社東芝 | 半導体集積回路および電源電圧・基板バイアス制御回路 |
JP4106033B2 (ja) | 2004-02-04 | 2008-06-25 | 株式会社ルネサステクノロジ | 半導体集積回路装置 |
US7129745B2 (en) | 2004-05-19 | 2006-10-31 | Altera Corporation | Apparatus and methods for adjusting performance of integrated circuits |
US20060175659A1 (en) | 2005-02-07 | 2006-08-10 | International Business Machines Corporation | A cmos structure for body ties in ultra-thin soi (utsoi) substrates |
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-
2011
- 2011-04-21 US US13/091,275 patent/US8816470B2/en not_active Expired - Fee Related
-
2012
- 2012-03-14 CN CN201280019453.8A patent/CN103503140B/zh not_active Expired - Fee Related
- 2012-03-14 GB GB1315408.3A patent/GB2502480B/en not_active Expired - Fee Related
- 2012-03-14 DE DE112012001195.3T patent/DE112012001195B4/de active Active
- 2012-03-14 WO PCT/US2012/028987 patent/WO2012145097A2/en active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010026990A1 (en) * | 2000-01-05 | 2001-10-04 | International Business Machines Corporation | Method and semiconductor structure for implementing dual plane body contacts for silicon-on-insulator (SOI) transistors |
US20030094654A1 (en) * | 2001-11-21 | 2003-05-22 | International Business Machines Corporation | Method and semiconductor structure for implementing buried dual rail power distribution and integrated decoupling capacitance for silicon on insulator (SOI) devices |
US20040248363A1 (en) * | 2003-06-09 | 2004-12-09 | International Business Machines Corporation | Soi trench capacitor cell incorporating a low-leakage floating body array transistor |
Non-Patent Citations (1)
Title |
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NEAMEN: "《Semiconductor Physics and Devices》", 31 December 2003 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105489609A (zh) * | 2014-10-03 | 2016-04-13 | 瑞萨电子株式会社 | 半导体器件 |
Also Published As
Publication number | Publication date |
---|---|
GB2502480B (en) | 2014-04-30 |
GB2502480A (en) | 2013-11-27 |
US8816470B2 (en) | 2014-08-26 |
DE112012001195B4 (de) | 2021-01-28 |
DE112012001195T5 (de) | 2013-12-12 |
WO2012145097A3 (en) | 2012-12-27 |
CN103503140B (zh) | 2016-05-18 |
WO2012145097A2 (en) | 2012-10-26 |
US20120267752A1 (en) | 2012-10-25 |
GB201315408D0 (en) | 2013-10-16 |
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Effective date of registration: 20171116 Address after: Grand Cayman, Cayman Islands Patentee after: GLOBALFOUNDRIES INC. Address before: American New York Patentee before: Core USA second LLC Effective date of registration: 20171116 Address after: American New York Patentee after: Core USA second LLC Address before: New York grams of Armand Patentee before: International Business Machines Corp. |
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