CN103501975A - Method for fixing a single-crystal workpiece to be treated on a processing device - Google Patents
Method for fixing a single-crystal workpiece to be treated on a processing device Download PDFInfo
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- CN103501975A CN103501975A CN201280021612.8A CN201280021612A CN103501975A CN 103501975 A CN103501975 A CN 103501975A CN 201280021612 A CN201280021612 A CN 201280021612A CN 103501975 A CN103501975 A CN 103501975A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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- Mechanical Treatment Of Semiconductor (AREA)
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Abstract
The invention relates to a method for fixing a single-crystal workpiece (1 ) on a holding means (2), the holding means (2) comprising a mounting surface (4) for mounting the holding means (2) on a processing device (6); wherein the method comprising the steps of: - measuring the crystal orientation of said single-crystal workpiece (1 ) with respect to a workpiece surface (5), - forming, in dependence of the crystal orientation of said single-crystal workpiece (1) with respect to said workpiece surface (5), on the holding means (2) a holding surface (3) for abuttingly receiving said workpiece surface (5), thereby defining the crystal orientation of the single-crystal workpiece (1) with respect to the mounting surface (4) of the holding means (2), and - gluing said workpiece surface (5) to said holding surface (3).
Description
Technical field
The present invention relates to a kind of the monocrystalline workpiece is fixed to the method on clamping device, clamping device comprises installed surface, this installed surface is for example, for being arranged on process equipment (cutting equipment) by clamping device, so that the monocrystalline workpiece can be accurately processed in described process equipment.
Background technology
The invention particularly relates to for the sliced crystal material sapphire crystal for example, crystal that comprises silicon or boron etc.On wafer technique, monocrystalline workpiece (normally ingot, crystal ingot or core) is cut into thin slice for further processing.
After sapphire crystal forms, can there is a crystal ingot: the monocrystal ingot produced by synthesis mode.The crystallographic direction of crystal ingot is determined by X-ray diffraction.Once the outer surface crystallographic direction of crystal ingot and 3D model form, just with the crystallographic direction with definite, consistent direction gets out from the crystal ingot with core drill core (cylinder).After boring is processed, core is polished or is polished.Unfortunately, the true angle of the machinery of core (how much) axle and crystal axis direction is not in error range.
When with scroll saw sliced crystal material, the angle between the plane of cutting plane and crystal structure is very important and crucial parameter.Select wrong direction and may cause sawline to be pushed on one side, and then cause curvilinear cut.In particular for the epitaxially grown sapphire of silicon, cutting plane must be very flat.Found that, optimal cutting is cut to 0.2 ° 0 ° of the angle of deviation on the A-plane of 0 ° to 0.35 ° of the angle of deviation on the M-plane of sapphire crystal and sapphire crystal.
Sapphire is that a kind of chemical formula is AL
20
3the crystalline material of (being alundum (Al2O3) or aluminium oxide).Along (must be fully not parallel) C-plane cutting sapphire, can be formed for producing the epitaxial growth of the material of LED.
Core is glued on clamping device, and also referred to as sacrificial plate, this is also to glue together with support disc.In cutting process, general is positioned such that: crystal under, clamping device is upper.In cutting process, sawline is crooked as bow.This means, last at cutting process, sacrificial plate is cut by sawline, thus it be named as sacrificial plate.So the clamping device of grip block form can only use once.
As mentioned above, one of sapphire application is in epitaxial growth, especially for the LED(light emitting diode of producing).Extension refers to the method for deposition single crystal film on single crystalline substrate.The film of deposition is called epitaxial film or epitaxial layer.Epitaxial film can be from liquid or gaseous precursors growth.Due to substrate, as crystal seed, deposit film has the lattice structure identical with substrate and direction.This membrane deposition method from other is different, other deposition polycrystalline or noncrystal membrane, or even deposit in single crystalline substrate.If deposit on the film substrate identical in component, this process is called as homoepitaxy, otherwise it is called as hetero-epitaxy.
In LED and semiconductor technology, sapphire is as the growth substrates of epitaxial film, silicon for example, gallium nitride and (or) GalnN.Growth needs to epitaxial film is avoided defect, and it is very important having exact matching between the surface direction of substrate and each crystrallographic plane so.Therefore, sapphire core is cut into to the cutting of a plurality of wafers parallel with crystrallographic plane.Yet, from crystrallographic plane, in the slight deviations of a specific angle/direction, be desirable, this can optimize cutting performance.The required direction of the cutting planes relevant to crystallographic direction also depends on the basilar memebrane combination.
Below introduce some known methods for directed crystal ingot before cutting process.
JP10337695A discloses a kind of method of manufacturing wafer from semiconductor single crystalline ingot, and semiconductor single crystalline ingot is attached to the clamping surface of clamping device.Then, clamping device is installed surface (i.e. the face relative with support surface) by it and is fixed to installing plate (as shown in Figure 5).For the angle that makes the monocrystal relevant to cutting plane reaches predetermined angle, surface is installed and is passed grinding steps (as shown in Figure 3) adjustment.Yet, clamping surface be monocrystal and crystallographic direction thereof independently, standard cylindrical.Therefore, clamping face all can not be operated at any time.The shortcoming of this solution comprises, the shape of clamping surface can not be adjusted to surface of the work individually, with and surface be installed be changed in the process of grinding steps, this may connect and cause harmful effect the form fit relevant to installing plate.These two aspects may cause the crystallographic axis relevant to cutting plane obviously to be lacked of proper care.
US2006032430A1 discloses the method for the monocrystal on a kind of measurement, location and fixing common supporter.When sawing, can, by suitably arranging the supplemental support thing, make forward on feed direction, determining that the direction of crystallographic axis tells on.This program is complicated, because the supplemental support thing must be arranged on common supporter and monocrystal by rights, this causes the mechanical displacement of not expecting.And, when crystallographic axis breaks away from cutting plane, can only on a dimension, compensate.Therefore, this method can not solve the problem of the three-dimensional directrix of correct crystallographic axis that acquisition by oneself is relevant to cut direction or cut surface.
DE2752925A1 discloses a kind of device of complexity, and this device is for correcting the crystallographic axis of the workpiece relevant to plane supportive device (two-dimentional seating surface).Described seating surface remains unchanged.Subsequently, workpiece is glued to supportive device.Its shortcoming is undesirable displacement may occur in apparatus for correcting complexity and gummed step.
The additive method of cut workpiece and technical background be at EP1568457A1, JP2007118354A, and US4819387A, US5720271A, US5839424A, have open in US2004084042A1 and WO2009028756A1.
The certain direction of ground flat mark that is parallel to the major axis of core or crystal ingot.When the cutting crystal ingot, wafer will show along the mark of the obliterated data section of circumference.
For plane lapping, crystal ingot need to be installed on supporter, thereby make the main shaft level run.For so-called C type crystal ingot, main shaft is C-direction (Fig. 4).For the in-plane of C type wafer A direction normally.Therefore, in the starting stage, mark A direction, then be installed to crystal ingot on supporter, above label orientation is pointed to like this.
In this position, for hope square to, measure and adjust crystal ingot.Being arranged on crystal ingot on holder is admitted to after mill to be returned and reexamines.If, not in desirable accuracy scope, can correcting, label orientation adjusts and repeats grinding steps.When using indivedual mill correction system deviation, the quantity that corrects step can minimize.
Said method is characterised in that, in order to obtain the correct directrix of the crystal ingot on saw, relatively, by using mill, forms the surface of crystal ingot.
Further statement is about being glued to the sapphire core the formerly technology of support plate.In order to correct the angle error of any crystallographic axis and core mechanical axis, core and support plate are glued together with certain angle.Step 1, glue puts on support plate.Then, core is held and can measures angle value accurately in the position that an angle is arranged with respect to plate.Before gluing, measure the angle error of crystallographic axis and core mechanical axis by X-ray diffraction.Angle between core mechanical axis and support plate can be measured.As long as within the angle of hope, the angle between core mechanical axis and support plate can be corrected with respect to the core mechanical axis of support plate.Now, through after a while with fixing glue.Due to the angle between support plate and core, they are the different zones of glue thickness.
Said method is characterised in that by trial and error and glues together the crystal ingot directrix that step is adjusted saw.
Another known method is based on core and piles up directions.Core is less than 300 millimeters usually so that more than one core is suitable for saw device.Use tractor-drawn rake (for example producing by EFG Berlin) for setting up the location core component that there is on a large scale independent property and consistency.Then, this assembly is glued to and is applicable to the saw device of supporting, using this as a cutting integral body.
Banking process is from mark reference direction, and reference direction is normally tended to the A-direction of C-type crystal.When label orientation, the plastics bundle adheres on core, can provide enough large contact-making surface like this so that follow-up gummed.
With the core of plastics Shu Yiqi, be installed on the adjusting holder, this holder is connected with a rotatable disc.Then, measured and adjusted required direction.After this enter a new stage with for another core.
Each stage comprises ring and the adapter for 2 "-10 " various sizes crystal ingot.12 " installation of crystal ingot does not need to use adapter.For the adjustment of crystal ingot direction, two cover screws are arranged for each stage.The mobility scale of this direction is approximately 1-1.5 degree.
Usually use epoxy resin that sample is glued on support plate.After resin solidification, the device of accumulation can be disassembled.Then resulting assembly can be installed in the scroll saw for cut crystal.
Said method is characterised in that, after the gummed process of adjusting location, by machinery, adjusts the crystal ingot directrix that movably holder realizes proofreading and correct saw.
There is following defect in these prior aries.It is difficulty (by EFG, need to use huge device) and loaded down with trivial details (this position must change by screw or similar device) that core (or crystal ingot) is navigated on support plate very exactly.When adhesive curing, needed position must be fixed.This means, as long as glue does not solidify, just can not use for the positioner of locating core.By using robot arm can not make core be positioned, because robot arm can not keep a state for a long time.Robot arm its state of having to always adjust again, this causes robot arm to be not suitable for gummed.
Summary of the invention
The objective of the invention is for a kind of new method that at least one monocrystal workpiece is fixed to clamping device is provided, the method gives the workpiece relevant to clamping device and accurately locates.The method does not need positioner of the prior art/adjusting holder.The method is reliable, save time and save money, and the assembly of a strong workpiece and clamping device can be provided.This assembly can define the crystallographic direction of the workpiece relevant to processing machine accurately.
The objective of the invention is that the described method of preorder characteristic by claim 1 realizes, step is as follows: the crystallographic direction of measuring the described monocrystalline workpiece relevant to surface of the work; According to the crystallographic direction of the described monocrystalline workpiece relevant to described surface of the work, form a support surface closely to receive described surface of the work on clamping device, thereby limit the crystallographic direction of the monocrystalline workpiece relevant to the apparatus surface of clamping device; And described surface of the work is adhered on described support surface.
From the inventive method step illustrated below, apparent above-mentioned steps is most preferably of the present invention, for example sequentially following: as to measure the crystallographic direction of monocrystalline workpiece, form a clamping surface according to crystallographic direction on clamping device, surface of the work is adhered on described clamping surface.This personalization that gives the best of monocrystal workpiece separately adapts to.
The clamping surface formed like this, just can obtain and the crystallographic direction that surperficial relevant desired (or pre-establishing) is installed.Then, when workpiece, during suitably in abutting connection with clamping surface, clamping surface is determined and the crystallographic direction that surperficial relevant monocrystal workpiece is installed.
According to solution of the present invention, on clamping device, formed clamping surface is for receiving the outer surface of core.In forming step, three-dimensional gummed mould results from the raw material clamping disk.Now, core can be placed on clamping device, and be combined with the clamping surface of clamping device in the surface of core like this, and does not need the angle between mechanical assistance instrument fixed clamp device and core crystal axial line just core can be glued on clamping device.When core is placed on clamping device and start to contact with clamping device, crystal axial line extends in desirable direction, and the clamping surface on clamping device has just formed.
Compared with prior art, with respect to the positioner of adjusting crystal ingot or use labyrinth, the formation of clamping device or reorganization, be all more easily, save time and save money.The invention has the advantages that simplicity and the validity of clamping device, because when fixation workpiece, clamping device is without any need for additional positioner.Because clamping surface has had " correctly " direction in clamping device, workpiece need only be placed on clamping surface.Term " correctly " direction refers to when workpiece during in abutting connection with clamping surface, forms and surperficial relevant desirable crystallographic direction is installed.
Compared with prior art, particularly JP10337695A, be not that surface is installed in operation, but be formed for receiving the clamping surface of workpiece according to the crystallographic direction of the workpiece relevant to surface of the work.Compared with prior art its advantage is, it is not perfect cylindrical surface of the work usually that the shape of clamping surface is suitable for respectively.
In addition, according to one embodiment of present invention, such clamping surface can adapt to surface of the work, and clamping surface only contacts workpiece partly, and for example, by a plurality of orientation fixed-point apparatus, they can be evenly distributed on clamping surface better.When between workpiece and these orientation fixed point, there is no glue-line, this can make the workpiece directrix more accurate.Equally, these orientation fixed points can be adapted and be made them to contact with the most suitable part of surface of the work, and for example, other parts of surface of the work are configured by the mode with level.
Because the installation surface can be very flat, can with scroll saw, coordinate well, or as selecting, it can be complicated shape that surface is installed, and can accurately with scroll saw or saddle, coordinate, saddle is unfavorable for changing the installation surface.According to the described method of JP10337695A, it is very difficult and complicated that core is positioned to desirable position.If on desirable position, clamping surface is not stably to contact with core, when core contacts with clamping surface/glues together, (this needs complicated equipment to keep it being absolutely correct on position, this just the present invention to prevent: use complex device) or, in sawing process, core will be easy to from this position landing.Under the pressure of scroll saw, glue can allow core move in due course.
Method of the present invention prevents the angle error of undesirable crystallographic axis relevant to cutting plane, and provides simple calibration/fixed routine by method step seldom.Other prior aries do not operate/change clamping device itself, but rely on complicated calibration and fixing step.
With JP10337695A, compare, further advantage of the present invention is that calibration more accurately is provided.After core in JP10337695A is glued to the first dish, the first dish is glued to the second dish and will causes error.On the contrary, system of the present invention allows, and before the clamping surface punching, mounting disc (for scroll saw is installed) is installed the clip surface wrapped folder by it and held device.Therefore, in an embodiment of the present invention, this error can not occur.Another error of JP10337695A is that, after core is glued to the first dish, assembly must be positioned on milling machine.But now the angle between the disc of core and plane to be ground must be determined.This is problematic, even because when not using notch (this is not a very flat surface), and the reference point that circular kernel has not still had in the heart.
Flat installation surface must be ground very smoothly, accurately to give the location of the core in scroll saw.Such plane can only be used flat drill to realize usually.This means, the flat drill core must be used for example five axle systems to locate, and must be completed by manual.Obtain very flat surface by milling machine, this is a process very complicated and consuming time.This process difficulty, expensive and inaccurate.
Because clamping plane of the present invention is not flat, but be adapted to surface of the work, it can use for example hand mill accurately to make, and allows to grind the surface of any desirable shape.In addition, owing to only having several orientation fixed point or line, the accurate location that this can limit core, only having these points or line is need to be highly accurate.Therefore, this there is no need to use multiple axes system.This can, very simply by for example using the only clamping surface of an axle formation clamping device, be placed to sandwich structure by mounting disc and clamping device on common milling machine.
Because the installation surface of the first dish in JP10337695A must be ground, therefore, in process of lapping, core dish assembly must obtain support by core.This is obviously danger close concerning core, because holding power must be enough large.Simultaneously, must be by individually, process in multiple times according to each core of JP10337695A.
Adopt the inventive method, the crystallographic axis deviation produced according to the mechanical axis from workpiece, only have the clamping surface of clamping device to be cut by machine.In the cylindrical work situation, sapphire core for example, the surface of the work of cylinder axis or side can be used as the geometric reference direction and uses.In the ordinary course of things, surface of the work is accepted by the clamping surface of the clamping device as the geometric reference direction.
The step that the inventive method can reduce the clamping surface on angle, processing and the surface of the work clamping device relatively of measuring between crystallographic axis and surface of the work and glue together surface of the work and clamping surface.
Preferably, before the described clamping surface on described clamping device forms, the data that the crystallographic direction of the described monocrystalline workpiece relevant with described surface of the work to measurement is relevant can feed-in moulding machine able to programme.From those data, three-dimensional clamping surface is made to model, three-dimensional clamping surface is transferred to the raw material of clamping device.This allows easily, automatic clamping surface machining.
The monocrystalline workpiece can be the core of ingot, crystal ingot, monocrystal, cylindrical shape or other any geometry single crystal samples to be ground or to be cut.
This can allow not only one but also a plurality of core to be affixed on a clamping device.These cores, through selecting, limit their crystallographic directions, determine and tilt and the inclined plane direction, measure their geometric parameter (with regard to length and the diameter of cylinder).These core datas and correct direction may be programmed into milling machine.Recess for each core enters clamping device along with desirable branch and inclination are polished.Finally, these cores are glued to by clamping surface and limit the recess formed.
Slicing processes has just been launched on correct branch and gradient.Be bonded at that workpiece assembly on clamping device can be by hand, semi-automatic or automatic machine tools location, scroll saw for example, milling machine, drilling machine or grinding machine, etc.For the volume of the glue that is limited to core and clamping surface, at the clamping surface of contiguous surface of the work, at least to form a recess.This can realize by forming projection or cave on clamping surface.By above-mentioned any method, the dosage that applies to the glue of clamping surface can be by accurate-metering to fill this volume.Do like this, workpiece in the situation that there is no glue near projection, is equivalent to intermediate layer.This makes location more accurate, because do not have the position error that glue produces.Channel on clamping surface can allow unnecessary solation go out, if placed the glue that surpasses required volume in projection.
Clamping device can be directly installed on machine tools for example on scroll saw.Perhaps, clamping device can be glued to additional installation holding components for example (also being known as support disc) in mounting disc.Because cast-cutting saw can not cut, holding components (and holding components is installed and needn't be processed separately for every workpiece) is not installed, this holding components can be made with firmer material, for example steel.Can and install between holding components at clamping device an additional telophragma is set, be used for adapting to special installation holding components.This telophragma is also nonessential and usually only in the situation that holding components is installed is very heavy or very expensive or in order there to be simpler gluing dish just to use.This telophragma can be threaded onto to be installed on holding components.
Can there be a plurality of cores to be glued on a dish.Because all cores do not have identical mismatch error, can adopt a plurality of clamping surfaces.
The accompanying drawing explanation
This is invented more embodiment and is introduced in accompanying drawing and dependent claims.Quote the sequence number list and also form a part of this disclosure.
Describe the present invention in detail below in conjunction with accompanying drawing.
In the accompanying drawings:
Fig. 1 means a single crystal rod with core, and the mode that this core is bored by hollow is made.
Fig. 2 means a monocrystalline core.
Fig. 3 means A plane and the M plane of sapphire crystal structure.
Fig. 4 means C plane and the R plane of sapphire crystal structure.
Fig. 5 is illustrated on clamping device the linear cutting equipment that workpiece is housed.
Fig. 6 means to possess the clamping device of the innovation of two clamping surfaces.
Fig. 7 means to be equipped with the clamping device of the innovation of three workpiece.
Fig. 8 means the illustrated X-ray diffraction equipment with a workpiece.
Fig. 9 means to be used to form the forming machine of clamping surface.
Figure 10,11 and 12 are illustrated on cross section, are adhesive in the workpiece on clamping device.And
Figure 13 and 14 means to be adhesive in the workpiece with on the clamping device of cut surface.
Quote the sequence number list
1: monocrystalline workpiece 2: clamping device 3: clamping surface 4: apparatus surface
5: surface of the work 6: process equipment 7: projection 8: channel
9: forming machine 10: alignment pin 11: the scroll saw of cutting equipment
12: mounting disc 13:X ray tube 14: detector 15: crystal ingot
16 glue
The specific embodiment
Next, with a sapphire workpiece, the present invention is described, but the intention of this invention can be applied to any other crystal (crystal that for example comprises boron or silicon).
Fig. 1 shows sapphire ingot or the crystal ingot 15 drawn high from molten soup.In drawing high process, this crystal ingot is slowly rolled.This process is called again the czochralski growth method.Yet usually, can use kyropoulos, one of them cold club can be dipped into molten soup, and crystallization process starts at this club end, the molten soup around club cools down lentamente simultaneously.
The three-dimensional outer surface of this crystal ingot is modeled, and crystallographic direction is tested according to the direction of outer surface.After the threedimensional model of the outer surface of crystallographic direction and crystal ingot is made, core is just bored and is got out from crystal ingot by hollow.Fig. 1 is presented at the cavity after drilled in crystal ingot 15.While selecting the direction of brill, in connection with the crystallographic direction of crystal ingot 15, purpose is to obtain the cylinder of geometrical axis and crystal axis coupling.Unfortunately, in most situation, all have deviation between the mechanical axis of crystal axis and core, and the direction of crystal axis is not in the error range allowed.
Fig. 2 has shown the monocrystalline workpiece 1 of the column type got out from crystal ingot 15.Surface of the work 5 is bonded on clamping device.
Fig. 3 and Fig. 4 have shown does not have the sapphire crystal of atomic arrangement structure.In Fig. 3, shown so-called A plane and M plane, and with perpendicular A axle and the M axle in corresponding plane.Fig. 4 has shown C axle and the R axle of C plane and R plane and corresponding crystal structure.Research finds that this cutting is when becoming 0 degree to 0.35 degree and becoming the offset angle of 0 to 0.35 degree with the A plane with sapphire crystal M plane, and cutting can complete ideally.Yet, by innovative approach of the present invention, can adjust to exactly any other direction of wanting (comprising out-of-plane direction).According to the type of crystal and its application, can select suitable cutting planes (and definite departing from of their language crystrallographic planes).
Fig. 5 has shown the linear cutting equipment 6 for cutting monocrystalline workpiece 1.Workpiece 1 is bonded on clamping device 2, and clamping device 2 is arranged on equipment 6.Move multi-thread arrangement cut workpiece.Usually workpiece 1 is placed on clamping device 2 belows, and line 11 is guided in from the bottom of workpiece 1 until top.
Fig. 6 shows the clamping device 2 of a plate-like, comprises that one is installed surface 4 in order to clamping device 2 is arranged on process equipment 6, for example, and the linear cutting equipment in Fig. 5.On contrary one side, clamping device 2 has clamping surface 3 in order to contact with two monocrystalline workpiece 1.Clamping surface 3 coordinates very rightly with the corresponding surface of the work 5 above being bonded at it.As what can see in Fig. 6 (and Fig. 9 to 14), clamping surface 3 is dug and is deeply made by clamping device 2.Clamping surface 3 form the blocking tool (container) that workpiece 1 has produced a three-dimensional.
Clamping device 2 can be made by any materials, preferably is easy to the materials such as plastics of processing, preferably fibre reinforced plastics.
To each workpiece 1, according to the surface of the work 5 to workpiece, the crystallographic direction of relevant workpiece 1, be individually formed clamping surface 3, and each workpiece 1 is glued to institute and forms separately clamping surface 3.Clamping surface 3 contacts with workpiece 1, therefore determines the crystallographic direction that installation workpiece 1 and clamping device 2 surface 4 is relevant.When workpiece 1 is placed on clamping surface 3, the contiguous clamping surface 3 of surface of the work 5, therefore determine a definite direction.
As what see from Fig. 6, two clamping surfaces 3 have with respect to the different direction that surface 4 is installed.This explanation, for two different workpiece 1, has different deviations on crystallographic direction and operating direction.Dotted line in Fig. 6 means the bottom line of clamping surface 3.
Here introduce the content of the present invention about cylindrical workpiece.For example, but the viewpoint of this innovation is applicable to the workpiece of any shape, particularly rectangle, silica brick.
Fig. 7 has shown the clamping device 2 that three different workpieces have been installed on clamping device 2.Each workpiece 1 has the different crystallographic directions relevant to mechanical axis, as the dotted line top from core, sees.But as represented as the arrow on dotted line in figure and dotted line, the crystallographic direction about reference planes 4 of all workpiece 1 is identical.
Mounting plane 4 is fixed on to be installed on holding components 12, and a for example mounting disc, be used for assembly is arranged on to process equipment 6(Fig. 5) in. the installation surface 4 of clamping device 2 directly can also be installed on process equipment 6.Installation surface 4 in Fig. 6 must not be flat.Installation surface in embodiment can be any other shape.Many installation surfaces also are fine.For example, surface 4 being installed can be connected with machine tools by installation gap or any other device (directly or indirectly).
Clamping device 2 is glued in mounting disc 12 usually.This glue is bi-component epoxide-resin normally, more than being heated to 70 degree Celsius, will lose cohesive force.After cutting step, with the installation holding components 12 of clamping device 2, be placed in hot water and can reuse to remove clamping device 2. these installation holding components 12.
Below, by introducing in detail, the method on clamping device 2 is located and be fixed on to workpiece 1.Fig. 8 shows the method with respect to the crystallographic direction of its outer surface by X-ray diffraction measuring workpieces 1.X-ray source 13 is directed to workpiece 1 by X-ray beam.The data that obtain can be determined crystallographic direction.
Next step, the crystallographic direction of relevant described monocrystalline workpiece 1 according to the surface of the work 5 to workpiece 1 forms clamping surface 3 on clamping device 2.In the embodiment of Fig. 9, this step is completed by a programmable machine 9, preferably a milling machine.The data relevant with crystallographic direction and operating direction and the shape of workpiece 1 be input in this processing machine 9 before procedure of processing.The clamping surface 3 of a three-dimensional is modeled and is transferred to the raw material of clamping device 2 according to these data.Shown in the three-dimensional coordinated system of Fig. 9, the drill bit of milling machine can move on three directions.In procedure of processing, an original clamping disk can form the rubber moulding (see figure 6) of a three-dimensional.
When clamping surface 3(or a plurality of clamping surface) while completing on clamping device 2, workpiece 1 is glued on the surface of the work corresponding with clamping surface 5.Workpiece 1 is pressed on the clamping surface 3 that is coated with glue equably.The shape of clamping surface 3 and orientation determination the crystallographic direction corresponding with reference surface 4 of single workpiece 1.
In the solidification process of glue, workpiece 1 can be forced on clamping device 2.
Figure 10 demonstration, from a preferred embodiment of cross section, workpiece 1 is glued on clamping device 2 by the mode of glue 16.Preferred, adopt epoxy glue, for example a kind of epoxy glue of bi-component.Yet the glue of any other type also can adopt.
Clamping surface 3 has the recess that holds glue.In the embodiment of Figure 10, clamping surface 3 consists of a plurality of projections 7 that extend to surface of the work 5, with surface 3, parallels.Projection 7 contact surface of the works 5 and glue 16 are distributed on the space (recess) between projection 7.This embodiment makes workpiece 1 that location accurately be arranged, because the contact position that projection 7 forms has accurately been determined the termination crystallographic direction of workpiece 1.This embodiment can avoid in the glue curing process due to the thickness of glue and (or) error that causes of the contraction of glue.
Figure 11 shows another preferred embodiment, and wherein clamping surface 3 includes at least one channel 8.Unnecessary glue 16 can be discharged from channel 18.
In the embodiment that Figure 12 shows, the part of surface of the work 5 has flat shape.As previously mentioned, any shape of surface of the work is all possible.With corresponding contiguous surface of the work 5, it doesn't matter in the formation of clamping surface 3.
Figure 13 and 14 has shown workpiece 1 assembly be adhesive on clamping device 2.Dotted line has shown and has been installed in the future the cutting planes on scroll saw with the line of being with point.
Below introduce the method for optimizing spacing between the line cutting.Space between workpiece 1 on clamping device 2 can be optimized by the spacing between line.This means if do not pay close attention to this space, the cutting of the line of first of workpiece and last wafer may not obtain available wafer (seeing Figure 13).In Figure 14, along the cutting of dotted line, can form 5 suitable wafers.Cutting along dotted line can form 6 suitable wafers.
Obviously, the position of second core can be optimized by identical mode.
Horizontal fixing: in order to obtain above-mentioned advantage, core need to be fixed in the horizontal (in above-mentioned accompanying drawing from left to right).This can realize by the alignment pin 10 that a core institute butt is set, and for example determines a surface (seeing arrow).
Other in the horizontal fixedly the positioner 10 of core can provide with the following methods: a clip, rubber band, sclerosis (melten gel) or solidify (instant glue, dental stone) very fast glue etc.
Also can correct with following methods the imperfect part of scroll saw.Any error in the line cutting performance can both measured and correction.In initial measurement, the accurate direction of cutting planes can be determined, and with the error of theoretical planes, can be used to ideally align with core by correct cutting planes.
If core has a Rotational Symmetry (usually so), core can provide a plane (seeing Figure 12) or breach (recess is parallel to the mechanical axis of core).Clamping surface can be made into this plane or breach adjacent, thereby determines the direction of core.
The present invention is not limited only to embodiment described above.Particularly, application is not limited only to sapphire crystal.The present invention can be applied to the crystal of any type processing (cutting, mill, bore, mill, etc.).The semiconductor crystal, the silicon crystal that comprise various electronic equipments or solar cell application in the middle of this.Obviously, method of the present invention and clamping device can be for various machines, drilling machine for example, polishing machine, grinder etc.After the present invention and following claim also comprise a kind of method and clamping device 2 wherein clamping device 2 are not formed on the measured crystallographic direction of workpiece 1 but a set of different clamping device 2 purposes wherein are provided is that to make the user be that independent workpiece 1 is selected the suitable clamping device with independent clamping surface 32.The present invention also comprises the semi-finished product clamping device 2 that soft upper part is arranged, when compacting the cylindrical of use is pressed into above-mentioned part by desired shape, this part can hardening, wherein said cylindrical have the shape of crystal workpiece 1 and wherein the direction of cylinder being pressed into soft top timesharing, be that the crystallographic direction (automatically final) that is not subject to workpiece 1 is controlled.
Claims (15)
1. be that clamping device (2) comprises an apparatus surface (4) that clamping device is installed on the assigned direction of process equipment (6) in the upper fixedly method of monocrystalline workpiece (1) of a clamping device (2); It is characterized in that the method comprises the following steps:
Measure the crystallographic direction of the described monocrystalline workpiece (1) relevant to the surface of the work (5) of described workpiece (1);
Crystallographic direction of the described monocrystalline workpiece (1) relevant to the surface of the work (5) of described workpiece (1) according to each, form a clamping surface closely to receive described surface of the work (5) on clamping device, thereby limit the crystallographic direction that this monocrystalline workpiece (1) is relevant to the apparatus surface (4) of clamping device (2); And
Described surface of the work (5) is adhered on described clamping surface.
2. method according to claim 1, is characterized in that the step that forms described clamping surface (3) is completed by moulding machine able to programme (9), preferably a grinding machine.
3. method according to claim 2, is characterized in that the data relevant with the crystallographic direction of measuring the described surface of the work about monocrystalline workpiece (1) go in the described clamping surface (3) of the described clamping device of processing (2) is imported into moulding machine able to programme (9) before.
4. according to the described method of aforementioned any one claim, it is characterized in that at upper at least one recess that forms of described clamping surface (3) to deposit glue.
5. according to the described method of aforementioned any one claim, it is characterized in that at upper at least one channel (8) that forms of described clamping surface (3) to discharge unnecessary glue.
6. according to the described method of aforementioned any one claim, it is characterized in that on described clamping surface (3) having an alignment pin (10) so that monocrystalline workpiece (1) is positioned on clamping device (2).
7. according to the described method of aforementioned any one claim, it is characterized in that described clamping device (2) is comprised of a plate.
8. according to the described method of aforementioned any one claim, it is characterized in that monocrystalline workpiece (1) has the profile of a cylinder, and described clamping surface (3) contacts with the side of monocrystalline workpiece (1).
9. according to the described method of aforementioned any one claim, it is characterized in that described monocrystalline workpiece (1) is sapphire.
10. according to the described method of aforementioned any one claim, it is characterized in that a plurality of monocrystalline workpiece (1) are fixed on clamping device (2), and the crystallographic direction relevant to its surface of the work (5) of each monocrystalline workpiece (1) can be measured, and comprise the following steps:
To each monocrystalline workpiece (1), the crystallographic direction of relevant described monocrystalline workpiece (1) according to the surface of the work (5) to described monocrystalline workpiece (1);
On clamping device, (2) form an independent clamping surface (3) closely to contact corresponding surface of the work (5), thereby limit the identical crystallographic direction of the whole monocrystalline workpiece (1) relevant with the installation surface (4) of clamping device (2); And
The surface of the work (5) of each monocrystalline workpiece (1) is adhered on corresponding clamping surface (3).
11. a method that monocrystalline workpiece (1) is cut into to sheet, is characterized in that the method comprises the described method of aforementioned any one claim, further comprising the steps of:
Monocrystalline workpiece (1) is put in the clamping device (2) that is equipped with saw; And
Sawing monocrystalline workpiece (1).
12., for the fixing clamping device (2) of monocrystalline workpiece (1), this clamping device (2) comprising:
An apparatus surface (4) of placing clamping device (2) on the assigned direction of process equipment (6); And
Clamping surface (3) is closely to contact the surface of the work (5) of the monocrystalline workpiece (1) be bonded on clamping surface (3), wherein said clamping surface (3) is according to the crystallographic direction of the monocrystalline workpiece relevant to surface of the work (5) and each self-forming, thereby determines this monocrystalline workpiece (1) crystallographic direction relevant to the apparatus surface (4) of clamping device (2).
13. clamping device according to claim 12, is characterized in that having at least a recess to deposit glue and/or to have a channel (8) at least to discharge unnecessary glue on described clamping surface (3) on described clamping surface (3).
14., according to the described clamping device of claim 12 or 13, it is characterized in that on described clamping surface (3) alignment pin (10) being arranged so that the monocrystalline workpiece is positioned to the position on clamping device.
15. a series of clamping device according to claim 12 (2), have the clamping surface (3) of different directions to select suitable clamping device (2), with for method claimed in claim 1.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP11165009A EP2520401A1 (en) | 2011-05-05 | 2011-05-05 | Method for fixing a single-crystal workpiece to be treated on a processing device |
| EP11165009.9 | 2011-05-05 | ||
| PCT/IB2012/051927 WO2012150517A1 (en) | 2011-05-05 | 2012-04-17 | Method for fixing a single-crystal workpiece to be treated on a processing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103501975A true CN103501975A (en) | 2014-01-08 |
Family
ID=46062667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280021612.8A Pending CN103501975A (en) | 2011-05-05 | 2012-04-17 | Method for fixing a single-crystal workpiece to be treated on a processing device |
Country Status (3)
| Country | Link |
|---|---|
| EP (2) | EP2520401A1 (en) |
| CN (1) | CN103501975A (en) |
| WO (1) | WO2012150517A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113696358A (en) * | 2021-08-26 | 2021-11-26 | 西安中晶半导体材料有限公司 | Method for realizing crystal orientation deviation of single crystal through multi-wire cutting |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10052848B2 (en) | 2012-03-06 | 2018-08-21 | Apple Inc. | Sapphire laminates |
| JP6132621B2 (en) * | 2013-03-29 | 2017-05-24 | Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 | Method for slicing semiconductor single crystal ingot |
| US9154678B2 (en) | 2013-12-11 | 2015-10-06 | Apple Inc. | Cover glass arrangement for an electronic device |
| JP6173225B2 (en) * | 2014-01-16 | 2017-08-02 | 京セラ株式会社 | Cutting plate |
| US10406634B2 (en) | 2015-07-01 | 2019-09-10 | Apple Inc. | Enhancing strength in laser cutting of ceramic components |
| CN107096634A (en) * | 2016-02-23 | 2017-08-29 | 内蒙古盾安光伏科技有限公司 | Polysilicon particle platform and particle method |
| CN107639755B (en) * | 2017-09-26 | 2019-06-11 | 深圳市石金科技股份有限公司 | A kind of processing method of graphite vanes pump blade |
| EP4289582A1 (en) * | 2022-06-10 | 2023-12-13 | Scientific Visual SA | Crystal wafering system and method |
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- 2012-04-17 EP EP12720636.5A patent/EP2704886A1/en not_active Withdrawn
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2012150517A1 (en) | 2012-11-08 |
| EP2704886A1 (en) | 2014-03-12 |
| EP2520401A1 (en) | 2012-11-07 |
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Application publication date: 20140108 |